CN219107779U

CN219107779U - Effective electrostatic discharge structure for micro circuit board

Info

Publication number: CN219107779U
Application number: CN202320036616.9U
Authority: CN
Inventors: 陈国威
Original assignee: Shenzhen Shengdele Electronics Co ltd
Current assignee: Shenzhen Shengdele Electronics Co ltd
Priority date: 2023-01-07
Filing date: 2023-01-07
Publication date: 2023-05-30
Anticipated expiration: 2033-01-07

Abstract

An effective electrostatic discharge structure for a micro circuit board is provided, a capacitance structure is formed between a conductive layer and the natural atmosphere on the PCB by arranging the PCB, the conductive layer and an insulating medium layer, static electricity is discharged to the air through a capacitance formed between a copper foil layer and the air of the PCB in a discharge path of the PCB, the larger the capacitance formed between the copper foil layer and the air is, the faster the discharge speed is, the phenomenon of static backlog is not generated, therefore, under the condition that the size of the PCB is fixed, the number of the PCB and the copper foil layer is increased, and the copper foil layers on different layers are communicated through a via hole electric connector, the total area of the copper foil layer can be effectively increased, so that the capacitance between the copper foil layer and the air is effectively increased, the air discharge speed of static electricity in the PCB is accelerated, components in the PCB are effectively protected, and effective electrostatic protection measures are provided for the micro circuit board.

Description

Effective electrostatic discharge structure for micro circuit board

Technical Field

The utility model relates to the technical field of static electricity protection, in particular to an effective static discharge structure for a micro circuit board.

Background

As is well known, in the working process of electrical equipment, a circuit board for integrating electronic components inevitably has the phenomenon of static backlog, if static is not discharged effectively in time, when the static backlog exceeds a component monitoring limit value, the phenomenon of breakdown damage to the components exists, so that the normal use of the electrical equipment is affected, and the electrical equipment is scrapped directly when serious, so that unpredictable loss is caused.

Therefore, in various electrical apparatuses, especially those working in important fields, various electrostatic protection measures are more needed, and at present, a common means is to make a circuit board grounded by using a conductive device, but such a method is only suitable for apparatuses with larger sizes, and only such apparatuses have enough space to realize connection and installation of a grounding device, but no such condition is provided for electrical apparatuses or components with small sizes, so that at present, no effective protection measure for electrostatic discharge of a micro circuit board exists in the industry.

Disclosure of Invention

The utility model aims to provide an effective electrostatic discharge structure for a micro circuit board, which is characterized in that a capacitance structure is formed between a conductive layer and the natural atmosphere on the PCB by arranging the PCB, the conductive layer and an insulating medium layer, so that static electricity is discharged to the air through a capacitor formed between a copper foil layer and the air of the PCB on a discharge path of the PCB, thereby effectively protecting components in the PCB and solving the problems raised by the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions: an effective electrostatic discharge structure for a micro circuit board comprises a PCB board, wherein conductive layers are paved on the upper surface and the lower surface of the PCB board, an insulating dielectric film is paved on one side of the conductive layer far away from the PCB board, a capacitance structure is formed between the conductive layer and the natural atmosphere, the PCB is provided with a laminated electric connection via hole penetrating through the board body, the laminated electric connection via hole is provided with a via hole electric connection piece, and the via hole electric connection piece is used for realizing electric communication between conductive layers on different layers.

Preferably, the PCB board lamination is provided with a plurality of layers, and a conductive layer is arranged between the plurality of layers of PCB boards.

Preferably, the via connector is formed by extending a conductive layer.

Preferably, the conductive layer is a copper foil layer.

Preferably, the insulating dielectric film is an oily insulating film.

Compared with the prior art, the utility model has the beneficial effects that:

according to the utility model, the capacitor structure is formed between the conductive layer and the natural atmosphere on the PCB by arranging the PCB, the conductive layer and the insulating medium layer, so that static electricity discharges air in a discharge path of the PCB through a capacitor formed between the copper foil layer and the air of the PCB, and the larger the capacitor formed between the copper foil layer and the air is, the faster the discharge speed is, the phenomenon of static accumulation is avoided, therefore, under the condition that the size of the PCB is fixed, the number of the PCB and the copper foil layer is increased, and the copper foil layers on different layers are communicated through the via hole electric connector, the total area of the copper foil layer can be effectively increased, the capacitor between the copper foil layer and the air is effectively increased, the discharge speed of static electricity in the PCB is accelerated, and therefore, components in the PCB are effectively protected, and effective static protection measures are provided for the micro circuit board.

Drawings

FIG. 1 is an exploded view of the structure of the present utility model.

In the figure: 1 a PCB board; 2 a conductive layer; 3, insulating dielectric film; 4, laminating and connecting the electric via holes; and 5, via hole electric connection parts.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1, an effective electrostatic discharge structure for a micro circuit board includes a PCB board 1, a conductive layer 2 is laid on the upper and lower surfaces of the PCB board 1, the conductive layer 2 is a copper foil layer, an insulating dielectric film 3 is laid on one side of the conductive layer 2 far away from the PCB board 1, the insulating dielectric film 3 is an oily insulating film, the PCB board 1 can be provided with multiple layers in a laminated manner according to practical requirements, a conductive layer is sandwiched between the multiple layers of the PCB board 1, a capacitor structure is formed between the conductive layer 2 and the natural atmosphere, a laminated electrical connection via 4 penetrating through a board body is provided on the PCB board 1, a via electrical connection piece 5 is provided on the laminated electrical connection via 4, the via electrical connection piece 5 can be formed by extending the conductive layer 2, and the via electrical connection piece 5 is used for realizing electrical communication between the conductive layers 2 on different layers.

To sum up: according to the utility model, the capacitance structure is formed between the conductive layer 2 and the natural atmosphere on the PCB 1 by arranging the PCB 1, the conductive layer 2 and the insulating medium layer 3, so that static electricity is discharged to the air through a capacitance formed between the copper foil layer and the air of the PCB 1 in a discharge path of the PCB 1, the larger the capacitance formed between the copper foil layer and the air is, the faster the discharge speed is, the phenomenon of static accumulation is avoided, therefore, under the condition that the size of the PCB 1 is fixed, the number of the PCB 1 and the copper foil layer is increased, and the copper foil layers on different layers are communicated through the via hole electric connector 5, the total area of the copper foil layers can be effectively increased, the capacitance between the copper foil layer and the air is effectively increased, the discharge speed of static electricity to the air in the PCB 1 is accelerated, components in the PCB 1 are effectively protected, and effective static protection measures are provided for a tiny circuit board.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An effective electrostatic discharge structure for a micro-wiring board, comprising a PCB board (1), characterized in that: conductive layers (2) are paved on the upper surface and the lower surface of the PCB (1), an insulating dielectric film (3) is paved on one side, far away from the PCB (1), of the conductive layers (2), a capacitor structure is formed between the conductive layers (2) and the natural atmosphere, the PCB (1) is provided with a laminated electricity-connecting via hole (4) penetrating through the board body, the laminated electricity-connecting via hole (4) is provided with a via electricity-connecting piece (5), and the via electricity-connecting piece (5) is used for realizing electric communication between conducting layers (2) on different layers.

2. An effective esd structure for a micro-wiring board according to claim 1, wherein: the PCB (1) is provided with a plurality of layers in a laminated manner, and conductive layers are arranged between the plurality of layers of the PCB (1) in a clamping manner.

3. An effective esd structure for a micro-wiring board according to claim 1, wherein: the via hole connector (5) is formed by extending the conductive layer (2).

4. An effective esd structure for a micro-circuit board according to any one of claims 1 to 3, wherein: the conductive layer (2) is a copper foil layer.

5. An effective esd structure for a micro-wiring board according to claim 1, wherein: the insulating dielectric film (3) is an oily insulating film.