CN209517817U - A kind of radiator structure of magnetic suspension bearing multiplex power amplifier - Google Patents
A kind of radiator structure of magnetic suspension bearing multiplex power amplifier Download PDFInfo
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- CN209517817U CN209517817U CN201821921383.6U CN201821921383U CN209517817U CN 209517817 U CN209517817 U CN 209517817U CN 201821921383 U CN201821921383 U CN 201821921383U CN 209517817 U CN209517817 U CN 209517817U
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- radiator
- heat dissipation
- bellows
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- side plate
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Abstract
The utility model creation provides a kind of radiator structure of magnetic suspension bearing multiplex power amplifier, heat dissipation bellows including both ends open, power device wait radiate in PCB circuit board protrudes into heat dissipation inner bellows, and corresponding PCB circuit board is fixed on to the outer wall of heat dissipation bellows side plate;The heat dissipation inner bellows correspond to and are equipped with upper radiator above power device, corresponding power device lower section is equipped with main radiator;The upper radiator includes upper matrix part and upper cooling fin, and upper matrix lower surface is bonded with power device upper surface;The main radiator includes main matrix part and main cooling fin, and main matrix lower surface is bonded with power device lower surface;There are windward chambers between the upper radiator and the top plate for the bellows that radiate;There are leeward chambers between the main radiator and the bottom plate for the bellows that radiate.The reasonable structural arrangement of this radiator structure, overall stability is good, realizes common heat dissipation up and down, perfect heat-dissipating.
Description
Technical field
The invention belongs to magnetic suspension bearing multiplex power amplifier radiating device technical field, more particularly, to one kind
The radiator structure of magnetic suspension bearing multiplex power amplifier.
Background technique
The heat dissipation majority of now common magnetic suspension bearing power amplifier just leans on power device and radiator to be bonded heat dissipation,
Or radiator cooperates fan cooling, it, can be individually by heat dissipation if power device is not again many if cooling fin is sufficiently large
Piece heat dissipation, once but power device is more than 10 or more, simple cooling fin cannot meet cooling requirements, now
Traditional way is exactly the edge for power device being placed on wiring board, the left side, the right or the right and left, intermediate wiring board use
The device that other realize power amplifier functions is placed, the blade for then installing fan against cooling fin additional is blowed, to by heat
It takes away, it, will when fastening power device and cooling fin if being firstly placed to one side or two sides
It is interfered with other intermediate devices, needs to avoid the channel of power device fastening, designed lines plate when design
When just will receive limitation.Second disadvantage is exactly that the blade of fan against cooling fin radiates, and the wind of fan blowout is not led
The channel of wind cannot adequately be blown on the blade of discrete piece, hot vortex is also occurred that due to device or layout, so that
Heat dissipation effect is bad.Third disadvantage is exactly that a screw fastening is required per power device all the way, just can guarantee power in this way
Device and cooling fin fit closely realization heat dissipation effect, and when installation and cost of labor is bigger when maintenance.
Summary of the invention
In view of this, the invention is intended to overcome above-mentioned defect existing in the prior art, a kind of magnetic suspension shaft is proposed
Hold the radiator structure of multiplex power amplifier.
In order to achieve the above objectives, the technical solution of the invention is achieved in that
A kind of radiator structure of magnetic suspension bearing multiplex power amplifier, the heat dissipation bellows including both ends open, wait radiate
Power device in PCB circuit board protrudes into heat dissipation inner bellows, and corresponding PCB circuit board is fixed on the outer of heat dissipation bellows side plate
Wall;
The heat dissipation inner bellows correspond to and are equipped with upper radiator above power device, corresponding power device lower section is equipped with main dissipate
Hot device;By connector, upper radiator, power device and main radiator are connected and fixed integrally, on radiation air roof box
It is correspondingly connected with part and sets through-hole;
The upper radiator includes upper matrix part and upper cooling fin, and upper matrix lower surface and power device upper surface are pasted
It closes;The main radiator includes main matrix part and main cooling fin, and main matrix lower surface is bonded with power device lower surface;
There are windward chamber between the upper radiator and the top plate for the bellows that radiate, and each abutting fins of upper radiator it
Between radiating groove be connected to windward chamber;There are leeward chamber between the main radiator and the bottom plate for the bellows that radiate, and main heat dissipation
Radiating groove between each blade of device is connected to leeward chamber.
Further, the upper radiator two sides are fixed by the first screw penetrated from heat dissipation bellows side plate, this first
Screw sequentially passes through PCB circuit board, side plate, and PCB circuit board, side plate and upper radiator are fixed together.
Further, the main radiator two sides are fixed by the second screw penetrated from heat dissipation bellows side plate, this second
Screw sequentially passes through PCB circuit board, side plate, and PCB circuit board, side plate and main radiator are fixed together.
Further, heat dissipation bellows both side plate outer surface is respectively provided with the installation position of installation PCB circuit board.
Further, what is be spaced between the main cooling fin and radiation air bottom plate is equipped with cushion block.
Further, positioning column, PCB circuit board and radiation air are equipped between the side plate and PCB circuit board of the heat dissipation bellows
Ventilation gap is formed by positioning column interval between case side plate.
Further, the connector uses screw.
Further, the heat dissipation bellows use metal material, and the two sides of the upper radiator and main radiator are bonded
In the inner wall of heat dissipation bellows side plate.
Compared with the existing technology, the invention has the advantage that
The reasonable structural arrangement of this radiator structure, overall stability is good, power device upper and lower surfaces all close to radiator,
Heat-sinking capability is improved, and the multichannel of side only can be by pressing power with installation no more than 3 screw, and realizes
Lower common heat dissipation, improves radiating efficiency, perfect heat-dissipating.
Detailed description of the invention
The attached drawing for constituting a part of the invention is used to provide to further understand the invention, present invention wound
The illustrative embodiments and their description made are used to explain the present invention creation, do not constitute the improper restriction to the invention.?
In attached drawing:
Fig. 1 is the planar structure schematic diagram of the invention;
Fig. 2 is the schematic perspective view of the invention.
Description of symbols:
1- heat dissipation bellows;2-PCB wiring board;3- power device;4- heat dissipation bellows side plate;The upper radiator of 5-;The main heat dissipation of 6-
Device;7- connector;8- through-hole;The upper matrix part of 9-;The upper cooling fin of 10-;The main matrix part of 11-;The main cooling fin of 12-;13- windward chamber;
14- radiating groove;15- leeward chamber;The first screw of 16-;The second screw of 17-;18- positioning column;19- ventilation gap.
Specific embodiment
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the invention can
To be combined with each other.
In the description of the invention, it is to be understood that term " center ", " longitudinal direction ", " transverse direction ", "upper", "lower",
The orientation or positional relationship of the instructions such as "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is
It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of description the invention and simplifies description, rather than indicate
Or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot understand
For the limitation to the invention.In addition, term " first ", " second " etc. are used for description purposes only, and should not be understood as indicating
Or it implies relative importance or implicitly indicates the quantity of indicated technical characteristic." first ", " second " etc. are defined as a result,
Feature can explicitly or implicitly include one or more of the features.In the description of the invention, unless separately
It is described, the meaning of " plurality " is two or more.
In the description of the invention, it should be noted that unless otherwise clearly defined and limited, term " peace
Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection;It can be mechanical connection, be also possible to be electrically connected;Can be directly connected, can also indirectly connected through an intermediary,
It can be the connection inside two elements.For the ordinary skill in the art, on being understood by concrete condition
State concrete meaning of the term in the invention.
Below with reference to embodiment come the present invention will be described in detail create.
A kind of radiator structure of magnetic suspension bearing multiplex power amplifier, as depicted in figs. 1 and 2, including both ends open
Radiate bellows 1, and the power device 3 in PCB circuit board 2 to be radiated protrudes into heat dissipation inner bellows, and corresponding PCB circuit board is fixed
In the outer wall of heat dissipation bellows side plate 4;
The heat dissipation inner bellows correspond to and are equipped with upper radiator 5 above power device, corresponding power device lower section is equipped with master
Radiator 6;By connector 7, upper radiator, power device and main radiator are connected and fixed integrally, on heat dissipation bellows top
It is correspondingly connected with part on plate and sets through-hole 8, connector can be protruded into connector via through holes when the assembly is complete using screw
Into heat dissipation bellows, it is attached fixation;
The upper radiator includes upper matrix part 9 and upper cooling fin 10, upper matrix lower surface and power device upper surface
Fitting;The main radiator includes main matrix part 11 and main cooling fin 12, main matrix lower surface and power device following table face paste
It closes;
There are windward chamber 13 between the upper radiator and the top plate for the bellows that radiate, and each abutting fins of upper radiator
Between radiating groove 14 be connected to windward chamber;There are leeward chambers 15 between the main radiator and the bottom plate for the bellows that radiate, and
Radiating groove between each blade of main radiator is connected to leeward chamber.
In practical radiation processes, fan is arranged in corresponding heat dissipation bellows side opening, is dried using fan into bellows.
Such structure design, has been effectively ensured the heat dissipation effect of radiator, and the heat absorbed by radiator is through radiating groove and accordingly
The intracavitary cold wind of wind is taken away, and wind area excessively is big, good heat dissipation effect.
Above-mentioned upper radiator two sides by fixed from the first screw 16 for penetrating of heat dissipation bellows side plate, first screw according to
It is secondary to pass through PCB circuit board, side plate, PCB circuit board, side plate and upper radiator are fixed together.
Above-mentioned main radiator two sides by fixed from the second screw 17 for penetrating of heat dissipation bellows side plate, second screw according to
It is secondary to pass through PCB circuit board, side plate, PCB circuit board, side plate and main radiator are fixed together.
What is be spaced between above-mentioned main cooling fin and radiation air bottom plate is equipped with cushion block, since upper radiator passes through the first screw
Fixed with corresponding construction part, main radiator is fixed by the second screw and corresponding construction part, in addition connector by upper radiator,
Power device and main radiator are fixed, and overall stability is good, and further through the supporting role of set cushion block, it is more reliable
It ensure that the stability of structure.
Positioning column 18, PCB circuit board and heat dissipation bellows side plate are equipped between the side plate and PCB circuit board of above-mentioned heat dissipation bellows
Between ventilation gap 19 formed by positioning column interval.PCB circuit board and side sheet room have also sufficiently reserved the space of ventilation and heat, really
Heat dissipation effect is protected.Above-mentioned the first screw, the second screw are also possible to that inner bellows are corresponding dissipates across positioning column and heat dissipation
Hot device connection.
Above-mentioned heat dissipation bellows both side plate outer surface is respectively provided with the installation position of installation PCB circuit board.Here installation
Position refers to the space that can install PCB circuit board to be radiated, and can be above-mentioned positioning column, is also possible to that wiring board is kept for pacify
The space of dress.That is, heat dissipation bellows two sides can effectively install PCB circuit board, and the power device on the heat sink of two sides
Part can be extend into heat dissipation bellows by the via hole of side plate, arranged for structure, provided more conveniences.
Above-mentioned heat dissipation bellows use metal material, and the two sides of the upper radiator and main radiator are fitted in radiation air
The inner wall of case side plate enhances thermally conductive function, better heat-radiation effect.
Since heat dissipation air duct can completely blow the wind that fan is blown out on a heat sink, if not radiating air duct, wind
The wind of fan blowout will blow to entire cabinet, can not completely concentrate on a heat sink.There is heat dissipation air duct will be by wind collection
On middle guide radiator, the reduction of air quantity not will cause, improve the efficiency that wind takes away heat on radiator.
The invention is reasonable in design, breaks conventional power devices and his device on one face and power device
The structure on the assist side that can only arrange both sides, each power device can only be close to side cooling fin by screw fastening carry out it is scattered
Heat, heat-sinking capability all close to radiator, is improved in the power device upper and lower surfaces of this structure, and the multichannel of side is only with installation
No more than 3 screw can be by pressing power, and realizes common heat dissipation up and down.Improve radiating efficiency, saving of work and time.
The foregoing is merely the preferred embodiments of the invention, are not intended to limit the invention creation, all at this
Within the spirit and principle of innovation and creation, any modification, equivalent replacement, improvement and so on should be included in the invention
Protection scope within.
Claims (8)
1. a kind of radiator structure of magnetic suspension bearing multiplex power amplifier, it is characterised in that: the radiation air including both ends open
Case, the power device wait radiate in PCB circuit board protrudes into heat dissipation inner bellows, and corresponding PCB circuit board is fixed on radiation air
The outer wall of case side plate;
The heat dissipation inner bellows correspond to and are equipped with upper radiator above power device, corresponding power device lower section is equipped with main heat dissipation
Device;By connector, upper radiator, power device and main radiator are connected and fixed integrally, it is right on radiation air roof box
Connector is answered to set through-hole;
The upper radiator includes upper matrix part and upper cooling fin, and upper matrix lower surface is bonded with power device upper surface;Institute
Stating main radiator includes main matrix part and main cooling fin, and main matrix lower surface is bonded with power device lower surface;
There are windward chambers between the upper radiator and the top plate for the bellows that radiate, and between each abutting fins of upper radiator
Radiating groove is connected to windward chamber;There are leeward chamber between the main radiator and the bottom plate for the bellows that radiate, and main radiator
Radiating groove between each blade is connected to leeward chamber.
2. a kind of radiator structure of magnetic suspension bearing multiplex power amplifier according to claim 1, it is characterised in that: institute
It states radiator two sides to fix by the first screw penetrated from heat dissipation bellows side plate, which sequentially passes through PCB line
PCB circuit board, side plate and upper radiator are fixed together by road plate, side plate.
3. a kind of radiator structure of magnetic suspension bearing multiplex power amplifier according to claim 1, it is characterised in that: institute
It states main radiator two sides to fix by the second screw penetrated from heat dissipation bellows side plate, which sequentially passes through PCB line
PCB circuit board, side plate and main radiator are fixed together by road plate, side plate.
4. a kind of radiator structure of magnetic suspension bearing multiplex power amplifier according to claim 1, it is characterised in that: institute
State the installation position that heat dissipation bellows both side plate outer surface is respectively provided with installation PCB circuit board.
5. a kind of radiator structure of magnetic suspension bearing multiplex power amplifier according to claim 1, it is characterised in that: institute
State be spaced between main cooling fin and radiation air bottom plate be equipped with cushion block.
6. a kind of radiator structure of magnetic suspension bearing multiplex power amplifier according to claim 1, it is characterised in that: institute
It states and is equipped with positioning column between the side plate and PCB circuit board of heat dissipation bellows, by positioning column between PCB circuit board and heat dissipation bellows side plate
Interval forms ventilation gap.
7. a kind of radiator structure of magnetic suspension bearing multiplex power amplifier according to claim 1, it is characterised in that: institute
Connector is stated using screw.
8. a kind of radiator structure of magnetic suspension bearing multiplex power amplifier according to claim 1, it is characterised in that: institute
Heat dissipation bellows are stated using metal material, the two sides of the upper radiator and main radiator are fitted in the interior of heat dissipation bellows side plate
Wall.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821921383.6U CN209517817U (en) | 2018-11-21 | 2018-11-21 | A kind of radiator structure of magnetic suspension bearing multiplex power amplifier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821921383.6U CN209517817U (en) | 2018-11-21 | 2018-11-21 | A kind of radiator structure of magnetic suspension bearing multiplex power amplifier |
Publications (1)
Publication Number | Publication Date |
---|---|
CN209517817U true CN209517817U (en) | 2019-10-18 |
Family
ID=68189984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201821921383.6U Active CN209517817U (en) | 2018-11-21 | 2018-11-21 | A kind of radiator structure of magnetic suspension bearing multiplex power amplifier |
Country Status (1)
Country | Link |
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CN (1) | CN209517817U (en) |
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2018
- 2018-11-21 CN CN201821921383.6U patent/CN209517817U/en active Active
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