CN219124421U

CN219124421U - Integrated circuit board with heat radiation structure

Info

Publication number: CN219124421U
Application number: CN202222927391.4U
Authority: CN
Inventors: 史云; 蒋飞; 史和平; 王国珍; 曹蒋杰
Original assignee: Changzhou Zechen Electronic Technology Co ltd
Current assignee: Changzhou Zechen Electronic Technology Co ltd
Priority date: 2022-11-03
Filing date: 2022-11-03
Publication date: 2023-06-02
Anticipated expiration: 2032-11-03

Abstract

The utility model relates to the technical field of integrated circuit boards, in particular to an integrated circuit board with a heat radiation structure, which is used for solving the technical problems that the heat radiation effect of all positions on the integrated circuit board is uneven and the heat radiation effect of the integrated circuit board is reduced due to the fact that the heat radiation effect of the wind blown to and not blown to is different when the traditional integrated circuit board is used mostly through air cooling, and comprises two groups of base plates and a heat radiation box, wherein supporting legs are arranged at corners of the bottom of the heat radiation box, and supporting plates are arranged on the outer wall of the bottom end of one side of the heat radiation box; the utility model has the beneficial effects that: the heat on the substrate can be led into the heat dissipation box through the heat-conducting plate, the cooling liquid is filled into the heat dissipation box through the liquid storage box to cool and dissipate heat, the heat generated on the substrate can be partially absorbed through the heat absorption aluminum sheet and the heat absorption layer, and the heat dissipation at each position on the integrated circuit board is uniform through the arrangement, so that the heat dissipation effect of the integrated circuit board is improved.

Description

Integrated circuit board with heat radiation structure

Technical Field

The utility model relates to the technical field of integrated circuit boards, in particular to an integrated circuit board with a heat dissipation structure.

Background

The integrated circuit board is made up by using semiconductor manufacturing process, and making several components of transistor, resistor and capacitor on a small monocrystalline silicon wafer, and combining them into a complete electronic circuit according to the method of multilayer wiring or tunnel wiring.

The existing integrated circuit board mostly dissipates heat through air cooling when in use, and the heat dissipation effect of the places where the air is blown and the places where the air is not blown is different, so that the heat dissipation of each position on the integrated circuit board is uneven, the heat dissipation effect of the integrated circuit board is reduced, and meanwhile, the wind power blows the integrated circuit board to cause the oscillation of the circuit board, so that the normal use of the integrated circuit board is affected.

Disclosure of Invention

The utility model aims to provide an integrated circuit board with a heat radiation structure, which is used for solving the technical problems that the heat radiation effect of the existing integrated circuit board is different between the places where wind blows and the places where the wind does not blow when the existing integrated circuit board is used, so that the heat radiation effect of the integrated circuit board is reduced due to uneven heat radiation of all the places on the integrated circuit board, and meanwhile, the vibration of the integrated circuit board is caused by the wind blowing of the integrated circuit board, so that the normal use of the integrated circuit board is influenced.

The aim of the utility model can be achieved by the following technical scheme:

the utility model provides an integrated circuit board with heat radiation structure, includes two sets of base plates and heat dissipation case, heat dissipation case bottom corner is equipped with the supporting leg, be equipped with the backup pad on the outer wall of heat dissipation case one side bottom, the liquid case is installed at the backup pad top, liquid case top intermediate position is equipped with the inlet, be equipped with the filter layer on the inner wall of liquid case middle part, one side bottom intercommunication that the liquid case is close to the heat dissipation case has the second water pump, the second water pump other end is equipped with the feed liquor pipe that is linked together with the heat dissipation case, liquid case one side top middle part intercommunication has first water pump, the first water pump other end is equipped with communicating pipe, one side top that the heat dissipation case kept away from the liquid case is equipped with the liquid outlet, just the communicating pipe other end is linked together with the liquid outlet, the top and the bottom middle part symmetry of heat dissipation case are provided with the heat conducting plate, two heat conducting plate and heat dissipation case fixed connection, two the heat conducting plate stretches into the inner chamber to the heat dissipation case, the symmetry is equipped with limit structure on the outer wall of heat dissipation case top and bottom both ends.

As a further improvement of the utility model: the two heat conducting plates are provided with a plurality of radiating fins on one end face of the inner cavity of the radiating box, and the radiating fins are fixedly connected with the heat conducting plates.

As a further improvement of the utility model: the heat absorption aluminum sheet is characterized in that a plurality of heat absorption layers are longitudinally arranged at intervals in the middle of the top end of the substrate, a plurality of first capacitors are arranged at intervals at the two ends of the heat absorption layers in a symmetrical mode, a plurality of resistor assemblies are arranged at intervals at one end of the first capacitors, which is far away from the heat absorption layers, and are arranged on the substrate, each resistor assembly comprises a plurality of resistors arranged at intervals, a plurality of chips are arranged at intervals at the one end of the resistor assembly, which is far away from the heat absorption layers, and a plurality of second capacitors are arranged at intervals at the one end of the chips, which is far away from the heat absorption layers, and heat absorption aluminum sheets are symmetrically arranged at the two ends of the middle position of the top of the substrate in the vertical direction.

As a further improvement of the utility model: limit structure includes dead lever and mounting panel, dead lever and mounting panel symmetry are established respectively at the base plate both ends, be equipped with the rotating electrical machines on mounting panel one side top outer wall, the cover is equipped with the rotating block on the output shaft of rotating electrical machines, annular spout has been seted up on the rotating block, the cover is equipped with the slip cap on the dead lever, fixed mounting has the fixed column on the intermediate position outer wall of slip cap one side, just the fixed column is sliding connection mutually with annular spout inner wall, the one end fixedly connected with fixed plate that the slip cap is close to the base plate.

As a further improvement of the utility model: the clamp plate is installed through the bolt to the fixed plate bottom, the bottom of clamp plate is equipped with the protection pad, be equipped with two sets of mounting holes that cooperate with the bolt to use on the clamp plate, be equipped with multiunit louvre on clamp plate and the protection pad, the bottom of protection pad is equipped with the ripple.

The utility model has the following beneficial effects:

the heat on the substrate can be guided into the heat dissipation box through the heat conduction plate, the cooling liquid is filled into the heat dissipation box through the liquid storage box to cool and dissipate heat, and the heat generated on the substrate can be partially absorbed through the heat absorption aluminum sheet and the heat absorption layer, so that the heat dissipation at each position on the integrated circuit board is uniform, and the heat dissipation effect of the integrated circuit board is improved;

the fixed column is driven to move through the operation of the rotating motor, so that the sliding sleeve moves up and down on the fixed rod, the position of the pressing plate can be adjusted, the position of the base plate can be limited and fixed, the base plate is prevented from shaking, and the normal use of the integrated circuit board is ensured.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of the internal structure of the present utility model;

FIG. 2 is a top view of a substrate of the present utility model;

FIG. 3 is a schematic view of the sectional structure of the liquid storage tank of the present utility model;

FIG. 4 is an enlarged schematic view of the structure of FIG. 1A according to the present utility model;

FIG. 5 is a schematic view showing the connection structure of the pressure plate, the protection pad, the heat dissipation holes and the mounting holes.

Reference numerals: 1. a substrate; 2. a chip; 3. a resistor; 4. a first capacitor; 5. a heat radiation box; 6. a liquid storage tank; 7. a first water pump; 8. a communicating pipe; 9. a second water pump; 10. a support plate; 11. support legs; 12. a heat conductive plate; 13. a heat sink; 14. a heat absorbing aluminum sheet; 15. a heat absorbing layer; 16. a filter layer; 17. a mounting plate; 18. a rotating electric machine; 19. a rotating block; 20. an annular chute; 21. a fixed rod; 22. a sliding sleeve; 23. a fixing plate; 24. a pressing plate; 25. a protective pad; 26. fixing the column; 27. a heat radiation hole; 28. a mounting hole; 29. and a second capacitor.

Detailed Description

The technical solutions of the present utility model will be clearly and completely described in connection with the embodiments, and it is obvious that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Examples

The existing integrated circuit board mostly dissipates heat through air cooling when in use, and the heat dissipation effect of the places where the air is blown and the places where the air is not blown are different, so that the heat dissipation of each position on the integrated circuit board is uneven, the heat dissipation effect of the integrated circuit board is reduced, and the following technical scheme is provided for solving the problem:

as shown in fig. 1-3, this embodiment provides an integrated circuit board with a heat dissipation structure, including two groups of base boards 1 and a heat dissipation case 5, a supporting leg 11 is disposed at a corner of the bottom of the heat dissipation case 5, a supporting plate 10 is disposed on an outer wall of a bottom end of one side of the heat dissipation case 5, a liquid storage case 6 is mounted at the top of the supporting plate 10, a liquid inlet is disposed at a middle position of the top of the liquid storage case 6, a filter layer 16 is disposed on an inner wall of a middle portion of the liquid storage case 6, a second water pump 9 is communicated with the bottom end of one side of the liquid storage case 6 close to the heat dissipation case 5, a liquid inlet pipe communicated with the heat dissipation case 5 is disposed at the other end of the second water pump 9, a first water pump 7 is communicated with a first water pump 7, a communicating pipe 8 is disposed at the other end of the first water pump 7, a liquid outlet is disposed at the top end of one side of the heat dissipation case 5 far from the liquid storage case 6, and the communicating pipe 8 is communicated with the liquid outlet, heat conducting plates 12 are symmetrically disposed at the top and bottom end of the heat dissipation case 5, the two heat conducting plates 12 are fixedly connected with the heat dissipation case 5, the two heat conducting plates 12 extend into an inner cavity of the heat dissipation case 5, and limit structures are symmetrically disposed at the top and bottom end of the heat dissipation case 5; the two heat conducting plates 12 are provided with a plurality of radiating fins 13 on one end face of the inner cavity of the radiating box 5, and the radiating fins 13 are fixedly connected with the heat conducting plates 12; a plurality of heat absorption layers 15 are longitudinally arranged at intervals in the middle of the top end of the substrate 1, a plurality of first capacitors 4 are longitudinally arranged at intervals at two ends of the heat absorption layers 15 in a symmetrical mode, a plurality of groups of resistor assemblies are longitudinally arranged at intervals at one end, far away from the heat absorption layers 15, of the first capacitors 4, each group of resistor assemblies comprises a plurality of resistors 3 which are arranged at intervals, a plurality of chips 2 are longitudinally arranged at intervals at one end, far away from the heat absorption layers 15, of each resistor assembly, a plurality of second capacitors 29 are longitudinally arranged at intervals at one end, far away from the heat absorption layers 15, of each chip 2, a plurality of heat absorption aluminum sheets 14 are symmetrically arranged at two ends of the middle position of the top of the substrate 1 in the vertical direction; the heat on the substrate 1 can be led into the heat dissipation box 5 through the heat-conducting plate 12, the cooling liquid is added into the liquid storage box 6 from the liquid inlet, the cooling liquid is poured into the heat dissipation box 5 by the second water pump 9 to cool and dissipate heat, the circulation of the cooling liquid can be realized by the cooperation of the first water pump 7 and the filter layer 16, the heat generated on the substrate 1 can be partially absorbed through the heat absorption aluminum sheet 14 and the heat absorption layer 15, the heat dissipation on the substrate 1 can be accelerated through the heat dissipation holes 27, the heat dissipation at each position on the integrated circuit board is uniform through the arrangement, and the heat dissipation effect of the integrated circuit board is improved.

Examples

The existing integrated circuit board mostly dissipates heat through air cooling when in use, and wind power blows the integrated circuit board to cause oscillation of the circuit board, so that normal use of the integrated circuit board is affected, and for solving the problem, the following technical scheme is provided:

as shown in fig. 1, fig. 4 and fig. 5, the limiting structure comprises a fixed rod 21 and a mounting plate 17, the fixed rod 21 and the mounting plate 17 are symmetrically arranged at two ends of a base plate 1 respectively, a rotating motor 18 is arranged on the outer wall of the top end of one side of the mounting plate 17, a rotating block 19 is sleeved on the output shaft of the rotating motor 18, an annular chute 20 is arranged on the rotating block 19, a sliding sleeve 22 is sleeved on the fixed rod 21, a fixed column 26 is fixedly arranged on the outer wall of the middle position of one side of the sliding sleeve 22, the fixed column 26 is in sliding connection with the inner wall of the annular chute 20, and one end, close to the base plate 1, of the sliding sleeve 22 is fixedly connected with a fixed plate 23; the bottom end of the fixed plate 23 is provided with a pressing plate 24 through bolts, the bottom end of the pressing plate 24 is provided with a protective pad 25, the pressing plate 24 is provided with two groups of mounting holes 28 matched with the bolts for use, the pressing plate 24 and the protective pad 25 are provided with a plurality of groups of heat dissipation holes 27, and the bottom end of the protective pad 25 is provided with waves; two base plates 1 are placed at the top and the bottom of the heat dissipation box 5, the rotating motor 18 is started, the rotating motor 18 works to drive the rotating block 19 to rotate, and then the fixed column 26 is driven to move, so that the sliding sleeve 22 moves up and down on the fixed rod 21, the position of the pressing plate 24 can be adjusted, the position of the base plate 1 is limited and fixed, the base plate 1 is prevented from shaking, and the normal use of the integrated circuit board is ensured.

The preferred embodiments of the utility model disclosed above are intended only to assist in the explanation of the utility model. The preferred embodiments are not intended to be exhaustive or to limit the utility model to the precise form disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, to thereby enable others skilled in the art to best understand and utilize the utility model. The utility model is limited only by the claims and the full scope and equivalents thereof.

Claims

1. The utility model provides an integrated circuit board with heat radiation structure, includes two sets of base plates (1) and heat dissipation case (5), its characterized in that, heat dissipation case (5) bottom corner is equipped with supporting leg (11), be equipped with backup pad (10) on the outer wall of heat dissipation case (5) one side bottom, liquid case (6) are installed at backup pad (10) top, liquid case (6) top intermediate position is equipped with the inlet, be equipped with filter layer (16) on liquid case (6) middle part inner wall, liquid case (6) are close to one side bottom intercommunication of heat dissipation case (5) has second water pump (9), the second water pump (9) other end is equipped with the feed liquor pipe that is linked together with heat dissipation case (5), liquid case (6) one side top middle part intercommunication has first water pump (7), the first water pump (7) other end is equipped with communicating pipe (8), liquid case (5) are kept away from one side top of liquid case (6) and are equipped with the liquid outlet, just communicating pipe (8) other end and liquid outlet are linked together, heat-conducting plate (12) and heat-conducting plate (12) are located at the top and heat-exchanger plate (5) are located two and are connected to heat dissipation case (5), limit structures are symmetrically arranged on the outer walls of the top and the bottom ends of the heat dissipation box (5).

2. An integrated circuit board with a heat dissipation structure according to claim 1, wherein two heat conducting plates (12) are provided with a plurality of heat dissipating fins (13) on one end surface of the inner cavity of the heat dissipating box (5), and the heat dissipating fins (13) are fixedly connected with the heat conducting plates (12).

3. The integrated circuit board with the heat dissipation structure according to claim 1, wherein a plurality of heat absorption layers (15) are longitudinally arranged at intervals in the middle of the top end of the substrate (1), a plurality of first capacitors (4) installed on the substrate (1) are symmetrically arranged at intervals in the longitudinal directions at two ends of the heat absorption layers (15), a plurality of resistor assemblies installed on the substrate (1) are longitudinally arranged at intervals at one ends of the first capacitors (4) far away from the heat absorption layers (15), each resistor assembly comprises a plurality of resistors (3) arranged at intervals, a plurality of chips (2) installed on the substrate (1) are longitudinally arranged at intervals at one ends of the resistor assemblies far away from the heat absorption layers (15), a plurality of second capacitors (29) installed on the substrate (1) are longitudinally arranged at intervals at one ends of the heat absorption layers (2), and aluminum sheets (14) are symmetrically installed at two ends of the middle positions of the top of the substrate (1) in the vertical directions.

4. The integrated circuit board with the heat radiation structure according to claim 1, characterized in that the limit structure comprises a fixed rod (21) and a mounting plate (17), the fixed rod (21) and the mounting plate (17) are symmetrically arranged at two ends of the base plate (1) respectively, a rotating motor (18) is arranged on the outer wall of one side top end of the mounting plate (17), a rotating block (19) is sleeved on an output shaft of the rotating motor (18), an annular chute (20) is arranged on the rotating block (19), a sliding sleeve (22) is sleeved on the fixed rod (21), a fixed column (26) is fixedly arranged on the outer wall of one side middle position of the sliding sleeve (22), the fixed column (26) is in sliding connection with the inner wall of the annular chute (20), and one end, close to the base plate (1), of the sliding sleeve (22) is fixedly connected with a fixed plate (23).

5. The integrated circuit board with the heat dissipation structure according to claim 4, wherein the bottom end of the fixing plate (23) is provided with a pressing plate (24) through bolts, the bottom end of the pressing plate (24) is provided with a protection pad (25), the pressing plate (24) is provided with two groups of mounting holes (28) matched with the bolts for use, the pressing plate (24) and the protection pad (25) are provided with a plurality of groups of heat dissipation holes (27), and the bottom end of the protection pad (25) is provided with waves.