CN219123206U - Silicon chip extraction device - Google Patents

Abstract

The application relates to a silicon wafer extraction device, which is used for extracting a silicon wafer from a silicon material box, wherein the silicon material box is provided with a first side wall and a second side wall which are opposite, an air injection mechanism is arranged at the second side wall, the silicon wafer extraction device comprises a pickup mechanism and a lifting mechanism, and the lifting mechanism comprises a guide piece with a guide rail and a moving piece which can move along the guide rail; the picking mechanism is arranged at the lower end of the moving piece and is provided with a horizontal picking surface; the air injection mechanism blows air from the second side wall to the first side wall so that the silicon wafer to be extracted is blown to be closely attached to the first side wall, the included angle between the guide rail and the vertical direction is A, and the upper end of the guide rail is inclined to the direction of the second side wall. According to the scheme, the moving part can drive the silicon wafer to incline and rise along the direction of the guiding part away from the first side wall when the silicon wafer is lifted, so that the silicon wafer can be away from the first side wall of the material box at the first time, the problems of edge breakage, notch, fragments and the like caused by scraping the first side wall in the rising process of the silicon wafer are avoided, and the defective rate caused by extraction of the silicon wafer is greatly reduced.

Description

Silicon chip extraction device

Technical Field

The application relates to the technical field of solar cell processing equipment, in particular to a silicon wafer extraction device.

Background

The manufacturing process of the solar cell comprises the working procedure of texturing the surface of the silicon wafer. When the surface of the silicon wafer is textured, the silicon wafers stacked in the silicon material box are usually transferred into the flower basket one by adopting automatic mechanical equipment. The silicon material box has a certain depth, and the automatic mechanical equipment firstly extracts the silicon wafer in the silicon material box upwards to the outside of the silicon material box, then places the silicon wafer on a conveyor belt, and transfers the silicon wafer into a flower basket through the conveying of the conveyor belt. However, when the silicon wafer is extracted from the silicon material box upwards, the silicon wafer is easy to contact with the side wall of the silicon material box to generate friction, so that the problems of edge breakage, notch, fragments and the like of the silicon wafer are caused, and the reject ratio of the silicon wafer is increased.

Disclosure of Invention

Based on the above, the utility model provides a silicon wafer extraction device, which aims to solve the problems that when the existing silicon wafer extraction device lifts a silicon wafer, the silicon wafer is easy to contact with the side wall of a silicon material box to generate friction, so that the silicon wafer is broken, chipped and broken.

The utility model provides a silicon wafer extracting device, which is used for extracting a silicon wafer horizontally stacked from a silicon material box, wherein the silicon material box is provided with a first side wall and a second side wall which are opposite, an air injection mechanism which blows air to the silicon wafer to be extracted to separate the silicon wafer to be extracted from a lower silicon wafer is arranged at the second side wall, the silicon wafer extracting device comprises a picking mechanism which adsorbs the silicon wafer to be extracted and a lifting mechanism which controls the lifting of the picking mechanism,

the lifting mechanism comprises a guide member having a guide rail and a moving member movably along the guide rail;

the picking mechanism is arranged at the lower end of the moving part and is provided with a horizontal picking surface for adsorbing the silicon wafer to be extracted;

the air injection mechanism blows air from the second side wall to the first side wall so that the silicon wafer to be extracted is blown to be closely attached to the first side wall, an included angle between the guide rail and the vertical direction is A, and the upper end of the guide rail is inclined towards the direction of the second side wall.

In one embodiment, an included angle between a connecting line L of the end of the silicon wafer to be extracted, which is close to the second side wall, and the upper end of the second side wall and the vertical direction is B, where the included angle a is smaller than the included angle B.

In one embodiment, the silicon wafer extraction device further comprises a fixing plate arranged at the upper end of the lifting mechanism, wherein the fixing plate is provided with a first mounting surface facing the lifting mechanism.

In one embodiment, the lifting mechanism comprises a cylinder, a piston rod of the cylinder forms the moving member, a cylinder body of the cylinder forms the guiding member, and a guiding sleeve in the cylinder body forms the guiding rail.

In one embodiment, a first gasket is provided between the fixing plate and the cylinder, the first gasket having a first surface facing the fixing plate and a second surface facing the cylinder, the second surface being perpendicular to an axial direction of the cylinder.

In one embodiment, the first mounting surface of the fixing plate and the first surface of the first spacer are attached to each other and horizontally arranged, and a first included angle is formed between the first surface and the second surface, and the first included angle is equal to the included angle a.

In one embodiment, a second shim is arranged between the moving member and the pick-up mechanism, the second shim having a third surface facing the moving member and a fourth surface facing the pick-up mechanism, the third surface being perpendicular to the axial direction of the moving member.

In one embodiment, the fourth surface is disposed horizontally, and a second included angle is formed between the third surface and the fourth surface, and the second included angle is equal to the included angle a.

In one embodiment, the picking mechanism comprises a mounting bracket and a sucker, the upper end of the mounting bracket is horizontally arranged on the fourth surface, the sucker is horizontally arranged at the lower end of the mounting bracket and connected with a negative pressure system, and the bottom surface of the sucker forms the horizontal picking surface.

In one embodiment, the first and second shims are provided with mounting holes therethrough.

The beneficial effects are that: before the silicon wafer is extracted, the uppermost layers of silicon wafers in the silicon material box are blown away by utilizing the air injection mechanism, so that gaps are generated between the silicon wafers to be extracted and the silicon wafers at the lower side, and the silicon wafers are separated from the silicon wafers at the lower side. In addition, because the guide rail of the guide piece of the silicon wafer extraction device is obliquely arranged, an included angle is formed between the guide rail and the vertical direction, and the upper end of the guide rail is inclined towards the direction of the second side wall, therefore, when the silicon wafer is lifted after the silicon wafer to be extracted is adsorbed by the pick-up mechanism, the moving piece can drive the silicon wafer to obliquely lift along the inclined track of the guide piece towards the direction away from the first side wall, so that the silicon wafer is lifted from the silicon material box to be away from the first side wall of the material box on the track, the space is kept between the silicon wafer and the first side wall all the time in the subsequent lifting process, the problems of edge breakage, notch, fragments and the like caused by scraping the first side wall in the lifting process of the silicon wafer are avoided, and the defective product rate caused when the silicon wafer is lifted is greatly reduced. In addition, the device can ensure that the lifting track of the moving part is inclined, and meanwhile, the pick-up mechanism still keeps horizontal, so that the horizontal pick-up surface can be horizontally contacted with the silicon wafer, extra fragments can not be generated during the suction of the silicon wafer, and the defective rate of the silicon wafer in the transfer process is reduced.

Drawings

FIG. 1 is a schematic diagram of an embodiment of a silicon wafer extraction apparatus according to the present utility model;

FIG. 2 is a split view of an embodiment of a silicon wafer extractor of the present utility model;

FIG. 3 is a schematic view of the positional relationship between a silicon wafer and a second sidewall in an embodiment of a silicon wafer extractor according to the present utility model;

FIG. 4 is a schematic view of a silicon wafer pick-up device according to an embodiment of the present utility model;

FIG. 5 is a schematic view of a silicon wafer extraction apparatus according to one embodiment of the present utility model lifting a silicon wafer to the top of a cassette;

FIG. 6 is a schematic view of a silicon wafer extraction apparatus according to one embodiment of the present utility model lifting a silicon wafer above a cassette;

fig. 7 is a schematic perspective view of a first spacer and a second spacer in an embodiment of a silicon wafer extraction apparatus according to the present utility model.

Reference numerals in the drawings of the specification include: 1-guide, 2-moving, 3-pick-up mechanism, 301-mounting bracket, 302-suction cup, 303-horizontal pick-up surface, 4-first side wall, 5-second side wall, 6-jet mechanism, 7-fixed plate, 71-first mounting surface, 8-first spacer, 801-first surface, 802-second surface, 9-second spacer, 901-third surface, 902-fourth surface, 10-second mounting surface, 11-mounting hole.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.

It should be noted that the illustrations provided in the present embodiment are merely schematic illustrations of the basic idea of the present utility model.

The structures, proportions, sizes, etc. shown in the drawings attached hereto are for illustration purposes only and should not be construed as limiting the utility model to the extent that it can be practiced, since modifications, changes in the proportions, or otherwise, used in the practice of the utility model, are particularly adapted to the specific details of construction and the use of the utility model, without departing from the spirit or essential characteristics thereof, which fall within the scope of the utility model as defined by the appended claims.

References in this specification to orientations or positional relationships as "upper", "lower", "left", "right", "intermediate", "longitudinal", "transverse", "horizontal", "inner", "outer", "radial", "circumferential", etc., are based on the orientation or positional relationships shown in the drawings, are also for convenience of description only, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore are not to be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

As described above, when the silicon wafer is extracted upward from the silicon material box, the silicon wafer is easily contacted with the side wall of the silicon material box to generate friction, so that the problems of edge breakage, notch, fragments and the like of the silicon wafer are caused, and the reject ratio of the silicon wafer is increased.

The method is mainly characterized in that when the silicon wafers are extracted, air is required to be blown between the gaps of the uppermost layers of silicon wafers in the silicon material box in advance through the air knife, so that the stacked uppermost layers of silicon wafers are dispersed, under the action of the air knife, the uppermost layers of silicon wafers in the silicon material box can be blown to one side of the silicon material box opposite to the air knife by the air knife, and are contacted with the side wall of the silicon material box, and therefore when the silicon wafers are extracted upwards, the silicon wafers are rubbed with the side wall of the silicon material box, so that the problems of edge breakage, notch, fragments and the like of the silicon wafers are caused, and the defective product rate of the silicon wafers is increased.

The silicon wafer extracting device provided by at least one embodiment of the utility model is used for extracting the silicon wafers horizontally stacked from the silicon material box, the silicon material box is provided with a first side wall and a second side wall which are opposite, the second side wall is provided with an air injection mechanism for blowing air to the silicon wafers to be extracted to separate the silicon wafers to be extracted from the lower side silicon wafers, the silicon wafer extracting device comprises a picking mechanism for adsorbing the silicon wafers to be extracted and a lifting mechanism for controlling the lifting of the picking mechanism,

the lifting mechanism comprises a guide member with a guide rail and a moving member movably along the guide rail;

the picking mechanism is arranged at the lower end of the moving part and is provided with a horizontal picking surface for adsorbing the silicon wafer to be extracted;

the air injection mechanism blows air from the second side wall to the first side wall so that the silicon wafer to be extracted is blown to be closely attached to the first side wall, the included angle between the guide rail and the vertical direction is A, and the upper end of the guide rail is inclined to the direction of the second side wall.

When the silicon wafer extraction device provided by the embodiment is used, the moving part is driven to move downwards along the guide rail of the guide part and drive the picking mechanism to move into the material box, then the silicon wafer at the uppermost layer in the silicon material box is horizontally adsorbed by the horizontal picking surface of the picking mechanism, and then the moving part is driven to obliquely rise along the guide rail of the guide part, so that the picking mechanism and the silicon wafer picked up by the picking mechanism are driven to rise together, and the silicon wafer extraction is realized.

In the above embodiment, the uppermost several layers of silicon wafers in the silicon material box are blown away by the air injection mechanism, so that a gap is generated between the silicon wafers to be extracted and the lower silicon wafers, and the silicon wafers are separated from the lower silicon wafers. In addition, because the guide rail of the guide piece of the silicon wafer extraction device is obliquely arranged, an included angle is formed between the guide rail and the vertical direction, and the upper end of the guide rail is inclined towards the direction of the second side wall, therefore, when the silicon wafer is lifted after the silicon wafer to be extracted is adsorbed by the pick-up mechanism, the moving piece can drive the silicon wafer to obliquely lift along the inclined track of the guide piece towards the direction away from the first side wall, so that the silicon wafer is lifted from the silicon material box to be away from the first side wall of the material box on the track, the space is kept between the silicon wafer and the first side wall all the time in the subsequent lifting process, the problems of edge breakage, notch, fragments and the like caused by scraping the first side wall in the lifting process of the silicon wafer are avoided, and the defective product rate caused when the silicon wafer is lifted is greatly reduced. In addition, the device can ensure that the lifting track of the moving part is inclined, and meanwhile, the pick-up mechanism still keeps horizontal, so that the horizontal pick-up surface can be horizontally contacted with the silicon wafer, extra fragments can not be generated during the suction of the silicon wafer, and the defective rate of the silicon wafer in the transfer process is reduced.

The silicon wafer extraction device provided in the embodiment of the present application is described in detail below with reference to the accompanying drawings. Fig. 1 is a schematic diagram of a silicon wafer extraction apparatus according to at least one embodiment of the present application.

Referring to fig. 1, in this embodiment, the cartridge is of cuboid or square configuration having opposed first and second side walls 4, 5. The second side wall 5 is provided with an air injection mechanism 6 which continuously injects air towards the direction of the first side wall 4, and the air injection mechanism 6 is mainly used for slicing the upper silicon wafers of the silicon wafer group, and the picking mechanism 3 is used for picking the silicon wafers in a single piece after the upper silicon wafers are scattered. Under the action of the air injection mechanism 6, the silicon wafer to be extracted is blown to the direction close to the first side wall 4, so that the silicon wafer to be extracted is closely attached to the first side wall 4.

Referring to fig. 1, it should be understood that the position of the air injection mechanism 6 is fixed and a part of silicon wafers can be blown off each time, in addition, the bottom of the existing silicon material box is usually provided with a lifting mechanism, firstly, the air injection mechanism 6 blows off the uppermost several layers of silicon wafers in the silicon material box, then the silicon material box starts to descend, and during the descending process, the silicon wafer extraction device adsorbs the blown off silicon wafers one by one; when the silicon wafer of which the uppermost layer is blown away is taken away, the jacking mechanism can move the silicon material box upwards for a certain distance, so that a plurality of silicon wafers at the uppermost part of the rest silicon wafers in the silicon material box correspond to the air injection mechanism 6, then the air injection mechanism 6 blows away the silicon wafers, then the silicon material box descends, the silicon wafer extraction devices adsorb the blown away silicon wafers one by one in the descending process, and the silicon wafers can be better prevented from being cracked when being adsorbed in the descending process of the silicon material box. Based on this, in the present embodiment, the following description about the positional relationship between the silicon wafer and the first and second side walls 4 and 5 refers to the positional relationship between the uppermost silicon wafer in the silicon cassette, i.e., the silicon wafer to be extracted, and the first and second side walls 4 and 5 at a specified height, i.e., when the silicon cassette is stationary.

Referring to fig. 1 and 2, in the present embodiment, the silicon wafer extraction apparatus includes a lifting mechanism and a pickup mechanism 3.

Wherein the lifting mechanism comprises a guide 1 with a guide rail and a mover 2 movable along the guide rail. In the present embodiment, the guide rail of the guide 1 is arranged obliquely, i.e. at an angle a to the vertical, and its upper end is inclined in the direction of the second side wall 5. Referring to fig. 1, the inclination of the upper end of the guide rail to the direction of the second side wall 5 may be understood as that the guide rail is inclined at an angle compared to the vertical direction, and the horizontal distance between the upper end of the guide rail and the second side wall 5 is smaller than the horizontal distance between the lower end of the guide rail and the second side wall 5. So, when moving member 2 along the guide rail motion of guide member 1, the lifting track of moving member 2 lower extreme through picking up the absorptive silicon chip of mechanism can rise to the direction slope of keeping away from first lateral wall 4, compares in the lifting track of current vertical direction like this, can prevent that the promotion in-process of silicon chip from owing to with the friction and the scratch of first lateral wall 4, lead to the silicon chip to break, reduce the defective products rate in the transfer process.

It will be appreciated that the wafer will gradually approach the second side wall 5 as it is tilted up, since it will move away from the first side wall 4 and the second side wall 5 will be located on the opposite side of the first side wall 4. In particular, since the silicon cassette has a certain depth, when the silicon wafer at the bottom of the silicon cassette is extracted, the end of the silicon wafer near the second sidewall may hit the second sidewall when it rises in a direction toward the second sidewall 5. Based on this, in this embodiment, it is also required to ensure that during the process of the moving member 2 driving the silicon wafer to rise obliquely, the end of the silicon wafer, which is close to the second sidewall 5, is prevented from rubbing against the second sidewall 5.

Specifically, referring to fig. 3, a vertical distance H is provided between a horizontal plane of the uppermost silicon wafer, i.e., a silicon wafer to be extracted, and a horizontal distance M is provided between an end of the silicon wafer, which is close to the second sidewall 5, and the second sidewall 5. Therefore, when the rising height of the silicon wafer to be extracted is the distance H and the horizontal displacement is the horizontal distance M, the right side edge of the silicon wafer can just pass through the top end of the second side wall 5, and when the horizontal displacement is greater than the horizontal distance M, the silicon wafer will contact with the second side wall 5, and when the horizontal displacement is less than the horizontal distance M, the silicon wafer will not contact with the second side wall 5.

Referring to fig. 3, a connecting line L is formed between the end of the extracted silicon wafer near the second side wall 5 and the upper end of the second side wall 5, when the silicon wafer obliquely rises along the connecting line L, the rising height of the silicon wafer is just a vertical distance H, the horizontal displacement is just a horizontal distance M, at this time, the right side edge of the silicon wafer can just pass through the second side wall 5, that is, the track of the connecting line L is the limit track of the rising of the silicon wafer, and when the inclined track of the guide member 1 is parallel to the connecting line L or the inclined angle is smaller, the silicon wafer can be ensured to pass through the second side wall 5 smoothly.

Referring to fig. 3, an included angle B is formed between the connecting line L and the vertical direction, the included angle B is the maximum limit value of the inclination angle of the guide member 1, when the inclination included angle a of the guide rail is greater than the included angle B, the end of the guide rail, which is close to the second side wall 5, will scratch the second side wall 5 when the silicon wafer is extracted, and when the inclination angle of the guide member 1 is less than or equal to the included angle B, the silicon wafer will not scratch the second side wall 5 when rising. Based on this, in this embodiment, the inclined angle a of the guide rail of the guide member 1 is set to be smaller than the inclined angle B, so that it can be ensured that the silicon wafer cannot scratch the first side wall 4 or scratch the second side wall 5 in the rising process, and the defective rate caused by lifting the silicon wafer is reduced.

A specific manner of the inclined arrangement of the guide 1 will be described below.

For example, referring to fig. 1 and 2, in the present embodiment, the lifting mechanism may include a cylinder, a piston rod of which constitutes the mover 2, a cylinder body of which constitutes the guide 1, and a guide bush inside the cylinder body constitutes the guide rail. In the process of transferring silicon wafers, an automatic mechanical device such as a mechanical arm is generally used, and an air cylinder is generally used as a lifting device in the automatic mechanical device.

Of course, in other examples, the lifting mechanism may be other linear driving mechanisms commonly used in the art, for example, the guide member 1 may be a linear guide rail, and the moving member 2 may be a moving rod slidingly engaged on the linear guide rail, which is not limited herein and will not be described herein.

Referring to fig. 1 and 2, in the present embodiment, the silicon wafer extraction apparatus further includes a fixing plate 7 provided at an upper end of the lifting mechanism, the fixing plate 7 having a first mounting surface 71 facing the lifting mechanism, i.e., a cylinder body of the air cylinder is mounted on the first mounting surface 71. The fixing plate 7 may be a separate component of the automated mechanical equipment or may be an additional structure in other components.

In an automated mechanical apparatus, a cylinder is disposed in a generally vertical direction to achieve lifting in the vertical direction. In the application, on the basis of not changing the automation mechanical equipment structure basically, for realizing the slope setting of cylinder, be provided with first gasket 8 between fixed plate 7 and the cylinder body to set up second gasket 9 between piston and the pickup mechanism, in order to guarantee the axial direction of cylinder, the direction slope of guide rail promptly, be contained angle A with vertical direction.

Specifically, the first gasket 8 has a first surface 801 facing the fixing plate 7 and a second surface 802 facing the cylinder. Referring to fig. 7, the first gasket 8 is provided with a plurality of through mounting holes 11. During installation, the bolts on the fixing plate 7 penetrate through the mounting holes 11 on the first gasket 8 and are in threaded fit with the threaded holes at the upper end of the cylinder body, and therefore the first gasket 8 can be fixedly installed.

Referring to fig. 2, the second surface 802 is obliquely disposed and forms a first included angle with the axial direction of the cylinder, and the first included angle is equal to the included angle a, that is, a side of the second surface 802 close to the first sidewall 4 is higher than a side of the second surface 802 close to the second sidewall 5, so that when the cylinder is mounted on the second surface 802, the axial direction of the cylinder forms the included angle a with the vertical direction.

Because the second surface 802 of the first gasket 8 is inclined with respect to the horizontal plane due to the above-described structural design, the cylinder is inclined after being mounted on the second surface 802. Further, since the side of the second surface 802 close to the first side wall 4 is higher than the side of the second surface 802 away from the first side wall 4, that is, the second surface 802 is an inclined surface with a high left end and a low right end, when the cylinder is mounted on the second surface 802, the direction in which the cylinder is inclined is the upper end inclined toward the second side wall, that is, the upper end of the guide 1 is inclined toward the second side wall 5, so that the movable member 2 can be inclined upward along the guide 1 in the direction away from the first side wall 4. Meanwhile, the included angle formed by the second surface 802 and the horizontal plane is equal to the included angle A and is smaller than the included angle B, so that the second side wall 5 can be prevented from being scratched when the silicon wafer rises.

More specifically, referring to fig. 2, in the present embodiment, the fixing plate 7 is a horizontally disposed plate member, and the fixing plate 7 has a horizontal bottom surface, which is the first mounting surface 71. The first gasket 8 is a wedge-shaped block and is provided with a first surface 801 and a second surface 802, the first surface 801 and the second surface 802 are arranged on two opposite sides of the wedge-shaped block, a first included angle is formed between the first surface 801 and the second surface 802, and the first included angle is equal to the included angle A.

In the mounting, the first surface 801 of the first spacer 8 is attached to the first mounting surface 71 and horizontally mounted on the first mounting surface 71, and the end of the first spacer 8 having a larger thickness is directed away from the first side wall 4. Since the first mounting surface 71 is a horizontal surface, when the first spacer 8 is mounted on the first mounting surface 71 horizontally through the first surface 801, the first surface 801 is brought into a horizontal state of being attached to the first mounting surface 71. Since the first surface 801 and the second surface 802 have the first angle therebetween, when the first surface 801 is in a horizontal state, the second surface 802 forms an inclined surface having an angle with the horizontal plane, and since the end of the first spacer 8 having a larger thickness faces in a direction away from the first side wall 4, the second surface 802 is in a form of being higher on the left and lower on the right, and on the basis of this, the guide 1 can be mounted on the second surface 802 so as to be inclined in a direction of the second side wall 5.

Of course, in other examples, the guide member 1 may be obliquely disposed on the fixing plate 7 in other manners, for example, the guide member 1 may be directly welded on the fixing plate 7 at a specified oblique angle, so long as the oblique installation of the guide member 1 can be achieved, which is not limited herein and will not be repeated herein.

In this embodiment, the first gasket 8 is only added between the fixing plate 7 and the cylinder body to realize the oblique installation of the cylinder, so that the structural design of the original equipment is not required to be changed, the upgrading and reconstruction are convenient to directly carry out on the existing equipment, the structure is simple, and the operation is convenient. Moreover, in this embodiment, the first spacer 8 may be replaced according to actual situations, so that the inclination angle of the guide member 1 may be changed, and the transfer of silicon wafers with different specifications may be adapted, so that the universality is better.

Referring to fig. 2, in the present embodiment, a second spacer 9 is provided between the mover 2 and the pickup mechanism 3, specifically, the second spacer 9 has a third surface 901 facing the mover 2 and a fourth surface 902 facing the pickup mechanism 3, wherein the third surface 901 is perpendicular to the axial direction of the mover 2. Specifically, a plurality of through mounting holes 11 are formed in the second gasket 9, and during mounting, bolts on the moving member 2 penetrate through the mounting holes 11 in the second gasket 9 and are in threaded fit with the pickup mechanism 3, so that the second gasket 9 can be fixedly mounted.

Referring to fig. 2, in the present embodiment, the moving member 2 has a second mounting surface 10 parallel to the second surface 802. A second angle is provided between the third surface 901 and the fourth surface 902 of the second gasket 9, the second angle being equal to the angle a. When the second spacer 9 is mounted, the third surface 901 is attached to the second mounting surface 10, the third surface 901 is perpendicular to the axial direction of the mover 2, and the fourth surface 902 forms a horizontal plane.

Specifically, referring to fig. 2 and 7, in the present embodiment, the second pad 9 is a wedge-shaped block having the same structure as the first pad 8, that is, a second angle formed between the third surface 901 and the fourth surface 902 of the second pad 9 is equal to the first angle. In the mounting process, the mounting direction of the second spacer 9 is opposite to the mounting direction of the first spacer 8, that is, the end of the second spacer 9 with larger thickness is arranged towards the direction close to the first side wall 4, so that when the second spacer 9 is mounted on the second mounting surface 10 through the third surface 901 in a bonding manner, the third surface 901 forms an inclined plane parallel to the second surface 802, and the fourth surface 902 forms a horizontal plane, so that the whole pick-up mechanism 3 mounted on the fourth surface 902 is in a horizontal form, and the silicon wafer can be adsorbed horizontally.

Referring to fig. 4 to 6, based on the above embodiment, the present application uses a pair of wedge blocks with opposite installation directions to install at two ends of the cylinder, so that the lifting track of the moving member 2 can be ensured to be inclined and changed, and the picking mechanism 3 still keeps horizontal, so as to ensure that the horizontal picking surface 303 of the picking mechanism 3 is in horizontal contact with the silicon wafer, no additional fragments are generated during the suction of the silicon wafer, and the defective rate of the silicon wafer in the transfer process is reduced. Moreover, the lifting direction of the air cylinder can be changed from vertical to inclined towards the second side wall 5 on the basis of not changing the existing automatic mechanical equipment, so that the air cylinder has a simple structure, can reduce the manufacturing cost, is convenient to operate, and can improve the working efficiency.

Referring to fig. 1, in the present embodiment, the pick-up mechanism 3 includes a mounting bracket 301 and a suction cup 302, the mounting bracket 301 is horizontally mounted on the fourth surface 902, the suction cup 302 is horizontally mounted on the lower end of the mounting bracket 301 and connected to the negative pressure system, and the bottom surface of the suction cup 302 constitutes a horizontal pick-up surface 303. The sucker 302 is used as the picking mechanism 3, so that the use is convenient, the silicon wafer is convenient to pick up quickly, the sucker 302 is contacted with the silicon wafer, the silicon wafer cannot be damaged, and the defective rate of the silicon wafer in the transferring process can be reduced.

The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The foregoing examples represent only a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the utility model. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.

Claims (10)

1. The silicon wafer extracting device is used for extracting horizontally stacked silicon wafers from a silicon material box, the silicon material box is provided with a first side wall (4) and a second side wall (5) which are opposite, an air injection mechanism (6) which blows air to the silicon wafers to be extracted to separate the silicon wafers to be extracted from the lower silicon wafers is arranged at the second side wall (5), the silicon wafer extracting device is characterized by comprising a picking mechanism (3) for adsorbing the silicon wafers to be extracted and a lifting mechanism for controlling the lifting of the picking mechanism (3), wherein,

the lifting mechanism comprises a guide (1) with a guide rail and a moving member (2) movably along the guide rail;

the picking mechanism (3) is arranged at the lower end of the moving part (2) and is provided with a horizontal picking surface (303) for adsorbing the silicon wafer to be extracted;

the air injection mechanism (6) blows air from the second side wall (5) to the first side wall (4) so that the silicon wafer to be extracted is blown to be closely attached to the first side wall (4), an included angle between the guide rail and the vertical direction is A, and the upper end of the guide rail is inclined towards the direction of the second side wall (5).

2. The silicon wafer extraction apparatus according to claim 1, wherein: and an included angle between a connecting line L of the end part of the silicon wafer to be extracted, which is close to the second side wall (5), and the upper end of the second side wall (5) and the vertical direction is B, wherein the included angle A is smaller than the included angle B.

3. The silicon wafer extraction apparatus according to claim 2, wherein: the silicon wafer extraction device further comprises a fixing plate (7) arranged at the upper end of the lifting mechanism, and the fixing plate (7) is provided with a first mounting surface (71) facing the lifting mechanism.

4. A silicon wafer extraction apparatus according to claim 3, wherein: the lifting mechanism comprises an air cylinder, a piston rod of the air cylinder forms the moving part (2), a cylinder body of the air cylinder forms the guide part (1), and a guide sleeve in the cylinder body forms the guide rail.

5. The silicon wafer extraction apparatus according to claim 4, wherein: a first gasket (8) is arranged between the fixing plate (7) and the cylinder body, the first gasket (8) is provided with a first surface (801) facing the fixing plate (7) and a second surface (802) facing the cylinder body, and the second surface (802) is perpendicular to the axial direction of the cylinder body.

6. The silicon wafer extraction apparatus according to claim 5, wherein: the first mounting surface (71) of the fixing plate (7) and the first surface (801) of the first gasket (8) are attached to each other and horizontally arranged, a first included angle is formed between the first surface (801) and the second surface (802), and the first included angle is equal to the included angle A.

7. The silicon wafer extraction apparatus according to claim 5, wherein: a second shim (9) is arranged between the moving member (2) and the pick-up mechanism (3), the second shim (9) having a third surface (901) facing the moving member (2) and a fourth surface (902) facing the pick-up mechanism, the third surface (901) being perpendicular to the axial direction of the moving member (2).

8. The silicon wafer extraction apparatus according to claim 7, wherein: the fourth surface (902) is horizontally arranged, a second included angle is formed between the third surface (901) and the fourth surface (902), and the second included angle is equal to the included angle A.

9. The silicon wafer extraction apparatus according to claim 8, wherein: the picking mechanism (3) comprises a mounting bracket (301) and a sucker (302), wherein the upper end of the mounting bracket (301) is horizontally arranged on the fourth surface (902), the sucker (302) is horizontally arranged at the lower end of the mounting bracket (301) and is connected with a negative pressure system, and the bottom surface of the sucker (302) forms the horizontal picking surface (303).

10. The silicon wafer extraction apparatus according to claim 9, wherein: the first gasket (8) and the second gasket (9) are provided with through mounting holes (11).

Images