CN211507674U - LED packaging shell convenient for mounting wafer - Google Patents
LED packaging shell convenient for mounting wafer Download PDFInfo
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- CN211507674U CN211507674U CN202020590699.2U CN202020590699U CN211507674U CN 211507674 U CN211507674 U CN 211507674U CN 202020590699 U CN202020590699 U CN 202020590699U CN 211507674 U CN211507674 U CN 211507674U
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- positive electrode
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 30
- 239000004020 conductor Substances 0.000 claims abstract description 13
- 238000009434 installation Methods 0.000 claims abstract description 7
- 230000002146 bilateral effect Effects 0.000 claims description 3
- 238000003860 storage Methods 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 16
- 230000000694 effects Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
An LED packaging shell convenient for mounting a wafer comprises a main shell and a conductor arranged on the lower side of the main shell, wherein the upper side of the main shell is provided with a storage groove for containing the LED wafer, and the upper notch and the lower notch of the storage groove are both circular; when viewed from top to bottom, the lower notch is positioned in the upper notch; an electrode layer is arranged in the lower notch and is electrically connected with the electric conductor; the electrode layers comprise three positive electrodes and three negative electrodes which are distributed left and right and are mutually spaced; the positive electrode and the negative electrode are different in shape; each positive electrode and each negative electrode are in contact with the lower notch, and the length of the circular arc section of each positive electrode and each negative electrode in contact with the lower notch is approximately the same. The difficulty of installing the LED wafer on the packaging shell by an installer can be greatly reduced; and the identification of the positive and negative electrodes by an installer is not obstructed, so that the later installation operation is facilitated.
Description
Technical Field
The utility model belongs to the technical field of the LED encapsulation and specifically relates to indicate a LED packaging shell convenient to installation wafer.
Background
The LED wafer is the main raw material of the LED lamp, and the LED lamp mainly depends on the wafer to emit light. In order to make the LED chip emit light, a package case is required to be used in cooperation with the LED chip. The LED packaging shell is a bottom base of the LED wafer before packaging, the chip is fixed on the LED packaging shell, the positive and negative electrodes are welded, and the LED packaging shell is packaged and formed by packaging glue at one time.
Most of the existing packaging shells adopt circular cups to contain LED wafers, and the LED packaging shells have the problem that the design of the lower openings of the circular cups is usually small in size for ensuring the light source effect, so that the LED packaging shells are inconvenient to install by technicians, especially when the number of positive and negative electrodes is large, the LED packaging shells are difficult to operate, and therefore the packaging shells need to be designed more humanized so as to be convenient for later-stage wafer installation.
SUMMERY OF THE UTILITY MODEL
The utility model provides a LED packaging shell convenient to installation wafer, the design of its main aim at overcoming current LED packaging shell is not convenient for install the defect of LED wafer.
In order to solve the technical problem, the utility model adopts the following technical scheme:
an LED packaging shell convenient for mounting a wafer comprises a main shell and a conductor arranged on the lower side of the main shell, wherein the upper side of the main shell is provided with a storage groove for containing the LED wafer, and the upper notch and the lower notch of the storage groove are both circular; when viewed from top to bottom, the lower notch is positioned in the upper notch; an electrode layer used for being electrically connected with the LED wafer is arranged in the lower notch, and the electrode layer is electrically connected with the electric conductor; the electrode layers comprise three positive electrodes and three negative electrodes which are distributed left and right and are mutually spaced; the positive electrode and the negative electrode are different in shape; each positive electrode and each negative electrode are in contact with the lower notch, and the length of the circular arc section of each positive electrode and each negative electrode in contact with the lower notch is approximately the same.
Furthermore, the three positive electrodes are positioned on the left side of the lower notch and are sequentially distributed from front to back; the three negative electrodes are positioned on the right side of the lower notch and are also distributed in sequence from front to back.
Further, the three positive electrodes comprise a first positive electrode, a second positive electrode and a third positive electrode which are sequentially distributed from front to back, and the first positive electrode and the third positive electrode are symmetrical front to back.
Furthermore, the three negative electrodes comprise a first negative electrode, a second negative electrode and a third negative electrode which are sequentially distributed from front to back, and the first negative electrode and the third negative electrode are symmetrical front and back.
Further, the first positive electrode is opposite to the first negative electrode left and right, the second positive electrode is opposite to the second negative electrode left and right, and the third positive electrode is opposite to the third negative electrode left and right; the second negative electrode also extends leftwardly between the first positive electrode and a third positive electrode.
Further, the conductor comprises three positive conductive pins electrically connected with the three positive electrodes one by one, and three negative conductive pins electrically connected with the three negative electrodes one by one; the bottom of three positive conductive pins and the bottom of three negative conductive pins are respectively arranged in a one-to-one bilateral symmetry mode, and the bottom of three positive conductive pins and the bottom of three negative conductive pins are both in a foot wrapping shape.
Furthermore, the packaging structure further comprises a filling block, and the filling block is wrapped in the three positive conductive pins and the three negative conductive pins.
Further, the electric conductor also comprises an insulating tape, and the three positive conductive pins and the three negative conductive pins are separated from each other by the insulating tape.
Further, the diameter of the upper notch is 4.00 +/-0.05 mm, and the diameter of the lower notch is 3.35 +/-0.05 mm.
Furthermore, the included angle between the object placing groove and the horizontal direction is 67.5 degrees.
Compared with the prior art, the utility model discloses the beneficial effect who produces lies in:
the utility model discloses simple structure, practicality are strong, set up each positive electrode in three positive electrode and three negative electrode, negative electrode all with lower notch contact, and the length of the circular arc section of each positive electrode, negative electrode and lower notch contact is all roughly the same, it is different from the traditional technical scheme that in order to distinguish positive electrode and negative electrode, and design into different length with the contact edge of lower notch, can make installer install LED wafer on this packaging shell the degree of difficulty compare with traditional packaging shell, obtained reducing greatly; and the identification of the positive and negative electrodes by an installer is not obstructed, so that the later installation operation is facilitated.
Drawings
Fig. 1 is a top view of the package according to the present invention.
Fig. 2 is a bottom view of the package in the present invention.
Fig. 3 is a rear view of the package according to the present invention.
Fig. 4 is a left side view of the package housing according to the present invention.
Fig. 5 is a top view of the package frame according to the present invention.
Detailed Description
The following describes embodiments of the present invention with reference to the drawings.
Refer to fig. 1, 2, 3, and 4. An LED packaging shell convenient for mounting a wafer comprises a main shell 1 and a conductor 2 arranged on the lower side of the main shell 1, wherein the upper side of the main shell 1 is provided with a storage groove 3 for containing an LED wafer (not shown), and an upper notch 31 and a lower notch 32 of the storage groove 3 are both circular; the lower notch 32 is located inside the upper notch 31 when viewed from top to bottom; an electrode layer 4 for electrically connecting with the LED chip is arranged in the lower notch 32, and the electrode layer 4 is electrically connected with the conductor 2; the electrode layer 4 comprises three positive electrodes 41 and three negative electrodes 42 distributed left and right, and the three positive electrodes 41 and the three negative electrodes 42 are mutually spaced; the positive electrode 41 and the negative electrode 42 are different in shape; each of the positive and negative electrodes 41, 42 is in contact with the lower notch 32, and the length of the circular arc section 321 where each of the positive and negative electrodes 41, 42 is in contact with the lower notch 32 is substantially the same.
The packaging shell in the utility model is different from the traditional technical proposal that the contact edges of the positive electrode, the negative electrode and the lower notch are designed into different lengths in order to distinguish the positive electrode and the negative electrode, but the lengths of the arc sections of the positive electrode, the negative electrode and the lower notch are all approximately same, which can greatly reduce the difficulty of installing the LED wafer on the packaging shell by an installer compared with the traditional packaging shell; and the identification of the positive and negative electrodes by an installer is not obstructed, so that the later installation operation is facilitated.
In particular, the method of manufacturing a semiconductor device,
refer to fig. 1, 2, 3, and 4. The three positive electrodes 41 are positioned on the left side of the lower notch 32 and are distributed in sequence from front to back; the three negative electrodes 42 are located on the right side of the lower notch 32 and are also distributed in sequence from front to back. Wherein the content of the first and second substances,
the three positive electrodes 41 include a first positive electrode 411, a second positive electrode 412, and a third positive electrode 413 which are sequentially distributed from front to back, and the first positive electrode 411 and the third positive electrode 413 are symmetrical front to back.
The three negative electrodes 42 include a first negative electrode 421, a second negative electrode 422, and a third negative electrode 423 that are sequentially distributed from front to back, and the first negative electrode 421 and the third negative electrode 423 are symmetrical from front to back.
The first positive electrode 411 is opposite to the first negative electrode 421 left and right, the second positive electrode 412 is opposite to the second negative electrode 422 left and right, and the third positive electrode 413 is opposite to the third negative electrode 423 left and right; the second negative electrode 422 also extends leftward between the first positive electrode 411 and the third positive electrode 421.
Refer to fig. 1, 2, 3, and 4. The conductor 2 comprises three positive conductive pins 21 electrically connected with three positive electrodes 41 one by one and three negative conductive pins 22 electrically connected with three negative electrodes 42 one by one; the bottom ends of the three positive conductive pins 21 and the bottom ends of the three negative conductive pins 22 are respectively arranged in bilateral symmetry one by one, and the bottom ends of the three positive conductive pins 21 and the bottom ends of the three negative conductive pins 22 are all in a foot wrapping shape. Specifically, the positive conductive pin 21 includes a left vertical supporting block 211 protruding leftward from the outer sidewall of the main housing 1 and a left foot 212, and the left end of the left foot 212 is connected to the lower end of the left vertical supporting block 211, and the right end thereof is supported upward by the filling block 5; the negative conductive pin 22 comprises a right vertical supporting block 221 and a right wrapping pin 222 which protrude out of the outer side wall of the main shell 1 rightwards, the right end of the right wrapping pin 222 is connected with the lower end of the right vertical supporting block 221, and the left end of the right wrapping pin is upwards supported by the filling block 5; the left side of the left vertical supporting block 211 and the right side of the right vertical supporting block 221 are respectively provided with an anti-slip groove 6 which is horizontally arranged. The three left wrapping legs 212 and the three right wrapping legs 222 are symmetrically distributed one by one. Through setting up left vertical supporting shoe 211 and right vertical supporting shoe 221 to set up anti-skidding groove 6 respectively on it, can enough guarantee the firm stability of packaging shell overall structure, anti-skidding groove 6 can play the effect that improves friction power effectively moreover, makes things convenient for installer to pull down the packaging shell from the encapsulation frame.
Refer to fig. 1, 2, 3, and 4. The utility model discloses still include a filling block 5, this filling block 5 cladding is in three positive conductive pin 21 and three negative conductive pin 22 to play firm structure's effect.
Six foot wrapping grooves 51 corresponding to the three left foot wrapping 212 and the three right foot wrapping 222 in one-to-one positions are formed in the lower side surface of the filling block 5 and used for containing the left foot wrapping 212 or the right foot wrapping 222 respectively. A lightening groove 52 is respectively arranged between the two left and right opposite foot wrapping grooves 51.
In addition, the conductive body 2 further includes an insulating tape 23, and the three positive conductive pins 21 and the three negative conductive pins 22 are separated from each other by the insulating tape 23. The three positive conductive pins 21, the insulating tape 23 and the three negative conductive pins 22 are integrated.
Refer to fig. 1, 2, 3, and 4. The diameter of the upper notch 31 is 4.00 +/-0.05 mm, and the diameter of the lower notch 32 is 3.35 +/-0.05 mm. The included angle between the object placing groove 3 and the horizontal direction is 67.5 degrees. The height of the main shell 1 is 0.80 plus or minus 0.05mm, and the height of the packaging shell is 1.60 plus or minus 0.05 mm. The distance between the left foot 212 and the right foot 222 which are opposite to each other is 2.60 +/-0.05 mm.
Refer to fig. 5. A package frame 100 comprises a frame 101 and a plurality of package shells 102 arranged on the frame in an array, wherein a channel 103 is formed between the left side and the right side of each package shell 102 and the frame 101; the anti-slip groove faces the channel 103.
The above-mentioned be the utility model discloses a concrete implementation way, nevertheless the utility model discloses a design concept is not limited to this, and the ordinary use of this design is right the utility model discloses carry out immaterial change, all should belong to the act of infringement the protection scope of the utility model.
Claims (10)
1. The utility model provides a LED packaging shell convenient to installation wafer, includes the main casing body and installs in the electric conductor of this main casing body downside, the upside of the main casing body is offered and is used for holding LED wafer put thing groove, its characterized in that: the upper notch and the lower notch of the article holding groove are both circular; when viewed from top to bottom, the lower notch is positioned in the upper notch; an electrode layer used for being electrically connected with the LED wafer is arranged in the lower notch, and the electrode layer is electrically connected with the electric conductor; the electrode layers comprise three positive electrodes and three negative electrodes which are distributed left and right and are mutually spaced; the positive electrode and the negative electrode are different in shape; each positive electrode and each negative electrode are in contact with the lower notch, and the length of the circular arc section of each positive electrode and each negative electrode in contact with the lower notch is approximately the same.
2. An LED package for facilitating mounting of a die as recited in claim 1, wherein: the three positive electrodes are positioned on the left side of the lower notch and are sequentially distributed from front to back; the three negative electrodes are positioned on the right side of the lower notch and are also distributed in sequence from front to back.
3. An LED package for facilitating mounting of a die as recited in claim 2, wherein: the three positive electrodes comprise a first positive electrode, a second positive electrode and a third positive electrode which are sequentially distributed from front to back, and the first positive electrode and the third positive electrode are symmetrical front to back.
4. An LED package for facilitating mounting of a chip as recited in claim 3, wherein: the three negative electrodes comprise a first negative electrode, a second negative electrode and a third negative electrode which are sequentially distributed from front to back, and the first negative electrode and the third negative electrode are symmetrical front to back.
5. An LED package for facilitating mounting of a chip as recited in claim 4, wherein: the first positive electrode is opposite to the first negative electrode left and right, the second positive electrode is opposite to the second negative electrode left and right, and the third positive electrode is opposite to the third negative electrode left and right; the second negative electrode also extends leftwardly between the first positive electrode and a third positive electrode.
6. An LED package for facilitating mounting of a die as recited in claim 1, wherein: the conductor comprises three positive conductive pins electrically connected with the three positive electrodes one by one and three negative conductive pins electrically connected with the three negative electrodes one by one; the bottom of three positive conductive pins and the bottom of three negative conductive pins are respectively arranged in a one-to-one bilateral symmetry mode, and the bottom of three positive conductive pins and the bottom of three negative conductive pins are both in a foot wrapping shape.
7. An LED package for facilitating mounting of a die as recited in claim 6, wherein: the packaging structure further comprises a filling block, and the filling block is wrapped in the three positive conductive pins and the three negative conductive pins.
8. An LED package for facilitating mounting of a die as recited in claim 6, wherein: the conductor further comprises an insulating tape, and the three positive conductive pins and the three negative conductive pins are separated from each other by the insulating tape.
9. An LED package for facilitating mounting of a die as recited in claim 1, wherein: the diameter of the upper notch is 4.00 +/-0.05 mm, and the diameter of the lower notch is 3.35 +/-0.05 mm.
10. An LED package for facilitating mounting of a die as recited in claim 1, wherein: the included angle between the object placing groove and the horizontal direction is 67.5 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020590699.2U CN211507674U (en) | 2020-04-20 | 2020-04-20 | LED packaging shell convenient for mounting wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020590699.2U CN211507674U (en) | 2020-04-20 | 2020-04-20 | LED packaging shell convenient for mounting wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211507674U true CN211507674U (en) | 2020-09-15 |
Family
ID=72404593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020590699.2U Expired - Fee Related CN211507674U (en) | 2020-04-20 | 2020-04-20 | LED packaging shell convenient for mounting wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211507674U (en) |
-
2020
- 2020-04-20 CN CN202020590699.2U patent/CN211507674U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210608 Address after: No.18 Lianxin Road, Guanqiao area, Longqiao garden, Anxi County Economic Development Zone, Quanzhou City, Fujian Province 362441 Patentee after: FUJIAN DINGKE PHOTOELECTRIC TECHNOLOGY Co.,Ltd. Address before: 362441 Guanqiao area, Longqiao garden, Anxi Economic Development Zone, Quanzhou City, Fujian Province Patentee before: FUJIAN DINGTAI OPTOELECTRONICS TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200915 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |