CN219106191U

CN219106191U - Multi-groove LED wafer packaging shell with compact structure

Info

Publication number: CN219106191U
Application number: CN202223471377.4U
Authority: CN
Inventors: 李伟龙
Original assignee: Xiamen Mingyou Electroplating Co ltd
Current assignee: Fujian Dingke Photoelectric Technology Co ltd
Priority date: 2022-12-26
Filing date: 2022-12-26
Publication date: 2023-05-30
Anticipated expiration: 2032-12-26

Abstract

The utility model relates to a multi-groove LED wafer packaging shell with a compact structure, which comprises a main shell, a filling block and a plurality of conductors arranged between the main shell and the filling block, wherein at least two lamp grooves for placing LED wafers are formed in the main shell, the adjacent two lamp grooves are provided with frosting surfaces on the inner side walls of one adjacent side, the conductors comprise electrode layers and pins, the electrode layers simultaneously extend into the two lamp grooves, the electrode layers of each conductor are separated by an insulating tape, and the pins are folded and wrapped on the filling block. According to the LED wafer packaging shell, the frosting is arranged on the adjacent inner side walls of the adjacent lamp slots, so that the light condensation brightness of one side of the adjacent lamp slots is reduced, the distance between the lamp slots can be greatly reduced while the excessive brightness of the adjacent side of the adjacent lamp slots is avoided, the size of the LED wafer packaging shell is further reduced, and the space utilization rate of the LED wafer packaging shell is improved.

Description

Multi-groove LED wafer packaging shell with compact structure

Technical Field

The utility model relates to the field of LED lamp packaging, in particular to a multi-groove LED wafer packaging shell with a compact structure.

Background

At present, when the LED chip package is used, a plurality of LED chip packages are generally arranged into a lamp panel in a matrix interval arrangement mode, the lamp groove of each LED chip package shell is equivalent to one luminous point of the lamp panel, and the larger the size of the lamp panel, the larger the number of LED chip packages, and the higher the brightness of the lamp panel. However, since there is only one lamp socket of the single LED chip package, the number of LED chip packages required for assembling a large-sized lamp panel is also complicated, which not only increases the cost of the lamp panel, but also greatly increases the difficulty of assembling the lamp panel.

Therefore, the applicant provides a multi-lamp-groove LED wafer packaging shell, the LED wafer packaging shell adopts a shell multi-lamp-groove design, and separation grooves are arranged between lamp grooves and used for compensating arrangement intervals of LED packaging among lamp plates, so that uniform light emission of the lamp plates is ensured, the number of LED packaging needed by the lamp plates under the same scale can be greatly reduced by the design of a main shell multi-groove, and the assembly difficulty of the lamp plates is greatly reduced. In the technical scheme, the separation grooves compensate arrangement intervals of the LED packages between the lamp panels, but the LED package shell cannot be further reduced in size, and the space utilization rate of the main shell is limited.

Disclosure of Invention

In order to solve the technical problems, the utility model provides a multi-groove LED wafer packaging shell with a compact structure.

In order to solve the technical problems, the utility model adopts the following technical scheme:

the utility model provides a compact structure's multislot LED wafer encapsulation shell, includes main casing, filling block and a plurality of conductor of installing between main casing and filling block, two lamp slots that are used for placing the LED wafer have been seted up on the main casing at least, two adjacent lamp slots, and the inside wall of its adjacent one side is equipped with the frosting, the conductor includes electrode layer and pin, the electrode layer extends to in two lamp slots simultaneously, separates through the insulating tape between the electrode layer of every conductor, the pin buckle wrap up in on the filling block.

Further, a convex strip is arranged between two adjacent lamp slots on the main shell.

Further, the outer surface of the raised strip is provided with a frosting surface.

Further, the convex strips are semicircular convex strips.

Further, a plurality of catching grooves and/or a plurality of catching projections are arranged on the insulating tape in the lamp groove.

Further, the lamp trough is a similar four-diamond table and consists of four inclined side surfaces and four transition curved surfaces.

Further, the lamp slots are plural and are arranged at intervals in a single row or in a plurality of rows and columns, the conductors comprise positive conductors and negative conductors, the positive conductors are positioned on one side of the main shell, and the negative conductors are positioned on the other side of the main shell.

Further, the number of the lamp slots is four, the lamp slots are arranged in a two-row two-column matrix at intervals, the conductors comprise four positive conductors and four negative conductors, the four positive conductors are arranged at one side of the main shell at intervals, and the four negative conductors are arranged at the other side of the main shell at intervals.

Compared with the prior art, the utility model has the beneficial effects that:

firstly, the main shell adopts a design of one shell with multiple lamp slots, so that the assembling difficulty of the lamp panel is greatly reduced while the number of LED packages required by the lamp panel under the same scale is greatly reduced; between the adjacent lamp slots, the inner side wall of the adjacent side of the lamp slot is frosted, and a raised strip with frosted surface is additionally arranged between the lamp slot and the lamp slot, the width of the raised strip is smaller than the installation gap of the LED packaging shell on the lamp panel, the inner side wall of the lamp slot and the raised strip are frosted, so that the condensation brightness of the adjacent side of the lamp slot is reduced, the arrangement interval of LED packaging between the lamp panels is made up, the condensation of the adjacent side of the lamp slot is avoided, the interval between the lamp slot and the lamp slot is greatly shortened, the volume of the LED wafer packaging shell is further reduced, and the space utilization rate of the LED wafer packaging shell is improved.

Secondly, according to the LED chip packaging structure, the grabbing grooves and the grabbing convex blocks are formed in the insulating tape in the lamp groove, when the LED chip is packaged, the sealing glue is injected into the grabbing grooves and wraps the grabbing convex blocks, and after the sealing glue is dried, the sealing glue can form fixed grabbing points through the grabbing grooves or the grabbing convex blocks, so that the sealing glue is not easy to fall off or loose.

Drawings

Fig. 1 is a top view of the present utility model.

Fig. 2 is a sectional view taken along the direction A-A in fig. 1.

Wherein, the reference numerals in the figures are as follows: the main casing 10, the conductor 20, the filling block 30, the insulating tape 40, the lamp groove 11, the convex strip 12, the electrode layer 21, the pin 22, the avoiding groove 31, the catching groove 41 and the catching bump 42.

Detailed Description

Specific embodiments of the present utility model will be described below with reference to the accompanying drawings.

Referring to fig. 1 and 2, a multi-groove LED chip package having a compact structure includes a main housing 10, a filling block 30, and a plurality of conductors 20 installed between the main housing 10 and the filling block 30. At least two lamp slots 11 for placing LED wafers are formed in the main shell 10, and the inner side walls of two adjacent lamp slots 11 are provided with frosting surfaces. In addition, a protruding strip 12 is arranged between two adjacent lamp grooves 11, the protruding strip 12 is a semicircular protruding strip, and the outer surface of the protruding strip 12 is a frosted surface. The conductors 20 comprise electrode layers 21 and pins 22, the electrode layers 21 extend into the two lamp sockets 11 at the same time, the electrode layers 21 of each conductor 20 are separated by an insulating tape 40, and the pins 22 are folded and wrapped on the filling blocks 30. The main shell 10 adopts a design of one shell with multiple lamp slots, so that the assembling difficulty of the lamp panel is greatly reduced while the number of LED packages required by the lamp panel under the same scale is greatly reduced; the inner side walls of adjacent lamp slots 11 are frosted, and raised strips 12 with frosted surfaces are additionally arranged between the lamp slots 11 and the lamp slots 11, the width of each raised strip 12 is smaller than the installation gap of an LED packaging shell on a lamp panel, and the light gathering brightness of the adjacent side of the lamp slot 11 is reduced through the inner side walls of the lamp slots 11 subjected to frosting and the raised strips 12, so that the arrangement interval of LED packaging between the lamp panels is compensated, and the light gathering of the adjacent side of the adjacent lamp slot 11 is avoided; meanwhile, the distance between the lamp slots 11 and the lamp slots 11 can be greatly reduced, so that the size of the LED wafer packaging shell is reduced, and the space utilization rate of the LED wafer packaging shell is improved.

Referring to fig. 1 and 2, more specifically, the lamp vessel 11 is a four-diamond-like table as a whole, and is composed of four inclined side surfaces and four transition curved surfaces. The lamp slots 11 are plural and are arranged in a single row and a plurality of columns in a strip mode or are arranged in a plurality of rows and a plurality of columns in an equidistant matrix mode. In this embodiment, the lamp slots 11 are preferably four, and are arranged in a two-row two-column matrix, the conductors 20 are four positive conductors 20 and four negative conductors 20, the four positive conductors 20 are arranged at intervals on one side of the main casing 10, and the four negative conductors 20 are arranged at intervals on the other side of the main casing 10; wherein the electrode layers 21 of the two positive conductors 20 and the electrode layers 21 of the two negative conductors 20 extend into the two lamp sockets 11 of the first row; the electrode layers 21 of the other two positive conductors 20 and the electrode layers 21 of the other two negative conductors 20 extend into the two lamp sockets 11 of the second row. The lower side of the filling block 30 is provided with a plurality of avoidance grooves 31, and the pins 22 of the eight conductors 20 are respectively sunken into the avoidance grooves 31, so that the stability between the conductors 20 and the filling block 30 is improved.

Referring to fig. 1 and 2, the insulation tape 40 in the lamp groove 11 is provided with a plurality of catching grooves 41 and/or a plurality of catching projections 42, and in this embodiment, the insulation tape 40 in the lamp groove 11 is preferably provided with one catching groove 41 and one catching projection 42. When the LED wafer is packaged, after the lamp groove 11 is filled with the sealing glue, the sealing glue is injected into the grabbing groove 41 and wraps the grabbing convex blocks 42, and after the sealing glue is dried, the sealing glue can form fixed grabbing points through the grabbing groove 41 or the grabbing convex blocks 42, so that the sealing glue is not easy to fall off or loose.

The foregoing is merely illustrative of specific embodiments of the present utility model, but the design concept of the present utility model is not limited thereto, and any insubstantial modification of the present utility model by using the design concept shall fall within the scope of the present utility model.

Claims

1. The utility model provides a compact structure's multislot LED wafer encapsulation shell, includes main casing, filling block and a plurality of electric conductor of installing between main casing and filling block, its characterized in that: the LED lamp is characterized in that at least two lamp slots for placing LED wafers are formed in the main shell, two adjacent lamp slots are formed in the inner side walls of one adjacent side of the two adjacent lamp slots, frosting surfaces are arranged on the inner side walls of one adjacent side of the two adjacent lamp slots, each conductor comprises an electrode layer and pins, the electrode layers extend into the two lamp slots at the same time, the electrode layers of each conductor are separated through insulating strips, and the pins are folded and wrapped on the filling blocks.

2. The compact multi-well LED chip package of claim 1, wherein: and a convex strip is arranged between two adjacent lamp slots on the main shell.

3. The compact multi-well LED chip package of claim 2, wherein: the outer surface of the raised strip is provided with a frosting surface.

4. The compact multi-well LED chip package of claim 2, wherein: the raised strips are semicircular raised strips.

5. The compact multi-well LED chip package of claim 1, wherein: the insulation belt in the lamp slot is provided with a plurality of grabbing grooves and/or a plurality of grabbing convex blocks.

6. The compact multi-well LED chip package of claim 1, wherein: the lamp trough is a similar four-diamond table and consists of four inclined side surfaces and four transition curved surfaces.

7. The compact multi-well LED chip package of claim 1, wherein: the lamp slots are plural and are arranged in a straight line, single row and interval or multiple rows and multiple columns, the conductors comprise positive conductors and negative conductors, the positive conductors are positioned on one side of the main shell, and the negative conductors are positioned on the other side of the main shell.

8. The compact multi-well LED chip package of claim 7, wherein: the lamp slots are four, are arranged in a two-row two-column matrix at intervals, the conductors comprise four positive conductors and four negative conductors, the four positive conductors are arranged at one side of the main shell at intervals, and the four negative conductors are arranged at the other side of the main shell at intervals.