CN100515159C - Laminated printing circuit board containing filter therein - Google Patents
Laminated printing circuit board containing filter therein Download PDFInfo
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- CN100515159C CN100515159C CNB2005101344996A CN200510134499A CN100515159C CN 100515159 C CN100515159 C CN 100515159C CN B2005101344996 A CNB2005101344996 A CN B2005101344996A CN 200510134499 A CN200510134499 A CN 200510134499A CN 100515159 C CN100515159 C CN 100515159C
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- dielectric material
- material layer
- metal level
- inductance
- high dielectric
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Abstract
The invention uses multi layer PCB made of composite material composed of high dielectric material and low dielectric material. In said multi layer PCB there are multi serial/or parallel capacitors to form a filter; wherein, at least one of serial capacitors is set as the interdigitated capacitor of the third metal layer on the low dielectric layer; the both ends of said interdigitated capacitor respectively have multi coupling teeth. The electrodes of the interdigitated capacitor all are located in same panel, and the sizes of the metal electrodes of the interdigitated capacitor can be pre-adjusted in order to control the central frequency and transmission loss of the filter.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB), particularly relate to a kind of multilayer board that includes filter.
Background technology
In recent years, utilizing PCB design frequency microwave assembly, especially radio-frequency filter, has been very general technology.Industrial technology development now is rapid, and consumption electronic products are constantly weeded out the old and bring forth the new, and function is variation more and more; Therefore corresponding, also stricter requirement has been proposed method and the quality of utilizing the PCB design filter.Except in the design phase, control centre's frequency (Center Frequency) accurately just, bandwidth (Band Width), the loss (Return Loss) of turning back, implant loss (Insertion Loss), outside the sideband rejection parameters such as (Out Band Rejection), also wish and to consider the departure that produced because of the print circuit plates making process in advance in the design phase, carry out systematic assessment and control.Therefore be necessary to propose a kind of printed circuit board arrangement of accurately control printed circuit board filter electrical characteristic.On the other hand, by this kind printed circuit board arrangement, could guarantee the performance of filter to greatest extent.
The disclosed printed circuit board (PCB) that includes filter of prior art, as United States Patent (USP) the 6th, 448, No. 873 " LC Filter with Suspended Printed Inductor and CompensatingInterdigital Capacitor ", it proposes in printed circuit board (PCB), utilize spirality inductance in parallel and interdigital electric capacity to form the resonant circuit of a LC, each LC resonant circuit in parallel can be connected into a filter circuit with series capacitance mutually, wherein the electric capacity on tandem paths adopts then formula assembly (SMD, Surface Mounted Device) of general surface.Though this patent proposes to use interdigital electric capacity in the filter of printed circuit board (PCB), it is mainly used in the LC parallel resonance of filter, but not is applied to the electric capacity on the tandem paths.
And for example United States Patent (USP) the 6th, 577, No. 208 " Radio Frequency Filter ", this patent is mainly used in the manufacturing of ceramic substrate, so wherein modular filter assembly is that formula assembly (SMD) is followed on a surface, wherein employed interdigital electric capacity is connected with coiling shape inductance respectively, and does not indicate the purposes of this interdigital electric capacity in filter.In addition, do not indicate the purposes of this interdigital electric capacity in filter yet.In sum, the disclosed printed circuit board (PCB) that includes filter of prior art, do not provide as yet the series capacitance of interdigital capacitance applications in filter, the also unresolved composite substrate that uses the height differing dielectric constant causes this electrical characteristic inaccuracy that includes filter and bandwidth problem of smaller.
In view of this, the present invention proposes a kind of multilayer board that includes filter, this multilayer board uses the composite material by multilayer printed circuit board (PCB) that forms with high dielectric material and dielectric materials pressing, wherein at least one capacitance component is the interdigital electric capacity that is arranged on the dielectric materials, by adjusting the metal electrode structure size of this interdigital electric capacity in advance, with the electrical characteristic of accurate this filter of control, and the levels bit errors problem when having avoided this composite material by multilayer print circuit plates making.
Summary of the invention
Subject matter to be solved by this invention is, it is the composite material by multilayer printed circuit board (PCB) that forms with high dielectric material and dielectric materials pressing by using, wherein include the interdigital electric capacity that metal electrode all is positioned at same layer plane, include electrical characteristics such as the centre frequency of filter and loss with accurate control, make to include the influence that filter can not be subjected to multilayer board manufacturing process departure, include the characteristic of filter with optimization.
Peripheral issue to be solved by this invention is, the composite material by multilayer printed circuit board (PCB) that utilization forms with high dielectric material and dielectric materials pressing, wherein include and utilize high dielectric material to form the high flat capacitor of capacitance, include the bandwidth of filter with lifting.
For achieving the above object, the present invention proposes a kind of multilayer board that includes filter, and this multilayer board uses the composite material by multilayer printed circuit board (PCB) that forms with high dielectric material and dielectric materials pressing.Design has a plurality of series connection and shunt capacitance assembly forming a filter in this composite material by multilayer printed circuit board (PCB), and wherein at least one capacitance component is to be arranged at the interdigital electric capacity on the dielectric materials or to be arranged at interdigital electric capacity on the high dielectric material layer.
The metal electrode of this interdigital electric capacity all is positioned at same layer plane, can be by adjusting the metal electrode structure size of this interdigital electric capacity in advance, with electrical characteristics such as the centre frequency of accurate this filter of control and losses, and the levels bit errors problem can avoid this composite substrate and make the time.
Description of drawings
Fig. 1 is the equivalent circuit diagram of filter that the present invention includes.
Fig. 2 is a multilayer board generalized section of the present invention.
Multilayer board first embodiment that Fig. 3 includes filter for the present invention schematic diagram that connects up.
Fig. 4 includes the electrical characteristic measurement result figure of multilayer board first embodiment of filter for the present invention.
Fig. 5 is the interdigital capacitance arrangement figure of first embodiment of the invention.
Fig. 6 is the interdigital capacitance arrangement figure of second embodiment of the invention.
Fig. 7 is the interdigital capacitance arrangement figure of third embodiment of the invention.
Fig. 8 is the interdigital capacitance arrangement figure of fourth embodiment of the invention.
Fig. 9 is the interdigital capacitance arrangement figure of fifth embodiment of the invention.
Figure 10 is the interdigital capacitance arrangement figure of sixth embodiment of the invention.
Wherein, Reference numeral:
2,13,22,33,34,53～high dielectric material
3,12,23,24,32,43,52～dielectric materials
Ca, Cc～series capacitance Cb～interdigital electric capacity
Cp1, Cp2～electric capacity L1, L2～inductance
M1～the first metal layer M2～second metal level
M3～the 3rd metal level 1～substrate
Embodiment
For making your auditor further cognitive and understanding be arranged to feature of the present invention, purpose and function, existing conjunction with figs. is described in detail as follows:
Figure 1 shows that the equivalent circuit diagram of filter that the present invention includes, wherein on transmission path Port 1 to Port 2, have three series capacitance Ca, Cb and Cc, and the two ends of series capacitance Cb respectively are connected with a LC antiresonant circuit, be capacitor C p1 and inductance L 1 antiresonant circuit and capacitor C p2 and inductance L 2 antiresonant circuits, wherein form a coupling mutual inductance between inductance L 1 and the inductance L 2.
Figure 2 shows that multilayer board generalized section of the present invention, it has the composite material by multilayer printed circuit board (PCB) of a high dielectric material 2 and a dielectric materials 3 in substrate 1 pressing in regular turn, and respectively is provided with the first metal layer M1, the second metal level M2 and the 3rd metal level M3 on substrate 1, high dielectric material 2 and dielectric materials 3.Wherein dielectric materials uses Mitsui MR500, and dielectric constant is 3.4; High dielectric material uses High Dk40, and dielectric constant is 40.
Figure 3 shows that multilayer board first embodiment that the present invention the includes filter schematic diagram that connects up.Wherein on transmission path Port 1 to Port 2, the series capacitance Ca of both sides and Cc adopt the design of flat capacitor, because series capacitance Ca and Cc need have bigger capacitance to include the bandwidth of filter with lifting, so series capacitance Ca and Cc use high dielectric material 2 as shown in Figure 2, and two parallel-plates among series capacitance Ca and the Cc use the second metal level M2 and the first metal layer M1 shown in Fig. 2; Middle series capacitance Cb then adopts the design of interdigital electric capacity.Respectively there is an end points both sides of this interdigital capacitor C b, and each end points all is connected with three coupling teeth.Because the capacitance of interdigital capacitor C b can be adjusted length, width and the spacing of the tooth that respectively is coupled and accurately obtains in the design phase, so the interdigital capacitor C b that includes the filter center frequency in order to decision just can obtain accurate control when designing.Usually the required capacitance of series capacitance Cb is less, so it is disposed on the dielectric materials 3 shown in Fig. 2, and its coupling tooth uses the 3rd metal level M3 shown in Fig. 2; It is when if Cb needs bigger capacitance, also configurable on high dielectric material.Because the top of interdigital capacitor C b is exposed in the very low air of dielectric constant, so that above-mentioned configuration can make the loss that includes filter reduce to is minimum.On the other hand, because interdigital capacitor C b only uses dielectric materials 3 shown in Fig. 2 and the 3rd metal level M3, so the influence of the levels bit errors problem can not be subjected to this composite material by multilayer print circuit plates making the time.
In addition, the two-end-point of interdigital capacitor C b respectively is connected with a LC antiresonant circuit among Fig. 3, i.e. capacitor C p1 and inductance L 1 antiresonant circuit and capacitor C p2 and inductance L 2 antiresonant circuits.By shown in Figure 3, capacitor C p1 and capacitor C p2 adopt the design of flat capacitor, be that capacitor C p1 and Cp2 use high dielectric material 2 as shown in Figure 2, and two parallel-plates among capacitor C p1 and the Cp2 use the second metal level M2 and the first metal layer M1 shown in Fig. 2, and in the second metal level M2 ground connection; Inductance L 1 is used a bit of microstrip transmission line of the 3rd metal level M3 shown in Fig. 2 respectively with 2 of inductance L, and utilizes the characteristic of edge coupling to form a coupling mutual inductance between inductance L 1 and the inductance L 2.Inductance L 1 and inductance L 2 among the present invention can be used lead formula inductance (Trace Inductor), three-dimensional helical form inductance (SinusoidalInductor), snail shape inductance (Spiral Inductor), circuitous shape cabling inductance (MeanderLine Inductor) according to circumstances.
Figure 4 shows that the present invention includes the electrical characteristic measurement result figure of multilayer board first embodiment of filter, can learn the composite material by multilayer printed circuit board (PCB) of use Fig. 2 and the practical wiring of Fig. 3 by Fig. 4, the pass band width that this multilayer board includes filter (3dB) from 2.0GHz to 3.2GHz, is about 1.2GHz; Pass-band loss then is about-1.73dB.This measurement result is used the SMD assembly of LTCC material with respect to the printed circuit board (PCB) that generally includes filter, can obviously realize better electrical characteristic.
Figure 5 shows that interdigital capacitor C b among the present invention in the configuration mode of aforementioned first embodiment, wherein pressing in regular turn has a high dielectric material 2 and a dielectric materials 3 on substrate, and interdigital capacitor C b is disposed at the metal level on the dielectric materials 3.Except configuration mode shown in Figure 5, interdigital capacitor C b also can use the configuration mode of second embodiment of the invention as shown in Figure 6.Wherein pressing in regular turn has a dielectric materials 12 and a high dielectric material 13 on substrate, and interdigital capacitor C b is disposed at the metal level on the high dielectric material 13.In addition, interdigital capacitor C b also can use the configuration mode of third embodiment of the invention as shown in Figure 7, wherein pressing in regular turn has a high dielectric material 22 and a dielectric materials 23 on substrate, interdigital capacitor C b is disposed at the metal level on the dielectric materials 23, and on this dielectric materials 23 again pressing one dielectric materials 24 is arranged, and on this low dielectric material layer 24, again pressing one the 4th metal level; Interdigital capacitor C b also can use the configuration mode as Fig. 8 fourth embodiment of the invention shown in Figure 8, wherein pressing in regular turn has a dielectric materials 32 and a high dielectric material 33 on substrate, interdigital capacitor C b is disposed at the metal level on the high dielectric material 33, and on this high dielectric material 33 again pressing one high dielectric material 34 is arranged.And on this low dielectric material layer 34, again pressing one the 4th metal level.In addition, interdigital capacitor C b also can use the configuration mode of fifth embodiment of the invention as shown in Figure 9, wherein pressing in regular turn has a high dielectric material 42 and a dielectric materials 43 on substrate, and interdigital capacitor C b is disposed at the metal level on the high dielectric material 42; Interdigital capacitor C b also can use the configuration mode of sixth embodiment of the invention as shown in figure 10, wherein pressing in regular turn has a dielectric materials 52 and a high dielectric material 53 on substrate, and interdigital capacitor C b is disposed at the metal level on the dielectric materials 52.
Comprehensively above-mentioned, the present invention proposes a kind of multilayer board that includes filter, this multilayer board uses the composite material by multilayer printed circuit board (PCB) that forms with high dielectric material and dielectric materials pressing, design has a plurality of series connection and/or shunt capacitance assembly to form a filter in this composite material by multilayer printed circuit board (PCB), wherein at least one capacitance component is the interdigital electric capacity that is arranged on the dielectric materials, and the metal electrode of this interdigital electric capacity all is positioned at same layer plane.This structure can be adjusted the metal electrode structure size of this interdigital electric capacity in advance, with electrical characteristics such as the centre frequency of accurate this filter of control and losses, and the levels bit errors problem can avoid this composite material by multilayer print circuit plates making the time.
Above-mentioned only is preferred embodiment of the present invention, when not limiting the scope of the invention with it.The i.e. equivalence of making according to claim of the present invention generally changes and revises, and does not still lose main idea of the present invention place, does not break away from the spirit and scope of the present invention, so should be considered as further embodiment of the present invention.
Claims (10)
1, a kind of multilayer board that includes filter, this multilayer board uses the composite material by multilayer printed circuit board (PCB) that forms with high dielectric material and dielectric materials pressing, comprising:
One substrate, and dispose a first metal layer on this substrate;
One high dielectric material layer, this high dielectric material layer are pressed on this first metal layer on the substrate, and dispose one second metal level on this high dielectric material layer; And
One low dielectric material layer, this low dielectric material layer are pressed on this second metal level on the high dielectric material layer, and dispose one the 3rd metal level on this low dielectric material layer;
Design has a plurality of series connection and shunt capacitance assembly to form a filter in this composite material by multilayer printed circuit board (PCB), it is characterized in that,
At least one series capacitance assembly is the interdigital electric capacity that is arranged at the 3rd metal level on this low dielectric material layer, the two ends of this interdigital electric capacity respectively have a plurality of coupling teeth, and this interdigital electric capacity only uses the 3rd metal level on this low dielectric material layer; Or
At least one series capacitance assembly is the interdigital electric capacity that is arranged at this second metal level on this high dielectric material layer, the two ends of this interdigital electric capacity respectively have a plurality of coupling teeth, and this interdigital electric capacity only uses this second metal level on this high dielectric material layer.
2, the multilayer board that includes filter as claimed in claim 1 is characterized in that, the 3rd metal level on this low dielectric material layer is pressing one low dielectric material layer again, and this disposes one the 4th metal level on pressing low dielectric material layer again.
3, the multilayer board that includes filter as claimed in claim 1 or 2 is characterized in that, this interdigital capacitances in series or be parallel to the flat capacitor with last lower metal layer includes filter to form this.
4, the multilayer board that includes filter as claimed in claim 1 or 2 is characterized in that, this interdigital electric capacity is serial or parallel connection one inductance in addition, includes filter to form this, and wherein this inductance is a coupling mutual inductance.
5, the multilayer board that includes filter as claimed in claim 4 is characterized in that, this inductance is lead formula inductance, three-dimensional helical form inductance, snail shape inductance or circuitous cabling inductance.
6, a kind of multilayer board that includes filter, this multilayer board uses the composite material by multilayer printed circuit board (PCB) that forms with high dielectric material and dielectric materials pressing, comprising:
One substrate, and dispose a first metal layer on this substrate;
One low dielectric material layer, this low dielectric material layer are pressed on this first metal layer on the substrate, and dispose one second metal level on this low dielectric material layer; And
One high dielectric material layer, this high dielectric material layer are pressed on this second metal level on the low dielectric material layer, and dispose one the 3rd metal level on this high dielectric material layer;
Design has a plurality of series connection and shunt capacitance assembly to form a filter in this composite material by multilayer printed circuit board (PCB), it is characterized in that,
At least one series capacitance assembly is the interdigital electric capacity that is arranged at the 3rd metal level on this high dielectric material layer, the two ends of this interdigital electric capacity respectively have a plurality of coupling teeth, and this interdigital electric capacity only uses the 3rd metal level on this high dielectric material layer; Or
At least one series capacitance assembly is the interdigital electric capacity that is arranged at this second metal level on this high dielectric material layer, the two ends of this interdigital electric capacity respectively have a plurality of coupling teeth, and this interdigital electric capacity only uses this second metal level on this high dielectric material layer.
7, the multilayer board that includes filter as claimed in claim 6 is characterized in that, the 3rd metal level on this high dielectric material layer is pressing one high dielectric material layer again, and this disposes one the 4th metal level on pressing high dielectric material layer again.
As claim 6 or the 7 described multilayer boards that include filter, it is characterized in that 8, this interdigital capacitances in series or be parallel to the flat capacitor with last lower metal layer includes filter to form this.
As claim 6 or the 7 described multilayer boards that include filter, it is characterized in that 9, this interdigital electric capacity is serial or parallel connection one inductance in addition, includes filter to form this, wherein this inductance is a coupling mutual inductance.
10, the multilayer board that includes filter as claimed in claim 9 is characterized in that, this inductance is lead formula inductance, three-dimensional helical form inductance, snail shape inductance or circuitous cabling inductance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101344996A CN100515159C (en) | 2005-12-15 | 2005-12-15 | Laminated printing circuit board containing filter therein |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101344996A CN100515159C (en) | 2005-12-15 | 2005-12-15 | Laminated printing circuit board containing filter therein |
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| Publication Number | Publication Date |
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| CN1984529A CN1984529A (en) | 2007-06-20 |
| CN100515159C true CN100515159C (en) | 2009-07-15 |
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| CNB2005101344996A Expired - Fee Related CN100515159C (en) | 2005-12-15 | 2005-12-15 | Laminated printing circuit board containing filter therein |
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| KR101771749B1 (en) * | 2012-12-28 | 2017-08-25 | 삼성전기주식회사 | Inductor |
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