CN218498057U - Low-thermal-resistance chip - Google Patents
Low-thermal-resistance chip Download PDFInfo
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- CN218498057U CN218498057U CN202222298562.1U CN202222298562U CN218498057U CN 218498057 U CN218498057 U CN 218498057U CN 202222298562 U CN202222298562 U CN 202222298562U CN 218498057 U CN218498057 U CN 218498057U
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- conduction copper
- heat dissipation
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Abstract
The utility model discloses a low thermal resistance chip, which comprises a housin, inside one side fixedly connected with chip board of casing, chip board's both sides all are equipped with the pin, the casing is stretched out to one side of pin, the downside of casing is equipped with heat dissipation mechanism, heat dissipation mechanism includes heat conduction copper sheet, first heat conduction copper post, second heat conduction copper post, first radiator unit, second radiator unit, the downside at chip board is connected in the laminating of heat conduction copper sheet. The above structure is adopted in the utility model, through setting up heat conduction copper sheet, first heat conduction copper post, second heat conduction copper post, first radiator unit, second radiator unit, effectively derive the heat that the during operation of chip board produced, prevent that the temperature from accumulating in the casing, very big avoided the high temperature to lead to chip work unstability, the condition of damaging even, increase of service life satisfies current user demand, in addition because the louvre has been seted up to the upside of casing, further improve the radiating effect of chip.
Description
Technical Field
The utility model belongs to the technical field of the chip, in particular to low thermal resistance chip.
Background
Integrated circuits, or microcircuits, microchips, and chips, are one way to miniaturize circuits in electronics, and are typically fabricated on the surface of a semiconductor wafer. The integrated circuit in which a circuit is formed over the surface of a semiconductor chip is also referred to as a thin film integrated circuit. Another thick film hybrid integrated circuit is a miniaturized circuit formed by integrating a separate semiconductor device and passive components onto a substrate or wiring board. This document relates to monolithic integrated circuits, i.e., thin film integrated circuits.
The heat-resisting degree of the chip depends on the material of the silicon semiconductor, the manufacturing process and the heat dissipation capacity of the package, at present, a heat sink with better heat conductivity is tightly attached to the chip with larger heat productivity, and a small fan is fixed above the heat sink, so that the air flow generated by the high-speed rotation of the fan takes away the heat on the heat sink, however, the method has higher cost, the heat dissipation effect of the chip is general due to unstable rotating speed after the fan is used for a long time and is aged, the heat in the chip shell is accumulated too much, the chip is easy to damage, the service life is shorter, and the current use requirement cannot be met.
SUMMERY OF THE UTILITY MODEL
To the problem mentioned in the background art, the utility model aims at providing a low thermal resistance chip to solve present chip heat radiation structure comparatively single, can not dispel the heat to the inside chip board of chip betterly, problem.
The above technical purpose of the present invention can be achieved by the following technical solutions:
a low-thermal-resistance chip comprises a shell, wherein a chip board is fixedly connected to one side in the shell, pins are arranged on two sides of the chip board, one side of each pin extends out of the shell, and a heat dissipation mechanism is arranged on the lower side of the shell;
the heat dissipation mechanism comprises a heat conduction copper sheet, a first heat conduction copper column, a second heat conduction copper column, a first heat dissipation assembly and a second heat dissipation assembly, the heat conduction copper sheet is attached to the lower side of the chip board, the first heat conduction copper column is fixedly connected to the two sides of the lower end of the heat conduction copper sheet, the second heat conduction copper column is arranged on the lower side of the first heat conduction copper column, the first heat dissipation assembly is arranged between the first heat conduction copper column and the second heat conduction copper column, and the second heat dissipation assembly is arranged on the lower side of the second heat conduction copper column.
Through adopting above-mentioned technical scheme, through setting up the heat conduction copper sheet, first heat conduction copper post, second heat conduction copper post, first radiator unit, second radiator unit, effectively derive the heat that the chip board during operation produced, prevent that the temperature accumulation is in the casing, very big avoided the high temperature to lead to chip job shakiness, the condition of damage even, increase of service life satisfies current user demand, in addition because the louvre has been seted up to the upside of casing, further improve the radiating effect of chip.
Further, as a preferred technical scheme, the first heat dissipation assembly comprises a heat conduction spring, the upper end of the heat conduction spring is fixedly connected with the bottom end of the first heat conduction copper column, and the lower end of the heat conduction spring is fixedly connected with the top end of the second heat conduction copper column.
Through adopting above-mentioned technical scheme, through one end with heat conduction spring and first heat conduction copper support connnection, heat conduction spring's the other end and second heat conduction copper support connnection play the thermal effect of transmission, and heat conduction spring establishes in the outside of casing, conveniently the partial heat of effluvium, and heat conduction spring also plays the support cushioning effect of certain extent in addition.
Further, as a preferable technical scheme, the outer surface of the heat conduction spring is coated with a heat conduction layer.
By adopting the technical scheme, the heat conduction layer is coated on the outer surface of the heat conduction spring, so that the heat dissipation effect is achieved.
Further, as an optimal technical scheme, the second heat dissipation assembly comprises a heat dissipation silica gel plate, the heat dissipation silica gel plate is fixedly connected to the bottom end of the second heat conduction copper column, and heat conduction silicone grease is arranged on the lower side of the heat dissipation silica gel plate.
Through adopting above-mentioned technical scheme, through setting up second radiator unit, the radiator silica gel board is with the partial heat effluvium of second copper post to the pcb aluminium base board on, the radiator silica gel board antidetonation buffering effect is also good in addition.
Further, as a preferred technical scheme, a plurality of groups of through holes are formed in the heat dissipation silica gel plate.
Through adopting above-mentioned technical scheme, through setting up the through-hole on the heat dissipation silica gel board, improve the radiating rate of heat dissipation silica gel board, reduce the heat and pile up.
Further, as preferred technical scheme, the bottom of heat dissipation silica gel board is equipped with anti-skidding line.
Through adopting above-mentioned technical scheme, through the anti-skidding line that sets up heat dissipation silica gel board bottom, play the frictional effect of increase, this chip of being convenient for is installed.
Further, as a preferred technical scheme, the upper end of the shell is provided with a heat dissipation hole, and one side of the interior of the heat dissipation hole is provided with a dust screen.
By adopting the technical scheme, the oblique heat dissipation holes are formed in the upper side of the shell, partial heat dissipated by the chip is discharged through the heat dissipation holes, and the dust screen prevents dust from entering the shell.
Further, as a preferred technical scheme, fixedly connected with bracing piece in the downside cavity of casing, the top fixedly connected with carriage of bracing piece, the inner wall of carriage is connected with the external surface fixed of first heat conduction copper post.
Through adopting above-mentioned technical scheme, the bracing piece is strengthened the support to the carriage to make the carriage strengthen the position of firm first heat conduction copper post, make first heat conduction copper post installation more firm, and then provide the guarantee for heat conduction work.
Further, as a preferred technical scheme, one side of the inside of the heat dissipation hole is fixedly connected with a baffle, and a plurality of hollow columns are arranged inside the baffle.
Through adopting above-mentioned technical scheme, through the internally mounted at the louvre have the baffle, the baffle is located the downside of dust screen, can further block the entering of dust, and is equipped with the cavity post on the baffle and is used for thermal giving off.
To sum up, the utility model discloses mainly have following beneficial effect:
firstly, heat generated during the working of a chip board is effectively led out by arranging the heat conducting copper sheet, the first heat conducting copper column, the second heat conducting copper column, the first heat dissipation assembly and the second heat dissipation assembly, so that the temperature is prevented from being accumulated in the shell, the condition that the chip is unstable in working and even damaged due to overhigh temperature is greatly avoided, the service life is prolonged, the existing use requirements are met, and in addition, the heat dissipation effect of the chip is further improved because the heat dissipation holes are formed in the upper side of the shell;
secondly, the heat conducting layer is coated on the surface of the heat conducting spring, so that the heat of the first heat conducting copper column can be transferred into the second heat conducting copper column, the heat transfer is convenient, the position of the second heat radiating assembly can be finely adjusted by the heat conducting spring, and the heat conducting spring is matched with the heat radiating silica gel plate to play a certain supporting and buffering role, so that the using effect is better;
thirdly, the supporting rod and the supporting frame are arranged, so that the position of the first heat-conducting copper column can be strengthened and stabilized by the supporting frame, the first heat-conducting copper column is more firmly installed, and the heat-conducting work is further guaranteed;
fourth, this technical scheme compares current fin cooperation fan heat dissipation, and the heat dissipation is more stable, and the result of use is better, has effectively reduced use cost.
Drawings
Fig. 1 is a perspective view of the present invention;
fig. 2 is a schematic structural diagram of the present invention;
FIG. 3 is a schematic view of the present invention;
fig. 4 is a connection structure diagram of the heat conductive spring and the heat conductive layer of the present invention.
Reference numerals are as follows: 1. the shell, 2, the pin, 3, the chip board, 4, the heat dissipation mechanism, 41, the heat conduction copper sheet, 42, first heat conduction copper post, 43, second heat conduction copper post, 5, first radiating component, 51, heat conduction spring, 52, the heat-conducting layer, 6, anti-skidding line, 7, second radiating component, 71, heat dissipation silica gel board, 72, the through-hole, 73, heat conduction silicone grease, 8, the louvre, 9, the dust screen, 10, the bracing piece, 11, the carriage, 12, the baffle, 13, the cavity post.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
Referring to fig. 1 to 4, a low thermal resistance chip described in this embodiment includes a housing 1, a chip board 3 is fixedly connected to one side of the inside of the housing 1, pins 2 are disposed on both sides of the chip board 3, one side of each pin 2 extends out of the housing 1, a heat dissipation mechanism 4 is disposed on the lower side of the housing 1, the heat dissipation mechanism 4 includes a heat conduction copper sheet 41, a first heat conduction copper column 42, a second heat conduction copper column 43, a first heat dissipation assembly 5, and a second heat dissipation assembly 7, the heat conduction copper sheet 41 is attached to the lower side of the chip board 3, the first heat conduction copper column 42 is fixedly connected to both sides of the lower end of the heat conduction copper sheet 41, the second heat conduction copper column 43 is disposed on the lower side of the first heat conduction copper column 42, the first heat dissipation assembly 5 is disposed between the first heat conduction copper column 42 and the second heat conduction copper column 43, the second heat conduction copper column 43 is disposed on the lower side of the second heat conduction copper column 43, the first heat conduction copper column 5 and the second heat dissipation assembly 7 are disposed on the lower side of the housing, the heat conduction copper column 41, the heat conduction copper column 42, the heat conduction assembly effectively guides heat generated when the chip 3 during operation, the chip can prevent the chip from being damaged, and the chip can prolong the chip, thereby prolonging the service life of the chip, and even the chip, thereby avoiding the chip.
Example 2
Referring to fig. 2-4, on the basis of embodiment 1, in order to achieve the purpose of heat dissipation, in this embodiment, an innovative design is performed on the first heat dissipation assembly 5 and the second heat dissipation assembly 7, specifically, the first heat dissipation assembly 5 includes a heat conduction spring 51, an upper end of the heat conduction spring 51 is fixedly connected to a bottom end of the first heat conduction copper pillar 42, a lower end of the heat conduction spring 51 is fixedly connected to a top end of the second heat conduction copper pillar 43, a heat conduction layer 52 is coated on an outer surface of the heat conduction spring 51, the second heat dissipation assembly 7 includes a heat dissipation silica gel plate 71, the heat dissipation silica gel plate 71 is fixedly connected to a bottom end of the second heat conduction copper pillar 43, a heat conduction silicone grease 73 is disposed on a lower side of the heat dissipation silica gel plate 71, and a plurality of sets of through holes 72 are disposed inside the heat dissipation silica gel plate 71; through being connected heat conduction spring 51's one end and first heat conduction copper post 42, heat conduction spring 51's the other end and second heat conduction copper post 43 are connected, play the effect of heat transfer, heat conduction spring 51 establishes in the outside of casing 1, conveniently dispel partial heat, heat conduction spring 51 also plays the support cushioning effect of certain extent in addition, apply paint heat conduction layer 52 with a brush through the surface at heat conduction spring 51, play radiating effect, through setting up second radiator unit 7, heat dissipation silica gel plate 71 disperses the partial heat of second copper post to the aluminium base board of pcb, heat dissipation silica gel plate 71 antidetonation buffering effect is also good in addition, through setting up through-hole 72 on the heat dissipation silica gel plate 71, improve the rate of heat dissipation silica gel plate 71, reduce the heat and pile up.
Referring to fig. 2, in order to achieve the purpose of enhancing anti-skid performance, in the present embodiment, the bottom end of the heat dissipation silicone plate 71 is provided with anti-skid grains 6; the anti-slip lines 6 at the bottom end of the heat dissipation silica gel plate 71 are arranged, so that the friction is increased, and the chip is convenient to mount.
Example 3
Referring to fig. 2, in this embodiment, on the basis of embodiment 1, in order to achieve the purpose of reinforcing the first heat-conducting copper cylinder 42, in this embodiment, a supporting rod 10 is fixedly connected in a lower cavity of the housing 1, a supporting frame 11 is fixedly connected to a top end of the supporting rod 10, and an inner wall of the supporting frame 11 is fixedly connected to an outer surface of the first heat-conducting copper cylinder 42; the bracing piece 10 strengthens the support to the carriage 11 to make the carriage 11 strengthen the position of firm first heat conduction copper post 42, make first heat conduction copper post 42 install more firmly, and then provide the guarantee for heat conduction work.
Referring to fig. 1-2, in order to achieve the purpose of speeding up the heat dissipation and dust prevention of the chip board 3, in this embodiment, the upper end of the casing 1 is provided with a heat dissipation hole 8, one side inside the heat dissipation hole 8 is provided with a dust-proof net 9, one side inside the heat dissipation hole 8 is fixedly connected with a baffle 12, and a plurality of hollow columns 13 are arranged inside the baffle 12; through set up slant louvre 8 at the upside of casing 1, the partial heat that chip board 3 effluvium is discharged through louvre 8, and dust screen 9 then prevents that the dust from entering into casing 1's inside, has baffle 12 through the internally mounted at louvre 8, and baffle 12 is located the downside of dust screen 9, can further block the entering of dust, and is equipped with well hollow column 13 on the baffle 12 and is used for thermal giving off.
The use principle and the advantages are as follows: during the use, weld pin 2 on the pcb, heat dissipation silica gel board 71 laminates the pcb this moment, heat dissipation silica gel board 71 extrudes heat conduction spring 51 a little, cooperation heat dissipation silica gel board 71 plays certain support cushioning effect, in addition, cooperation through slide bar 12 and spout 13 between first heat conduction copper post 42 and the second heat conduction copper post 43, prevent effectively that heat conduction spring 51 from removing and producing the deviation, strengthen heat conduction spring 51's stability, through scribbling heat-conducting layer 52 on heat conduction spring 51 surface, can be with the heat transfer of first heat conduction copper post 42 to the second heat conduction copper post 43 in, conveniently carry out the heat transfer, through set up slant louvre 8 at the upside of casing 1, the partial heat that chip board 3 dispels discharges through 8 louvres, dust screen 9 then prevents that the dust from entering casing 1's inside, through setting up heat conduction copper sheet 41, first heat conduction copper post 42, second heat conduction copper post 43, first heat-radiating component 5, second heat-radiating component 7, the heat that effectively produces with chip board 3 during operation derives, prevent that the temperature accumulation is in casing 1, very big temperature has been avoided, the high temperature damage condition is satisfied, the current service life of the extension, the use condition that leads to some unstable even, the use life of the chip leads to some.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. A low thermal resistance chip, characterized by: the heat dissipation device comprises a shell, wherein a chip board is fixedly connected to one side in the shell, pins are arranged on two sides of the chip board, one side of each pin extends out of the shell, and a heat dissipation mechanism is arranged on the lower side of the shell;
the heat dissipation mechanism comprises a heat conduction copper sheet, a first heat conduction copper column, a second heat conduction copper column, a first heat dissipation assembly and a second heat dissipation assembly, the heat conduction copper sheet is attached to the lower side of the chip board, the first heat conduction copper column is fixedly connected to the two sides of the lower end of the heat conduction copper sheet, the second heat conduction copper column is arranged on the lower side of the first heat conduction copper column, the first heat dissipation assembly is arranged between the first heat conduction copper column and the second heat conduction copper column, and the second heat dissipation assembly is arranged on the lower side of the second heat conduction copper column.
2. A low thermal resistance chip as defined in claim 1, wherein: the first heat dissipation assembly comprises a heat conduction spring, the upper end of the heat conduction spring is fixedly connected with the bottom end of the first heat conduction copper column, and the lower end of the heat conduction spring is fixedly connected with the top end of the second heat conduction copper column.
3. A low thermal resistance chip as defined in claim 2, wherein: the outer surface of the heat conduction spring is coated with a heat conduction layer.
4. A low thermal resistance chip as defined in claim 1, wherein: the second heat dissipation assembly comprises a heat dissipation silica gel plate, the heat dissipation silica gel plate is fixedly connected to the bottom end of the second heat conduction copper column, and heat conduction silicone grease is arranged on the lower side of the heat dissipation silica gel plate.
5. The low thermal resistance chip according to claim 4, wherein: and a plurality of groups of through holes are formed in the heat dissipation silica gel plate.
6. The low thermal resistance chip according to claim 4, wherein: the bottom of heat dissipation silica gel board is equipped with anti-skidding line.
7. The low thermal resistance chip of claim 1, wherein: the upper end of the shell is provided with a heat dissipation hole, and one side of the interior of the heat dissipation hole is provided with a dust screen.
8. A low thermal resistance chip as defined in claim 1, wherein: the utility model discloses a heat conduction copper column, including casing, the lower side cavity of casing is internal fixedly connected with bracing piece, the top fixedly connected with carriage of bracing piece, the inner wall of carriage is connected with the external fixed surface of first heat conduction copper post.
9. A low thermal resistance chip as defined in claim 7, wherein: the heat dissipation device is characterized in that a baffle is fixedly connected to one side of the inside of the heat dissipation hole, and a plurality of hollow columns are arranged inside the baffle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222298562.1U CN218498057U (en) | 2022-08-30 | 2022-08-30 | Low-thermal-resistance chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222298562.1U CN218498057U (en) | 2022-08-30 | 2022-08-30 | Low-thermal-resistance chip |
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| CN218498057U true CN218498057U (en) | 2023-02-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202222298562.1U Active CN218498057U (en) | 2022-08-30 | 2022-08-30 | Low-thermal-resistance chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116110863A (en) * | 2023-04-13 | 2023-05-12 | 深圳辰达行电子有限公司 | Low-voltage high-current groove type MOS device |
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2022
- 2022-08-30 CN CN202222298562.1U patent/CN218498057U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116110863A (en) * | 2023-04-13 | 2023-05-12 | 深圳辰达行电子有限公司 | Low-voltage high-current groove type MOS device |
| CN116110863B (en) * | 2023-04-13 | 2023-06-16 | 深圳辰达行电子有限公司 | Low-voltage high-current groove type MOS device |
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