CN219163365U - Chip adsorption component and number writing machine - Google Patents

Abstract

The utility model discloses a chip adsorption component and a number writing machine, wherein the chip adsorption component comprises: the vacuum suction device comprises a support, a first rotary driving piece, a vacuum suction head and a lifting driving piece; the vacuum adsorption head is suitable for adsorbing the chip; the first rotary driving piece is arranged on the support and connected with the vacuum adsorption head to drive the vacuum adsorption head to rotate so as to adjust the direction of the chip; the lifting driving piece is connected with the support to drive the vacuum adsorption head to move up and down so as to take and place chips. The chip adsorption component can independently adjust the direction and the gesture of each chip to match with a vision device to realize the accurate positioning of the chip on the number writing component.

Description

Chip adsorption component and number writing machine

Technical Field

The utility model relates to the technical field of chip production, in particular to a chip adsorption component and a number writing machine.

Background

In the production process of the chip, the chip is usually subjected to laser carving, program downloading, function testing, function writing and other working procedures; the function writing number is to take the chips on the conveying line to the number writing board of the number writing part by using the adsorption head so as to write the data such as the function information of the chips into the chips. In the related art, a plurality of adsorption heads arranged side by side are used for sucking and conveying a plurality of chips simultaneously so as to ensure efficiency. However, the above-mentioned adsorption head cannot adjust the posture of each chip individually to cooperate with the vision device to realize accurate positioning of the chip on the number writing assembly.

Disclosure of Invention

The present utility model aims to solve at least to some extent one of the technical problems in the above-described technology. Therefore, an object of the present utility model is to provide a chip adsorbing assembly that can adjust the direction and posture of each chip individually to be positioned on a writing board accurately.

Another object of the present utility model is to provide a number writing machine.

To achieve the above object, an embodiment of the present utility model provides, in a first aspect, a chip adsorbing assembly, including: the vacuum suction device comprises a support, a first rotary driving piece, a vacuum suction head and a lifting driving piece;

the vacuum adsorption head is suitable for adsorbing the chip;

the first rotary driving piece is arranged on the support and connected with the vacuum adsorption head to drive the vacuum adsorption head to rotate so as to adjust the direction of the chip;

the lifting driving piece is connected with the support to drive the vacuum adsorption head to move up and down so as to take and place chips.

According to the chip adsorption assembly provided by the utility model, the first rotary driving piece is adopted to independently control the vacuum adsorption head to rotate, and the direction of each chip can be adjusted by matching with the vision device on the number writing machine, so that the chips can be accurately placed in the number writing machine; the movement of the vacuum adsorption head is independently controlled through the lifting driving piece, so that each chip can be independently taken and placed.

In addition, the chip adsorption assembly provided by the utility model can also have the following additional technical characteristics:

optionally, the first rotary driving piece is a micro motor, and the vacuum adsorption head is connected with a power output shaft of the micro motor.

Optionally, the lifting driving piece includes second rotary driving piece, action wheel, follow driving wheel, hold-in range and revolute pair, the support sets up on the revolute pair, the revolute pair is connected the hold-in range, the action wheel with follow the driving wheel passes through the hold-in range synchronous rotation, the second rotary driving piece is connected the action wheel is in order to drive the action wheel rotates.

Further, the moving pair comprises a linear guide rail and a sliding block, the sliding block is connected with the linear guide rail in a sliding mode, the support is arranged on the sliding block, and the synchronous belt is connected with the sliding block through a connecting plate.

Further, a sensor switch is included, which is adapted to sense the position of the slider.

Further, the second rotary driving member is a motor.

In a second aspect, an embodiment of the present utility model provides a number writing machine, which includes the above-mentioned chip adsorption component.

According to the number writing machine provided by the embodiment of the utility model, through the arrangement of the chip adsorption assembly, each chip can be independently subjected to posture adjustment so as to be accurately positioned on the number writing plate.

Drawings

FIG. 1 is a schematic diagram of a chip adsorbing assembly according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram of another perspective view of a chip attach assembly according to an embodiment of the utility model;

FIG. 3 is a partial schematic view of a robot part according to an embodiment of the present utility model;

reference numerals illustrate:

the chip adsorbing assembly 10, the second rotary driving member 1011, the driving wheel 1012, the timing belt 1013, the moving pair 1014, the driven wheel 1015, the inductive switch 102, the support 103, the first rotary driving member 104, the vacuum adsorbing head 105, the connecting plate 106 and the mounting plate 20.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.

In order that the above-described aspects may be better understood, exemplary embodiments of the present utility model will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present utility model are shown in the drawings, it should be understood that the present utility model may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art.

In order to better understand the above technical solutions, the following detailed description will refer to the accompanying drawings and specific embodiments.

The chip adsorbing assembly 10 according to the embodiment of the present utility model is described below with reference to the drawings.

As shown in fig. 1 to 3, the chip adsorbing assembly 10 according to the embodiment of the present utility model is suitable for taking and placing chips and adjusting directions of the chips. The chip adsorbing assembly 10 includes a support 103, a first rotary driving member 104, a vacuum adsorbing head 105, and a lifting driving member 101.

Specifically, the vacuum adsorption head 105 is suitable for adsorbing a chip, and the first rotary driving member 104 is arranged on the support 103 and is connected with the vacuum adsorption head 105 to drive the vacuum adsorption head 105 to rotate so as to adjust the direction of the chip; the lifting driving part 101 is connected with the support 103 to drive the vacuum adsorption head 105 to move up and down so as to pick and place chips.

That is, the plurality of chips are not exactly positioned at the number writing position when being transported to the number writing assembly due to different postures (directions), and the chip adsorbing assembly 10 can adjust the direction of each chip by matching with the vision device on the number writing machine by independently controlling the rotation of the vacuum adsorbing head 109 through the first rotary driving member 108, and then is transported to the number writing position after being adjusted; through the removal of lift drive 101 individual control vacuum adsorption head 105, can carry out the individual to every chip and get put for the chip can realize getting alone and put and can put at the machine of writing in again accurately.

According to the chip adsorption assembly 10 provided by the embodiment of the utility model, the first rotary driving piece 104 is used for independently controlling the rotation of the vacuum adsorption head 105, the direction of each chip can be adjusted by matching with a vision device on a number writing machine, and the lifting driving piece 101 is used for independently controlling the movement of the vacuum adsorption head 105, so that each chip can be independently taken and placed; therefore, the chips can be independently taken and placed, the posture of each chip can be independently adjusted, the chips can be more accurately placed in the number writing machine, and the qualification rate of chip production is improved.

The number of the chip adsorbing assemblies 10 can be set on the number writer according to actual requirements.

Therefore, the plurality of chips can be independently and accurately taken and placed through the matching of the plurality of groups of chip adsorption assemblies 10 and the plurality of writing positions, the structure is compact, the space on a host is saved, and the production efficiency is improved.

As shown in fig. 1 to 3, for the first rotation driving member 104, the first rotation driving member 104 is provided on the support 103 and connected to the vacuum suction head 105 to drive the vacuum suction head 105 to rotate so as to adjust the direction of the chip.

Specifically, the first rotary driving member 104 independently controls the vacuum adsorption head 105 to rotate, so that the direction of each chip can be adjusted by matching with a vision device on the number writing machine, and then the chips can be accurately positioned at the number writing position by matching with the moving driving assembly (a part on the manipulator); the first rotary driving member 104 may be a micro motor as in fig. 1, and the micro motor is used to directly drive the vacuum adsorption head 105 to rotate.

As shown in fig. 1 to 3, for the elevation driving member 101, the elevation driving member 101 is provided on the mounting plate 20 and is connected to the support 103 to drive the vacuum suction head 105 to move up and down to pick and place the chip.

Specifically, the lifting driving member 101 includes a second rotary driving member 1011, a driving pulley 1012, a timing belt 1013, a traveling pair 1014, and a driven pulley 1015, the support 103 is provided on the traveling pair 1014, the traveling pair 1014 is connected to the timing belt 1012, the driving pulley 1012 and the driven pulley 1015 are synchronously rotated by the timing belt 1013, and the second rotary driving member 1011 is connected to the driving pulley 1012 to drive the driving pulley 1012 to rotate. Thereby, the second rotary driving member 1011 drives the rotary wheel 1012 to rotate, thereby driving the timing belt 1013 to rotate and driving the support 103 to move up and down. Of course, in other examples, other configurations of the lift drive 101 may be used.

The second rotary driving member 1011 may be a motor as shown in fig. 1, and the moving pair 1014 includes a linear rail and a slider connected to the linear rail, the support 103 is disposed on the slider, and the timing belt 1012 is connected to the slider through the connection plate 106.

As shown in fig. 1-3, for the inductive switch 102, the inductive switch 102 is suitable for sensing the inductive piece on the connecting plate 110, the inductive piece is arranged on the connecting plate 110, and the lifting driving component 101 drives the connecting plate 110 to lift, so that the support 103 arranged on the connecting plate 110 is synchronously driven to lift, and the vacuum adsorption head 105 is ensured to be in a correct working position.

As shown in fig. 1 to 3, for the vacuum suction head 105, the vacuum suction head 105 is connected to a power output shaft of a micro motor, and the vacuum suction head 105 is adapted to suction a chip.

Specifically, the vacuum suction head 105 is connected to the power output shaft of the micro motor, and the movement of the vacuum suction head 105 is individually controlled by the lifting driving member 101, so that each chip can be individually picked and placed.

For a better understanding of the present embodiment, the workflow in connection with the present embodiment is further described: firstly, a plurality of chips are conveyed on a conveying belt, a position judgment control moving assembly of a vision device on a number writing machine is matched to enable a manipulator to move to a position to be grabbed above the chips, then a lifting driving piece 101 drives a support 103 to drive a vacuum adsorption head 105 to move downwards to suck the chips, a first rotary driving piece 104 is controlled to adjust the chips to a posture which accords with a position for placing the chips into the number writing position through judgment of the vision device, and finally the moving driving assembly is controlled to accurately place the chips into the number writing position.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms should not be understood as necessarily being directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Further, one skilled in the art can engage and combine the different embodiments or examples described in this specification.

While embodiments of the present utility model have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the utility model.

Claims (7)

1. A chip adsorbing assembly, comprising: the vacuum suction device comprises a support, a first rotary driving piece, a vacuum suction head and a lifting driving piece;

the vacuum adsorption head is suitable for adsorbing the chip;

the first rotary driving piece is arranged on the support and connected with the vacuum adsorption head to drive the vacuum adsorption head to rotate so as to adjust the direction of the chip;

the lifting driving piece is connected with the support to drive the vacuum adsorption head to move up and down so as to take and place chips.

2. The die attach assembly of claim 1 wherein said first rotary drive member is a micro motor and said vacuum attach head is coupled to a power take off shaft of said micro motor.

3. The die attach assembly of claim 1 wherein said lift drive comprises a second rotary drive, a drive wheel, a driven wheel, a timing belt, and a traveling pair, said support being disposed on said traveling pair, said traveling pair being coupled to said timing belt, said drive wheel and said driven wheel being rotated synchronously by said timing belt, said second rotary drive being coupled to said drive wheel to drive said drive wheel.

4. The die attach assembly of claim 3 wherein said kinematic pair comprises a linear guide and a slider slidably coupled to said linear guide, said support being disposed on said slider, said timing belt being coupled to said slider by a web.

5. The die attach assembly of claim 4 further comprising a sensor switch adapted to sense the position of the slider.

6. The die attach assembly of claim 3 wherein said second rotary drive is a motor.

7. A number writer comprising the chip adsorbing assembly according to any one of claims 1-6.

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