CN211670426U

CN211670426U - Semiconductor laser element

Info

Publication number: CN211670426U
Application number: CN202020260383.7U
Authority: CN
Inventors: 陈光宇
Original assignee: Gaoguang Optics Shenzhen Co ltd
Current assignee: Gaoguang Optics Shenzhen Co ltd
Priority date: 2020-03-05
Filing date: 2020-03-05
Publication date: 2020-10-13
Anticipated expiration: 2030-03-05

Abstract

The utility model discloses a semiconductor laser element relates to semiconductor laser technical field, which comprises a housin, the inside of casing is provided with semiconductor element, the bottom of casing is provided with the lid, semiconductor element's bottom is provided with the probe that extends to the lid outside, the outside parcel of probe has the protection film, the outside activity parcel of protection film has flexible plastic tubing. The utility model discloses a casing has been set up, a cover, heat conduction silica gel column, fin and heat sink isotructure, install semiconductor element into the casing before the use, seal by the lid at last, only leave the probe outside, thereby make semiconductor element avoid with air direct contact, and suffer external influence, when using, the heat of production is absorbed by the heat sink, give the fin with the heat transfer by heat conduction silica gel column again, and finally disperse in the air, great improvement semiconductor element's life, the material consumption cost is reduced.

Description

Semiconductor laser element

Technical Field

The utility model relates to a semiconductor laser technical field specifically is a semiconductor laser element.

Background

Semiconductor devices are electronic devices that have electrical conductivity between a good electrical conductor and an insulator, and that use the special electrical properties of semiconductor materials to perform specific functions, and can be used to generate, control, receive, convert, amplify signals, and perform energy conversion.

When the existing semiconductor laser element is used, the element is exposed outside and is in direct contact with air, so that the service life of the element is greatly shortened, and the use cost is improved; when an existing semiconductor laser element is installed, a part of a probe of the existing semiconductor laser element is contacted with a carrier and is wrapped, and a part of the probe is directly exposed in the air, so that the existing semiconductor laser element has the harm of electric leakage.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a: the semiconductor laser element aims to solve the problems that when the existing semiconductor laser element is used, the elements are exposed outside and are in direct contact with air, so that the service life of the elements is greatly shortened, and the use cost is improved; when an existing semiconductor laser element is installed, a part of a probe of the semiconductor laser element is contacted with a carrier and is wrapped, and a part of the probe is directly exposed in the air, so that the problem of electric leakage exists, and the semiconductor laser element is provided.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a semiconductor laser element, includes the casing, the inside of casing is provided with semiconductor element, the bottom of casing is provided with the lid, semiconductor element's bottom is provided with the probe that extends to the lid outside, the outside parcel of probe has the protection film, the outside activity parcel of protection film has flexible plastic tubing, the inside top both sides of casing all are connected with the spring, the bottom of spring is connected with the heat absorbing fin, the both sides at heat absorbing fin top all are connected with the spring cooperate and extend to the heat conduction silica gel post at casing top, the top of heat conduction silica gel post is connected with the fin.

Preferably, the top of the shell is provided with a sleeve matched with the heat-conducting silica gel column.

Preferably, bolts are connected between the shell and the cover at four corners of the shell in a threaded manner.

Preferably, the middle of the cover is provided with a groove matched with the probe.

Preferably, the heat absorbing fins and the heat radiating fins are in a half-fan-shaped structure.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a set up casing, lid, heat conduction silica gel column, fin and heat absorbing fin isotructure, in installing semiconductor element into the casing before using, seal by the lid at last, only leave the probe outside to make semiconductor element avoid with the air direct contact, and suffer external influence, when using, the heat that produces is absorbed by the heat absorbing fin, is transmitted the heat to the fin by heat conduction silica gel column again, and finally disperse in the air, greatly improved semiconductor element's life, reduced material consumption cost; still through having set up flexible plastic tubing, protection film isotructure, when using, only need upwards stretch out and draw back the height that needs with flexible plastic tubing, and peel off the place that needs with the protection film, and other places are then protected, have avoided appearing the harm of electric leakage for use safelyr.

Drawings

FIG. 1 is a schematic sectional view of the present invention;

FIG. 2 is a partially enlarged schematic structural view of the present invention;

fig. 3 is a schematic plan view of the present invention;

fig. 4 is a schematic perspective view of the present invention.

In the figure: 1. a housing; 2. a cover; 3. a heat conducting silica gel column; 4. a heat sink; 5. a telescopic plastic pipe; 6. a bolt; 7. a semiconductor element; 8. a heat absorbing sheet; 9. a sleeve; 10. a spring; 11. a probe; 12. and (5) protecting the film.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, a semiconductor laser device includes a housing 1, a semiconductor device 7 is disposed inside the housing 1, a cover 2 is disposed at the bottom of the housing 1, a probe 11 extending to the outside of the cover 2 is disposed at the bottom of the semiconductor device 7, a protective film 12 is wrapped at the outside of the probe 11, a flexible plastic tube 5 is movably wrapped at the outside of the protective film 12, springs 10 are connected to both sides of the top end of the inside of the housing 1, a heat absorbing plate 8 is connected to the bottom of the springs 10, heat conductive silicone columns 3 matched with the springs 10 and extending to the top of the housing 1 are connected to both sides of the top of the heat absorbing plate 8, and heat dissipation fins 4 are connected to the top of the heat conductive.

The utility model discloses a casing 1 has been set up, lid 2, heat conduction silica gel column 3, fin 4 and heat absorbing sheet 8 isotructures, install semiconductor element 7 into casing 1 before the use, seal by lid 2 at last, only keep probe 11 outside, thereby make semiconductor element 7 avoid with air direct contact, and suffer external influence, when using, the heat of production is absorbed by heat absorbing sheet 8, give fin 4 with heat transfer by heat conduction silica gel column 3 again, and finally disperse in the air, great improvement semiconductor element 7's life, the material consumption cost has been reduced.

Please refer to fig. 1, fig. 3 and fig. 4, the sleeve 9 is disposed at the top of the casing 1 and is matched with the heat conducting silica gel column 3, the sleeve 9 is disposed in the present invention, so that the heat absorbing sheet 8 can move without resistance when being squeezed.

Please refer to fig. 1, fig. 3 and fig. 4, the bolts 6 are screwed between the housing 1 and the cover 2 and located at the four corners of the housing, and the bolts 6 are provided to fix the cover 2, so as to support the semiconductor device 7 well.

Please refer to fig. 1, fig. 3 and fig. 4, a groove matched with the probe 11 is formed in the middle of the cover 2, and the groove is provided to facilitate the installation of the cover 2.

Please refer to fig. 1, fig. 3 and fig. 4, the heat absorbing plate 8 and the heat dissipating plate 4 are both in a half-fan structure, and the half-fan structure is provided to increase the contact area between the heat absorbing plate and the air, so that the heat absorbing and dissipating effects are improved.

The working principle is as follows: before use, the semiconductor element 7 is installed in the shell 1, the cover 2 is closed on the shell 1 by the bolts 6, so that the semiconductor element 7 is fixed in the shell 1, only the probe 11 on the semiconductor element 7 extends out of the shell 1, meanwhile, the upper part of the semiconductor element 7 is contacted with the heat absorbing sheet 8, meanwhile, the use range of the equipment can be enlarged by adjusting the spring 10, when in use, the telescopic plastic tube 5 is upwards stretched to a required height, the protective film 12 is peeled to a required position, the metal part on the probe 11 is exposed, soldering connection is carried out, when the semiconductor element 7 works for a period of time, heat is generated and scattered in the shell 1, at the moment, the heat absorbing sheet 8 absorbs the heat in the shell 1, the heat is transferred to the heat radiating sheet 4 through the heat conducting silica gel column 3 and finally radiated to the air, and the temperature in the shell 1 is reduced, avoiding influencing the use.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A semiconductor laser element comprising a housing (1), characterized in that: the utility model discloses a heat-conducting silica gel column, including casing (1), the inside of casing (1) is provided with semiconductor element (7), the bottom of casing (1) is provided with lid (2), the bottom of semiconductor element (7) is provided with probe (11) that extend to the lid (2) outside, the outside parcel of probe (11) has protection film (12), the outside activity parcel of protection film (12) has flexible plastic tubing (5), the inside top both sides of casing (1) all are connected with spring (10), the bottom of spring (10) is connected with heat absorbing sheet (8), the both sides at heat absorbing sheet (8) top all are connected with and cooperate and extend to heat-conducting silica gel column (3) at casing (1) top with spring (10), the top of heat-conducting silica gel column (3) is connected with fin (4).

2. A semiconductor laser device according to claim 1, wherein: the top of the shell (1) is provided with a sleeve (9) matched with the heat-conducting silica gel column (3).

3. A semiconductor laser device according to claim 1, wherein: bolts (6) are connected between the shell (1) and the cover (2) and positioned at four corners of the shell in a threaded manner.

4. A semiconductor laser device according to claim 1, wherein: the middle of the cover (2) is provided with a groove matched with the probe (11).

5. A semiconductor laser device according to claim 1, wherein: the heat absorbing fins (8) and the heat radiating fins (4) are in a half-sector structure.