CN218630726U

CN218630726U - Memory bank heat radiation structure

Info

Publication number: CN218630726U
Application number: CN202223113185.6U
Authority: CN
Inventors: 张宇
Original assignee: Central university of finance and economics
Current assignee: Central university of finance and economics
Priority date: 2022-11-22
Filing date: 2022-11-22
Publication date: 2023-03-14
Anticipated expiration: 2032-11-22

Abstract

The utility model relates to a DRAM technical field specifically is a DRAM heat radiation structure, which comprises a mainboard, the top of mainboard is provided with the installation piece, the right side of installation piece is provided with the installation storehouse, the inside in installation storehouse is provided with the DRAM, the left side in installation storehouse is provided with heat radiation structure, the top in installation storehouse is provided with the restriction groove, the top in restriction groove is provided with fixed storehouse, the inside in fixed storehouse is provided with the threaded rod, the below of threaded rod is provided with the fixed plate. The utility model discloses the DRAM pulls open the baffle through the pull rod when using, and the motor begins work, and the flabellum rotates and blows into the installation storehouse with outside air through first dust screen and second dust screen in, dispels the heat, and the inside air in installation storehouse is discharging through the breather plate, strengthens the radiating effect, removes baffle and dust storehouse through the pull rod when the DRAM is out of work and forms a seal structure, prevents that outside dust from entering into the internal damage DRAM of installation storehouse.

Description

Memory bank heat radiation structure

Technical Field

The utility model relates to a DRAM technical field specifically is a DRAM heat radiation structure.

Background

The memory bank generally refers to a random access memory, which is also called a main memory, and is an internal memory that directly exchanges data with the CPU.

If a CN 213581986U's a have high-efficient heat radiation structure memory stick, the utility model discloses a have high-efficient heat radiation structure memory stick, including fan box and heating panel, the fan box is installed on heating panel upper end outer wall, the louvre has been seted up on the heating panel, utilize the carriage to pass through the effect of spring, press on memory stick main part front and back end surface, make the heating panel card in memory stick main part, avoid the heating panel to fall from memory stick main part, later install the fan box on the heating panel, and with the connection of electric lines on the outside power, and through the rotation of micro motor drive flabellum, blow to the memory stick main part, after memory stick main part works for a long time, can produce than higher temperature, influence the operation of memory stick main part, because the cold wind that the fan box blew off enters into between two heating panels, dispels the heat to the memory stick main part, and with the heat after, will distribute to the outside air from the louvre, this heat abstractor device can realize quick multidirectional heat dissipation, and can prolong life, high efficiency, easy and simple operation.

In summary, the following technical problems are known in the prior art: when the memory bank is not used for a long time, the memory bank is not damaged due to the fact that a structure for preventing dust from entering does not exist, the memory bank can fall off due to the fact that the structure for fixing the memory bank does not exist when a host vibrates, and a computer cannot be started.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a DRAM heat radiation structure to solve the problem that proposes in the above-mentioned background art.

In order to solve the technical problem, the utility model adopts the following technical scheme:

the utility model provides a DRAM heat radiation structure, includes the mainboard, the top of mainboard is provided with the installation piece, the right side of installation piece is provided with the installation storehouse, the inside in installation storehouse is provided with the DRAM, the left side in installation storehouse is provided with heat radiation structure, the top in installation storehouse is provided with the restriction groove, the top in restriction groove is provided with fixed storehouse, the inside in fixed storehouse is provided with the threaded rod, the below of threaded rod is provided with the fixed plate, the inside of installation piece is provided with the mounting groove, the left side of threaded rod is provided with the breather plate, the inside of fixed plate is provided with the heat-conducting plate.

Preferably, heat radiation structure includes first dust screen, the right side of first dust screen is provided with the motor, and the right side of motor is provided with the flabellum, the right side of flabellum is provided with the second dust screen, and the right side of second dust screen is provided with dustproof storehouse, dustproof storehouse's inside is provided with the spout, and the top of spout is provided with the baffle, the right side of baffle is provided with the spring, and the right side of spring is provided with the restriction piece, the inside of baffle is provided with the pull rod, and the rear end of pull rod is provided with the pulling block, dustproof storehouse's outer end is provided with the fixed slot.

Preferably, the baffle passes through spout and dustproof storehouse sliding connection.

Preferably, the limiting block is matched with the size of the fixing groove.

Preferably, the mounting block is connected with the main board through screws.

Preferably, the fixed cabin is connected with the installation cabin in a sliding mode through a limiting groove.

Preferably, the threaded rod is in threaded connection with the fixed bin.

The above description shows that, with the above technical solutions of the present application, the technical problems to be solved by the present application can be solved.

Simultaneously, through above technical scheme, the utility model discloses possess following beneficial effect at least:

the utility model discloses be provided with heat radiation structure, the DRAM pulls open the baffle through the pull rod when using, the motor begins to work, the flabellum rotates and blows into the installation storehouse with outside air through first dust screen and second dust screen in, dispels the heat, the inside air in installation storehouse is discharging through the breather plate, strengthen the radiating effect, form a seal structure through pull rod movable baffle and dust guard when the DRAM is out of work, prevent that outside dust from entering into the installation storehouse and damaging the DRAM.

Drawings

FIG. 1 is a schematic view of the front view structure of the present invention;

FIG. 2 is a schematic view of the front cross-sectional structure of the present invention;

FIG. 3 is a schematic view of the heat dissipation structure of the present invention;

fig. 4 is a schematic view of the side view structure of the heat dissipation device of the present invention.

In the figure: 1. a main board; 2. mounting a block; 3. a memory bank; 4. a heat dissipation structure; 401. a first dust screen; 402. a motor; 403. a fan blade; 404. a second dust screen; 405. a dust-proof bin; 406. a baffle plate; 407. a chute; 408. a limiting block; 409. a spring; 410. pulling the block; 411. a pull rod; 412. a fixing groove; 5. a limiting groove; 6. fixing the bin; 7. a fixing plate; 8. a threaded rod; 9. mounting grooves; 10. a breather plate; 11. a heat conducting plate; 12. and (7) installing a bin.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

Embodiment 1

As shown in fig. 1 and fig. 2, the present invention provides a technical solution: the utility model provides a DRAM heat radiation structure, including mainboard 1, the top of mainboard 1 is provided with installation piece 2, the right side of installation piece 2 is provided with installation bin 12, the inside of installation bin 12 is provided with DRAM 3, the left side of installation bin 12 is provided with heat radiation structure 4, the top of installation bin 12 is provided with restriction groove 5, the top of restriction groove 5 is provided with fixed storehouse 6, the inside of fixed storehouse 6 is provided with threaded rod 8, the below of threaded rod 8 is provided with fixed plate 7, the inside of installation piece 2 is provided with mounting groove 9, the left side of threaded rod 8 is provided with breather plate 10, the inside of fixed plate 7 is provided with heat-conducting plate 11, installation piece 2 passes through screwed connection with mainboard 1, fixed storehouse 6 is through restriction groove 5 and installation bin 12 sliding connection, threaded rod 8 and the 6 threaded connection of fixed storehouse.

Example two

The scheme in the first embodiment is further described in the following with reference to specific working modes, which are described in detail in the following:

as shown in fig. 3 and 4, as a preferred embodiment, in addition to the above-mentioned embodiments, further, the heat dissipation structure 4 includes a first dust screen 401, a motor 402 is disposed on the right side of the first dust screen 401, a fan blade 403 is disposed on the right side of the motor 402, a second dust screen 404 is disposed on the right side of the fan blade 403, a dust-proof bin 405 is disposed on the right side of the second dust screen 404, a sliding slot 407 is disposed inside the dust-proof bin 405, a baffle 406 is disposed above the sliding slot 407, a spring 409 is disposed on the right side of the baffle 406, a limiting block 408 is disposed on the right side of the spring 409, a pull rod 411 is disposed inside the baffle 406, a pull block 410 is disposed at the rear end of the pull rod 411, a fixing slot 412 is disposed at the outer end of the dust-proof bin 405, the baffle 406 is slidably connected with the dust-proof bin 405 through the sliding slot 407, the limiting block 408 is in size matching with the fixing slot 412, the internal storage bar 3 is pulled by the pull rod 411 when in use, the motor 402 starts to operate, the fan blade 403 rotates to blow external air into the storage bin 12 through the first dust-proof bin 401 and the second dust screen 404, thereby performing heat dissipation installation, the internal air is installed in the internal storage bin 12, and the internal air is prevented from being damaged by the external dust bin 12, and the sealing structure is formed by the reinforcing structure, and the external dust bin 405, and the dust bin 405 is moved by the sealing structure, and the air is prevented from being damaged by the air from the dust bin 12.

In summary, the following can be found:

the utility model discloses to technical problem: when the memory bank is not used for a long time, the memory bank is not damaged due to the influence of dust because of no structure for preventing dust from entering, and the memory bank can fall off due to the fact that the memory bank is not fixed when the host vibrates, so that the computer cannot be started; the technical scheme of each embodiment is adopted. Meanwhile, the implementation process of the technical scheme is as follows:

firstly, a memory bank 3 is firstly installed on a mainboard 1, an installation bin 12 is fixedly connected with an installation block 2 through an installation groove 9, the installation block 2 is connected with the mainboard 1 through a screw, a fixed bin 6 is in sliding connection with the installation bin 12 through a limiting groove 5 and is in threaded connection with the fixed bin 6 through a threaded rod 8, and the threaded rod 8 is rotated to drive a fixed plate 7 to move downwards so that a heat-conducting plate 11 is in contact with the memory bank 3 for fixing;

then, when the memory bank 3 works, the baffle 406 is pulled through the pull rod 411 and the pulling block 410, the baffle 406 moves in the dustproof bin 405 through the sliding groove 407, after the baffle moves to a specified position, the limiting block 408 is popped out through the fixing groove 412 under the action of the spring 409 to limit the movement of the baffle 406, the motor 402 starts to work, the fan blade 403 rotates to blow external air into the mounting bin 12 through the first dustproof net 401 and the second dustproof net 404 for heat dissipation, and the external air is exhausted through the ventilation plate 10;

finally, when the memory bank 3 is not used for a long time, the pull rod 411 drives the baffle 406 to move to form a sealing structure with the dust-proof bin 405, so that external dust is prevented from entering the installation bin 12.

Through above-mentioned setting, above-mentioned technical problem can be solved certainly to this application, simultaneously, realizes following technological effect:

the utility model discloses be provided with heat radiation structure 4, DRAM 3 pulls open baffle 406 through pull rod 411 when using, motor 402 begins to work, flabellum 403 rotates and blows into installation storehouse 12 with outside air through first dust screen 401 and second dust screen 404 in, dispel the heat, the inside air in installation storehouse 12 is discharging through aeration plate 10, strengthen the radiating effect, remove baffle 406 and dust-proof storehouse 405 formation a seal structure through pull rod 411 when DRAM 3 is out of work, prevent that outside dust from entering into damage DRAM 3 in the installation storehouse 12.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a DRAM heat radiation structure, a serial communication port, including mainboard (1), the top of mainboard (1) is provided with installation piece (2), the right side of installation piece (2) is provided with installation storehouse (12), the inside of installation storehouse (12) is provided with DRAM (3), the left side of installation storehouse (12) is provided with heat radiation structure (4), the top of installation storehouse (12) is provided with restriction groove (5), the top of restriction groove (5) is provided with fixed storehouse (6), the inside of fixed storehouse (6) is provided with threaded rod (8), the below of threaded rod (8) is provided with fixed plate (7), the inside of installation piece (2) is provided with mounting groove (9), the left side of threaded rod (8) is provided with breather plate (10), the inside of fixed plate (7) is provided with heat-conducting plate (11).

2. The heat dissipation structure of the memory bank as claimed in claim 1, wherein the heat dissipation structure (4) comprises a first dust screen (401), a motor (402) is arranged on the right side of the first dust screen (401), fan blades (403) are arranged on the right side of the motor (402), a second dust screen (404) is arranged on the right side of the fan blades (403), a dust-proof bin (405) is arranged on the right side of the second dust screen (404), a sliding groove (407) is arranged in the dust-proof bin (405), a baffle (406) is arranged above the sliding groove (407), a spring (409) is arranged on the right side of the baffle (406), a limiting block (408) is arranged on the right side of the spring (409), a pull rod (411) is arranged in the baffle (406), a pull block (410) is arranged at the rear end of the pull rod (411), and a fixing groove (412) is arranged at the outer end of the dust-proof bin (405).

3. The memory bank heat dissipation structure of claim 2, wherein the baffle (406) is slidably connected to the dust-proof bin (405) through a sliding slot (407).

4. The die pad heat dissipation structure of claim 2, wherein the limiting blocks (408) are matched with the fixing grooves (412).

5. The heat dissipation structure of claim 1, wherein the mounting block (2) is connected to the motherboard (1) by screws.

6. The memory bank heat dissipation structure of claim 1, wherein the fixing bin (6) is slidably connected with the mounting bin (12) through a limiting groove (5).

7. The memory bank heat dissipation structure of claim 1, wherein the threaded rod (8) is in threaded connection with the fixed bin (6).