CN210226071U - Combined type adjusting heat dissipation structure - Google Patents
Combined type adjusting heat dissipation structure Download PDFInfo
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- CN210226071U CN210226071U CN201920932537.XU CN201920932537U CN210226071U CN 210226071 U CN210226071 U CN 210226071U CN 201920932537 U CN201920932537 U CN 201920932537U CN 210226071 U CN210226071 U CN 210226071U
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- heating panel
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Abstract
The utility model discloses a modular adjust heat radiation structure, including circuit board, power consumption component, first heating panel, second heating panel, air-cooler, power consumption component sets up on the circuit board, first heating panel, second heating panel are located respectively the circuit board both sides, the air-cooler with the circuit board cooperatees, still includes the third heating panel, third heating panel one end with first heating panel is connected, the third heating panel other end with the second heating panel is connected. The utility model discloses a structure setting of trilateral heating panel, effectual increase with the area of contact between the air, improved the radiating efficiency, increased the life of product, improved the safe in utilization of product, very accord with the needs of modern production life.
Description
Technical Field
The utility model relates to a heat radiation structure especially relates to a modular adjust heat radiation structure.
Background
The circuit is often in normal course of the work, and it is fixed with heating device and metal fin contact often, and the heat that the heating device produced conducts the air fast through the fin to realize reducing the purpose of heating device surface temperature, current heat radiation structure often can add the fan on the machine simultaneously, in order to reach the purpose of accelerating circulation of air. However, the contact area between the existing heat dissipation structure and air is small, and the heat dissipation plate in the existing heat dissipation structure is usually only arranged at the edge of the circuit board or at the bottom of the circuit board, which results in low heat dissipation efficiency.
Disclosure of Invention
The utility model discloses the area of contact to the heat radiation structure that exists among the prior art and air is less, and the heating panel among the current heat radiation structure only sets up in the bottom of circuit board edge or circuit board usually, and the radiating efficiency defect such as comparatively low provides a new combination formula and adjusts heat radiation structure.
In order to solve the technical problem, the utility model discloses a following technical scheme realizes:
the utility model provides a modular heat radiation structure of adjusting, includes circuit board, power consumption component, first heating panel, second heating panel, air-cooler, power consumption component sets up on the circuit board, first heating panel, second heating panel are located respectively the circuit board both sides, the air-cooler with the circuit board cooperatees, still includes the third heating panel, third heating panel one end with first heating panel is connected, the third heating panel other end with the second heating panel is connected.
The first heat dissipation plate and the second heat dissipation plate are arranged on the two sides of the circuit board respectively, so that heat generated by the electric element is quickly conducted to the air, and the purpose of reducing the surface temperature of the electric element is achieved. The air cooler is arranged to be matched with the circuit board so as to achieve the purpose of accelerating air circulation and improve the heat dissipation efficiency. The third heat dissipation plate is additionally arranged on the basis, so that the contact area of the third heat dissipation plate and air is increased, and the heat dissipation efficiency of the product is further improved. The arrangement of the heat dissipation plates in the three directions enables the generated heat to be diffused to different directions, and the heat diffusion speed is increased.
The utility model discloses a structure setting of trilateral heating panel, effectual increase with the area of contact between the air, improved the radiating efficiency, increased the life of product, improved the safe in utilization of product, very accord with the needs of modern production life.
Preferably, the third heat dissipation plate comprises a connecting piece and a heat dissipation piece, one end of the heat dissipation piece is connected with the first heat dissipation plate through the connecting piece, the other end of the heat dissipation piece is connected with the second heat dissipation plate through the connecting piece, and the heat dissipation piece is movably connected with the connecting piece.
The third heat dissipation plate is divided into the connecting piece and the heat dissipation piece, and the heat dissipation piece and the connecting piece are movably connected, so that corresponding height adjustment can be performed according to the height of the electric element which is contacted as required, the optimal heat dissipation position is determined, and the heat dissipation efficiency is improved.
Preferably, the combined type adjusting heat dissipation structure further comprises a first positioning element, wherein a plurality of first positioning holes are formed in the top of the first heat dissipation plate and the top of the second heat dissipation plate in an array mode, and the first positioning element penetrates through the connecting piece to be matched with the first positioning holes.
The first positioning piece is arranged to penetrate through the connecting piece to be matched with the first positioning hole, and the fixing connection effect is achieved. The first positioning holes are formed in the top portions of the first heat dissipation plate and the second heat dissipation plate in an array mode, so that the first positioning holes are matched with the heating positions of the electric elements more accurately, and the heat dissipation efficiency is further improved.
Preferably, the combined type adjustable heat dissipation structure further comprises a second positioning part, wherein a plurality of second positioning holes are vertically formed in two sides of the heat dissipation part, and the second positioning part penetrates through the connecting part to be matched with the second positioning holes.
The second positioning piece is arranged to penetrate through the connecting piece to be matched with the second positioning hole, so that the fixing connection effect is achieved. The second positioning holes are vertically formed in the two sides of the radiating piece, so that the purpose of adjusting the height of the radiating piece is achieved, the gap between the radiating piece and the electric element is reduced, and the radiating efficiency is improved.
Preferably, in the above combined type adjusting heat dissipation structure, the bottom of the connecting member is provided with a limiting groove, and the limiting groove is matched with the top of the second heat dissipation plate.
Be provided with spacing recess in the connecting piece bottom in order to cooperate with second heating panel top, play the location guide effect, ensure that the connecting piece can follow horizontal direction rectilinear movement all the time, make accommodation process more convenient, accurate.
Preferably, in the above combined type adjusting heat dissipation structure, the third heat dissipation plate is movably connected to the first heat dissipation plate and the second heat dissipation plate.
The third heat dissipation plate is movably connected with the first heat dissipation plate and the second heat dissipation plate so as to adjust the specific position of the third heat dissipation plate according to actual conditions, so that the third heat dissipation plate is more accurately matched with the heating position of the electric element, and the heat dissipation efficiency is further improved.
Preferably, in the above-mentioned combined type adjustable heat dissipation structure, the first heat dissipation plate, the second heat dissipation plate, and the third heat dissipation plate are all provided with a plurality of heat dissipation fins.
The first heat dissipation plate, the second heat dissipation plate and the third heat dissipation plate are respectively provided with a plurality of heat dissipation fins, so that on one hand, the heat dissipation area is increased, and the heat dissipation efficiency is improved, on the other hand, the heat dissipation fins arranged on the third heat dissipation plate and the heat dissipation fins arranged on the inner sides of the first heat dissipation plate and the second heat dissipation plate are all positioned in the air channel, and the heat dissipation efficiency can be further improved.
Preferably, the combined type adjusting heat dissipation structure further includes an insulating member, and the first heat dissipation plate is connected to the third heat dissipation plate through the insulating member.
The insulating part is arranged between the first heat dissipation plate and the third heat dissipation plate so as to prevent the metal heat dissipation plate from influencing the insulating performance of the circuit and improve the use safety of the product.
Preferably, the above-mentioned combined type adjusting heat dissipation structure further includes an elastic heat conducting member, and the electric element is connected to the bottom of the third heat dissipation plate through the elastic heat conducting member.
The elastic heat conducting piece is arranged for filling a gap between the electric element and the third heat dissipation plate, so that the heat dissipation efficiency is improved, meanwhile, the elastic heat conducting piece has good heat conduction performance, the heat dissipation efficiency is further improved, and the elastic heat conducting piece also has a good damping effect.
Drawings
Fig. 1 is a schematic structural view of a combined type adjustable heat dissipation structure of the present invention;
fig. 2 is a sectional view of a combined type heat dissipation adjusting structure of the present invention;
fig. 3 is an exploded view of a third heat dissipating plate according to the present invention.
Detailed Description
The invention will be described in further detail with reference to the accompanying figures 1-3 and the detailed description, but they are not intended to limit the invention:
example 1
The utility model provides a modular heat radiation structure of adjusting, includes circuit board 5, consumer 11, first heating panel 3, second heating panel 7, air-cooler 1, consumer 11 sets up on circuit board 5, first heating panel 3, second heating panel 7 are located respectively 5 both sides of circuit board, air-cooler 1 with circuit board 5 cooperatees, still includes third heating panel 2, 2 one end of third heating panel with first heating panel 3 is connected, the 2 other ends of third heating panel with second heating panel 7 is connected.
During the use, as shown in fig. 1-2, at first with consumer 11 setting on circuit board 5, then with first heating panel 3, second heating panel 7 sets up respectively in circuit board 5 both sides, then set up third heating panel 2 in consumer 11 top, in the circular telegram use, consumer 11 can give out a large amount of heats owing to long-time work, consumer 11 and first heating panel 3, second heating panel 7, third heating panel 2 cooperate, in the heat that produces oneself conducts the air fast through the heating panel, thereby realize reducing consumer 11 surface temperature's purpose, simultaneously air-cooler 1 can accelerate the circulation of air, further improve the radiating efficiency, thereby the effectual life who increases the product, the safety in utilization of product has been guaranteed.
Preferably, the third heat dissipation plate 2 includes a connector 21 and a heat dissipation member 22, one end of the heat dissipation member 22 is connected to the first heat dissipation plate 3 through the connector 21, the other end of the heat dissipation member 22 is connected to the second heat dissipation plate 7 through the connector 21, and the heat dissipation member 22 is movably connected to the connector 21.
Preferably, the heat sink further comprises a first positioning element 6, a plurality of first positioning holes 31 are formed in the top of each of the first heat sink 3 and the second heat sink 7 in an array, and the first positioning element 6 penetrates through the connecting element 21 to be matched with the first positioning holes 31.
Preferably, the heat sink further comprises a second positioning part 9, a plurality of second positioning holes 221 are vertically formed in two sides of the heat sink 22, and the second positioning part 9 penetrates through the connecting part 21 to be matched with the second positioning holes 221.
Preferably, the bottom of the connecting member 21 is provided with a limiting groove 211, and the limiting groove 211 is matched with the top of the second heat dissipation plate 7.
Preferably, the third heat sink 2 is movably connected to the first heat sink 3 and the second heat sink 7.
Preferably, the first heat dissipation plate 3, the second heat dissipation plate 7, and the third heat dissipation plate 2 are all provided with a plurality of heat dissipation fins 4.
Preferably, the heat sink further includes an insulating member 8, and the first heat sink 3 is connected to the third heat sink 2 through the insulating member 8.
Preferably, the heat sink further comprises an elastic heat conducting member 10, and the electric element 11 is connected to the bottom of the third heat dissipation plate 2 through the elastic heat conducting member 10.
In use, as shown in fig. 1-2, the electric element 11 is first disposed on the circuit board 5, then the first heat dissipation plate 3 and the second heat dissipation plate 7 are disposed on two sides of the circuit board 5, and then the third heat dissipation plate 2 is disposed above the electric element 11. In the process, different second positioning holes 221 vertically arranged on two sides of the heat dissipation member 22 can be selected according to the height of the actually contacted electric element 11 to adjust the longitudinal position of the third heat dissipation plate 2, the second positioning member 9 penetrates through the connecting member 21 to be matched with the second positioning holes 221 to realize fixation, meanwhile, different first positioning holes 31 can be selected according to the heating position of the electric element 11 to adjust the transverse position of the third heat dissipation plate 2, and the first positioning member 6 penetrates through the connecting member 21 to be matched with the first positioning holes 31 to realize fixation, so that the optimal heat dissipation position is determined, and the heat dissipation efficiency is improved. In the circular telegram use, consumer 11 can give out a large amount of heats owing to work for a long time, consumer 11 and first heating panel 3, second heating panel 7, third heating panel 2 cooperatees, in 4 quick conduction of a plurality of heat dissipation fins that set up on the heating panel with the heat that self produced are to the air, thereby realize reducing the purpose of consumer 11 surface temperature, air-cooler 1 can accelerate the circulation of air simultaneously, further improve the radiating efficiency, thereby the effectual life who increases the product, the safety in utilization of product has been guaranteed.
In short, the above description is only a preferred embodiment of the present invention, and all the equivalent changes and modifications made within the scope of the claims of the present invention should be covered by the present invention.
Claims (9)
1. The utility model provides a modular heat radiation structure of adjusting, includes circuit board (5), uses electric element (11), first heating panel (3), second heating panel (7), air-cooler (1), use electric element (11) to set up on circuit board (5), first heating panel (3), second heating panel (7) are located respectively circuit board (5) both sides, air-cooler (1) with circuit board (5) cooperate, its characterized in that: the LED lamp further comprises a third heat dissipation plate (2), one end of the third heat dissipation plate (2) is connected with the first heat dissipation plate (3), and the other end of the third heat dissipation plate (2) is connected with the second heat dissipation plate (7).
2. The combined adjustable heat dissipation structure of claim 1, wherein: third heating panel (2) are including connecting piece (21), radiating piece (22) one end is passed through connecting piece (21) with first heating panel (3) are connected, radiating piece (22) other end passes through connecting piece (21) with second heating panel (7) are connected, radiating piece (22) with connecting piece (21) move the connection.
3. The combined adjustable heat dissipation structure of claim 2, wherein: still include first locating piece (6), first heating panel (3), second heating panel (7) top all are provided with a plurality of first locating holes (31) in the array, first locating piece (6) pass connecting piece (21) with first locating hole (31) cooperate.
4. The combined adjustable heat dissipation structure of claim 2, wherein: the heat dissipation structure is characterized by further comprising a second positioning piece (9), wherein a plurality of second positioning holes (221) are vertically formed in two sides of the heat dissipation piece (22), and the second positioning piece (9) penetrates through the connecting piece (21) to be matched with the second positioning holes (221).
5. The combined adjustable heat dissipation structure of claim 2, wherein: the bottom of the connecting piece (21) is provided with a limiting groove (211), and the limiting groove (211) is matched with the top of the second heat dissipation plate (7).
6. The combined adjustable heat dissipation structure of claim 1, wherein: the third heat dissipation plate (2) is movably connected with the first heat dissipation plate (3) and the second heat dissipation plate (7).
7. The combined adjustable heat dissipation structure of claim 1, wherein: the first heat dissipation plate (3), the second heat dissipation plate (7) and the third heat dissipation plate (2) are all provided with a plurality of heat dissipation fins (4).
8. The combined adjustable heat dissipation structure of claim 1, wherein: the heat dissipation plate is characterized by further comprising an insulating piece (8), and the first heat dissipation plate (3) is connected with the third heat dissipation plate (2) through the insulating piece (8).
9. The combined adjustable heat dissipation structure of claim 1, wherein: the heat dissipation device further comprises an elastic heat conduction piece (10), and the electric element (11) is connected with the bottom of the third heat dissipation plate (2) through the elastic heat conduction piece (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920932537.XU CN210226071U (en) | 2019-06-20 | 2019-06-20 | Combined type adjusting heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920932537.XU CN210226071U (en) | 2019-06-20 | 2019-06-20 | Combined type adjusting heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210226071U true CN210226071U (en) | 2020-03-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920932537.XU Active CN210226071U (en) | 2019-06-20 | 2019-06-20 | Combined type adjusting heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210226071U (en) |
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2019
- 2019-06-20 CN CN201920932537.XU patent/CN210226071U/en active Active
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