CN219106102U - Wafer blanking device and wafer detection equipment - Google Patents
Wafer blanking device and wafer detection equipment Download PDFInfo
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- CN219106102U CN219106102U CN202223067727.0U CN202223067727U CN219106102U CN 219106102 U CN219106102 U CN 219106102U CN 202223067727 U CN202223067727 U CN 202223067727U CN 219106102 U CN219106102 U CN 219106102U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
And the wafer blanking device and the wafer detection equipment. Wherein, unloader includes on the wafer: the wafer carrying platform comprises a first carrying platform and a second carrying platform which are arranged at intervals; the guide rail assembly is fixedly arranged on the mounting bracket and is positioned below the wafer carrying platform; the material taking assembly is movably connected with the guide rail assembly, and part of the material taking assembly is movably arranged between the first carrying platform and the second carrying platform and is used for obtaining wafer materials on the wafer carrying platform and carrying the wafer materials to move; the driving assembly is arranged at one end of the guide rail assembly, is in transmission connection with the material taking assembly and is used for driving the material taking assembly to move along the guide rail assembly. The carrier assembly, the guide rail assembly, the material taking assembly and the driving assembly are integrally installed, and the material taking position of the material taking assembly and the material placing position of the wafer material are kept fixed, so that the material taking precision of the wafer material is improved.
Description
Technical Field
The application relates to the technical field of wafer detection, in particular to a wafer blanking device and wafer detection equipment.
Background
With the rapid development of the semiconductor industry, wafers often need to be transported during the processes of wafer fabrication, inspection, and the like. In the prior art, a manipulator is generally used to reciprocate between a material bin and a wafer device so as to realize the transmission of the wafer. Because the material bin, the manipulator and the equipment are arranged separately, the storage position of the wafer in the material bin can be changed, and the material taking position of the manipulator needs to be calibrated frequently, so that the precision and the stability of wafer transmission are affected.
Disclosure of Invention
The application provides a blanking device and wafer check out test set on the wafer to solve above-mentioned technical problem.
Embodiments of the present application are implemented as follows:
a blanking device on a wafer comprises:
the wafer carrying platform comprises a first carrying platform and a second carrying platform which are arranged at intervals;
the guide rail assembly is fixedly arranged on the mounting bracket and is positioned below the wafer carrying platform;
the material taking assembly is movably connected with the guide rail assembly, and part of the material taking assembly is movably arranged between the first carrying platform and the second carrying platform and is used for obtaining the wafer materials on the wafer carrying platform and carrying the wafer materials to move;
the driving assembly is arranged at one end of the guide rail assembly, is in transmission connection with the material taking assembly and is used for driving the material taking assembly to move along the guide rail assembly.
Therefore, the carrying platform assembly, the guide rail assembly, the material taking assembly and the driving assembly are integrally installed, the material taking position of the material taking assembly and the material placing position of the wafer material are kept fixed, the material taking precision of the wafer material is improved, the structural compactness of the lifting device is improved, and the occupied space of the device is reduced.
In one possible embodiment: the first carrying platform is provided with a first profiling groove, the second carrying platform is provided with a second profiling groove corresponding to the first profiling groove, and the first profiling groove and the second profiling groove are used for limiting the wafer materials placed on the wafer carrying platform.
In one possible embodiment: the carrier assembly further comprises a first sensor and a second sensor, the first sensor is mounted on the first carrier and corresponds to the first profiling groove, the second sensor is mounted on the second carrier and corresponds to the second profiling groove, and the first sensor and the second sensor are used for detecting wafer materials.
In one possible embodiment: the mounting bracket comprises a first bracket and a second bracket which are oppositely arranged, the first carrier is fixedly arranged on the first bracket, and the second carrier is fixedly arranged on the second bracket; the guide rail assembly comprises a mounting bottom plate and guide rails, the mounting bottom plate is fixedly connected with the mounting bracket and is positioned between the first bracket and the second bracket, the guide rails are arranged on two opposite sides of the mounting bottom plate, and the mounting bottom plate and the first carrying platform are arranged in parallel; and the material taking assembly is movably connected with the guide rail.
In one possible embodiment: the driving assembly comprises a screw rod and a driver, the screw rod is arranged between the guide rails on two opposite sides of the mounting bottom plate, the driver is arranged on one side, deviating from the guide rails, of the mounting bottom plate, the screw rod is in transmission connection with the driving assembly, and the material taking assembly is in threaded connection with the screw rod.
In one possible embodiment: the material taking assembly comprises a sliding block and a suction plate assembly, the sliding block is movably connected with the guide rail assembly, the suction plate assembly is connected with the sliding block, the suction plate assembly is used for adsorbing the wafer materials, and the distance between the first carrying platform and the second carrying platform is larger than the width of the suction plate assembly
In one possible embodiment: the material taking assembly comprises a sliding table cylinder, wherein the sliding table cylinder is connected between the suction plate assembly and the sliding block and is used for driving the suction plate assembly to move along the direction perpendicular to the guide rail.
In one possible embodiment: the suction plate assembly comprises a mounting plate, a wafer suction plate and a fixing plate, wherein the mounting plate is connected with the sliding table cylinder and the wafer suction plate, the wafer suction plate is used for adsorbing wafer materials, the fixing plate is arranged on one side, deviating from the mounting plate, of the wafer suction plate, and the fixing plate is connected with the mounting plate.
In one possible embodiment: the two ends of the mounting bottom plate are respectively provided with a third sensor and a fourth sensor, the material taking assembly is connected with an induction piece, the induction piece is correspondingly arranged with the third sensor and the fourth sensor, and the third sensor and the fourth sensor are used for detecting the moving distance of the material taking assembly and limiting the moving range of the material taking assembly.
The embodiment of the application also provides wafer detection equipment, which comprises a detection platform and the wafer blanking device, wherein the wafer blanking device is used for moving wafer materials to the detection platform or taking the wafer materials away from the detection platform.
The utility model provides a unloader and wafer check out test set are through with carrier assembly, guide rail assembly, get material subassembly and drive assembly integrated installation on the wafer, and the position is kept fixed with getting the material position of getting material subassembly to the material of wafer material place the position, is favorable to improving the material precision of getting of wafer material, still is favorable to hoisting device's compact structure, reduces device occupation space. The moving direction and the moving distance of the material taking assembly are precisely guided through the structures such as the screw rod and the guide rail, and the stability of material transmission of the wafer can be improved while the material taking precision is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following description will briefly describe the drawings in the embodiments, it being understood that the following drawings only illustrate some embodiments of the present application and should not be considered as limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a blanking device on a wafer according to an embodiment of the present application.
Fig. 2 is a schematic structural view of a part of the structure of the blanking device on the wafer shown in fig. 1 in a use state.
Fig. 3 is a schematic structural diagram of the blanking device on the wafer shown in fig. 1 after removing the shell and the wafer material.
Fig. 4 is a top view of the wafer blanking apparatus shown in fig. 3.
Fig. 5 is a front view of the wafer blanking apparatus shown in fig. 3.
Fig. 6 is a side view of the wafer blanking apparatus shown in fig. 3.
Fig. 7 is another side view of the wafer blanking apparatus shown in fig. 3.
Fig. 8 is a schematic structural diagram of a suction plate assembly in the wafer blanking apparatus shown in fig. 3.
Fig. 9 is an exploded view of the suction plate assembly of fig. 8.
Description of main reference numerals:
the following detailed description will further illustrate the application in conjunction with the above-described figures.
Detailed Description
The following description of the technical solutions in the embodiments of the present application will be made clearly and completely with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "or/and" as used herein includes any and all combinations of one or more of the associated listed items.
Some embodiments of the present application are described in detail. The following embodiments and features of the embodiments may be combined with each other without collision.
Referring to fig. 1, 2 and 3, an embodiment of the present application provides a wafer blanking device 100, which includes a stage assembly 1, a guide rail assembly 4, a material taking assembly 5 and a driving assembly 6. The carrier assembly 1 is used for placing the wafer material 200, and the driving assembly 6 is used for driving the material taking assembly 5 to move along the guide rail assembly 4 so as to obtain and move the wafer material 200 on the carrier assembly 1. Specifically, the carrier assembly 1 includes a mounting bracket 2 and a wafer carrier 3, the wafer carrier 3 is fixedly disposed on the mounting bracket 2, the wafer carrier 3 includes a first carrier 31 and a second carrier 32 disposed at intervals, and the mounting heights of the first carrier 31 and the second carrier 32 are the same and are used for jointly carrying the wafer material 200. The guide rail assembly 4 is fixedly arranged on the mounting bracket 2 and is positioned below the wafer carrying platform 3. The material taking assembly 5 is movably connected with the guide rail assembly 4, and a part of the material taking assembly 5 is movably arranged between the first carrier 31 and the second carrier 32. The driving component 6 is disposed at one end of the guide rail component 4, and the driving component 6 is in transmission connection with the material taking component 5, and is used for driving the material taking component 5 to move along the guide rail component 4, obtaining the wafer material 200 on the wafer carrier 3, and carrying the wafer material 200 to move to a preset position, or placing the detected wafer material 200 on the wafer carrier 3.
Thus, the carrier assembly 1, the guide rail assembly 4, the material taking assembly 5 and the driving assembly 6 are integrally installed, the material taking precision of the wafer material 200 is improved, the structural compactness of the lifting device is improved, and the occupied space of the device is reduced.
The wafer blanking device 100 further comprises a shell 7, and the carrier assembly 1, the guide rail assembly 4, the material taking assembly 5 and the driving assembly 6 are partially contained in the shell 7, so that external impurities are reduced from entering the wafer blanking device 100, and the operation safety of the wafer blanking device 100 is improved.
Referring to fig. 3 and 4, the mounting bracket 2 includes a first bracket 21 and a second bracket 22 that are disposed opposite to each other, the first carrier 31 is fixedly disposed on the first bracket 21, and the second carrier 32 is fixedly disposed on the second bracket 22. The first carrier 31 and the second carrier 32 are opposite and are arranged at intervals, a material taking channel is formed at intervals between the first carrier 31 and the second carrier 32, and the first carrier 31 and the second carrier 32 are symmetrically arranged along the axis of the material taking channel, so that the supporting force of the first carrier 31 and the second carrier 32 on the wafer material 200 can be uniformly distributed, and the problem that the wafer material 200 falls from the carrier due to uneven stress is solved. The material taking assembly 5 can move to the material taking channel along the guide rail assembly 4, so as to obtain the wafer materials 200 borne on the first carrier 31 and the second carrier 32, or place the wafer materials 200 which are detected on the empty first carrier 31 and second carrier 32, so that the wafer materials 200 which are detected can be conveniently taken away by workers or other equipment. In the embodiment of the application, one side of the first carrier 31 is fixedly connected with the top end of the first support 21, the other side is arranged towards the second carrier 32, and one side of the second carrier 32 away from the first carrier 31 is fixedly connected with the top end of the second support 22, so that the first carrier 31 and the first support 21 approximately form an inverted-L-shaped structure, the second carrier 32 and the second support 22 approximately form an inverted-L-shaped structure opposite to the first carrier 31, and enough space is formed below the wafer carrier 3, so that the guide rail assembly 4 and other structures can be conveniently installed.
Further, the first carrier 31 is provided with a first imitating groove 311, the second carrier 32 is provided with a second imitating groove 321 corresponding to the first imitating groove 311, and the first imitating groove 311 and the second imitating groove 321 are used for limiting the wafer material 200 placed on the wafer carrier 3, so that the risk of accidental dropping of the wafer material 200 is reduced. In the embodiment of the application, the first profiling groove 311 and the second profiling groove 321 are respectively arranged on the side edges of the first carrying platform 31 and the second carrying platform 32, which are close to the material taking channel, and are symmetrically arranged along the axis of the material taking channel, so that the wafer material 200 is conveniently and stably erected on the material taking channel, and the feeding mode is simple.
In the embodiment of the present application, the stage assembly 1 further includes a first sensor 33 and a second sensor 34, where the first sensor 33 is installed on the first stage 31 and corresponds to the first profiling groove 311, and the second sensor 34 is installed on the second stage 32 and corresponds to the second profiling groove 321, and is used for detecting whether the wafer material 200 exists on the stage assembly 1, and is also used for determining whether the wafer material 200 is placed in place. When the wafer material 200 is placed on the first carrier 31 and the second carrier 32, signals such as induction light and induction wave emitted by the first sensor 33 and the second sensor 34 can be shielded, and when the first sensor 33 and the second sensor 34 both sense the wafer material 200, the wafer material 200 is correctly placed. The material taking assembly 5 takes or releases the wafer material 200 according to the detection results of the first sensor 33 and the second sensor 34.
Referring to fig. 3, 4 and 5, the rail assembly 4 includes a mounting plate 41 and a rail 42 provided on the mounting plate 41. The material taking assembly 5 comprises a sliding block 51 and a suction plate assembly 54, wherein the sliding block 51 is movably connected with the guide rail 42, and the suction plate assembly 54 is connected with the sliding block 51 and is used for sucking the wafer material 200. The mounting bracket 2 further includes a third bracket 23, the third bracket 23 is located between the first bracket 21 and the second bracket 22, the mounting base 41 is fixedly connected to the third bracket 23, and the mounting base 41 is disposed substantially parallel to the first carrier 31. The extending direction of the guide rail 42 is parallel to the axis of the material taking channel, so as to ensure that the material taking assembly 5 can smoothly move to the material taking channel. In the embodiment of the present application, two guide rails 42 are symmetrically disposed on two opposite sides of the mounting base plate 41, and the slider 51 is connected with two guide rails 42 at the same time, which is favorable for improving the sliding stability and the material taking precision of the suction plate assembly 54.
Further, the driving assembly 6 includes a screw 61 and a driver 62, the screw 61 is disposed between the two guide rails 42, the slider 51 is in threaded connection with the screw 61, and the driver 62 is disposed on a side of the mounting base 41 away from the guide rails 42 and is in driving connection with one end of the screw 61. The driver 62 is configured to drive the screw 61 to rotate forward and backward, so as to drive the slider 51 to reciprocate along the screw 61, and the two guide rails 42 are configured to guide the moving direction of the slider 51, so as to reduce the wobble of the slider 51. The suction plate assembly 54 can suck the wafer material 200 to move synchronously with the slide block 51. The driver 62 can realize the quantitative movement of the material taking assembly 5 by precisely controlling the transmission circle number of the screw rod 61, so that the precision of material taking and material moving is further improved.
With continued reference to fig. 6 and 7, in the embodiment of the present application, along the extending direction of the guide rail 42, a third sensor 43 and a fourth sensor 44 are further disposed at two ends of the mounting base 41, respectively, for detecting the moving distance of the slider 51, limiting the moving range of the slider 51, and the driver 62 stops rotating the screw 61 according to the detection result of the third sensor 43 or the fourth sensor 44. The slider 51 is connected with a sensing piece 55, and the sensing piece 55 is disposed corresponding to the third sensor 43 and the fourth sensor 44. When the slider 51 moves to the end of the guide rail 42, the sensing piece 55 may shade the sensing signal sent by the third sensor 43 or the fourth sensor 44, and the third sensor 43 or the fourth sensor 44 sends the corresponding detection result to the driver 62 according to the signal shading condition.
The driving assembly 6 further comprises a driving belt 63, a first driving wheel 64 and a second driving wheel 65, the first driving wheel 64 is connected to the end portion of the screw rod 61, the second driving wheel 65 is connected to the output end of the driver 62, the driving belt 63 is sleeved on the first driving wheel 64 and the second driving wheel 65, and when the driver 62 drives the second driving wheel 65 to rotate, rotation torque is output to the screw rod 61 through the driving belt 63 and the first driving wheel 64, so that the sliding block 51 is driven to move along the screw rod 61.
Referring to fig. 3, 8 and 9, the material taking assembly 5 further includes a sliding table cylinder 53, where the sliding table cylinder 53 is connected between the suction plate assembly 54 and the sliding block 51, and is used for driving the suction plate assembly 54 to move along a direction perpendicular to the guide rail 42, so as to obtain a material from the wafer carrier 3 or place the material on the wafer carrier 3. Specifically, the slide cylinder 53 is fixedly connected with the slider 51 through the connecting piece 52. When the suction plate assembly 54 moves to the lower part of the wafer carrier 3 along with the sliding block 51, the sliding table cylinder 53 drives the suction plate assembly 54 to move towards the wafer carrier 3, so that the suction plate assembly 54 moves to the material taking channel, the suction plate assembly 54 adsorbs the wafer material 200 on the wafer carrier 3 and lifts the wafer material 200 from the wafer carrier 3 under the action of the sliding table cylinder 53, and when the sliding block 51 continues to move to a preset position along the guide rail 42, the sliding table cylinder 53 can drive the suction plate assembly 54 to move downwards, so that the suction plate assembly 54 is convenient to release vacuum, and the wafer material 200 is placed on the detection platform. After the wafer material 200 completes the detection process, the suction plate assembly 54 can suck the detected wafer material 200 from the detection platform, lift the wafer material 200 under the action of the sliding table air cylinder 53, then move to the position of the wafer carrier 3 along with the sliding block 51 under the action of the driving assembly 6, at this time, the sliding block 51 is located below the first carrier 31 and the second carrier 32, the suction plate assembly 54 and the wafer material 200 are located below the first carrier 31 and the second carrier 32, the sliding table air cylinder 53 drives the suction plate assembly 54 to move downwards again, the suction plate assembly 54 releases the wafer material 200, so that the detected wafer material 200 is placed on the first carrier 31 and the second carrier 32, and a worker or other material moving equipment waits for the detected wafer material 200 to be removed.
It should be noted that, the width of the material taking channel is greater than the width of the suction plate assembly 54, that is, the space between the first carrier 31 and the second carrier 32 is greater than the width of the suction plate assembly 54, so that the suction plate assembly 54 can smoothly pass through the material taking channel, and the collision between the suction plate assembly 54 and the wafer carrier 3 is reduced.
In the embodiment of the present application, the suction plate assembly 54 includes a mounting plate 541, a wafer suction plate 542, and a fixing plate 543. The mounting plate 541 is connected to one end of the sliding table cylinder 53 and one end of the wafer suction plate 542, and the sliding table cylinder 53 drives the wafer suction plate 542 to move along the direction of the vertical guide rail 42 through the mounting plate 541. The fixing plate 543 is disposed on a side of the wafer suction plate 542 away from the mounting plate 541, and the fixing plate 543 connects the wafer suction plate 542 with the mounting plate 541 through fasteners such as bolts, so that one end of the wafer suction plate 542 facing the sliding table cylinder 53 is locked and fixed between the mounting plate 541 and the fixing plate 543, and connection reliability between the wafer suction plate 542 and the sliding table cylinder 53 is improved.
Further, the wafer suction plate 542 is further provided with a vacuum groove 544, and a vacuum pipe connected to an external pressure device can be accommodated in the vacuum groove 544. The surface of the wafer suction plate 542 is provided with a plurality of suction holes, and the suction holes are communicated with a vacuum pipeline, and the vacuum pipeline is used for providing negative pressure or positive pressure to the suction holes, so that the wafer suction plate 542 can conveniently suck the wafer material 200 or release the wafer material 200. The suction plate assembly 54 further comprises a vacuum cover plate 545, wherein the vacuum cover plate 545 is detachably connected to one side of the wafer suction plate 542 and is used for sealing the vacuum grooves 544, so that the surface flatness of the wafer suction plate 542 is maintained, and the maintenance and inspection of the vacuum channels in the wafer suction plate 542 are facilitated.
The embodiment of the application also provides wafer detection equipment, which comprises a detection platform and the wafer blanking device 100 in the embodiment, wherein the wafer blanking device 100 is used for moving the wafer material 200 to the detection platform or taking the wafer material 200 from the detection platform.
The wafer unloader 100 and the wafer check out test set of this application are through with carrier assembly 1, guide rail subassembly 4, get material subassembly 5 and drive assembly 6 integrated installation, and the position of placing of wafer material 200 and the position of getting the material of getting material subassembly 5 remain fixed, are favorable to improving the precision of getting material of wafer material 200, still are favorable to hoisting device's compact structure, reduce device occupation space. The moving direction and the moving distance of the material taking assembly 5 are precisely guided through the structures such as the screw rod and the guide rail, and the stability of wafer transmission can be improved while the material taking precision is improved.
The above embodiments are only for illustrating the technical solution of the present application and not for limiting, and although the present application has been described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that the technical solution of the present application may be modified or substituted without departing from the spirit and scope of the technical solution of the present application.
Claims (10)
1. Unloader on wafer, its characterized in that includes:
the wafer carrying platform comprises a first carrying platform and a second carrying platform which are arranged at intervals;
the guide rail assembly is fixedly arranged on the mounting bracket and is positioned below the wafer carrying platform;
the material taking assembly is movably connected with the guide rail assembly, and part of the material taking assembly is movably arranged between the first carrying platform and the second carrying platform and is used for obtaining the wafer materials on the wafer carrying platform and carrying the wafer materials to move;
the driving assembly is arranged at one end of the guide rail assembly, is in transmission connection with the material taking assembly and is used for driving the material taking assembly to move along the guide rail assembly.
2. The wafer blanking device of claim 1, wherein:
the first carrying platform is provided with a first profiling groove, the second carrying platform is provided with a second profiling groove corresponding to the first profiling groove, and the first profiling groove and the second profiling groove are used for limiting the wafer materials placed on the wafer carrying platform.
3. The wafer blanking device of claim 2, wherein:
the carrier assembly further comprises a first sensor and a second sensor, the first sensor is mounted on the first carrier and corresponds to the first profiling groove, the second sensor is mounted on the second carrier and corresponds to the second profiling groove, and the first sensor and the second sensor are used for detecting wafer materials.
4. The wafer blanking device of claim 1, wherein:
the mounting bracket comprises a first bracket and a second bracket which are oppositely arranged, the first carrier is fixedly arranged on the first bracket, and the second carrier is fixedly arranged on the second bracket;
the guide rail assembly comprises a mounting bottom plate and guide rails, the mounting bottom plate is fixedly connected with the mounting bracket and is positioned between the first bracket and the second bracket, the guide rails are arranged on two opposite sides of the mounting bottom plate, and the mounting bottom plate and the first carrying platform are arranged in parallel; and the material taking assembly is movably connected with the guide rail.
5. The wafer blanking device of claim 4, wherein:
the driving assembly comprises a screw rod and a driver, the screw rod is arranged between the guide rails on two opposite sides of the mounting bottom plate, the driver is arranged on one side, deviating from the guide rails, of the mounting bottom plate, the screw rod is in transmission connection with the driving assembly, and the material taking assembly is in threaded connection with the screw rod.
6. The wafer blanking device of claim 1, wherein:
the material taking assembly comprises a sliding block and a suction plate assembly, the sliding block is movably connected with the guide rail assembly, the suction plate assembly is connected with the sliding block, the suction plate assembly is used for adsorbing the wafer materials, and the distance between the first carrying platform and the second carrying platform is larger than the width of the suction plate assembly.
7. The wafer blanking device of claim 6, wherein:
the material taking assembly comprises a sliding table cylinder, wherein the sliding table cylinder is connected between the suction plate assembly and the sliding block and is used for driving the suction plate assembly to move along the direction perpendicular to the guide rail.
8. The wafer blanking device of claim 7, wherein:
the suction plate assembly comprises a mounting plate, a wafer suction plate and a fixing plate, wherein the mounting plate is connected with the sliding table cylinder and the wafer suction plate, the wafer suction plate is used for adsorbing wafer materials, the fixing plate is arranged on one side, deviating from the mounting plate, of the wafer suction plate, and the fixing plate is connected with the mounting plate.
9. The wafer blanking device of claim 4, wherein:
the two ends of the mounting bottom plate are respectively provided with a third sensor and a fourth sensor, the material taking assembly is connected with an induction piece, the induction piece is correspondingly arranged with the third sensor and the fourth sensor, and the third sensor and the fourth sensor are used for detecting the moving distance of the material taking assembly and limiting the moving range of the material taking assembly.
10. A wafer inspection apparatus comprising an inspection platform and the on-wafer blanking device of any of claims 1-9, the on-wafer blanking device being configured to move wafer material to the inspection platform or to remove the wafer material from the inspection platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223067727.0U CN219106102U (en) | 2022-11-18 | 2022-11-18 | Wafer blanking device and wafer detection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223067727.0U CN219106102U (en) | 2022-11-18 | 2022-11-18 | Wafer blanking device and wafer detection equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219106102U true CN219106102U (en) | 2023-05-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223067727.0U Active CN219106102U (en) | 2022-11-18 | 2022-11-18 | Wafer blanking device and wafer detection equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219106102U (en) |
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2022
- 2022-11-18 CN CN202223067727.0U patent/CN219106102U/en active Active
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