CN219226273U

CN219226273U - Heat conduction gasket for packaging chip

Info

Publication number: CN219226273U
Application number: CN202223377804.2U
Authority: CN
Inventors: 张立伟
Original assignee: Suzhou Microcrystalline Electronics Co ltd
Current assignee: Suzhou Microcrystalline Electronics Co ltd
Priority date: 2022-12-16
Filing date: 2022-12-16
Publication date: 2023-06-20
Anticipated expiration: 2032-12-16

Abstract

The utility model discloses a heat conduction gasket for packaging chips, which comprises a gasket body, wherein a plurality of heat conduction grooves are uniformly formed in the surface of the gasket body, a heat conduction mechanism is arranged in each heat conduction groove, the gasket body is of a square structure, ventilation grooves are formed in the lower end of the outer wall of the gasket body, the ventilation grooves are distributed at equal intervals, the ventilation grooves penetrate through the gasket body and transversely and longitudinally intersect, a cylindrical heat exchange cavity is formed by the intersecting points, and the tail end of each heat conduction mechanism extends into the heat exchange cavity. According to the utility model, the top surface of the heat conducting gasket is provided with the heat conducting groove, the heat conducting mechanism is arranged in the heat conducting groove to downwards guide out heat, the heat is guided out to the heat exchange column at the tail end of the heat conducting mechanism after being guided out, the heat on the heat exchange column is quickly carried out after air in the air guiding groove circulates, the heat conducting mechanism and the heat conducting gasket are cooled, and the heat conducting groove is filled with heat conducting silicone grease to reduce gaps between the heat conducting mechanism and the chip, so that the heat conducting efficiency is improved, the heat conducting persistence of the heat conducting gasket is ensured, and the heat conducting effect is improved.

Description

Heat conduction gasket for packaging chip

Technical Field

The utility model relates to the technical field of chips, in particular to a heat conduction gasket for packaging a chip.

Background

Thermally conductive gaskets are filled air gaps between a heat-generating device and a heat sink or metal base, whose flexible, resilient characteristics enable it to be used to cover very uneven surfaces. Heat is conducted from the separate device or the entire PCB to the metal housing or diffusion plate, thereby improving the efficiency and use of the heat generating electronic components.

The heat conduction gasket of current encapsulation chip improves the cooling effect through laminating on the chip, and the heat conduction gasket can derive the partial heat in the chip, but the heat conduction gasket is deriving the back with the heat from the chip, and the heat gathers in the heat conduction gasket, increases along with the time, and its effect of heat conduction continuously descends, and the persistence of heat conduction is not strong. A thermally conductive pad for packaging a chip is provided.

Disclosure of Invention

(one) solving the technical problems

Aiming at the defects of the prior art, the utility model provides a heat conduction gasket for packaging chips, which solves the problems that: the heat conduction gasket of current encapsulation chip improves the cooling effect through laminating on the chip, and the heat conduction gasket can derive the partial heat in the chip, but the heat conduction gasket is deriving the back with the heat from the chip, and the heat gathers in the heat conduction gasket, increases along with the time, and the effect of its heat conduction continuously descends, the not strong problem of persistence of heat conduction.

(II) technical scheme

In order to achieve the above purpose, the utility model is realized by the following technical scheme: the utility model provides a heat conduction gasket of encapsulation chip, includes the gasket body, a plurality of heat conduction groove has evenly been seted up on the surface of gasket body, the internally mounted of heat conduction groove has heat conduction mechanism, the gasket body is square structure and outer wall lower extreme and has all been seted up the ventilation groove, the ventilation groove sets up a plurality of and equidistance and distributes, and the ventilation groove runs through the gasket body and transversely and vertically intersect, and the intersection point forms columniform heat transfer chamber, heat conduction mechanism's end extends to in the heat transfer chamber.

As a further preferable mode of the utility model, the heat conducting mechanism comprises a heat conducting plate, a connecting column and a heat exchanging column, wherein the heat conducting plate is connected to the inner bottom of the heat conducting groove in an embedded mode, the lower end of the heat conducting plate is connected with the upper end of the connecting column, and the tail end of the connecting column extends into the heat exchanging cavity and is connected with the heat exchanging column.

As a further preferable mode of the utility model, four air guide grooves which are distributed in a ring shape are arranged on the outer wall of the heat exchange column, the air guide grooves are inwards sunken and form an arc-shaped structure, and the orientation of the air guide grooves corresponds to that of the ventilation grooves.

As a further preferable mode of the utility model, through holes are formed in the surfaces of the heat exchange columns and in the positions of the air guide grooves, the through holes form a cross-shaped structure, a plurality of first heat exchange plates and a plurality of second heat exchange plates are vertically arranged in the through holes, and the first heat exchange plates and the second heat exchange plates are alternately distributed.

As a further preferable mode of the utility model, the top of the heat conducting groove and the surfaces of the upper end of the heat conducting mechanism and the gasket body are coated with heat conducting silicone grease.

(III) beneficial effects

The utility model provides a heat conduction gasket for packaging a chip. The beneficial effects are as follows:

according to the utility model, the top surface of the heat conducting gasket is provided with the heat conducting groove, the heat conducting mechanism is arranged in the heat conducting groove to downwards guide out heat, the heat is guided out to the heat exchange column at the tail end of the heat conducting mechanism after being guided out, the heat on the heat exchange column is quickly carried out after air in the air guiding groove circulates, the heat conducting mechanism and the heat conducting gasket are cooled, the heat conducting groove is filled with heat conducting silicone grease to reduce gaps between the heat conducting mechanism and the chip, the heat conducting efficiency is improved, the heat conducting persistence of the heat conducting gasket is ensured, and the heat conducting effect is improved.

Drawings

FIG. 1 is a block diagram of a thermally conductive pad of a packaged chip according to the present utility model;

FIG. 2 is a bottom view of a thermally conductive pad of a packaged chip according to the present utility model;

FIG. 3 is a schematic diagram of the internal structure of a thermally conductive pad of a packaged chip according to the present utility model;

fig. 4 is an internal structural view of the heat exchange column according to the present utility model.

In the figure: 1. a gasket body; 2. a heat conduction groove; 3. a heat conduction mechanism; 4. a ventilation groove; 5. a heat exchange cavity; 6. a heat exchange column; 7. an air guide groove; 8. a connecting column; 9. a through hole; 10. a heat conductive plate; 11. a first heat exchange plate; 12. and a heat exchange plate II.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, the embodiment of the present utility model provides a technical solution: the utility model provides a heat conduction gasket of encapsulation chip, including gasket body 1, a plurality of heat conduction groove 2 has evenly been seted up on the surface of gasket body 1, heat conduction mechanism 3 has been installed to the internally mounted of heat conduction groove 2, the gasket body 1 is square structure and ventilation groove 4 has all been seted up to outer wall lower extreme, ventilation groove 4 sets up a plurality of and equidistance and distributes, ventilation groove 4 runs through gasket body 1 and transversely and vertically intersect, no matter what direction ventilation all can play the wind-guiding effect, can install the fan and blow cooling air to ventilation groove 4, the intersection forms columniform heat transfer chamber 5, heat conduction mechanism 3's end extends to in the heat transfer chamber 5, heat conduction mechanism 3 end cools down in heat transfer chamber 5, can derive heat fast.

Further improved, the heat conducting mechanism 3 comprises a heat conducting plate 10, a connecting column 8 and a heat exchanging column 6, the heat conducting plate 10 is embedded and connected to the inner bottom of the heat conducting groove 2, the lower end of the heat conducting plate 10 is connected with the upper end of the connecting column 8, the tail end of the connecting column 8 extends into the heat exchanging cavity 5 and is connected with the heat exchanging column 6, the heat conducting plate 10 guides heat to the heat exchanging column 6, and heat exchange is carried out between the heat exchanging column 6 and air in the heat exchanging cavity 5, so that the cooling effect is achieved. The outer wall of the heat exchange column 6 is provided with four air guide grooves 7 which are annularly distributed, the air guide grooves 7 are inwards sunken and form an arc-shaped structure, the direction of the air guide grooves 7 corresponds to the direction of the ventilation grooves 4, the air guide grooves 7 can guide air into the heat exchange column 6, the heat exchange effect is improved, meanwhile, wind resistance can be reduced, and the influence on other heat exchange columns 6 is reduced. Through holes 9 are formed in the surface of the heat exchange column 6 and located at the air guide groove 7, the through holes 9 form a cross-shaped structure, a plurality of first heat exchange plates 11 and second heat exchange plates 12 are vertically arranged in the through holes 9, the first heat exchange plates 11 and the second heat exchange plates 12 are alternately distributed, and the two heat exchange plates can improve heat exchange efficiency.

Further improved, the top of the heat conducting groove 2 and the surfaces of the upper end of the heat conducting mechanism 3 and the gasket body 1 are coated with heat conducting silicone grease, so that gaps among the heat conducting gasket, the heat conducting plate 10 and the chip are reduced.

Working principle: the heat conduction silicone grease is smeared on the surface of the heat conduction gasket, the heat conduction gasket is covered on the surface of the chip after smearing, the heat of the chip is led out to the heat conduction gasket, the heat is led downwards through the heat conduction plate 10 after leading out, cooling air flows into the heat exchange cavity 5, the cooling air contacts the surface of the heat exchange column 6 and penetrates through the through hole 9, and the heat in the heat exchange column 6 is carried out to achieve the effect of cooling.

The utility model relates to a gasket body, which comprises a gasket body, a gasket body and a gasket seat, wherein the gasket body is arranged on the gasket body; 2. a heat conduction groove; 3. a heat conduction mechanism; 4. a ventilation groove; 5. a heat exchange cavity; 6. a heat exchange column; 7. an air guide groove; 8. a connecting column; 9. a through hole; 10. a heat conductive plate; 11. a first heat exchange plate; 12. the heat exchange plate II is a general standard component or a component known by a person skilled in the art, and the structure and the principle of the heat exchange plate II are the same as those of the person skilled in the art, and the heat exchange plate II can be known by the person skilled in the art through a technical manual or through a conventional experimental method.

While the fundamental and principal features of the utility model and advantages of the utility model have been shown and described, it will be apparent to those skilled in the art that the utility model is not limited to the details of the foregoing exemplary embodiments, but may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.

Claims

1. The utility model provides a heat conduction gasket of encapsulation chip, includes gasket body (1), its characterized in that: a plurality of heat conduction grooves (2) are uniformly formed in the surface of the gasket body (1), a heat conduction mechanism (3) is arranged in the heat conduction groove (2), the gasket body (1) is of a square structure, ventilation grooves (4) are formed in the lower end of the outer wall of the gasket body, the ventilation grooves (4) are distributed at equal intervals, the ventilation grooves (4) penetrate through the gasket body (1) and are transversely and longitudinally intersected, a cylindrical heat exchange cavity (5) is formed at the intersection point, and the tail end of the heat conduction mechanism (3) extends into the heat exchange cavity (5).

2. The thermally conductive gasket of claim 1, wherein: the heat conduction mechanism (3) comprises a heat conduction plate (10), a connecting column (8) and a heat exchange column (6), wherein the heat conduction plate (10) is embedded and connected to the inner bottom of the heat conduction groove (2), the lower end of the heat conduction plate (10) is connected with the upper end of the connecting column (8), and the tail end of the connecting column (8) extends into the heat exchange cavity (5) and is connected with the heat exchange column (6).

3. The thermally conductive gasket for a packaged chip of claim 2, wherein: four air guide grooves (7) which are annularly distributed are formed in the outer wall of the heat exchange column (6), the air guide grooves (7) are inwards recessed and form an arc-shaped structure, and the direction of the air guide grooves (7) corresponds to the ventilating grooves (4).

4. A thermally conductive gasket for a packaged chip as claimed in claim 3, wherein: the heat exchange column is characterized in that through holes (9) are formed in the surface of the heat exchange column (6) and located at the air guide groove (7), the through holes (9) form a cross structure, a plurality of first heat exchange plates (11) and second heat exchange plates (12) are vertically arranged in the through holes (9), and the first heat exchange plates (11) and the second heat exchange plates (12) are alternately distributed.

5. The thermally conductive gasket of claim 1, wherein: the top of the heat conduction groove (2) and the surfaces of the upper end of the heat conduction mechanism (3) and the gasket body (1) are coated with heat conduction silicone grease.