CN219225427U - Heat abstractor of dustproof host computer - Google Patents
Heat abstractor of dustproof host computer Download PDFInfo
- Publication number
- CN219225427U CN219225427U CN202223495027.1U CN202223495027U CN219225427U CN 219225427 U CN219225427 U CN 219225427U CN 202223495027 U CN202223495027 U CN 202223495027U CN 219225427 U CN219225427 U CN 219225427U
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- Prior art keywords
- heat
- main board
- host
- power supply
- cover plate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a heat radiator of a dustproof host, which relates to the technical field of computers, and comprises a host case, an inward fan group, a main board heat-conducting plate, a heat-conducting calandria, an outward fan group and a host case cover plate; the host machine case is provided with a host machine case cover plate slot, a main board positioning screw hole and a power supply connecting hole; the inward fan group is connected with the power supply through the inward fan power supply flat cable; the outward fan group is connected with the outward fan power supply interface through an outward fan power supply flat cable; copper heat conduction is carried out through the main board heat conduction plate and the heat conduction calandria, aluminum heat dissipation is carried out through the host case and the host case cover plate to achieve the maximum heat dissipation effect, internal heat exchange is completed through the inward fan, and heat dissipation is completed through the outward fan. So that the internal sealing environment can complete rapid heat conduction and heat exchange with the external environment in a dust-free state.
Description
Technical Field
Relates to the technical field of computers.
Background
The core components in the host are all installed in the host case, the heat radiation structure of the host case of the computer at present is mainly a heat radiation fan in the case, and the traditional heat radiation mode has some defects, firstly, the air-cooled heat radiation mode is low in efficiency, when the ambient temperature of the case is high, the air blown by the fan is hot air, so that the heat radiation quality is greatly reduced, secondly, the fan can absorb external dust and the like into the case in the heat radiation process, and damage can be caused to the core components of the computer for a long time. Especially, the server host needs to work continuously for 24 hours all the year round, and a stable heat dissipation mode can ensure long-time stable operation of the computer system.
Disclosure of Invention
Aiming at the defects of the prior art, the heat dissipating device of the dustproof host machine provided by the utility model consists of a host machine case, an inward fan group, a main board heat conducting plate, a heat conducting calandria, an outward fan group and a host machine case cover plate; the host machine case is provided with a host machine case cover plate slot, a main board positioning screw hole and a power supply connecting hole; the inward fan group is connected with the power supply through the inward fan power supply flat cable; the outward fan group is connected with the outward fan power supply interface through an outward fan power supply flat cable;
the host machine case is made of aluminum alloy, and the host machine case cover plate is fixed on the host machine case through the host machine case cover plate slot to finish sealing; after the power supply connecting hole is connected with an external power supply, the interior of the host case is isolated from the external environment, and the power supply connecting hole is tightly attached to the external power supply; the main board positioning screw holes are used for fixing the computer main board;
the main board heat conducting plate is made of a copper plate, an aluminum oxide coating is sprayed on one side of the main board, the aluminum oxide coating has the effects of insulation and heat conduction, and the main board heat conducting plate is directly bonded and covered on an integrated circuit on the main board and conducts heat generated by the main board to the heat conducting calandria;
the heat-conducting calandria is attached to one side of the heat-conducting surface of the main board, which faces the cover plate of the host machine case, and is hollow copper pipes, the distance between each heat-conducting calandria is five millimeters, and the heat-conducting calandria transfers heat to the cover plate of the host machine case;
the cover plate of the host case is made of aluminum alloy, one side facing the heat conduction calandria is attached to the heat conduction calandria, and the outside is attached with an outward fan group;
the inward fan group completes the supplementary heat dissipation of the internal heat conduction, so that devices which are not attached to the main board heat conduction plate exchange heat with the host case and the main board heat conduction plate through inward wind; the outward fan assembly is responsible for exchanging heat conducted to the cover plate of the host case with the surrounding environment.
Advantageous effects
Copper heat conduction is carried out through the main board heat conduction plate and the heat conduction calandria, aluminum heat dissipation is carried out through the host case and the host case cover plate to achieve the maximum heat dissipation effect, internal heat exchange is completed through the inward fan, and heat dissipation is completed through the outward fan. So that the internal sealing environment can complete rapid heat conduction and heat exchange with the external environment in a dust-free state.
Drawings
FIG. 1 is a block diagram of the present utility model;
fig. 2 is a side view of the present utility model.
Detailed Description
Referring to fig. 1 and 2, the heat dissipating device for a dustproof host provided by the utility model is composed of a host case 1, an inward fan group 2, a main board heat conducting plate 3, a heat conducting calandria 4, an outward fan group 6 and a host case cover plate 5; the host case 1 is provided with a host case cover plate slot 10, a main board positioning screw hole 11 and a power supply connecting hole 12; the inward fan group 2 is connected with the power supply through the power supply connecting hole 12 through the inward fan power supply flat cable 20; the outward fan group 6 is connected with an outward fan power supply line 60 and is connected with an outward fan power supply interface 61;
the host machine case 1 is made of aluminum alloy, and a host machine case cover plate is fixed on the host machine case 1 through a host machine case cover plate slot 10 to finish sealing; after the power supply connecting hole 12 is connected with an external power supply, the inside of the host case 1 is isolated from the external environment, and the power supply connecting hole 12 is tightly attached to the external power supply; the main board positioning screw hole 11 is used for fixing a main board B of the computer;
the main board heat-conducting plate 3 is made of a copper plate, an aluminum oxide coating is sprayed on one side facing the main board B, the aluminum oxide coating has the effects of insulation and heat conduction, and the main board heat-conducting plate 3 is directly adhered to and covered on an integrated circuit on the main board B to conduct heat generated by the main board B to the heat-conducting calandria 4;
the heat conduction calandria 4 is attached to one side of the main board heat conduction plate 3 facing the host case cover plate 5, the heat conduction calandria 4 is a hollow copper pipe, the distance interval between each heat conduction calandria 4 is five millimeters, and the heat conduction calandria 4 transfers heat to the host case cover plate 5;
the cover plate 5 of the host case is made of aluminum alloy, one side facing the heat conduction calandria 4 is attached to the heat conduction calandria 4, and the outward fan group 6 is attached to the outer side;
the inward fan group 2 completes the supplementary heat dissipation of the internal heat conduction, so that devices which are not attached to the main board heat-conducting plate 3 exchange heat with the main machine case 1 and the main board heat-conducting plate 3 through inward wind; the outward fan assembly 6 is responsible for exchanging heat conducted to the main chassis cover 5 with the surrounding environment.
Claims (1)
1. The heat radiator of the dustproof host is characterized by comprising a host case, an inward fan group, a main board heat conducting plate, a heat conducting calandria, an outward fan group and a host case cover plate; the host machine case is provided with a host machine case cover plate slot, a main board positioning screw hole and a power supply connecting hole; the inward fan group is connected with the power supply through the inward fan power supply flat cable; the outward fan group is connected with the outward fan power supply interface through an outward fan power supply flat cable;
the host machine case is made of aluminum alloy, and the host machine case cover plate is fixed on the host machine case through the host machine case cover plate slot to finish sealing; after the power supply connecting hole is connected with an external power supply, the interior of the host case is isolated from the external environment, and the power supply connecting hole is tightly attached to the external power supply; the main board positioning screw holes are used for fixing the computer main board;
the main board heat conducting plate is made of a copper plate, an aluminum oxide coating is sprayed on one side of the main board, the aluminum oxide coating has the effects of insulation and heat conduction, and the main board heat conducting plate is directly bonded and covered on an integrated circuit on the main board and conducts heat generated by the main board to the heat conducting calandria;
the heat-conducting calandria is attached to one side of the heat-conducting surface of the main board, which faces the cover plate of the host machine case, and is hollow copper pipes, the distance between each heat-conducting calandria is five millimeters, and the heat-conducting calandria transfers heat to the cover plate of the host machine case;
the cover plate of the host case is made of aluminum alloy, one side facing the heat conduction calandria is attached to the heat conduction calandria, and the outside is attached with an outward fan group;
the inward fan group completes the supplementary heat dissipation of the internal heat conduction, so that devices which are not attached to the main board heat conduction plate exchange heat with the host case and the main board heat conduction plate through inward wind; the outward fan assembly is responsible for exchanging heat conducted to the cover plate of the host case with the surrounding environment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223495027.1U CN219225427U (en) | 2022-12-28 | 2022-12-28 | Heat abstractor of dustproof host computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223495027.1U CN219225427U (en) | 2022-12-28 | 2022-12-28 | Heat abstractor of dustproof host computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219225427U true CN219225427U (en) | 2023-06-20 |
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ID=86753104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223495027.1U Active CN219225427U (en) | 2022-12-28 | 2022-12-28 | Heat abstractor of dustproof host computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219225427U (en) |
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2022
- 2022-12-28 CN CN202223495027.1U patent/CN219225427U/en active Active
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