CN219201725U - Test probe for resisting tin pick-up - Google Patents

Abstract

The utility model relates to a test probe for resisting tin pick-up, which has the characteristics of simple structure, convenient installation, high production efficiency and low production cost. The needle part is positioned at the opening end of the probe mounting opening and corresponds to the chip bonding pad, the needle belly part is connected with the inner bottom of the probe mounting opening, the outer sides of the two side arcs are respectively propped against the first boss and the second boss, and the needle body part and the needle tail part are propped against the chip testing seat through the connecting conductive adhesive tape to ensure the contact stability between the needle body part and the needle tail part. When in test, the original up-and-down movement mode is changed into selective movement, so that tin on the chip bonding pad is not easy to be adhered to the test probe, and the contact stability during test is ensured. In addition, the test probe produced by stamping has higher stability and dimensional accuracy, thereby greatly reducing the production cost.

Description

Test probe for resisting tin pick-up

Technical Field

The utility model relates to the technical field of semiconductor testing, in particular to a tin pick-up resistant test probe.

Background

The flow of semiconductor chips from design to production is very complex, and mainly goes through three stages of design, fabrication and encapsulation. The packaging test is to cut, bond wires and mold the produced qualified wafer, so that the chip circuit is electrically connected with an external device, the chip is mechanically and physically protected, and the packaged chip is subjected to function and performance test by using a testing tool provided by an integrated circuit design enterprise. The test probe is a test needle for testing semiconductor chips, and the surface of the test needle is plated with gold and is internally connected with a high-performance spring with the average service life of tens of thousands times. The variety of test probes is largely divided into cantilever probes and vertical probes.

Along with the increasing speed of signal transmission of semiconductor chips, the stability of resistance values in the test process is required to be higher and higher. The test probe is a key component in the test process and plays a role in connecting the tested chip and the circuit board. The traditional test probe consists of a sleeve, an upper probe head, a lower probe head and a spring, and the sleeve, the upper probe head, the lower probe head and the spring are assembled by riveting or crimping to complete the test probe. Because the test probe can only move up and down generally when in use, tin on the pin of the semiconductor chip is easy to be adhered to the test probe in the process of up and down movement in the test, thereby influencing the resistance value of the test probe. Therefore, a test probe is needed to solve the problem of tin pick-up during testing.

Disclosure of Invention

The summary of the utility model is provided to introduce a selection of concepts in a simplified form that are further described below in the detailed description. The summary of the utility model is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

Aiming at the problems and the defects existing in the prior art, the utility model aims to provide the anti-tin-pick test probe, which is mainly designed into a hook-shaped structure, and the outer parts of the two sides of the needle belly part are propped against the corners of the first boss and the second boss, and the arc top end of the test probe is connected with the inner bottom of the probe mounting port. The original up-and-down movement mode is changed into selective movement during testing, so that tin on the chip bonding pad is not easy to be adhered to the test probe, and the contact stability during testing is ensured.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the test probe comprises a needle head part, a needle belly part, a needle body part and a needle tail part, a test circuit board is connected to the bottom of a chip test seat, a probe mounting port is arranged at the position of the test circuit board corresponding to a chip bonding pad, and a first boss and a second boss which are inwards protruded are respectively arranged at the two inner sides of the probe mounting port; the test probe is arranged in the probe mounting opening, the opening end of the needle head part extending out of the probe mounting opening corresponds to the chip bonding pad, the needle belly part is of an arc structure, the arc top end of the needle belly part is connected with the inner bottom of the probe mounting opening, and the outer parts of two sides of the needle belly part are respectively propped against the corners of the first boss and the second boss.

The whole test probe is designed into a hook-shaped structure and consists of a needle head part, a needle belly part, a needle body part and a needle tail part, and the test probe is arranged in a probe mounting opening formed in a test circuit board before testing. The two outer sides of the needle belly part are propped against the corners of the first boss and the second boss, and the arc top end of the needle belly part is connected with the inner bottom of the probe mounting opening. The needle head part is positioned above the second boss, the needle tail part is positioned above the first boss, and the opening end of the needle head part extending out of the probe mounting opening corresponds to the chip bonding pad. When in test, the chip to be tested is placed on the chip test seat, the chip bonding pad is contacted with the needle head part of the test probe under the action of force, and the needle belly part slides along the probe mounting opening. The movement direction of the test probe is changed into selective movement, so that redundant tin on the surface of the chip bonding pad is not easy to be adhered to the needle head part, and good contact between the test probe and the chip bonding pad is ensured.

Furthermore, the needle body part is also in a circular arc structure, and the concave part of the needle body part is connected with the conductive adhesive tape and props against the chip test seat. The conductive adhesive tape is commonly called as an electric silica gel connector, can eliminate damage to a thermal effect device without any welding, and can be used for connecting some electronic elements vulnerable to heat to replace welding. When testing, the chip to be tested is pressed and put in, the chip bonding pad contacts the needle head part of the test probe to slide downwards, and the needle body part is connected with the conductive adhesive tape to form a passage. The conductive adhesive tape can enable the test probe to have acting force in the contact process with the tested chip and the test circuit board, so that the contact stability of the test probe is further ensured. But also can make the connection point between them be in a sealed state, and can also have the functions of moisture-proofing and corrosion-proofing.

Furthermore, the test probe is manufactured by adopting a stamping process. The stamping process is based on plastic deformation of metal, and the metal is subjected to pressure by using a die and stamping equipment to make the metal generate plastic deformation or separation, so that parts with certain shapes, sizes and performances are obtained. The processing method has high production efficiency and low material consumption, is suitable for the production of larger parts and products, and is convenient for realizing mechanization and automation. The stamping production process can reduce waste and waste-free production, and even fully utilize leftover bits and pieces, so that the production cost is effectively reduced. The test probe produced by stamping has higher stability and dimensional accuracy, so that the production cost is greatly reduced.

Compared with the prior art, the utility model has the beneficial effects that:

the utility model has the characteristics of simple structure, convenient installation, high production efficiency and low production cost. The test probe is designed into a hook-shaped structure and consists of a needle head part, a needle belly part, a needle body part and a needle tail part, and is arranged in a probe mounting opening formed in a test circuit board before testing. The needle part is positioned at the opening end of the probe mounting opening and corresponds to the chip bonding pad, the needle belly part is connected with the inner bottom of the probe mounting opening, the outer sides of the two side arcs are respectively propped against the first boss and the second boss, and the needle body part and the needle tail part are propped against the chip testing seat through the connecting conductive adhesive tape to ensure the contact stability between the needle body part and the needle tail part. When in test, the original up-and-down movement mode is changed into selective movement, so that tin on the chip bonding pad is not easy to be adhered to the test probe, and the contact stability during test is ensured. In addition, the test probe produced by stamping has higher stability and dimensional accuracy, thereby greatly reducing the production cost.

Drawings

Fig. 1: schematic side cross-sectional structure after the installation of the utility model;

fig. 2: a structural schematic diagram for mounting the test probe in the utility model;

fig. 3: a schematic diagram of a top view structure of the chip test seat in the utility model;

fig. 4: a schematic diagram of a bottom view structure of the chip test seat in the utility model;

fig. 5: a schematic diagram of a side view structure of the chip test seat in the utility model;

fig. 6: is a schematic structural diagram of the test probe in the utility model.

Marked in the figure as: 1. a test probe; 101. a needle portion; 102. a needle belly part; 103. a needle body part; 104. a needle tail; 2. a chip bonding pad; 3. testing the circuit board; 301. a first boss; 302. a second boss; 4. a conductive adhesive tape; 5. and a chip test seat.

Detailed Description

Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While certain embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete. It should be understood that the drawings and embodiments of the present disclosure are for illustration purposes only and are not intended to limit the scope of the present disclosure.

It should be noted that, for convenience of description, only the portions related to the present utility model are shown in the drawings. Embodiments of the present disclosure and features of embodiments may be combined with each other without conflict.

Examples

The test probe for resisting tin pick-up provided in this embodiment is shown in fig. 1-6: the test probe 1 comprises a hook-shaped structure, wherein the test probe 1 comprises a needle head part 101, a needle belly part 102, a needle body part 103 and a needle tail part 104, a test circuit board 3 is connected to the bottom of a chip test seat 5, a probe mounting opening is arranged at the position of the test circuit board 3 corresponding to a chip bonding pad 2, and a first boss 301 and a second boss 302 which are inwards protruded are respectively arranged at the two inner sides of the probe mounting opening; the test probe 1 is installed in the probe installation opening, the opening end of the probe head 101 extending out of the probe installation opening corresponds to the chip bonding pad 2, the probe belly part 102 is of an arc structure, the arc top end of the probe belly part is connected with the inner bottom of the probe installation opening, and the outer parts of two sides of the probe belly part are respectively propped against the corners of the first boss 301 and the second boss 302. During testing, the chip to be tested is placed on the chip test seat 5, the chip bonding pad 2 is contacted with the needle head 101 of the test probe 1 under the action of force, and the needle belly 102 slides along the probe mounting opening. The movement direction of the test probe 1 is changed into selective movement, so that the superfluous tin on the surface of the chip bonding pad 2 is not easy to be adhered to the needle head 101, and good contact between the test probe 1 and the chip bonding pad 5 is ensured.

The embodiment further includes that the needle body 103 is also in a circular arc structure, and the concave part of the needle body 103 is connected with the conductive adhesive tape 4 and abuts against the chip test seat 5. The needle body 103 of the test probe 1 is connected with the conductive adhesive tape 4 to form a passage, when the chip to be tested is pressed and put on the chip test seat 5, the conductive adhesive tape 4 can enable the test probe 1 to have acting force in the contact process with the chip to be tested and the test circuit board 3, so that the contact stability of the test probe 1 is further ensured. But also can make the connection point between them be in a sealed state, and can also have the functions of moisture-proofing and corrosion-proofing.

The present embodiment further includes that the test probe 1 is manufactured by a stamping process. The stamping process is a processing method with high production efficiency and low material consumption, is suitable for the production of larger batch of part products, and is convenient for realizing mechanization and automation. And the production efficiency is improved, waste materials can be reduced, waste-free production can be realized, and even leftover materials can be fully utilized, so that the production cost is effectively reduced. Therefore, the test probe 1 produced by stamping has higher stability and dimensional accuracy, so that the production cost of the test probe is greatly reduced.

The application method of the utility model comprises the following steps:

before testing, the bottom of the chip testing seat 5 is connected with the testing circuit board 3, and an opening for clamping the tested chip is arranged at the center of the chip testing seat 5. A probe mounting port is formed in the test circuit board 3 at a position corresponding to the chip bonding pad 5, a first boss 301 and a second boss 302 protruding inwards are respectively arranged on two sides of the inside of the probe mounting port, and the first boss 301 and the second boss 302 are of step structures.

The test probe 1 is designed into a hook-shaped structure, and comprises a needle head part 101, a needle belly part 102, a needle body part 103 and a needle tail part 104, and the test probe 1 is arranged in a probe mounting port on the test circuit board 6. Specifically, the test probe 1 is located at the connection between the second boss 302 and the inner sidewall of the probe mounting port, and the probe tip portion 101 extends out of the probe mounting port to correspond to the chip pad 5. The needle belly part 102 and the needle body part 103 are both in arc structures protruding downwards, the needle belly part 102 is connected with the inner bottom of the probe mounting port, and the two outer sides of the needle belly part 102 are respectively abutted against the first boss 301 and the second boss 302. The pin tail 104 is located at the connection part of the first boss 301 and the inner side wall of the probe mounting port, the pin body 103 and the pin tail 104 are propped against the bottom of the chip test seat 5 through the conductive adhesive tape 4, so that the stability of contact between the test probe 1 and the test circuit board 3 is ensured, and the effects of moisture resistance and corrosion resistance are also achieved.

During testing, the chip to be tested is pressed onto the chip test seat 5, and the chip bonding pad 2 is in pressing contact with the needle head part 101. Because the test probe 1 is in a hook-shaped structure, when the chip to be tested is placed on the chip test seat 5, the motion track of the test probe 1 does not move up and down, but slides along the needle belly part 102 in the probe mounting port instead, and the conductive adhesive tape 4 is driven to rotate. During its movement, the tip portion 101 may scrape off the excess tin pick up on the surface of the chip pad 2 due to the sliding of the tip portion 101 when it is in contact with the chip pad 2, so as to ensure good contact between the tip portion 101 and the chip pad 2.

In the description of the present utility model, it should be understood that the orientation or positional relationship indicated is based on the orientation or positional relationship shown in the drawings, and is merely for convenience in describing the present utility model and simplifying the description, and does not indicate or imply that the apparatus or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

In addition to the above embodiments, the present utility model may have other embodiments. It should be understood that modifications of the above-described embodiments, or equivalent substitutions of some technical features thereof may be made by those skilled in the art, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principles of the present utility model should be included in the scope of the present utility model.

Claims (3)

1. The utility model provides a test probe of anti tin that glues which characterized in that: the test probe (1) comprises a hook-shaped structure, wherein the test probe (1) comprises a probe head part (101), a probe belly part (102), a probe body part (103) and a probe tail part (104), a test circuit board (3) is connected to the bottom of a chip test seat (5), a probe mounting opening is formed in the test circuit board (3) at a position corresponding to a chip bonding pad (2), and a first boss (301) and a second boss (302) which are protruded inwards are respectively arranged at two inner sides of the probe mounting opening; the test probe (1) is installed in the probe installation opening, the opening end of the needle head part (101) extending out of the probe installation opening corresponds to the chip bonding pad (2), the needle belly part (102) is of an arc structure, the arc top end of the needle belly part is connected with the inner bottom of the probe installation opening, and the outer parts of two sides of the needle belly part are propped against the corners of the first boss (301) and the second boss (302) respectively.

2. A test probe resistant to tin pick up as claimed in claim 1, wherein: the needle body part (103) is also in a circular arc structure, and the concave part of the needle body part (103) is connected with the conductive adhesive tape (4) and props against the chip test seat (5).

3. A test probe resistant to tin pick up as claimed in claim 1, wherein: the test probe (1) is manufactured by adopting a stamping process.

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