CN209822682U

CN209822682U - Material cost saving's LED wafer packaging shell

Info

Publication number: CN209822682U
Application number: CN201921111815.1U
Authority: CN
Inventors: 袁洪峰
Original assignee: FUJIAN DINGTAI PHOTOELECTRIC TECHNOLOGY Co Ltd
Current assignee: Fujian Dingke Photoelectric Technology Co ltd
Priority date: 2019-07-16
Filing date: 2019-07-16
Publication date: 2019-12-20
Anticipated expiration: 2029-07-16

Abstract

An LED wafer packaging shell capable of saving material cost comprises a main shell, a concave electric conductor and a filling block, wherein a storage groove for containing an LED wafer is formed in the upper side of the main shell, an electrode layer is arranged in the storage groove, the concave electric conductor is arranged on the lower side of the main shell and is electrically connected with the electrode layer, a group of inward-bent wrapping feet are respectively arranged at the bottom ends of two sides of the concave electric conductor, a supporting foot is connected to the upper side of each wrapping foot, and the upper side surface of each supporting foot is abutted to the lower side surface of the filling block; the ratio of the thickness of the filling block to the height of the supporting legs is 1: 1-1: 1.2. The utility model discloses can enough make concave type electric conductor obtain the support of filling block and keep structural stability, the thickness of filling block moreover compares in current filling block can obtain the reduction of to a great extent to reduce the volume of required filling block on the whole, and then practiced thrift material cost.

Description

Material cost saving's LED wafer packaging shell

Technical Field

The utility model relates to a LED lamp equipment part especially indicates a material saving cost's LED wafer encapsulation shell.

Background

The LED wafer is the main raw material of the LED lamp, and the LED lamp mainly depends on the wafer to emit light. In order to make the LED chip emit light, a package case is required to be used in cooperation with the LED chip.

The existing packaging shell generally comprises a main shell body, and a positive electrode and a negative electrode which are arranged on the main shell body, wherein an LED wafer is packaged on the main shell body, is connected with the positive electrode and the negative electrode, and is connected with commercial power through a conductor on the main shell body. Nowadays, in order to improve the stability of the molded conductor, a filler block is installed in the conductor.

For example, the present applicant filed chinese utility model patent application No. CN201621478188.1 in 2016, 12, 30, which includes a main housing, a storage slot for accommodating an LED chip is provided on the upper side of the main housing, an electrode layer is provided in the storage slot, a concave electric conductor with a downward opening is installed on the lower side of the main housing, the concave electric conductor is electrically connected to the electrode layer, the bottom ends of the concave electric conductor located at both sides have a pair of inward bending legs, and the two pairs of legs extend upward to abut against a filling block installed on the inner side of the concave electric conductor.

Although the LED chip package has not a great problem in use after years of application, the manufacturing cost and the overall weight of the LED chip package are gradually at a disadvantage with new products continuously introduced by the applicant, and the LED chip package has a problem of high manufacturing cost and large overall weight.

SUMMERY OF THE UTILITY MODEL

The utility model provides a LED wafer packaging shell of material saving cost, its main aim at overcome current LED wafer packaging shell defect with high costs, that whole weight is big.

In order to solve the technical problem, the utility model adopts the following technical scheme:

an LED wafer packaging shell capable of saving material cost comprises a main shell, a concave electric conductor and a filling block arranged on the inner side of the concave electric conductor, wherein a storage groove used for containing an LED wafer is formed in the upper side of the main shell, an electrode layer is arranged in the storage groove, the concave electric conductor is arranged on the lower side of the main shell and is electrically connected with the electrode layer, a group of inward-bent wrapping feet are respectively arranged at the bottom ends of two sides of the concave electric conductor, a supporting foot is connected to the upper side of each wrapping foot, and the upper side surface of each supporting foot is abutted to the lower side surface of the filling block; the ratio of the thickness of the filling block to the height of the supporting leg is 1: 1-1: 1.2.

Furthermore, the supporting legs are connected to the upper side of the inner side end of the wrapping leg.

Furthermore, the supporting legs and the wrapping legs which are connected are integrally formed.

Further, the area of the upper side surface of the supporting leg is larger than the area of the lower side surface of the supporting leg.

Furthermore, the cross section of the supporting leg is trapezoidal.

Further, the electrode layer includes three positive electrodes and a negative electrode.

Further, each group of the foot comprises two feet; in the two groups of wrapping pins, three wrapping pins are positive electrode pins which are respectively connected with the three positive electrodes one by one, and the other wrapping pin is a negative electrode pin which is connected with the negative electrode.

Compared with the prior art, the utility model discloses the beneficial effect who produces lies in:

the utility model has simple structure and strong practicability, the supporting legs are arranged on the upside of the wrapping feet to support the filling block, so that the concave electric conductor can be supported by the filling block to keep the structural stability, and the thickness of the filling block can be reduced to a great extent compared with the existing filling block, thereby reducing the volume of the required filling block on the whole and further saving the material cost; in addition, because the filling block volume has obtained reducing, consequently the weight of filling block has also obtained reducing, thereby makes the utility model discloses the LED wafer packaging shell that makes has reduced one tenth to one eighth compared with prior art weight.

Drawings

Fig. 1 is a schematic top view of the present invention.

Fig. 2 is a schematic bottom view of the present invention.

Fig. 3 is a sectional view a-a of fig. 2.

Detailed Description

The following describes embodiments of the present invention with reference to the drawings.

Reference is made to fig. 1, 2 and 3. An LED wafer packaging shell capable of saving material cost comprises a main shell 1, a concave conductor 2 and a filling block 3 arranged on the inner side of the concave conductor 2, wherein the upper side of the main shell 1 is provided with a storage groove 11 for containing an LED wafer, an electrode layer 4 is arranged in the storage groove 11, the concave conductor 2 is arranged on the lower side of the main shell 1 and is electrically connected with the electrode layer 4, the bottom ends of two sides of the concave conductor 2 are respectively provided with a group of inward bent wrapping feet 21, the upper side of each wrapping foot 21 is connected with a supporting foot 5, and the upper side 51 of each supporting foot 5 is abutted against the lower side of the filling block 3; the ratio of the thickness a of the filling block to the height b of the supporting foot is 1: 1-1: 1.2. The utility model discloses a set up supporting legs 5 and support the filling block 3 on the upside of package foot 21, can enough make concave type electric conductor 2 obtain the support of filling block 3 and keep structural stability, and the thickness of filling block 3 can obtain to a great extent to reduce compared with current filling block moreover, thus reduced the volume of required filling block on the whole, and then practiced thrift material cost; in addition, because the filling block volume has obtained reducing, consequently the weight of filling block has also obtained reducing, thereby makes the utility model discloses the LED wafer packaging shell that makes has reduced one tenth to one eighth compared with prior art weight.

Reference is made to fig. 1, 2 and 3. Specifically, the supporting leg 5 is connected to the upper side of the inner end 210 of the foot 21. The connected supporting feet 5 and the wrapping feet 21 are integrally formed. The purpose is to reduce the difficulty of the molding process of the packaging shell.

The area of the upper surface 51 of the support foot 5 is larger than the area of the lower surface 52 of the support foot. Its purpose firstly lies in improving the stability when side and the lateral surface butt of filling block on the supporting legs, secondly avoids because the lateral surface area undersize on the supporting legs to make filling block downside stress point too concentrated, thereby damage the filling block. Specifically, the cross-section of the supporting leg can be designed to be trapezoidal.

Reference is made to fig. 1, 2 and 3. The electrode layer 4 includes three positive electrodes 41 and a negative electrode 42, and each of the adjacent two electrodes is separated by an insulating tape 43. Each group of the foot comprises two feet; in the two groups of pins 21, three pins are positive electrode pins 211 respectively connected with the three positive electrodes 41 one by one, and the other pin is a negative electrode pin 212 connected with the negative electrode 42. The positive electrode pin 211 and the negative electrode pin 212 are both connected to an external commercial power, and the LED chip accommodated in the accommodating slot 11 is respectively connected to the positive electrode pin and the negative electrode pin through circuits of the positive electrode pin and the negative electrode pin.

The above-mentioned be the utility model discloses a concrete implementation way, nevertheless the utility model discloses a design concept is not limited to this, and the ordinary use of this design is right the utility model discloses carry out immaterial change, all should belong to the act of infringement the protection scope of the utility model.

Claims

1. The utility model provides a material cost saving's LED wafer packaging shell, includes a main casing body, a spill electric conductor and one installs in the inboard filling block of this spill electric conductor, the upside of main casing body is offered and is used for the holding LED wafer put the thing groove, put the thing inslot and be equipped with the electrode layer, the spill electric conductor install in main casing body downside and with the electrode layer electricity is connected, the bottom on spill electric conductor both sides respectively has a set of package foot of inwards buckling, its characterized in that: the upper side of each wrapping foot is connected with a supporting foot, and the upper side surface of each supporting foot is abutted against the lower side surface of the filling block; the ratio of the thickness of the filling block to the height of the supporting leg is 1: 1-1: 1.2.

2. The material cost effective LED chip package of claim 1, wherein: the supporting legs are connected to the upper side of the inner side end of the wrapping leg.

3. The material cost effective LED chip package of claim 1, wherein: the supporting legs and the wrapping legs which are connected are integrally formed.

4. The material cost effective LED chip package of claim 1, wherein: the area of the upper side surface of the supporting leg is larger than the area of the lower side surface of the supporting leg.

5. The material cost effective LED chip package of claim 4, wherein: the cross section of the supporting leg is trapezoidal.

6. The material cost effective LED chip package of claim 1, wherein: the electrode layer comprises three positive electrodes and a negative electrode.

7. The material cost effective LED chip package of claim 6, wherein: each group of the foot comprises two feet; in the two groups of wrapping pins, three wrapping pins are positive electrode pins which are respectively connected with the three positive electrodes one by one, and the other wrapping pin is a negative electrode pin which is connected with the negative electrode.