CN219106140U

CN219106140U - Semiconductor device

Info

Publication number: CN219106140U
Application number: CN202223331085.0U
Authority: CN
Inventors: 蒋高喜; 陈颖
Original assignee: Wuxi Xinze Semiconductor Technology Co ltd
Current assignee: Wuxi Xinze Semiconductor Technology Co ltd
Priority date: 2022-12-13
Filing date: 2022-12-13
Publication date: 2023-05-30
Anticipated expiration: 2032-12-13

Abstract

The utility model discloses a semiconductor device, which relates to the technical field of semiconductors and comprises a mounting plate and a protection mechanism, wherein an insulating coating is arranged on the outer side of the mounting plate, the top end of the mounting plate is connected with the protection mechanism, and the inner side of the protection mechanism is connected with a semiconductor chip. The beneficial effects of the utility model are as follows: a semiconductor device is characterized in that a protection mechanism is arranged, a semiconductor chip is clamped into a mounting plate, conical buckles in two end fixing boxes are used, the semiconductor chip is inserted into conical grooves in the mounting plate, then a top cover is fixed on the mounting box by using screws, a heat-connecting plate is in contact with the semiconductor chip, a pressurizing spring provides downward pressure for the heat-connecting plate, heat generated by the semiconductor chip is absorbed by the heat-connecting plate and is transferred upwards through the heat-connecting plate, the heat is conducted to a heat dissipation plate through a metal heat conductor to dissipate heat, the semiconductor chip is easily affected by external static electricity, and static electricity outside the mounting box can be conducted by a static electricity conductor such as the power transmission box.

Description

Semiconductor device

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a semiconductor device.

Background

The semiconductor device is an electronic device with conductivity between good conductor and insulator, and uses the special electric property of semiconductor material to implement specific function, and can be used for producing, controlling, receiving, converting, amplifying signal and making energy conversion. The circuits within various appliances are also used with semiconductor devices.

After the semiconductor device is installed, the heat dissipation silicone grease is coated on the outer side of the semiconductor to cool the chip, the heat dissipation silicone grease can reduce the cooling effect due to the baking of the temperature after a certain time, and the chip is used in a long-time high-temperature environment, so that the poor heat dissipation of the chip is easily caused.

Thus, we provide a semiconductor device that solves the above problems.

Disclosure of Invention

The utility model provides a semiconductor device, which is used for solving the problems that after the semiconductor device is installed in the background art, heat dissipation silicone grease is coated on the outer side of a semiconductor to cool a chip, the heat dissipation silicone grease can reduce the cooling effect due to temperature baking after a certain time, and the chip is easy to cause poor heat dissipation of the chip when the chip is used in a long-time high-temperature environment.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor device, includes mounting panel and protection machanism, protection machanism includes mounting box, fixed box, toper knot, awl groove, electrostatic conductor, transmission of electricity box, top cap, metal heat conductor, heating panel, heat transfer board, heat-transfer board and booster spring, the outside of mounting panel is equipped with insulating coating, the top of mounting panel is connected with protection machanism, protection machanism's inboard is connected with semiconductor chip.

Preferably, the insulating coating is in adhesion connection with the mounting plate, and the insulating coating is tightly attached to the mounting plate.

Preferably, the protection machanism includes mounting box, fixed box, toper knot, conical groove, electrostatic conductor, transmission of electricity box, top cap, metal heat conductor, heating panel, heat transfer board and supercharging spring, the upside draw-in groove of mounting panel is connected with the mounting box, the both sides of mounting box all are equipped with fixed box, the inboard of fixed box all is connected with the toper knot, the downside that the toper was detained all is equipped with the conical groove, all be equipped with electrostatic conductor around the mounting box, electrostatic conductor's downside all is connected with the transmission of electricity box, the top screw connection of mounting box has the top cap, the top cap inboard is equipped with metal heat conductor, metal heat conductor's upside is connected with the heating panel, the heating panel downside is connected with the heat transfer board, heat transfer board both sides all are equipped with supercharging spring.

Preferably, the conical buckle is connected with the fixing box through a clamping groove, and the inner diameter of the conical buckle is smaller than that of the fixing box.

Preferably, the electrostatic conductors are in welded connection with the mounting box, and the electrostatic conductors and the mounting box are distributed at equal intervals.

Preferably, the heat dissipation plate is in adhesion connection with the metal heat conductor, and the heat dissipation plate is tightly attached to the metal heat conductor.

Preferably, the pressurizing spring is in adhesion connection with the heat-connecting plate, and the pressurizing spring and the heat-connecting plate are arranged in a central axis symmetry manner.

Compared with the prior art, the utility model has the beneficial effects that: the utility model provides a semiconductor device, through setting up protection machanism, when needs use, go into the mounting panel with the semiconductor chip card, then put the mounting panel on the mounting panel, use the toper knot in the fixed box in both ends, insert the awl inslot on the mounting panel, can increase whole steadiness, the atress is more even, be difficult for droing, then use the screw to fix the top cap on the mounting panel, the contact plate contacts with the semiconductor chip, the booster spring provides decurrent pressure for the contact plate, fix the semiconductor chip, after using, the heat that the semiconductor chip produced can be absorbed by the contact plate, upwards transfer through the heat transfer plate, and the contact plate is with cooling effect, the heat rethread metal heat conductor conducts the heating panel and dispels the heat, increase the heat conduction effect, and in the use, the semiconductor chip receives outside static easily to conduct like the transmission box by static electricity conductor, avoid the semiconductor chip to produce the influence.

Drawings

FIG. 1 is a schematic overall perspective view of the present utility model;

FIG. 2 is a schematic view of the overall planar structure of the present utility model;

FIG. 3 is an enlarged view of point A of FIG. 2 in accordance with the present utility model;

fig. 4 is a schematic structural view of the fixing case of the present utility model.

Reference numerals in the drawings: 1. a mounting plate; 2. an insulating coating; 3. a protective mechanism; 301. a mounting box; 302. a fixed box; 303. a conical buckle; 304. a conical groove; 305. an electrostatic conductor; 306. a power transmission box; 307. a top cover; 308. a metal heat conductor; 309. a heat dissipation plate; 310. a heat transfer plate; 311. a heat-receiving plate; 312. a booster spring; 4. a semiconductor chip.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model; all other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, the present utility model provides a technical solution: the utility model provides a semiconductor device, includes mounting panel 1 and protection machanism 3, and protection machanism 3 includes mounting box 301, fixed box 302, toper knot 303, toper groove 304, static conductor 305, transmission of electricity box 306, top cap 307, metal heat conductor 308, heating panel 309, heat transfer board 310, heat-transfer board 311 and booster spring 312, and the outside of mounting panel 1 is equipped with insulating coating 2, and the top of mounting panel 1 is connected with protection machanism 3, and the inboard of protection machanism 3 is connected with semiconductor chip 4.

Further, the insulating coating 2 is in adhesion connection with the mounting plate 1, the insulating coating 2 is tightly attached to the mounting plate 1, and the insulating coating 2 can reduce the influence of external static electricity on the mounting plate 1 from the lower side.

Further, the protection mechanism 3 comprises a mounting box 301, a fixing box 302, a conical buckle 303, a conical groove 304, electrostatic conductors 305, a power transmission box 306, a top cover 307, a metal heat conductor 308, a heat dissipation plate 309, a heat transmission plate 310, a heat connection plate 311 and a pressurizing spring 312, wherein the upper clamping groove of the mounting plate 1 is connected with the mounting box 301, both sides of the mounting box 301 are respectively provided with the fixing box 302, the inner sides of the fixing box 302 are respectively connected with the conical buckle 303, the lower sides of the conical buckles 303 are respectively provided with the conical groove 304, the periphery of the mounting box 301 is respectively provided with the electrostatic conductors 305, the lower sides of the electrostatic conductors 305 are respectively connected with the power transmission box 306, the top end screw of the mounting box 301 is connected with the top cover 307, the inner side of the top cover 307 is provided with the metal heat conductor 308, the upper side of the metal heat conductor 308 is connected with the heat dissipation plate 309, the lower side of the heat dissipation plate 309 is connected with the heat transmission plate 310, the lower side of the heat transmission plate 310 is connected with the heat connection plate 311, the two sides of the heat-connecting plate 311 are provided with the pressurizing springs 312, when the heat-connecting plate 311 is needed to be used, the semiconductor chip 4 is clamped into the mounting plate 1, then the mounting plate 301 is placed on the mounting plate 1, the conical buckles 303 in the two-end fixing boxes 302 are inserted into the conical grooves 304 on the mounting plate 1, the whole stability can be improved, the stress is more uniform, the top cover 307 is not easy to fall off, then the top cover 307 is fixed on the mounting plate 301 by using screws, the heat-connecting plate 311 is contacted with the semiconductor chip 4, the pressurizing springs 312 provide downward pressure for the heat-connecting plate 311, the semiconductor chip 4 is fixed, after the use, heat generated by the semiconductor chip 4 is absorbed by the heat-connecting plate 311, the heat is transferred upwards through the heat-connecting plate 310, the heat-connecting plate 311 has a cooling effect, the heat is conducted to the heat-radiating plate 309 through the metal heat-radiating body 308, the heat conduction effect is increased, the electrostatic conductor 305 can avoid the influence of static electricity on the semiconductor chip 4.

Further, the tapered buckle 303 is connected with the fixing box 302 by a clamping groove, the inner diameter of the tapered buckle 303 is smaller than that of the fixing box 302, and after the tapered buckle 303 is clamped into the tapered groove 304, the mounting box 301 is fixed by mechanical clamping force.

Further, the electrostatic conductors 305 are welded to the mounting box 301, and the electrostatic conductors 305 are disposed at equal intervals to the mounting box 301, so that the semiconductor chip 4 is susceptible to external static electricity in use, and static electricity outside the mounting box 301 can be conducted by the electrostatic conductors 305, such as a power transmission box 306.

Further, the heat dissipation plate 309 is connected to the metal heat conductor 308 in an adhesion manner, the heat dissipation plate 309 is tightly adhered to the metal heat conductor 308, and the whole heat dissipation plate 309 can provide cooling treatment for the semiconductor chip 4, so as to increase the service life and performance of the semiconductor chip 4.

Further, the pressurizing spring 312 is in adhesion connection with the heat-connecting plate 311, the pressurizing spring 312 and the heat-connecting plate 311 are arranged in central axis symmetry, and when the heat-connecting plate 311 provides downward pressure to the semiconductor chip 4, the pressurizing spring 312 can provide active pressure to prevent the hard pressure from damaging the semiconductor chip 4.

Working principle: when the semiconductor chip 4 is required to be used, the semiconductor chip 4 is clamped into the mounting plate 1 in the first step, the mounting box 301 is placed on the mounting plate 1 in the second step, the conical buckles 303 in the fixing boxes 302 at the two ends are used and inserted into the conical grooves 304 on the mounting plate 1, the overall stability can be improved, the stress is more uniform, the top cover 307 is not easy to fall off, the top cover 307 is fixed on the mounting box 301 by using screws, the heat-conducting plate 311 is contacted with the semiconductor chip 4, the pressurizing spring 312 provides downward pressure for the heat-conducting plate 311, the semiconductor chip 4 is fixed, after the semiconductor chip 4 is used, the heat generated by the semiconductor chip 4 is absorbed by the heat-conducting plate 311, the heat is transferred upwards through the heat-conducting plate 310, the heat-conducting plate 311 is attached with a cooling effect, the heat is conducted to the heat dissipation plate 309 through the metal heat conductor 308, the heat conduction effect is improved, the semiconductor chip 4 is easy to be influenced by external static electricity in use, the static electricity on the outer side of the mounting box 301 can be conducted by the static electricity conductor 305, the static electricity on the outer side of the mounting plate 301 is avoided, and finally the insulating coating 2 can reduce the influence on the semiconductor chip 4 from the outer side 1.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a semiconductor device, includes mounting panel (1) and protection machanism (3), and protection machanism (3) include mounting box (301), fixed box (302), toper knot (303), toper groove (304), electrostatic conductor (305), transmission of electricity box (306), top cap (307), metal heat conductor (308), heating panel (309), heat transfer board (310), heat transfer board (311) and booster spring (312), its characterized in that: the semiconductor device is characterized in that an insulating coating (2) is arranged on the outer side of the mounting plate (1), a protection mechanism (3) is connected to the top end of the mounting plate (1), and a semiconductor chip (4) is connected to the inner side of the protection mechanism (3).

2. A semiconductor device according to claim 1, characterized in that the insulating coating (2) is in adhesive connection with the mounting board (1), and the insulating coating (2) is in close contact with the mounting board (1).

3. The semiconductor device according to claim 1, wherein the protection mechanism (3) comprises a mounting box (301), a fixing box (302), a taper buckle (303), a taper groove (304), an electrostatic conductor (305), a power transmission box (306), a top cover (307), a metal heat conductor (308), a heat dissipation plate (309), a heat transfer plate (310), a heat connection plate (311) and a pressurizing spring (312), the upper side clamping groove of the mounting plate (1) is connected with the mounting box (301), both sides of the mounting box (301) are respectively provided with the fixing box (302), the inner sides of the fixing box (302) are respectively connected with the taper buckle (303), the lower sides of the taper buckle (303) are respectively provided with the taper groove (304), the periphery of the mounting box (301) is respectively provided with the electrostatic conductor (305), the lower sides of the electrostatic conductor (305) are respectively connected with the power transmission box (306), the top end screw of the mounting box (301) is connected with the top cover (307), the inner sides of the mounting box (307) are respectively provided with the metal heat conductor (308), the upper sides of the metal conductor (308) are respectively connected with the heat dissipation plate (309), the lower sides of the heat dissipation plate (310) are connected with the heat dissipation plate (309), and pressurizing springs (312) are arranged on two sides of the heat-connecting plate (311).

4. A semiconductor device according to claim 3, wherein the taper button (303) is connected to the fixing case (302) by a clamping groove, and the inner diameter of the taper button (303) is smaller than the inner diameter of the fixing case (302).

5. A semiconductor device according to claim 3, characterized in that the electrostatic conductor (305) is soldered to the mounting box (301), and the electrostatic conductor (305) is disposed equidistantly from the mounting box (301).

6. A semiconductor device according to claim 3, characterized in that the heat spreader (309) is in adhesive connection with the metal heat conductor (308), and the heat spreader (309) is in close contact with the metal heat conductor (308).

7. A semiconductor device according to claim 3, wherein the pressurizing spring (312) and the heat-receiving plate (311) are connected by adhesion, and the pressurizing spring (312) and the heat-receiving plate (311) are arranged in central axis symmetry.