CN211457421U

CN211457421U - Electronic ballast for ultraviolet lamp

Info

Publication number: CN211457421U
Application number: CN201922353085.2U
Authority: CN
Inventors: 苏博周; 樊世超
Original assignee: Beijing Charmsstone Jingyuan Electronics Technology Co ltd
Current assignee: Beijing Charmsstone Jingyuan Electronics Technology Co ltd
Priority date: 2019-12-24
Filing date: 2019-12-24
Publication date: 2020-09-08
Anticipated expiration: 2029-12-24

Abstract

The utility model relates to an ultraviolet lamp electronic ballast belongs to electrical equipment's technical field, aims at solving the problem that traditional electronic ballast cost is higher, the heat-sinking capability is not good, and this ultraviolet lamp electronic ballast includes shell, upper cover, PCB board, MOS pipe and radiator fan, a serial communication port, the shell includes bottom plate and two curb plates, and two curb plates set up relatively on the internal surface of bottom plate, have formed both ends open-ended radiating duct, the body fastening laminating of MOS pipe just follows the radiating duct direction on the medial surface of two curb plates, and the MOS pipe does not have other components and parts to shelter from, the upper cover lid closes the top of shell, radiator fan hoist and mount in on the internal surface of upper cover, on cover and seted up a plurality of ventilation holes and fan ventilation hole. The utility model discloses have the effect that heat-sinking capability preferred, manufacturing cost are lower.

Description

Electronic ballast for ultraviolet lamp

Technical Field

The utility model belongs to the technical field of electrical equipment's technique and specifically relates to an ultraviolet lamp electronic ballast is related to.

Background

The electronic ballast can be matched with the ultraviolet lamp tube, and the electronic ballast product special for the ultraviolet lamp tube is widely applied to the industries of sewage treatment, water purification treatment, air purification, waste gas treatment, medical treatment, printing and the like.

The electronic ballast is provided with a large number of electronic components, wherein the main heating elements comprise an MOS tube, an inductor and the like, and the MOS tube is relatively large in turn-on and conduction loss along with the increase of the power of the electronic ballast, so that the traditional electronic ballast needs to additionally arrange a radiating fin on the MOS tube, and the radiating fin is fastened on the MOS tube through a bolt so as to realize the heat dissipation of the MOS tube, but the volume of the radiating fin is easily influenced by the typesetting of a PCB (printed circuit board) and the size of the internal space of a shell, so that the mode is obviously relatively high in cost and relatively large in occupied space; meanwhile, the radiating fins are generally made of aluminum materials, so that the production cost of the electronic ballast is increased.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects existing in the prior art, the utility model aims to provide an ultraviolet lamp electronic ballast with lower cost and better heat dissipation capability.

The above utility model discloses an above-mentioned utility model purpose can realize through following technical scheme: the utility model provides an ultraviolet lamp electronic ballast, includes shell, upper cover, PCB board, MOS pipe and at least one radiator fan, the shell includes bottom plate and two curb plates, and two curb plates set up relatively on the internal surface of bottom plate, have formed both ends open-ended radiating duct, the body fastening laminating of MOS pipe just follows the radiating duct direction on the medial surface of two curb plates, and the MOS pipe does not have other components and parts to shelter from, the upper cover lid closes the top of shell, at least one radiator fan hoist and mount in on the internal surface of upper cover, the upper cover is opened and is equipped with a plurality of ventilation holes and fan-out wind hole.

By adopting the technical scheme, the MOS tubes in the electronic ballast are all arranged at two sides of the PCB, and when being installed, the MOS tubes are all tightly attached to the two side plates, the MOS tube body is directly contacted with the shell of the electronic ballast, the solid heat conduction speed is higher, and the rapid heat dissipation of the MOS tubes is facilitated; the inner surface of the upper cover is provided with the cooling fan, and the cooling fan can actively ventilate the electric components in the cooling air duct, so that the cooling air duct and the outside can form air circulation, and the cooling efficiency of the electronic ballast is further improved; because the MOS tube is arranged on the two sides, and when the circuit is typeset, no electronic component is arranged or the arranged electronic component cannot block the MOS tube along the length direction of the heat dissipation channel, airflow can smoothly flow through the surface of the MOS tube body, the heat dissipated is quickly taken away, and the airflow circulation can be increased by matching with the ventilation hole arranged on the upper cover, so that the effect of quick heat dissipation is achieved; compared with the traditional radiating method of additionally installing radiating fins for radiating, the aluminum metal material consumption of the radiating fins is reduced, and the production cost is reduced.

The utility model discloses can further set up to in a preferred example: the upper cover includes the lid body, by the perpendicular buckling type sealing portion of two short side edges of lid body and the block portion of buckling type by two long side edges of lid body, the ventilation hole is seted up the lid body with in the sealing portion, block portion block in the surface of two curb plates of shell to with the surface fastening of two curb plates.

Through adopting above-mentioned technical scheme, the ventilation hole sets up on the lid body and on the sealing, and the heat can flow out on the top of lid body and the sealing, improves the radiating rate in the shell.

The utility model discloses can further set up to in a preferred example: the vent holes comprise round hole shapes and/or kidney-shaped hole shapes.

The utility model discloses can further set up to in a preferred example: the cover body is riveted with a fan mounting threaded sleeve with internal threads from the outer surface to one side of the inner surface of the cover body, and a fan mounting hole on the heat dissipation fan is sleeved on the fan mounting threaded sleeve and locked on the inner surface of the upper cover through a locking bolt.

By adopting the technical scheme, on one hand, the fan mounting threaded sleeve can position the cooling fan, so that the cooling fan is convenient to fix; the cooling fan is arranged on the inner surface of the cover body, the distance from the cooling fan to the electronic component is closer, the ventilation and cooling speed of the electronic component on the surface of the PCB is improved, and the service life of the electronic component on the PCB is prolonged.

The utility model discloses can further set up to in a preferred example: the heat radiation fans are provided with two or more than two heat radiation fans which are evenly distributed on the cover body.

By adopting the technical scheme, two or more cooling fans are arranged, so that when a certain cooling fan breaks down, another cooling fan can still actively cool and dissipate heat, and the effective heat dissipation capacity of the electronic ballast is ensured.

The utility model discloses can further set up to in a preferred example: and the two side plates of the shell are respectively provided with a second mounting hole, the second mounting holes correspond to the bodies of the MOS tubes distributed on the respective sides one by one, and the bodies of the MOS tubes are locked on the side plates through bolts and nuts.

The utility model discloses can further set up to in a preferred example: and the upper surface of the bottom plate and the inner surfaces of the two side plates are provided with insulating partition materials, the PCB and the shell are separated by the insulating partition materials, and the MOS tube is separated from the shell.

Through adopting above-mentioned technical scheme, insulating material that separates can keep apart PCB board and MOS pipe and shell, avoids in transportation or later stage use, causes PCB board or MOS pipe and shell to take place to contact because of reasons such as collision and leads to short circuit fault, has improved the security of equipment operation.

The utility model discloses can further set up to in a preferred example: the insulating spacer is a PET insulating spacer made of a PET material with good insulating capability and thermal conductivity.

Through adopting above-mentioned technical scheme, the insulating material that separates selects the PET material, and the PET material has good insulating ability and heat conductivity.

The utility model discloses can further set up to in a preferred example: the PCB board is supported above the bottom plate.

The utility model discloses can further set up to in a preferred example: support threaded sleeves are respectively constructed at four corners and the middle part of the bottom plate, the insulating partition material is positioned through the support threaded sleeves, and the PCB is supported at the upper ends of the support threaded sleeves and locked through bolt pieces.

To sum up, the utility model discloses a following beneficial technological effect:

1. the utility model arranges the MOS tubes on both sides of the PCB and clings to the side plate of the shell, so that the MOS tubes can radiate through the shell; the upper cover is provided with the heat radiation fan which can form airflow circulation with the outside in the heat radiation air duct, so that heat in the shell is quickly radiated to the outside, the MOS tube is arranged on the side surface of the PCB and cannot be blocked by other electronic components, so that the airflow can quickly flow through the surface of the MOS tube body, the heat radiation efficiency of the MOS tube is improved, and the long-term and stable operation of the electronic ballast is facilitated;

2. the utility model discloses a radiator fan is fixed at the internal surface of upper cover, is close the electronic components on PCB board surface more, is favorable to accelerating electronic components's radiating rate, improves components and parts's life.

Drawings

Fig. 1 is a schematic view of the overall structure of the embodiment of the present invention.

Fig. 2 is a schematic structural diagram of the hidden upper cover according to the embodiment of the present invention.

Fig. 3 is a schematic structural diagram of the upper cover according to the embodiment of the present invention.

Fig. 4 is a schematic structural view illustrating a position of the protruding heat dissipation fan on the upper cover according to an embodiment of the present invention.

Fig. 5 is an exploded view of a prominent cooling fan mounting structure according to an embodiment of the present invention.

Fig. 6 is a schematic structural view of an upper cover position where the number of the heat dissipation fans is two in the embodiment of the present invention.

Fig. 7 is a schematic structural diagram of a housing according to an embodiment of the present invention.

Fig. 8 is a schematic position diagram of a heat sink according to an embodiment of the present invention.

Fig. 9 is a schematic cross-sectional view of a MOS transistor mounted on a flange according to an embodiment of the present invention (where the structure of the bolt, the MOS transistor, and the flange is partially enlarged).

In the figure, 1, a housing; 11. a base plate; 12. a side plate; 121. a first mounting hole; 122. a second mounting hole; 13. a heat dissipation air duct; 2. an upper cover; 21. a cover body; 211. an air outlet hole of the fan; 22. a sealing part; 221. a vent hole; 23. a fastening part; 231. connecting holes; 3. an MOS tube; 4. a heat radiation fan; 41. a fan mounting hole; 42. a screw sleeve is installed on the fan; 43. locking the bolt; 5. a bolt; 51. a nut; 6. an insulating spacer; 7. a PCB board; 71. a fastening hole; 72. supporting the threaded sleeve; 8. a thinning groove; 9. a flange.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

The invention discloses a heat-dissipation electronic ballast of an ultraviolet lamp, which comprises a shell 1 and two side plates 12, wherein the shell 1 is integrally cuboid and comprises a bottom plate 11 and the two side plates 12, and the two side plates 12 are oppositely arranged on two long sides of the bottom plate 11. The two side plates 12 may be formed by vertically bending two long sides of the bottom plate 11 upward. The bottom plate 11 and the two side plates 12 form a heat dissipation air duct 13 with two open ends.

Referring to fig. 1 and 3, the housing 1 is provided with an upper cover 2, and the upper cover 2 mainly includes a cover body 21, a sealing portion 22, and a locking portion 23. The sealing part 22 is formed by bending two short sides of the cover body 21 towards the bottom plate 11; the engaging portion 23 is formed by bending two long sides of the cover body 21 perpendicularly to the direction of the bottom plate 11. In order to improve the heat dissipation inside the housing 1, the lid body 21 and the sealing portion 22 are both provided with a vent hole 221, and the vent hole 221 may be a circular hole or a waist-shaped hole, or a combination of two shapes of vent holes 221. In one example, the vent hole 221 is selected to be a kidney-shaped hole, which is opened at a position of the cap body 21 near the sealing portion 22 and extends from the cap body 21 to the entire sealing portion 22; the clamping parts 23 are respectively provided with a connecting hole 231, correspondingly, the side plate 12 of the shell 1 is provided with a first mounting hole 121, the clamping parts 23 are clamped on the outer side surface of the side plate 12 and locked by bolt pieces, and the bolt pieces comprise bolts and nuts or expansion bolts; a plurality of strip-shaped fan air outlet holes 211 are formed in the surface of the cover body 21 and close to the middle of the cover body, and the whole shape of the plurality of fan air outlet holes 211 is circular.

Referring to fig. 4 and 5, the heat dissipation fan 4 is detachably attached to the inner surface of the cover body 21, and at least one of the heat dissipation fans 4 may be provided. In one example, one heat dissipation fan 4 is provided, which is located in the middle of the cover body 21, the heat dissipation fan 4 is square in shape, and fan mounting holes 41 are respectively formed in four corners of the heat dissipation fan 4; four fan installation thread sleeves 42 are riveted from outside to inside at the middle position of the cover body 21, the cooling fan 4 is sleeved on the fan installation thread sleeves 42 through the fan installation holes 41 from the inner side of the cover body 21, the cooling fan 4 is locked on the inner surface of the cover body 21 through the locking bolt 43, and the cooling fan 4 is opposite to the fan air outlet hole 211 on the cover body 21. In another example, referring to fig. 6, the number of the heat dissipation fans 4 may be two, and the volume of the two heat dissipation fans 4 is relatively required to be reduced compared to the case of providing one heat dissipation fan 4, which has an advantage of improving the stability of active heat dissipation of the heat dissipation fan 4, and even if one of the fans fails to work, the other heat dissipation fan 4 can still work.

The heat dissipation fan 4 can actively blow or suck heat to the PCB board 7 mounted on the bottom board 11 inside the heat dissipation air duct 13, and the circulation of the air flow inside and outside the heat dissipation air duct 13 can be formed by matching the ventilation holes 221 and the fan air outlet holes 211 on both sides, so that effective heat dissipation is realized, and the service life of the equipment is prolonged.

Referring to fig. 2, all the MOS transistors 3 in the electronic ballast circuit are arranged on two long sides of the PCB 7 during composition, and the body of the MOS transistor 3 is formed with a via hole for fixing with two side plates 12 of the housing 1.

Referring to fig. 2 and 7, a plurality of second mounting holes 122 are respectively formed in two side plates 12 of the housing 1, and the number of the second mounting holes 122 in each side plate 12 is the same as the number of the MOS transistors 3 fixed to the side plate 12. Each second mounting hole 122 corresponds to one MOS transistor 3, and the corresponding second mounting hole 122 and the via hole of the MOS transistor 3 are concentric. The second mounting hole 122 is provided with a bolt member therein. In one example, the bolt member may be a separate bolt 5 and a nut 51, the bolt 5 sequentially passes through the second mounting hole 122 and the through hole of the body of the MOS transistor 3 from the outer surface of the side plate 12, and then the MOS transistor 3 is locked on the side plate 12 by the nut 51; meanwhile, attention is paid to keeping the body surface of the MOS tube 3 and the inner surface of the side plate 12 to be attached tightly, and the effectiveness of heat dissipation is ensured; all MOS pipes 3 all set up the inboard at curb plate 12 for MOS pipe 3 can not receive stopping of other electronic components, through blowing of radiator fan 4, can make the air current be in the unobstructed flow in the position that is close to curb plate 12, thereby the heat that comes out that drives MOS pipe 3's body and gives off discharges the casing outside fast, and the radiating efficiency has obtained improvement by a wide margin.

Referring mainly to fig. 2, since the PCB 7, the MOS transistor 3 and other electronic components on the PCB 7 are easily in contact with the metal housing 1, thereby causing a short-circuit fault, for this purpose, the inner surfaces of the bottom plate 11 and the two side plates 12 are covered with the insulating spacer 6, the insulating spacer 6 can be made into a groove-shaped structure with the same shape as the housing 1, and the insulating spacer 6 is used for isolating the PCB 7, the MOS transistor 3 and other electronic components on the PCB 7 from the housing 1. The insulating spacer 6 may be a plate or sheet having a certain plasticity, or a film material attached to the inner surface of the housing 1. Preferably, the insulating spacer 6 is a sheet. In one example, the insulating spacer 6 is selected from a PET material having good insulating ability and thermal conductivity.

Referring mainly to fig. 2, the PCB 7 is horizontally supported above the inner surface of the bottom plate 11, so that a certain gap is formed between the back surface of the PCB 7 and the upper surface of the bottom plate 11, which can reduce the abrasion of the PCB 7 on the insulating spacer 6 and avoid short-circuit failure; on the other hand, the space between the PCB board 7 and the bottom plate 11 is advantageous for ventilation and heat dissipation. In a specific example, the four corners of the bottom plate 11 and the geometric center of the bottom plate 11 are respectively riveted with a supporting threaded sleeve 72 protruding from the inner surface of the bottom plate 11, the supporting threaded sleeves 72 are in a vertical posture, the vertical height of each supporting threaded sleeve 72 is equal, fastening holes 71 corresponding to the supporting threaded sleeves 72 one by one are formed in the PCB 7, and the diameter of each fastening hole 71 is smaller than the diameter of each supporting threaded sleeve 72. When the PCB is installed, the PCB 7 is horizontally placed on the support screw sleeves 72, the fastening holes 71 correspond to the support screw sleeves 72 one by one, and then the PCB 7 is fastened in the support screw sleeves 72 by the bolts 5 passing through the fastening holes 71 from the upper part of the PCB 7. In addition, the insulating spacer 8 is attached to the bottom plate 11, and the support screw 72 can also play a role in positioning the insulating spacer 6.

Referring to fig. 8, a thinning groove 8 is formed in the side plate 12 at a position corresponding to the MOS transistor 3, the second mounting hole 122 is opened in the thinning groove 8, and the body portion of the MOS transistor 3 is fitted in the thinning groove 8. The thinning groove 8 may be formed by die forming. The design of attenuate can strengthen the heat-sinking capability of curb plate 12, can also play certain limiting displacement to MOS pipe 3's body, alleviates the later stage in transportation, use, because the skew that MOS pipe 3 produced, the distortion phenomenon of the wearing and tearing of the body of MOS pipe 3 and MOS pipe 3's stitch that the rotation caused, is favorable to having prolonged MOS pipe 3's life.

Referring to fig. 9, further, each second mounting hole 122 is configured with a flange 9 formed on the inner surface of the side plate 12, and the axial length of the flange 9 is less than or equal to the thickness of the body of the MOS transistor 3. During installation, the body of the MOS tube 3 is sleeved on the flange 9 through the through hole, the bolt 5 sequentially penetrates through the second installation hole 122 and the flange 9 from the outer surface of the side plate 12, one section of the bolt 5 is exposed out of the through hole, and the nut 51 is in threaded connection with the bolt 5 to lock the MOS tube 3. The flange 9 can pre-position the body of the MOS tube 3, so that the MOS tubes 3 can be conveniently installed and locked; the bolt 5 penetrates through the flange 9, so that friction loss between the bolt 5 and the second mounting hole 122 and between the bolt 5 and the through hole of the MOS tube 3 can be reduced.

The shell 1 and the upper cover 2 are both made of aluminum materials, and the aluminum materials are favorable for enhancing the heat dissipation capacity. The electronic ballast of the embodiment of the invention can be a non-glue-pouring electronic ballast.

According to the invention, the electronic ballast circuit of the ultraviolet lamp is reformed, and the electronic components on the PCB 7 are reasonably arranged, so that all the MOS tubes 3 with stronger heating capacity are distributed on two sides of the PCB 7, and therefore, when the LED lamp is installed, the MOS tubes 3 are tightly attached to the side plates 12 of the shell 1, and the solid heat conduction is beneficial to the rapid heat dissipation of the MOS tubes 3; the heat dissipation fan 4 is arranged on the inner side of the cover body 21, so that circulating airflow can be actively formed in the heat dissipation air duct 13, and the MOS tube 3 is arranged on the side plate 12 and cannot be blocked by other electronic components, so that the circulating airflow can directly blow the surface of the MOS tube 3, and heat is rapidly driven to be discharged out of the shell 1; the thinning groove 8 is arranged, so that the heat dissipation capability is further improved, and meanwhile, the PCB 7 is convenient to mount; in addition, the flange 9 and other structures are utilized, so that the pre-positioning of the MOS tube 3 can be realized, the PCB 7 is convenient to assemble, the working stability of the MOS tube 3 is improved, and the service life of the electronic ballast is prolonged integrally.

The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.

Claims

1. The utility model provides an ultraviolet lamp electronic ballast, its characterized in that, includes shell (1), upper cover (2), PCB board (7), MOS pipe (3) and at least one radiator fan (4), shell (1) includes bottom plate (11) and two curb plates (12), and two curb plates (12) set up relatively on the internal surface of bottom plate (11), have formed both ends open-ended radiating air duct (13), the body fastening laminating of MOS pipe (3) just follows radiating air duct (13) direction on the medial surface of two curb plates (12), and MOS pipe (3) do not have other components and parts to shelter from, upper cover (2) lid closes the top of shell (1), at least one radiator fan (4) hoist and mount in on the internal surface of upper cover (2), a plurality of ventilation holes (221) and fan wind hole (211) have been seted up to upper cover (2).

2. The electronic ballast for ultraviolet lamp according to claim 1, wherein said upper cover (2) comprises a cover body (21), a sealing portion (22) formed by vertically bending two short sides of the cover body (21), and a locking portion (23) formed by bending two long sides of the cover body (21), said ventilation hole (221) is opened on said cover body (21) and said sealing portion (22), said locking portion (23) is locked on the outer surface of two side plates (12) of said housing (1) and fastened with the outer surface of two side plates (12).

3. An electronic ballast according to claim 2, characterized in that said ventilation holes (221) comprise a round hole shape and/or a kidney-shaped hole shape.

4. The ultraviolet lamp electronic ballast according to claim 2, wherein the cover body (21) is riveted with a fan mounting screw sleeve (42) having an internal thread from an outer surface to an inner surface side thereof, and the fan mounting hole (41) of the heat dissipation fan (4) is fitted over the fan mounting screw sleeve (42) and locked to an inner surface of the upper cover (2) by a locking bolt (43).

5. The ultraviolet lamp electronic ballast according to claim 4, wherein said heat radiating fan (4) is provided in two or more and evenly distributed on the cover body (21).

6. The ultraviolet lamp electronic ballast according to claim 1, wherein the two side plates (12) of the housing (1) are respectively provided with second mounting holes (122), the second mounting holes (122) correspond to the bodies of the MOS tubes (3) distributed on the respective sides one by one, and the bodies of the MOS tubes (3) are locked on the side plates (12) by bolts (5) and nuts (51).

7. An electronic ballast for ultraviolet lamp according to claim 1, characterized in that insulating spacers (6) are provided on the upper surface of the bottom plate (11) and the inner surfaces of the two side plates (12), said insulating spacers (6) separating the PCB board (7) from the housing (1), the MOS tube (3) from the housing (1).

8. An electronic ballast according to claim 7, characterized in that said insulating spacer (6) is a PET insulating spacer (6) of PET material having good insulating ability and thermal conductivity.

9. An electronic ballast according to claim 7, characterized in that the PCB board (7) is supported above the base plate (11).

10. The ultraviolet lamp electronic ballast according to claim 9, wherein said base plate (11) is constructed with support bosses (72) at four corners and a middle portion, respectively, said insulating spacer (6) is positioned by the support bosses (72), and said PCB board (7) is supported at an upper end of the support bosses (72) and locked by bolt members.