CN219144186U

CN219144186U - Patch type packaging structure suitable for infrared detector

Info

Publication number: CN219144186U
Application number: CN202222087930.8U
Authority: CN
Inventors: 冯海; 杜炳纯; 常飞; 关东奇
Original assignee: Senba Sensing Technology Co ltd
Current assignee: Senba Sensing Technology Co ltd
Priority date: 2022-08-09
Filing date: 2022-08-09
Publication date: 2023-06-06
Anticipated expiration: 2032-08-09

Abstract

The utility model discloses a patch type packaging structure suitable for an infrared detector, which comprises a tube shell and a base, wherein the tube shell is hermetically packaged, an infrared sensing circuit is arranged between the base and the tube shell, a plurality of lead holes which are communicated up and down are formed in the base, leads are inserted into the lead holes, the tops of the leads are connected with the infrared sensing circuit, bonding pads are fixedly connected to the tops of the leads, and the infrared sensing circuit comprises an infrared sensing element, an infrared filter and a circuit board; the infrared sensitive element is connected with the top of the circuit board through the supporting component, a control chip is arranged in the circuit board, and the infrared filter is horizontally arranged above the infrared sensitive element. The utility model realizes the pasting of the sensor without changing the traditional TO-type sensor packaging process, has the advantages of electromagnetic interference resistance and good sealing property, avoids the heat conduction self-excitation phenomenon on materials, and is beneficial TO the automation of downstream application.

Description

Patch type packaging structure suitable for infrared detector

Technical Field

The utility model relates to the technical field of infrared sensors, in particular to a patch type packaging structure suitable for an infrared detector.

Background

The traditional packaging mode in the field of infrared sensors is a TO standard DIP packaging mode, the sensor is not easy TO realize a patch automation process due TO overlong leads, and the existing patch technology adopts an injection molding/ceramic support packaging mode by utilizing a crystal oscillator technology.

However, the sealing of the injection molding support and the optical filter is not beneficial to the sealing reliability of the sensor due to the material problem, and the self-excitation of the sensor is easily caused by the heat conduction problem of the ceramic material in the ceramic support package.

Disclosure of Invention

The utility model aims to solve the problem that the sealing of an injection molding support and an optical filter in the prior art is not beneficial to the sealing reliability of a sensor due to the fact that conductive adhesive is used for sealing, and the self-excitation of the sensor is easy to cause due to the heat conduction problem of ceramic materials in ceramic support packaging.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

the surface-mounted packaging structure suitable for the infrared detector comprises a shell and a base, wherein an infrared sensing circuit is arranged between the base and the shell, a plurality of lead holes are formed in the base, leads are inserted into the lead holes, the tops of the leads are connected with the infrared sensing circuit, bonding pads are fixedly connected to the tops of the leads, and the infrared sensing circuit comprises an infrared sensing element, an infrared filter and a circuit board; the infrared sensitive element is connected with the top of the circuit board through the supporting component, a control chip is arranged in the circuit board, the infrared filter is horizontally arranged above the infrared sensitive element, and a window corresponding to the infrared filter is arranged on the tube shell.

Preferably, the lead is a kovar material.

Preferably, the leads and the bonding pads are in a T-shaped structure.

Preferably, the lead holes are insulated from the base by glass bead material.

Preferably, the pads may be circular, rectangular, triangular or linear in configuration.

Preferably, the shape of the base is round or polygonal, and the material of the base is metal, ceramic, PCB or injection molding material.

Preferably, the chip is a single chip microcomputer, MCU, integrated circuit or FET.

Preferably, the support member is a holder, a silicon wafer or a capacitor.

The beneficial effects are that:

the utility model realizes the pasting of the sensor without changing the traditional TO-type sensor packaging process, has the advantages of electromagnetic interference resistance and good sealing property, avoids the heat conduction and self excitation phenomenon on materials, and is beneficial TO the automation of downstream application.

Drawings

Fig. 1 is a schematic structural diagram of a patch type package structure for an infrared detector according to the present utility model;

FIG. 2 is a schematic side view of a surface mount package structure for an infrared detector according to the present utility model;

fig. 3 is a schematic top view of a surface mount package structure for an infrared detector according to the present utility model;

fig. 4 is a schematic bottom view of a base of a patch-type package structure for an infrared detector according to the present utility model.

In the figure: 1 base, 2 circuit board, 3 supporting component, 4 infrared sensitive element, 5 infrared filter, 6 tube shell, 7 lead wires, 8 bonding pads, 9 lead wire holes.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

Referring to fig. 1-4, a patch type packaging structure suitable for an infrared detector comprises a tube shell 6 and a base 1, wherein the tube shell 6 is hermetically packaged, the base 1 is circular or polygonal in shape, the base 1 is made of metal, ceramic, PCB or injection molding material, and an infrared sensing circuit is arranged between the base 1 and the tube shell 6 and used for generating infrared rays;

in this embodiment, a plurality of lead holes 9 are formed in the base 1 for supporting the leads 7, the lead holes 9 are insulated from the base 1 by glass bead material, the leads 7 are inserted into the lead holes 9, and the leads 7 are made of kovar metal material;

in this embodiment, the top of the lead 7 is connected with an infrared induction circuit, and is used for supplying power to the infrared induction circuit, and the top of the lead 7 is fixedly connected with a bonding pad 8, where the bonding pad 8 may be in a circular, rectangular, triangular or linear structure;

in the embodiment, the lead 7 and the bonding pad 8 are in a T-shaped structure, and the infrared induction circuit comprises an infrared sensitive element 4, an infrared filter 5 and a circuit board 2;

in this embodiment, the infrared sensor 4 is connected to the top of the circuit board 2 through the supporting component 3, and is used for converting an electrical signal into an optical signal, and is used for being provided with a control chip in the circuit board 2, the infrared filter 5 is horizontally disposed above the infrared sensor 4, and the tube shell 6 is provided with a window corresponding to the infrared filter 5.

In the embodiment, the sensor is pasted while the traditional TO-type sensor packaging technology is not changed, and the sensor has the advantages of electromagnetic interference resistance and good sealing performance, avoids the heat conduction and self excitation phenomenon in materials, and is beneficial TO automation of downstream application.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims

1. The utility model provides a paster type packaging structure suitable for infrared detector, includes airtight encapsulation's tube shell (6) and base (1), its characterized in that: an infrared induction circuit is arranged between the base (1) and the tube shell (6), a plurality of lead holes (9) are formed in the base (1), lead wires (7) are inserted in the lead holes (9), the tops of the lead wires (7) are connected with the infrared induction circuit, bonding pads (8) are fixedly connected to the tops of the lead wires (7), and the infrared induction circuit comprises an infrared sensitive element (4), an infrared optical filter (5) and a circuit board (2); the infrared sensitive element (4) is connected with the top of the circuit board (2) through the supporting component (3), a control chip is arranged in the circuit board (2), the infrared filter (5) is horizontally arranged above the infrared sensitive element (4), and a window corresponding to the infrared filter (5) is arranged on the tube shell (6).

2. A patch-type package structure for an infrared detector as set forth in claim 1, wherein: the lead (7) is made of kovar metal material.

3. A patch-type package structure for an infrared detector as set forth in claim 1, wherein: the lead (7) and the bonding pad (8) are in a T-shaped structure.

4. A patch-type package structure for an infrared detector as set forth in claim 1, wherein: the lead hole (9) is insulated from the base (1) by glass bead materials.

5. A patch-type package structure for an infrared detector as set forth in claim 1, wherein: the pads (8) may be circular, rectangular, triangular or linear in configuration.

6. A patch-type package structure for an infrared detector as set forth in claim 1, wherein: the shape of the base (1) is round or polygonal, and the material of the base (1) is metal, ceramic, PCB or injection molding material.

7. A patch-type package structure for an infrared detector as set forth in claim 1, wherein: the control chip is a singlechip, an MCU, an integrated circuit or an FET.

8. A patch-type package structure for an infrared detector as set forth in claim 1, wherein: the supporting component (3) is a retainer, a silicon wafer or a capacitor.