CN213581986U - Memory bank with efficient heat dissipation structure - Google Patents

Abstract

The utility model discloses a memory bank with a high-efficiency heat dissipation structure, which comprises a fan box and a heat dissipation plate, wherein the fan box is arranged on the outer wall of the upper end of the heat dissipation plate, the heat dissipation hole is arranged on the heat dissipation plate, the sliding frame is pressed on the front and back end surfaces of the memory bank main body through the action of a spring, so that the heat dissipation plate is clamped on the memory bank main body to avoid the heat dissipation plate falling off from the memory bank main body, then the fan box is arranged on the heat dissipation plate, the electric wire is connected on an external power supply, and the fan blade is driven to rotate through a micro motor to blow the memory bank main body, when the memory bank main body works for a long time, higher temperature can be generated to influence the operation of the memory bank main body, because cold air blown out by the fan box enters between the two heat dissipation plates to dissipate the heat of the memory bank main body, and after the heat is, the heat dissipation device can realize rapid multidirectional heat dissipation, can prolong the service life, and is high in efficiency and simple and convenient to operate.

Description

Memory bank with efficient heat dissipation structure

Technical Field

The utility model belongs to the technical field of the DRAM is relevant, concretely relates to has high-efficient heat radiation structure DRAM.

Background

The memory bank generally refers to a random access memory, which is also called a main memory, and is an internal memory that directly exchanges data with the CPU. It can be read and written at any time (except for refreshing), and has high speed, and is usually used as a temporary data storage medium of an operating system or other programs in operation. The RAM can write (store) or read (take out) information from any one of designated addresses at any time when it is operated. The biggest difference with the ROM is the volatility of data, i.e. the stored data will be lost as soon as power is turned off. RAM is used in computers and digital systems to temporarily store programs, data and intermediate results, so-called "random access", meaning that the time required when data in memory is read or written is independent of where the piece of information is located or where it is written. In contrast, the time and location required to read or write information in a sequential access storage device can be related. It is mainly used to store operating system, various application programs, data, etc.

The existing memory bank technology has the following problems: at present, a circuit board is generally exposed and is inserted into a memory bank slot of a mainboard of a computer, and the circuit board of the memory bank is burnt out when the heat productivity of the memory bank is overlarge due to the fact that the memory bank is not provided with a heat dissipation device.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a have high-efficient heat radiation structure memory strip to propose the problem that has the risk of burning out when memory strip calorific capacity is too big in solving above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a memory bank with a high-efficiency heat dissipation structure comprises a fan box and a heat dissipation plate, wherein the fan box is installed on the outer wall of the upper end of the heat dissipation plate, heat dissipation holes are formed in the heat dissipation plate, a memory bank main body is arranged on the right lower side of the fan box, a side plate is fixed on the heat dissipation plate on the rear side of the memory bank main body, a magnet is arranged inside the outer wall of the front end of the side plate, a dust screen is fixed inside the outer wall of the upper end of the fan box, a micro motor is arranged inside the fan box, the micro motor and the fan box are fixedly connected through a mounting frame, a shaft extending downwards is arranged inside the micro motor, fan blades are arranged on the outer wall of the circumference of the shaft, mounting columns are fixed on the outer wall of the lower end of the fan box, mounting holes are formed inside the outer wall of the upper end of the heat dissipation plate, a, the sliding groove is internally provided with a sliding frame, the sliding frame is elastically connected with the fixing frame through a spring, and the micro motor is electrically connected with the fixing frame through an external power supply.

Preferably, the number of the heat dissipation plates is two, and a side plate is fixed to the heat dissipation plate on the front side of the memory bank main body.

Preferably, the heat dissipation plate, the sliding frame and the fixing frame are all made of aluminum materials.

Preferably, the mounting frame is internally provided with an electric wire.

Preferably, an opening is formed in the outer wall of the lower end of the fan box.

Preferably, the circumferential outer wall of the mounting column is sleeved with a rubber sleeve.

Compared with the prior art, the utility model provides a have high-efficient heat radiation structure memory strip possesses following beneficial effect:

the memory bank of the utility model is provided with the heat dissipation plate and the fan box outside the memory bank, and realizes air-cooled heat dissipation by utilizing cold air blown by the fan box, and the heat dissipation device is installed, the two heat dissipation plates are covered on the front side and the back side of the memory bank main body at first, and the magnets on the two heat dissipation plates mutually attract each other, so that the heat dissipation plates cover the memory bank main body, meanwhile, the sliding frame is pressed on the front end surface and the back end surface of the memory bank main body through the action of the spring, so that the heat dissipation plates are clamped on the memory bank main body, the heat dissipation plates are prevented from falling from the memory bank main body, then the fan box is installed on the heat dissipation plates, and wires are connected on an external power supply, and the fan blades are driven to rotate by the micro motor to blow air to the memory bank main body, when the memory bank main body works for a long time, higher temperature can be generated, the operation of the, the memory bank main body is cooled, after heat is taken away, the heat is dissipated to outside air from the heat dissipation holes, the heat dissipation device can achieve rapid multidirectional heat dissipation, the service life can be prolonged, efficiency is high, and operation is simple and convenient.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description, do not constitute a limitation of the invention, in which:

fig. 1 is a schematic diagram of a front structure of a memory bank with a high-efficiency heat dissipation structure according to the present invention;

fig. 2 is a schematic diagram of a front cross-sectional structure of the memory bank heat dissipation device of the present invention;

fig. 3 is a schematic side view of the memory bank heat dissipation device according to the present invention;

fig. 4 is a schematic side sectional view of the memory bank heat dissipation device according to the present invention;

in the figure: 1. a fan case; 2. heat dissipation holes; 3. a heat dissipation plate; 4. a memory bank body; 5. a side plate; 6. a magnet; 7. a dust screen; 8. mounting a column; 9. mounting holes; 10. a micro motor; 11. a crankshaft; 12. a mounting frame; 13. a fan blade; 14. a carriage; 15. a fixed mount; 16. a sliding groove; 17. a spring.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a memory bank with a high-efficiency heat dissipation structure comprises a fan box 1 and a heat dissipation plate 3, wherein the fan box 1 is installed on the outer wall of the upper end of the heat dissipation plate 3, the heat dissipation hole 2 is formed in the heat dissipation plate 3, a memory bank main body 4 is arranged right under the fan box 1, a side plate 5 is fixed on the heat dissipation plate 3 at the rear side of the memory bank main body 4, a magnet 6 is arranged inside the outer wall of the front end of the side plate 5, a dustproof net 7 is fixed inside the outer wall of the upper end of the fan box 1, a micro motor 10 is arranged inside the fan box 1, the micro motor 10 and the fan box 1 are fixedly connected through a mounting frame 12, a shaft 11 extending downwards is arranged inside the micro motor 10, fan blades 13 are arranged on the circumferential outer wall of the shaft 11, a mounting column 8 is fixed on the outer wall of the lower end of the fan box 1, a mounting hole 9 is formed inside, a sliding groove 16 is formed in the outer wall of the rear end of the fixing frame 15, a sliding frame 14 is arranged in the sliding groove 16, the sliding frame 14 is elastically connected with the fixing frame 15 through a spring 17, and the micro motor 10 is electrically connected through an external power supply.

A memory bank with a high-efficiency heat dissipation structure comprises a fan box 1 and two heat dissipation plates 3, wherein the two heat dissipation plates 3 are arranged, a side plate 5 is also fixed on the heat dissipation plate 3 at the front side of a memory bank main body 4, so that the two heat dissipation plates 3 can be fixed together by using magnets 6 on the side plate 5, the memory bank main body 4 is installed inside the two heat dissipation plates 3, and then the fan box 1 is used for air cooling the memory bank main body 4 to realize cooling, the heat dissipation plates 3, a sliding frame 14 and a fixing frame 15 are all made of aluminum materials, the aluminum materials have good heat conduction characteristics, high temperature generated by the memory bank main body 4 can be easily absorbed and transmitted to the outer wall of the heat dissipation plate 3, part of temperature can be reduced, electric wires are arranged inside the mounting frame 12, and thus, when dust is reduced as much as possible, the dust is prevented from entering the inside of the fan box 1 from electric, lead to the fact the influence to flabellum 13 and DRAM main part 4, the radiating effect has been influenced, and can provide the electric current for micro motor 10 through external power supply again, the inside opening of having seted up of fan box 1 lower extreme outer wall, the cold wind that blows out through fan box 1 like this enters into between two heating panels 3, dispel the heat to DRAM main part 4, and take away the back with the heat, in will giving off the outside air from louvre 2, the rubber sleeve has been cup jointed on the 8 circumference outer walls of erection column, when installing fan box 1 on heating panel 3 like this, make fan box 1 more firm.

The utility model discloses a theory of operation and use flow: when the memory bank main body 4 of the utility model is installed, before the memory is ready to be inserted, the lock catches at two ends of the memory slot are broken off, then the memory bank main body 4 is aligned with the memory slot in the computer host and inserted down, and the end is inserted, then the lock catches at two ends are buckled on the memory bank main body 4, so as to ensure that the memory bank main body 4 is not loosened, then two heat dissipation plates 3 are covered at the front and back sides of the memory bank main body 4, and the heat dissipation plates 3 are mutually attracted by the magnets 6 on the two heat dissipation plates 3, so that the memory bank main body 4 is covered by the heat dissipation plates 3, meanwhile, the sliding frame 14 is pressed on the front and back end surfaces of the memory bank main body 4 through the action of the spring 17, so that the heat dissipation plates 3 are clamped on the memory bank main body 4, the heat dissipation plates 3 are prevented from falling from the memory bank main body 4, then, the mounting columns 8 are inserted into the mounting holes 9, and with the connection of electric lines on the power of outside, after opening the switch, it is rotatory through micro motor 10 drive flabellum 13, blow to DRAM main part 4, after DRAM main part 4 long-time work, can produce than higher temperature, influence the operation of DRAM main part 4, because the cold wind that fan box 1 blew out enters into between two heating panels 3, dispel the heat to DRAM main part 4, and take away the back with the heat, will distribute to the outside air from louvre 2, realize the heat dissipation purpose of forced air cooling.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a have high-efficient heat radiation structure memory bank, includes fan box (1) and heating panel (3), its characterized in that: the fan box (1) is installed on the outer wall of the upper end of the heat dissipation plate (3), the heat dissipation hole (2) is formed in the heat dissipation plate (3), a memory bank main body (4) is arranged on the right lower side of the fan box (1), a side plate (5) is fixed on the heat dissipation plate (3) on the rear side of the memory bank main body (4), a magnet (6) is arranged inside the outer wall of the front end of the side plate (5), a dust screen (7) is fixed inside the outer wall of the upper end of the fan box (1), a micro motor (10) is arranged inside the fan box (1), the micro motor (10) and the fan box (1) are fixedly connected through a mounting frame (12), a spindle (11) extending downwards is arranged inside the micro motor (10), fan blades (13) are arranged on the outer wall of the circumference of the spindle (11), and a mounting column (8) is fixed on the outer wall of, mounting hole (9) have been seted up to heating panel (3) upper end outer wall inside, be fixed with mount (15) on heating panel (3) of DRAM main part (4) front side, inside sliding tray (16) have been seted up to mount (15) rear end outer wall, inside carriage (14) that is provided with of sliding tray (16), carriage (14) and mount (15) are through spring (17) elastic connection, micro motor (10) are through external power source electric connection.

2. The memory bank with the efficient heat dissipation structure of claim 1, wherein: the memory bank is characterized in that the number of the heat dissipation plates (3) is two, and a side plate (5) is also fixed on the heat dissipation plate (3) on the front side of the memory bank main body (4).

3. The memory bank with the efficient heat dissipation structure of claim 1, wherein: the heat dissipation plate (3), the sliding frame (14) and the fixing frame (15) are all made of aluminum materials.

4. The memory bank with the efficient heat dissipation structure of claim 1, wherein: the mounting frame (12) is internally provided with an electric wire.

5. The memory bank with the efficient heat dissipation structure of claim 1, wherein: an opening is formed in the outer wall of the lower end of the fan box (1).

6. The memory bank with the efficient heat dissipation structure of claim 1, wherein: and the circumferential outer wall of the mounting column (8) is sleeved with a rubber sleeve.

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