CN219418989U

CN219418989U - Wafer chuck structure compatible with various wafer breaking space-time offset

Info

Publication number: CN219418989U
Application number: CN202320160900.7U
Authority: CN
Inventors: 王旭东
Original assignee: Zibo Lvnengxinchuang Electronic Technology Co ltd
Current assignee: Zibo Lvnengxinchuang Electronic Technology Co ltd
Priority date: 2023-02-01
Filing date: 2023-02-01
Publication date: 2023-07-25
Anticipated expiration: 2033-02-01

Abstract

The utility model provides a wafer sucker structure compatible with various wafer space-time offset, comprising: a wafer chuck and a positioning block; the wafer sucker is provided with a plurality of positioning blocks, and the positioning blocks are distributed along the same round circumference. The special positioning block structure is added to the wafer placement edge, so that the problem that when multiple types of wafer material sheets are used, the wafer sucker breaks the air for compressed air, and the wafer of the material sheets is blown off and deflected due to inconsistent weight is solved.

Description

Wafer chuck structure compatible with various wafer breaking space-time offset

Technical Field

The utility model relates to the field of wafer chuck structures, in particular to a wafer chuck structure compatible with various wafer space-time offsets.

Background

Silicon carbide wafer factories can use silicon carbide and silicon two kinds of material wafers simultaneously, because the material is different, and unidimensional wafer weight is inconsistent, when breaking the empty absorption after the wafer sucking disc adsorbs the wafer, because broken empty CDA (compressed air) tolerance is certain, great offset (silicon carbide wafer is lighter than silicon wafer with the size with the weight) can appear in the broken empty time of wafer that weight is little for wafer offset collision wafer box produces the piece risk when the manipulator gets the piece.

Disclosure of Invention

Aiming at the defects in the prior art, the utility model aims to provide a wafer sucking disc structure compatible with various wafer breaking space-time offsets.

The wafer sucker structure compatible with various wafer space-time offset comprises: a wafer chuck and a positioning block;

the wafer sucker is provided with a plurality of positioning blocks, and the positioning blocks are distributed along the same round circumference.

Preferably, the positioning block is composed of a cylinder and two inclined cones, wherein one side end face of the cylinder is arranged on the wafer sucker, and the other side end face of the cylinder is connected with the two inclined cones.

Preferably, the bottom surfaces of the two inclined cones are connected with the end surface of the cylinder, and a gap is arranged between the top ends of the two inclined cones.

Preferably, the inclined cone is arranged to be a smooth conical curved surface facing away from the outer side of the other inclined cone.

Preferably, the wafer is placed in a circular area surrounded by a plurality of positioning blocks, and the outer side of the wafer is tangent to the positioning blocks.

Preferably, the positioning blocks are uniformly distributed along the circumferential side of the wafer, and the conical curved surface of any oblique cone of the positioning blocks faces the direction of the wafer.

Preferably, the wafer chuck is provided with a plurality of mounting holes which are circularly arranged along different diameters, and the positioning block selects the mounting holes corresponding to the circular diameter positions according to the diameters of the wafers to be mounted on the wafer chuck.

Compared with the prior art, the utility model has the following beneficial effects:

the special positioning block structure is added to the wafer placement edge, so that the problem that when multiple types of wafer material sheets are used, the wafer sucker breaks the air for compressed air, and the wafer of the material sheets is blown off and deflected due to inconsistent weight is solved.

Drawings

Other features, objects and advantages of the present utility model will become more apparent upon reading of the detailed description of non-limiting embodiments, given with reference to the accompanying drawings in which:

FIG. 1 is a schematic view of a wafer chuck;

FIG. 2 is a front view of the positioning block;

FIG. 3 is a side view of a locating block;

FIG. 4 is a top view of the positioning block;

the figure shows:

Detailed Description

The present utility model will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the present utility model, but are not intended to limit the utility model in any way. It should be noted that variations and modifications could be made by those skilled in the art without departing from the inventive concept. These are all within the scope of the present utility model.

As shown in fig. 1, the present embodiment includes: a wafer chuck 2 and a positioning block 3; the wafer sucker 2 is provided with a plurality of positioning blocks 3, and the positioning blocks 3 are uniformly distributed along the same circular circumference. The wafer 1 is placed in a circular area surrounded by a plurality of positioning blocks 3, and the outer side of the wafer 1 is tangent to the positioning blocks 3. The wafer chuck 2 is provided with a plurality of mounting holes which are circularly arranged along different diameters, and the positioning block 3 is arranged on the wafer chuck 2 according to the mounting holes of the diameter of the wafer 1, which correspond to the circular diameter.

As shown in fig. 2 to 4, the positioning block 3 is composed of a cylinder and two inclined cones, wherein one end face of the cylinder is installed on the wafer chuck 2, and the other end face of the cylinder is connected with the two inclined cones. The bottom surfaces of the two inclined cones are connected with the end surface of the cylinder, a gap is arranged between the top ends of the two inclined cones, the outer sides of the inclined cones back to the other inclined cone are smooth conical curved surfaces, and the conical curved surface of any inclined cone of the positioning block 3 faces the direction of the wafer 1.

The conical curved surface of the oblique cone of the positioning block 3 is aligned with the edge of the wafer 1 and is fixed on the wafer sucker 2. The positioning block 3 is composed of a cylinder and two inclined cones, the wafer 1 can be clamped at the position where the wafer sucker 2 is placed by the cylinder structure, no offset occurs, the conical structure can enable the silicon carbide wafer 1 to smoothly fall to a determined position when being blown off in the process of breaking the space, a deformed buffer space can be reserved for the positioning block 3, atmospheric pressure is reserved between the two conical structures under the condition of long-time use, and large deformation of a conical curved surface cannot influence use.

In the description of the present application, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements being referred to must have a specific orientation, be configured and operated in a specific orientation, and are not to be construed as limiting the present application.

The foregoing describes specific embodiments of the present utility model. It is to be understood that the utility model is not limited to the particular embodiments described above, and that various changes or modifications may be made by those skilled in the art within the scope of the appended claims without affecting the spirit of the utility model. The embodiments of the present application and features in the embodiments may be combined with each other arbitrarily without conflict.

Claims

1. A wafer chuck structure compatible with multiple wafer break space-time offsets, comprising: a wafer sucker (2) and a positioning block (3);

the wafer sucking disc (2) is provided with a plurality of positioning blocks (3), and the positioning blocks (3) are distributed along the same round circumference.

2. The wafer chuck structure compatible with multiple wafer break space-time offsets of claim 1, wherein: the positioning block (3) consists of a cylinder and two inclined cones, wherein one side end face of the cylinder is arranged on the wafer sucker (2), and the other side end face of the cylinder is connected with the two inclined cones.

3. The wafer chuck structure compatible with multiple wafer break space-time offsets of claim 2, wherein: the bottom surfaces of the two inclined cones are connected with the end surface of the cylinder, and a gap is arranged between the top ends of the two inclined cones.

4. The wafer chuck structure compatible with multiple wafer break space-time offsets of claim 2, wherein: the outer side of the inclined cone, which is opposite to the other inclined cone, is provided with a smooth conical curved surface.

5. The wafer chuck structure compatible with multiple wafer break space-time offsets of claim 4, wherein: the wafer (1) is placed in a circular area surrounded by the positioning blocks (3), and the outer side of the wafer (1) is tangent to the positioning blocks (3).

6. The wafer chuck structure compatible with multiple wafer break space-time offsets of claim 5, wherein: the positioning blocks (3) are uniformly distributed along the periphery of the wafer (1).

7. The wafer chuck structure compatible with multiple wafer break space-time offsets of claim 5, wherein: the wafer sucking disc (2) is provided with a plurality of mounting holes which are distributed along circles with different diameters, and the positioning block (3) is installed on the wafer sucking disc (2) according to the mounting holes with the diameters corresponding to the circular diameters of the wafer (1).

8. The wafer chuck structure compatible with multiple wafer break space-time offsets of claim 5, wherein: the conical curved surface of any oblique cone of the positioning block (3) faces the direction of the wafer (1).