CN216449140U - Adjustable temperature control assembly and modular error code tester - Google Patents
Adjustable temperature control assembly and modular error code tester Download PDFInfo
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- CN216449140U CN216449140U CN202123161112.XU CN202123161112U CN216449140U CN 216449140 U CN216449140 U CN 216449140U CN 202123161112 U CN202123161112 U CN 202123161112U CN 216449140 U CN216449140 U CN 216449140U
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Abstract
The utility model provides an adjustable temperature control assembly and a modularized error code tester, belonging to the technical field of communication. This control by temperature change assembly with adjustable is used for the error code tester, the control by temperature change assembly includes: the temperature control seat has a temperature adjusting function, a refrigerating piece is arranged on the top surface of the temperature control seat, and the refrigerating piece is attached to the heat dissipation bottom surface of the optical module to be tested, which is connected with the error code tester; the box body bottom plate is fixedly connected with the shell of the error code tester and is positioned below the temperature control seat; and the guide rail assembly is arranged between the temperature control seat and the box body bottom plate and used for realizing movable connection between the temperature control seat and the box body bottom plate so as to adjust the contact area between the refrigerating sheet and the optical module to be detected. The adjustable temperature control assembly and the modular error code tester can improve the thermal conductivity and improve the testing efficiency.
Description
Technical Field
The utility model relates to the technical field of communication, in particular to an adjustable temperature control assembly and a modular error code tester.
Background
The semiconductor refrigerator is a semiconductor device composed of a plurality of tiny and effective heat pumps, heat is transferred from one surface of a semiconductor refrigeration piece to the other surface by applying a low-voltage direct-current power supply, so that the phenomenon that one surface is heated and the other surface is cooled is generated, the phenomenon is completely reversible, the heat is transferred to the opposite direction by changing the polarity of the power supply, and a system needing heating and cooling can be manufactured by utilizing the phenomenon. When the error code tester carries out temperature cycle test on the optical module, the semiconductor refrigerating sheet conducts heat to the optical module through a material with high heat conductivity, and therefore three-temperature test of the optical module is achieved. The semiconductor refrigerator has the advantages of small volume, light weight, no noise, no electromagnetic interference and the like, and is very suitable for large-scale production so as to be applied to an error code tester.
In practical application, the heat dissipation bottom surface of the optical module is attached to the semiconductor refrigeration piece to conduct heat, and the semiconductor refrigeration piece is installed on the heat sink. When conducting heat, the heat sink and the optical module need to be in close contact, the temperature rising and falling speed of the module is directly influenced by the contact tightness, and in order to enhance the contact tightness, the contact area of the heat sink and the optical module needs to be increased as much as possible. The MSA general protocol (optical module general protocol) specifies the determined height and width of the optical module, while the length only specifies the maximum length, and various manufacturers can specify different lengths according to the design. As shown in fig. 1, since the heat dissipation bottom surface of the optical module is a plane recessed relative to the operating end thereof, in order to avoid interference between the heat sink and the optical modules with different lengths, it is common to manufacture the heat sink according to the optical module with the minimum length adapted to the error code tester, but in this way, when the error code tester needs to be connected to a longer optical module, the heat conduction efficiency is affected due to the small contact area between the semiconductor cooling plate and the optical module, and the test efficiency is further affected.
SUMMERY OF THE UTILITY MODEL
It is an object of the first aspect of the present invention to provide an adjustable temperature control assembly, which can improve the thermal conductivity and improve the testing efficiency.
It is a further object of the utility model to improve the ease of adjustment.
It is an object of the second aspect of the present invention to provide a modular error code tester including the adjustable temperature control assembly.
In particular, the present invention provides an adjustable temperature control assembly for an error code tester, the temperature control assembly comprising:
the temperature control seat has a temperature adjusting function, a refrigerating piece is arranged on the top surface of the temperature control seat, and the refrigerating piece is attached to the heat dissipation bottom surface of the optical module to be tested, which is connected with the error code tester;
the box body bottom plate is fixedly connected with the shell of the error code tester and is positioned below the temperature control seat; and
and the guide rail assembly is arranged between the temperature control seat and the box body bottom plate and used for realizing movable connection between the temperature control seat and the box body bottom plate so as to adjust the contact area between the refrigerating sheet and the optical module to be detected.
Optionally, the width of the refrigeration piece is greater than the width of the heat dissipation bottom surface of the optical module to be tested, the guide rail assembly extends along the length direction of the optical module to be tested, and is configured to adjust the relative position of the temperature control seat and the box bottom plate according to the length of the heat dissipation bottom surface of the currently connected optical module to adapt the position of the refrigeration piece to the length of the heat dissipation bottom surface of the currently connected optical module to be tested.
Optionally, the adjustable temperature control assembly further comprises:
and the motor is connected with the guide rail assembly and used for controlling the stroke of the guide rail assembly according to the length of the heat dissipation bottom surface of the currently connected optical module to be tested.
Optionally, the motor is configured to have a default output state to control the position of the refrigeration piece to be adapted to the length of the heat dissipation bottom surface of the universal optical module to be tested.
Optionally, the refrigeration piece is a semiconductor refrigeration piece.
Optionally, the temperature-controlled base comprises:
the water cooling module is used for circulating cooling liquid; and
and the heat sink structure is arranged on the top surface of the water cooling module, and the refrigeration sheet is fixed on the top surface of the heat sink structure.
Optionally, the water cooling module spans the width area of a plurality of optical modules to be tested of the error code tester, a plurality of heat sink structures are arranged above the water cooling module, and each heat sink structure corresponds to one optical module to be tested.
Optionally, the temperature-controlled base further comprises:
and the limiting structures are fixed above each heat sink structure and used for limiting the positions of the optical module to be tested in the width direction and the height direction.
Optionally, the rail assembly comprises:
the limiting strips are fixed at the bottom plate of the box body and extend along the length direction of the optical module to be tested, and limiting grooves are formed in the tops of the limiting strips; and
and the limiting blocks corresponding to the limiting strips are fixed at the bottom of the temperature control seat, and limiting convex blocks matched with the limiting guide grooves are arranged at the bottoms of the limiting blocks.
Particularly, the utility model also provides a modular error code tester which comprises the adjustable temperature control assembly.
According to one embodiment of the utility model, the temperature control seat and the box body bottom plate are slidably connected, so that the position of the refrigerating sheet on the temperature control seat relative to the optical module to be tested can be adjusted by sliding the temperature control seat, that is, the contact area between the refrigerating sheet and the heat dissipation bottom surface of the optical module to be tested can be controlled, and the optimal contact area between the refrigerating sheet and the heat dissipation bottom surface of the optical module to be tested is ensured, thereby improving the thermal conductivity, reducing the temperature rise and fall time, further reducing the cost and improving the test efficiency.
According to an embodiment of the present invention, the adjustable temperature control assembly further includes a motor connected to the rail assembly, for controlling a stroke of the rail assembly according to a length of the heat dissipation bottom surface of the currently connected optical module to be tested. The automatic adaptability adjustment of the temperature control seat for different types of optical modules to be tested can be realized by arranging the motor, so that the contact area between the refrigeration sheet and the heat dissipation bottom surface of the current optical module to be tested is always kept to be the largest, the optical module to be tested is ensured to be in good contact with the refrigeration sheet, and the temperature rise and fall time is shortened.
The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments thereof, taken in conjunction with the accompanying drawings.
Drawings
Some specific embodiments of the utility model will be described in detail hereinafter, by way of illustration and not limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:
FIG. 1 is a schematic structural diagram of an optical module under test;
fig. 2 is a schematic diagram of a partial structure of an error tester according to an embodiment of the utility model;
FIG. 3 is an enlarged view of a portion of FIG. 1 at A;
FIG. 4 is a top view of an adjustable temperature control assembly according to one embodiment of the present invention;
FIG. 5 is a cross-sectional view taken at B-B of FIG. 4;
FIG. 6 is a schematic view of a first view angle of a temperature control base of an adjustable temperature control assembly according to an embodiment of the present invention;
FIG. 7 is a second perspective view of a temperature control base of an adjustable temperature control assembly according to an embodiment of the present invention.
Reference numerals:
100-temperature control assembly, 10-temperature control seat, 11-refrigeration piece, 20-box bottom plate, 30-guide rail component, 31-limit strip, 32-limit block, 12-water cooling module, 13-heat sink structure, 14-limit structure, 40-optical module to be tested, 41-heat dissipation bottom surface, 200-error code tester, 201-test board
Detailed Description
Fig. 2 is a schematic diagram of a partial structure of an error tester 200 according to an embodiment of the present invention. Fig. 3 is a partially enlarged view of a portion a in fig. 1. FIG. 4 is a top view of an adjustable temperature control assembly 100 according to one embodiment of the present invention. Fig. 5 is a sectional view at B-B in fig. 4. As shown in fig. 2, the adjustable temperature control assembly 100 is used for an error code tester 200, the error code tester 200 is provided with a test board 201, a front end of the test board 201 is connected to the optical module 40 to be tested, and the adjustable temperature control assembly 100 is disposed below the optical module 40 to be tested. As shown in fig. 2, in one embodiment, the thermal control assembly 100 includes a thermal control base 10, a cabinet floor 20, and a rail assembly 30. The temperature control base 10 has a temperature adjusting function, and a top surface of the temperature control base 10 is provided with a refrigerating sheet 11 (see fig. 5), and optionally, the refrigerating sheet 11 is a semiconductor refrigerating sheet 11, that is, the temperature control base 10 includes a semiconductor refrigerator for temperature adjustment. The refrigerating plate 11 is attached to the heat dissipation bottom surface 41 of the optical module to be tested 40 connected to the error code tester 200. The box bottom plate 20 is fixedly connected with the casing of the error code tester 200 and is located below the temperature control base 10. As shown in fig. 5, the guide rail assembly 30 is disposed between the temperature control seat 10 and the box bottom plate 20, and is used for realizing movable connection between the temperature control seat 10 and the box bottom plate 20, so as to adjust a contact area between the cooling fin 11 and the optical module 40 to be measured.
In this embodiment, the temperature control seat 10 and the box bottom plate 20 are slidably connected, and the position of the cooling fin 11 on the temperature control seat 10 relative to the optical module 40 to be tested can be adjusted by sliding the temperature control seat 10, that is, the contact area between the cooling fin 11 and the heat dissipation bottom surface 41 of the optical module 40 to be tested can be controlled, and the best contact area between the cooling fin 11 and the heat dissipation bottom surface 41 of the optical module 40 to be tested is ensured, so that the thermal conductivity is improved, the temperature rise and fall time is reduced, the cost is reduced, and the test efficiency is improved.
Fig. 6 is a schematic structural diagram of a first view angle of the temperature control base 10 of the adjustable temperature control assembly 100 according to an embodiment of the utility model. The temperature controlled base 10 at the far left in fig. 6 has the spacing structure 14 omitted. Further, as shown in fig. 6, the width of the cooling fin 11 is greater than the width of the heat dissipation bottom surface 41 of the optical module 40 to be tested, the guide rail assembly 30 extends along the length direction of the optical module 40 to be tested (see fig. 4), and is configured to adjust the relative position of the temperature control base 10 and the box bottom plate 20 according to the length of the heat dissipation bottom surface 41 of the currently connected optical module 40 to adapt the position of the cooling fin 11 to the length of the heat dissipation bottom surface 41 of the currently connected optical module 40 to be tested.
As shown in table 1 below, by testing 3 different types of optical modules 40 to be tested, the cooling time (the second column in table 1) of the optical module 40 to be tested when the heat sink is of the standard length in the prior art is used and the cooling time (the third column in table 1) of the optical module 40 to be tested after the adjustable temperature control base 10 of the above embodiment is used are recorded, and are compared as follows. It can be seen that the temperature reduction time of the adjustable temperature control assembly 100 in this embodiment is greatly shortened, and the heat conduction efficiency can be significantly improved.
TABLE 1
| Optical module under |
Standard length cooling time | Adjusting length of cooling time |
| Cisco | 180S | 90S |
| WTD | 256S | 120S |
| Arista | 120S | 80S |
In a further embodiment, the adjustable temperature control assembly 100 further includes a motor (not shown) connected to the rail assembly 30 for controlling a stroke of the rail assembly 30 according to a length of the heat dissipation bottom surface 41 of the currently connected optical module 40 to be tested. Specifically, by counting and storing the data of each optical module to be tested 40 adapted by the error code tester 200 in software, when the current model of the optical module to be tested 40 is detected, the controller can read the data of the optical module to be tested 40, such as the length information of the heat dissipation bottom surface 41, and then control the motor to perform corresponding output, so as to adapt to different types of optical modules. In one embodiment, the motor is configured to control the position of the cooling plate 11 to be adapted to the length of the heat dissipation bottom surface 41 of the universal optical module to be tested 40 according to the default output state of the motor. Of course, in other embodiments, the length information of the heat dissipation bottom surface 41 of the current optical module to be tested 40 may also be manually input, so that the controller adjusts the output of the motor according to the input information, so that the contact area between the cooling fins 11 and the heat dissipation bottom surface 41 of the optical module to be tested 40 is kept to be the maximum.
In this embodiment, the temperature control base 10 can be adjusted automatically and adaptively to different types of optical modules 40 to be tested by setting the motor, so that the contact area between the cooling plate 11 and the heat dissipation bottom surface 41 of the current optical module 40 to be tested is always kept the largest, thereby ensuring that the optical module 40 to be tested and the cooling plate 11 are in good contact, and reducing the temperature rise and fall time.
In one embodiment, as shown in FIG. 5, the thermal controlled base 10 includes a water cooled module 12 and a heat sink structure 13. The water cooling module 12 is used for circulating cooling liquid. The heat sink structure 13 is disposed on the top surface of the water cooling module 12, and the top surface thereof is fixed with the refrigeration sheet 11.
Further, as shown in fig. 2, a plurality of test boards 201 are arranged in the width direction of the error code tester 200, and the front end of each test board 201 is inserted with the optical module 40 to be tested. In one embodiment, the water cooling module 12 spans the width area of the optical modules 40 to be tested of the error code tester 200, and a plurality of heat sink structures 13 are disposed above the water cooling module 12, where each heat sink structure 13 corresponds to one optical module 40 to be tested.
In a further embodiment, as shown in fig. 6, the temperature-controlled socket 10 further includes a limiting structure 14 fixed above each heat sink structure 13 for limiting the position of the optical module 40 to be tested in the width direction and the height direction.
Fig. 7 is a schematic structural diagram of a second view angle of the temperature control base 10 of the adjustable temperature control assembly 100 according to an embodiment of the utility model. In one embodiment, as shown in fig. 5, the guide rail assembly 30 includes a plurality of stopper bars 31 and stoppers 32 corresponding to each stopper bar 31 (see fig. 7). Each limiting strip 31 is fixed at the bottom plate 20 of the box body and extends along the length direction of the optical module 40 to be tested, and a limiting groove is formed in the top of each limiting strip 31. Each limiting block 32 is fixed at the bottom of the temperature control base 10, and the bottom of the limiting block 32 is provided with a limiting convex block matched with the limiting guide groove. In this embodiment, the cross sections of the limiting groove and the limiting cam are rectangular, and in other embodiments not shown, the limiting groove and the limiting cam can be arranged in other shapes. Of course, the form of the track assembly 30 is not limited to the structure of the present embodiment, and a roller type track and the like commonly used in the art may be used.
The utility model also provides a modular error code tester 200, which comprises the adjustable temperature control assembly 100 in any embodiment and any combination of the embodiments.
The error code tester 200 of this embodiment sets the temperature control seat 10 and the box bottom plate 20 to be slidably connected, and the position of the refrigeration sheet 11 on the temperature control seat 10 relative to the optical module 40 to be tested can be adjusted by sliding the temperature control seat 10, that is, the contact area between the refrigeration sheet 11 and the heat dissipation bottom surface 41 of the optical module 40 to be tested can be controlled, and the best contact area between the refrigeration sheet 11 and the heat dissipation bottom surface 41 is ensured, so that the thermal conductivity is improved, the temperature rise and fall time is reduced, the cost is reduced, and the test efficiency is improved.
Thus, it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the utility model have been illustrated and described in detail herein, many other variations or modifications consistent with the principles of the utility model may be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the utility model. Accordingly, the scope of the utility model should be understood and interpreted to cover all such other variations or modifications.
Claims (10)
1. An adjustable temperature control assembly for an error code tester, the temperature control assembly comprising:
the temperature control seat has a temperature adjusting function, a refrigerating piece is arranged on the top surface of the temperature control seat, and the refrigerating piece is attached to the heat dissipation bottom surface of the optical module to be tested, which is connected with the error code tester;
the box body bottom plate is fixedly connected with the shell of the error code tester and is positioned below the temperature control seat; and
and the guide rail assembly is arranged between the temperature control seat and the box body bottom plate and used for realizing movable connection between the temperature control seat and the box body bottom plate so as to adjust the contact area between the refrigerating sheet and the optical module to be detected.
2. The adjustable temperature control assembly of claim 1,
the width of the refrigeration piece is larger than the width of the heat dissipation bottom surface of the optical module to be tested, the guide rail assembly extends along the length direction of the optical module to be tested and is configured to adjust the relative position of the temperature control seat and the box body bottom plate according to the length of the heat dissipation bottom surface of the currently connected optical module to be tested so as to adapt the position of the refrigeration piece to the length of the heat dissipation bottom surface of the currently connected optical module to be tested.
3. The adjustable temperature control assembly of claim 2, further comprising:
and the motor is connected with the guide rail assembly and used for controlling the stroke of the guide rail assembly according to the length of the heat dissipation bottom surface of the currently connected optical module to be tested.
4. The adjustable temperature control assembly of claim 3,
the motor is configured to be in a default output state to control the position of the refrigerating sheet to be matched with the length of the heat dissipation bottom surface of the universal optical module to be tested.
5. The adjustable temperature control assembly of claim 4,
the refrigerating piece is a semiconductor refrigerating piece.
6. The adjustable temperature control assembly according to any one of claims 1 to 5, wherein the temperature control base comprises:
the water cooling module is used for circulating cooling liquid; and
and the heat sink structure is arranged on the top surface of the water cooling module, and the refrigeration sheet is fixed on the top surface of the heat sink structure.
7. The adjustable temperature control assembly of claim 6,
the water cooling module spans the width area of a plurality of optical modules to be tested of the error code tester, a plurality of heat sink structures are arranged above the water cooling module, and each heat sink structure corresponds to one optical module to be tested.
8. The adjustable temperature control assembly of claim 7, wherein the temperature control mount further comprises:
and the limiting structures are fixed above each heat sink structure and used for limiting the positions of the optical module to be tested in the width direction and the height direction.
9. The adjustable temperature control assembly of claim 1, wherein the guide track assembly comprises:
the limiting strips are fixed at the bottom plate of the box body and extend along the length direction of the optical module to be tested, and limiting grooves are formed in the tops of the limiting strips; and
and the limiting blocks corresponding to the limiting strips are fixed at the bottom of the temperature control seat, and limiting convex blocks matched with the limiting grooves are arranged at the bottoms of the limiting blocks.
10. A modular error code tester comprising an adjustable temperature control assembly according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123161112.XU CN216449140U (en) | 2021-12-15 | 2021-12-15 | Adjustable temperature control assembly and modular error code tester |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123161112.XU CN216449140U (en) | 2021-12-15 | 2021-12-15 | Adjustable temperature control assembly and modular error code tester |
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| Publication Number | Publication Date |
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| CN216449140U true CN216449140U (en) | 2022-05-06 |
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| CN202123161112.XU Active CN216449140U (en) | 2021-12-15 | 2021-12-15 | Adjustable temperature control assembly and modular error code tester |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114986409A (en) * | 2022-05-18 | 2022-09-02 | 苏州联讯仪器有限公司 | Clamping device for optical module, crimping box and error code testing equipment |
| CN115122256A (en) * | 2022-05-26 | 2022-09-30 | 苏州联讯仪器有限公司 | Temperature control clamping device for optical module, crimping box and error code testing device |
-
2021
- 2021-12-15 CN CN202123161112.XU patent/CN216449140U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114986409A (en) * | 2022-05-18 | 2022-09-02 | 苏州联讯仪器有限公司 | Clamping device for optical module, crimping box and error code testing equipment |
| CN115122256A (en) * | 2022-05-26 | 2022-09-30 | 苏州联讯仪器有限公司 | Temperature control clamping device for optical module, crimping box and error code testing device |
| CN115122256B (en) * | 2022-05-26 | 2023-11-17 | 苏州联讯仪器股份有限公司 | Temperature control clamping device for optical module, compression joint box and error code testing device |
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Address after: Building 5, No. 1508, Xiangjiang Road, Suzhou High-tech Zone, Suzhou City, Jiangsu Province 215129 Patentee after: Suzhou Lianxun Instrument Co.,Ltd. Address before: 215129 Building 1, No. 1508, Xiangjiang Road, Suzhou high tech Zone, Suzhou, Jiangsu Province Patentee before: STELIGHT INSTRUMENT Inc. |