CN219056959U

CN219056959U - Ceramic finger

Info

Publication number: CN219056959U
Application number: CN202222869335.XU
Authority: CN
Inventors: 程泽西; 王利; 莫科伟
Original assignee: Gmc Semitech Co ltd
Current assignee: Jimsi Semiconductor Technology (Wuxi) Co.,Ltd.
Priority date: 2022-10-28
Filing date: 2022-10-28
Publication date: 2023-05-23
Anticipated expiration: 2032-10-28

Abstract

The utility model relates to a finger for wafer transfer, in particular to a ceramic finger. The ceramic finger body is of a thin sheet structure and comprises a connecting part and a lifting part. The ceramic finger provided by the utility model is made of ceramic, so that particles are not easy to adhere, metal ions are not separated out, and the pollution to a wafer is small; the wafer is limited on the ceramic finger through the fixed groove, so that the wafer is prevented from moving, and meanwhile, the contact area with the wafer is reduced through the lower groove, so that the pollution to the wafer is reduced; interference with a supporting column for supporting a wafer on the equipment is avoided through the strip shape and the arranged open slot; meanwhile, the ceramic finger is high in hardness and not easy to deform, so that the thickness of the finger is greatly reduced; the ceramic finger is a brittle finger, so that the ceramic finger is easy to crush after collision, other equipment cannot be damaged, and core equipment is effectively protected.

Description

Ceramic finger

Technical Field

The utility model relates to a finger for wafer transfer, in particular to a ceramic finger.

Background

The existing wafer is transported and assembled by the fingers to lift the wafer, the fingers are mainly made of metal at present, the metal fingers are easy to adhere to tiny particles and can separate out metal ions, the particles and the metal ions can pollute the wafer, and meanwhile, the metal fingers are thicker and easy to interfere with other equipment in order to ensure the strength and prevent deformation.

Disclosure of Invention

In order to solve the problems, the utility model provides a ceramic finger which is not easy to adhere to particles and has no metal ion precipitation and small pollution to a wafer, and the specific technical scheme is as follows:

the ceramic finger comprises a ceramic finger body made of ceramic, wherein the ceramic finger body is of a sheet structure and comprises a connecting part and a lifting part.

Preferably, the lifting part is provided with a fixing groove, and the fixing groove is used for placing a wafer.

Wherein, the fixed slot is a circular slot.

Further, a lower groove is formed in the bottom of the fixing groove, and the lower groove is not in contact with the wafer.

Further, a connecting inclined plane is arranged between the lower groove and the fixed groove.

Preferably, the end of the lifting part is provided with an insertion arc surface.

Preferably, the lifting part is provided with an open slot, and the open slot is communicated with one end of the lifting part.

Preferably, side grooves are symmetrically formed in two sides of the lifting portion.

Further, a side arc surface is arranged between the side surface groove and the side surface of the lifting part.

Preferably, the connecting part is provided with a plurality of fixing holes and/or threaded holes.

Compared with the prior art, the utility model has the following beneficial effects:

the ceramic finger provided by the utility model is made of ceramic, so that particles are not easy to adhere, metal ions are not separated out, and the pollution to a wafer is small; the wafer is limited on the ceramic finger through the fixed groove, so that the wafer is prevented from moving, and meanwhile, the contact area with the wafer is reduced through the lower groove, so that the pollution to the wafer is reduced; interference with a supporting column for supporting a wafer on the equipment is avoided through the strip shape and the arranged open slot; meanwhile, the ceramic finger is high in hardness and not easy to deform, so that the thickness of the finger is greatly reduced; the ceramic finger is a brittle finger, so that the ceramic finger is easy to crush after collision, other equipment cannot be damaged, and core equipment is effectively protected.

Drawings

FIG. 1 is a schematic structural view of a ceramic finger;

FIG. 2 is a front view of a ceramic finger;

FIG. 3 is a side view of a ceramic finger;

fig. 4 is a rear view of a ceramic finger.

Detailed Description

The utility model will now be further described with reference to the accompanying drawings.

As shown in fig. 1 to 4, a ceramic finger includes a ceramic finger body made of ceramic, the ceramic finger body having a sheet structure, and the ceramic finger body includes a connection portion 1 and a lifting portion 2. The ceramic finger is made of alumina ceramic, has high hardness and is not easy to deform, the thickness can be reduced, the shape of a thin sheet can be made, and interference with other equipment can be effectively avoided. The ceramic finger is also wear-resistant, stable in performance and long in service life. The ceramic finger has smooth surface, is not easy to adhere to particles and is not easy to generate static electricity, so that the particles can be effectively prevented from being adsorbed by static electricity, the cleanliness of the surface is ensured, and the surface of a wafer is prevented from being polluted. The ceramic material is also a brittle material, and is easy to crush after collision, so that when the ceramic material collides with other equipment, ceramic fingers are directly crushed, other equipment is not easy to damage, and the maintenance cost of the equipment can be reduced.

The lifting part 2 is provided with a fixing groove 11, a lower groove 12, an inserting arc surface 15, an opening groove 13 and a side surface groove 14. The fixed slot 11 is a circular slot and is matched with a wafer, the wafer is placed in the fixed slot 11, the fixed slot 11 limits the wafer on a ceramic finger, the wafer is prevented from being smoothly discharged out of the ceramic finger, and the reliability and stability of conveying the wafer are improved. The lower groove 12 is arranged at the bottom of the fixed groove 11 and is not in contact with the wafer, so that the contact area with the wafer can be effectively reduced, and the pollution to the wafer is further reduced. The connecting inclined plane 16 is arranged between the lower groove 12 and the fixed groove 11, the connecting inclined plane 16 avoids stress concentration, the ceramic finger can be prevented from being broken from the connecting position between the lower groove 12 and the fixed groove 11, and the strength is improved. The tip of lifting portion 2 is equipped with inserts arc surface 15, and the front and the back of lifting portion 2 all are equipped with inserts arc surface 15, inserts arc surface 15 can effectively avoid scratching the surface of wafer. The open slot 13 is disposed at the end of the lifting portion 2 and penetrates through the fixing slot 11 and the lower groove 12 to avoid the supporting column on the device, so that the lifting portion 2 can completely enter under the wafer, and the wafer can be lifted from the lower side of the wafer conveniently. The side grooves 14 are symmetrically arranged on two sides of the lifting part 2, and the side grooves 14 can reduce the width of the lifting part 2 penetrating into the lower part of the wafer, so that interference with supporting columns of equipment is avoided. The support columns are generally provided with three support columns and are arranged in an annular array, the open grooves 13 are inserted in one support column, the whole lifting part 2 is located between the other two support columns, interference does not occur, and the lifting part 2 can be guaranteed to be capable of directly downwards Fang Tuoju the wafer. A side arc surface 17 is provided between the side surface groove 14 and the side surface of the lifting portion 2, and the side arc surface 17 can prevent stress concentration, prevent the lifting portion 2 from breaking, and improve reliability.

The connecting part 1 is provided with two rows of fixing holes 21 and two threaded holes 23, so that the connecting part can be conveniently connected with various devices, and the universality is improved.

The technical principle of the present utility model is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the utility model and should not be taken in any way as limiting the scope of the utility model. Other embodiments of the utility model will occur to those skilled in the art from consideration of the specification and practice of the utility model without the need for inventive faculty, and are within the scope of the claims.

Claims

1. The ceramic finger is characterized by comprising a ceramic finger body made of ceramic, wherein the ceramic finger body is of a sheet structure and comprises a connecting part (1) and a lifting part (2);

a fixing groove (11) is formed in the lifting part (2), and the fixing groove (11) is used for placing a wafer;

the bottom of the fixed groove (11) is provided with a lower groove (12), and the lower groove (12) is not contacted with the wafer.

2. A ceramic finger according to claim 1, characterized in that the fixing groove (11) is a circular groove.

3. A ceramic finger according to claim 1, characterized in that a connecting bevel (16) is provided between the lower groove (12) and the fixing groove (11).

4. A ceramic finger according to claim 1, characterized in that the end of the lifting part (2) is provided with an insertion circular arc surface (15).

5. A ceramic finger according to any one of claims 1 to 4, wherein the lifting part (2) is provided with an open slot (13), the open slot (13) communicating with one end of the lifting part (2).

6. A ceramic finger according to claim 5, characterized in that the lifting part (2) is symmetrically provided with side grooves (14) on both sides.

7. A ceramic finger according to claim 6, characterized in that a side arc surface (17) is provided between the side groove (14) and the side of the lifting part (2).

8. A ceramic finger according to any one of claims 1 to 4, wherein the connecting portion (1) is provided with a plurality of fixing holes (21) and/or threaded holes (23).