CN219087384U - Circuit board structure for preventing optical point from falling off - Google Patents

Abstract

The utility model discloses a circuit board structure for preventing optical points from falling off. Comprising the following steps: a circuit board body and an optical dot metal layer; the circuit board body is provided with an optical point area, and at least one blind hole is formed in the optical point area; the optical point metal layer is arranged in the optical point area, and the vertical projection of the optical point metal layer on the circuit board body covers the blind hole, wherein the optical point metal layer is in contact connection with the inner wall of the blind hole. The utility model provides a circuit board structure for preventing optical points from falling off, which reduces the probability of falling off of the optical points on the circuit board and improves the connection stability of the optical points.

Description

Circuit board structure for preventing optical point from falling off

Technical Field

The embodiment of the utility model relates to the technical field of circuit boards, in particular to a circuit board structure for preventing optical points from falling off.

Background

The optical points, namely optical positioning points, are generally classified into two types, one type is a whole board identification reference in the circuit board assembly process, and the other type is used as an identification base point of an element with high individual assembly accuracy requirements in the PCB.

In the production of PCB technology, the optical spot is usually protected by increasing the thickness of the copper ring, but the optical spot is still cleaned by a plurality of pretreatment steps in the production process, resulting in the falling-off phenomenon of the optical spot and the loss of positioning function.

Disclosure of Invention

The utility model provides a circuit board structure for preventing optical points from falling off, which reduces the probability of falling off of the optical points on the circuit board and improves the connection stability of the optical points.

The embodiment of the utility model provides a circuit board structure for preventing optical points from falling off, which comprises: a circuit board body and an optical dot metal layer;

the circuit board body is provided with an optical point area, and at least one blind hole is formed in the optical point area; the optical point metal layer is arranged in the optical point area, and the vertical projection of the optical point metal layer on the circuit board body covers the blind hole, wherein the optical point metal layer is in contact connection with the inner wall of the blind hole.

Optionally, the shape of the perpendicular projection of the optical point metal layer on the circuit board body is a circle or a regular polygon.

Optionally, at least two blind holes are arranged in the optical spot area; the blind hole distribution is symmetrical about the center of the optical point metal layer.

Optionally, a blind hole is arranged in the optical point area; the blind holes coincide with the center positions of the optical point metal layers.

Optionally, the optical dot metal layer has a thickness of between 10 μm and 14 μm.

Optionally, the diameter of the blind hole is between 0.05 and 0.1 mm.

Optionally, the circuit board structure for preventing the optical point from falling off further comprises a protection ring;

the protection ring surrounds the optical point metal layer, and an open area is formed between the protection ring and the optical point metal layer.

Optionally, the guard ring has a thickness of between 10 μm and 14 μm.

Optionally, the circuit board body includes a first raw copper layer, an insulating layer, and a second raw copper layer;

the first copper layer, the insulating layer and the second copper layer are sequentially stacked, and the blind holes are exposed out of the surface, close to the insulating layer, of the first copper layer.

Optionally, the inside of the blind hole is filled with the optical spot metal layer.

According to the embodiment of the utility model, the blind hole is formed, so that the metal layer of the optical point is connected with the inside of the blind hole, and the connecting force between the optical point and the circuit board is improved by utilizing the inner wall of the blind hole, thereby avoiding the phenomenon that the optical point is scraped off and falls off when the surface treatment process is performed.

Drawings

Fig. 1 is a schematic top view of a circuit board structure for preventing optical points from falling off according to an embodiment of the present utility model;

FIG. 2 is a schematic cross-sectional view of a circuit board structure for preventing optical dots from falling off according to an embodiment of the present utility model;

FIG. 3 is a schematic top view of a circuit board structure for preventing optical dots from falling off according to an embodiment of the present utility model;

FIG. 4 is a schematic top view of a circuit board structure for preventing optical dots from falling off according to an embodiment of the present utility model;

fig. 5 is a schematic cross-sectional view of a circuit board structure for preventing optical dots from falling off according to an embodiment of the utility model.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

After copper foil is formed by copper plating development and etching, when the copper foil is subjected to brush surface treatment process, the isolated optical points are easily scraped by the brush and fall off to cause bad phenomena because copper is not connected around the isolated optical points.

In view of the above, fig. 1 is a schematic top view of a circuit board structure for preventing optical dots from falling off, and fig. 2 is a schematic cross-sectional structure of a circuit board structure for preventing optical dots from falling off, referring to fig. 1 and 2, the circuit board includes: a circuit board body and an optical dot metal layer 120;

the circuit board body is provided with an optical point area 130, and at least one blind hole 110 is arranged in the optical point area 130; the optical dot metal layer 120 is disposed in the optical dot area 130, and a vertical projection of the optical dot metal layer 120 on the circuit board body covers the blind hole 110, wherein the optical dot metal layer 120 is in contact connection with an inner wall of the blind hole 110.

Specifically, the circuit board body may be a PCB circuit board, and exemplary, the circuit board may be a multi-layer board structure, which is not limited herein. The optical dot area 130 is defined according to the position where the circuit board needs to be positioned, and the front surface of the optical dot is formed by plating the optical dot metal layer 120 in the optical dot area 130. Before the optical spot surface is formed, at least one blind hole 110 is formed in the optical spot area 130 of the circuit board, wherein the size of the blind hole 110 can be the same as the size of the blind hole 110 used in other positions of the circuit board, so that the blind hole 110 can be finished synchronously without separately setting a blind hole 110 process in the processing, and the processing time is saved. The optical dot metal layer 120 is generated in the optical dot area 130, the optical dot metal layer 120 covers the blind hole 110, the optical dot metal layer 120 is a front copper plating layer of the optical dot, and the optical dot metal layer 120 can enter the blind hole 110 to be in contact connection with the inner wall of the blind hole 110 in the copper plating process, so that the adhesive force of the optical dot is increased. Illustratively, the blind hole 110 passes through the front copper layer 210 and the insulating layer 220 of the circuit board to reach the surface of the back copper layer 230, where the other surface of the back copper layer is in contact with the back copper layer 240, and the optical point metal layer 120 is in contact with the sides of the front copper layer 210, the insulating layer 220 and the back copper layer 230, so that the connection force of the optical point metal layer 120, that is, the optical point, can be increased, and the probability of dropping of the optical point in the processing of the circuit board is reduced. The number of the blind holes 110 in the optical spot area 130 is not limited, and the plurality of blind holes 110 can further improve the connection force of the optical spot metal layer 120, and further improve the anti-drop capability of the optical spot. According to the embodiment of the utility model, the blind hole is formed, so that the metal layer of the optical point is connected with the inside of the blind hole, and the connecting force between the optical point and the circuit board is improved by utilizing the inner wall of the blind hole, thereby avoiding the phenomenon that the optical point is scraped off and falls off when the surface treatment process is performed.

Optionally, the shape of the perpendicular projection of the optical dot metal layer 120 on the circuit board body is a circle or a regular polygon. Specifically, the optical point is used as an optical reference mark point, the optical point is moved to the coordinate of the target point through the CCD sensor camera, light is emitted, the reflective area and the shape are adhered, whether the optical point is at the corresponding position or not is calculated through signal conversion, and for the convenience of detection, the optical point is designed to be a regular polygon such as a circle, a square, a triangle and the like.

Fig. 3 is a schematic top view of a circuit board structure for preventing optical points from falling off according to an embodiment of the present utility model, referring to fig. 3, at least two blind holes 110 are disposed in an optical point area 130; the blind holes 110 are distributed symmetrically about the center of the optical spot metal layer 120.

Specifically, when the plurality of blind holes 110 are disposed in the optical dot area 130, the plurality of blind holes 110 are symmetrical with respect to the center position of the perpendicular projection of the optical dot metal layer 120 on the circuit board body in position because the optical dot metal layer 120 is in a regular pattern, so that the connection force of the optical dots can be uniformly distributed, and the anti-falling capability of brushing the optical dots in all directions can be improved. Illustratively, the number of the blind holes 110 is three, the blind holes 110 are symmetrical about the center position, and the distribution uniformity of the connecting force is improved.

With continued reference to FIG. 1, a blind hole 110 is provided in the optical spot area 130; the blind hole 110 coincides with the center position of the optical spot metal layer 120.

Specifically, when a blind hole 110 is disposed in the optical spot area 130, since the optical spot metal layer 120 is in a regular pattern, the blind hole 110 is disposed at a position overlapping the center position of the perpendicular projection of the optical spot metal layer 120 on the circuit board body, so that the stress at the joint of the optical spot and the blind hole 110 is uniform, the number of processing blind holes 110 is reduced, and the anti-falling capability is good.

Optionally, the optical spot metal layer 120 has a thickness between 10 μm and 14 μm. Specifically, the thickness of the optical dot metal layer 120 can be the same as the copper plating thickness in the circuit board processing and distributed between 10 μm and 14 μm, so that the preparation of the optical dot metal layer 120 can be synchronously completed in the circuit board copper plating processing process, the process steps are saved, and the production cost is reduced.

Alternatively, the blind hole 110 has a diameter of between 0.05-0.1 mm.

Fig. 4 is a schematic top view of a circuit board structure for preventing optical points from falling off, referring to fig. 4, and further includes a protection ring 410;

the guard ring 410 surrounds the optical dot metal layer 120, and an open area 411 is formed between the guard ring 410 and the optical dot metal layer 120.

Specifically, in the copper plating process of the circuit board, by arranging the protection ring 410 area on the selective plating negative film, when the optical point metal layer 120 is formed in the copper plating process of the circuit board, one protection ring 410 is simultaneously generated to surround the optical point metal layer 120, and optionally, the thickness of the protection ring 410 is between 10 μm and 14 μm, and the cleaning acting force on the optical point is further blocked by utilizing the protection ring 410 and the open area 411 between the protection ring 410 and the optical point metal layer 120, so that the acting force on the optical point by grinding is reduced, and the anti-falling capability is further improved.

With continued reference to fig. 2, the circuit board body includes a first raw copper layer, an insulating layer, and a second raw copper layer;

the first copper layer, the insulating layer and the second copper layer are sequentially stacked, and the blind holes 110 expose the surface of the first copper layer, which is close to the insulating layer.

Illustratively, the first copper layer is a back copper layer 230, the second copper layer is a front copper layer 210, and an insulating layer 220 is disposed between the first copper layer and the second copper layer, and the blind hole 110 passes through the front copper layer 210 and the insulating layer 220 of the circuit board to reach the surface of the back copper layer 230, and the optical point metal layer 120 is in contact connection with the surfaces of the front copper layer 210, the insulating layer 220 and the back copper layer 230, so as to increase the connection force of the optical point.

Fig. 5 is a schematic cross-sectional view of a circuit board structure for preventing optical dots from falling off according to an embodiment of the present utility model, referring to fig. 5, the inside of the blind via 110 is filled with an optical dot metal layer 120. Specifically, the blind hole 110 is filled with the optical spot metal layer 120, and the filling portion 510 in the blind hole 110 can improve the stability of the optical spot metal layer 120 when the optical spot is polished.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims (10)

1. A circuit board structure for preventing optical dots from falling off, comprising: a circuit board body and an optical dot metal layer;

the circuit board body is provided with an optical point area, and at least one blind hole is formed in the optical point area; the optical point metal layer is arranged in the optical point area, and the vertical projection of the optical point metal layer on the circuit board body covers the blind hole, wherein the optical point metal layer is in contact connection with the inner wall of the blind hole.

2. The circuit board structure for preventing optical dots from falling off according to claim 1, wherein the shape of the perpendicular projection of the optical dot metal layer on the circuit board body is a circle or a regular polygon.

3. The circuit board structure for preventing optical dots from falling off according to claim 2, wherein at least two blind holes are arranged in the optical dot region; the blind hole distribution is symmetrical about the center of the optical point metal layer.

4. The circuit board structure for preventing optical spot from falling off according to claim 2, wherein a blind hole is arranged in the optical spot area; the blind holes coincide with the center positions of the optical point metal layers.

5. The circuit board structure for preventing optical dot drop according to claim 1, wherein the thickness of the optical dot metal layer is between 10 μm and 14 μm.

6. The circuit board structure for preventing optical spot detachment according to claim 1, characterized in that the diameter of the blind hole is between 0.05-0.1 mm.

7. The circuit-board structure for preventing optical spot detachment according to any one of claims 1 to 6, further comprising a guard ring;

the protection ring surrounds the optical point metal layer, and an open area is formed between the protection ring and the optical point metal layer.

8. The circuit board structure for preventing optical spot detachment according to claim 7, characterized in that the guard ring has a thickness of between 10 μm and 14 μm.

9. The circuit board structure for preventing optical spot detachment according to claim 1, wherein the circuit board body comprises a first raw copper layer, an insulating layer and a second raw copper layer;

the first copper layer, the insulating layer and the second copper layer are sequentially stacked, and the blind holes are exposed out of the surface, close to the insulating layer, of the first copper layer.

10. The circuit board structure for preventing optical spot detachment according to claim 1, characterized in that the inside of the blind hole is filled with the optical spot metal layer.

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