CN219203115U - LED wafer bearing disc storage device - Google Patents
LED wafer bearing disc storage device Download PDFInfo
- Publication number
- CN219203115U CN219203115U CN202223165494.8U CN202223165494U CN219203115U CN 219203115 U CN219203115 U CN 219203115U CN 202223165494 U CN202223165494 U CN 202223165494U CN 219203115 U CN219203115 U CN 219203115U
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- grooves
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- base
- upper cover
- bearing disc
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- 238000003860 storage Methods 0.000 title claims abstract description 17
- 238000005192 partition Methods 0.000 claims abstract description 30
- 238000005096 rolling process Methods 0.000 claims description 8
- 238000005530 etching Methods 0.000 abstract description 18
- 239000002245 particle Substances 0.000 abstract description 17
- 238000000034 method Methods 0.000 abstract description 10
- 239000000428 dust Substances 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 238000002360 preparation method Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 15
- 230000000694 effects Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
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Abstract
The utility model relates to the field of semiconductor preparation, in particular to an LED wafer bearing disc storage device, which comprises a base and a bearing disc, wherein a plurality of bearing disc grooves are formed in the base along the height direction of the base, and the bearing disc is placed in the bearing disc grooves; a partition plate for separating the two tray carrying grooves is arranged between the adjacent tray carrying grooves, two sides of the base corresponding to the partition plate are provided with plate grooves, and two sides of the partition plate are inserted into the plate grooves; the plurality of carrier disc grooves arranged in the base are used as placement positions of the carrier discs, so that the plurality of carrier discs can be uniformly sent into etching equipment without being placed one by one, and the processing waiting time of the equipment is reduced; meanwhile, the partition plate between the tray carrying grooves is used for separating the tray carrying grooves, so that the phenomenon that the particles on the back side of the upper tray are stained with particles on the front side of the lower tray is avoided, and meanwhile, the partition plate and the plate grooves are inserted, so that the partition plate can be timely detached and cleaned after being used, and dust particles are prevented from being stained, and the etching process is prevented from being influenced.
Description
Technical Field
The utility model relates to the field of semiconductor preparation, in particular to an LED wafer bearing disc storage device.
Background
ICP etching is an indispensable procedure in the processing of semiconductor chips, and the basic principle is that a mask with a specific pattern is firstly processed and formed on the surface of a semiconductor material, then etching gas is controlled by ICP equipment to etch away the places without the mask, and finally the specific pattern is left. Generally, during etching, a wafer source to be etched is arranged in a wafer carrying disc at a wafer loading operation table, and is transferred into an equipment cavity after the wafer source to be etched is arranged, and etching operation is started after all the 5-disc sources are transferred. In the loading process of the 5-disc source, the equipment is in a waiting state, and the production efficiency is affected. And if the carrying disc with the upper piece is placed on the table top, particles are carried into the back surface of the carrying disc of the wafer in the etching process, and the etching effect is also affected.
Disclosure of Invention
The technical problems to be solved by the utility model are as follows: an LED wafer carrier disk storage device is provided that is capable of transferring multiple carrier disks at a time while avoiding particulate matter from being carried over onto the carrier disks.
In order to solve the technical problems, the utility model adopts the following technical scheme: the LED wafer bearing disc storage device comprises a base and a bearing disc, wherein a plurality of bearing disc grooves are formed in the base along the height direction of the base, and the bearing disc is placed in the bearing disc grooves; a partition plate for separating the two tray carrying grooves is arranged between the adjacent tray carrying grooves, plate grooves are formed in the base at two sides of the partition plate, and two sides of the partition plate are inserted into the plate grooves.
Further, two sides of the tray groove are protruded with placing seats, and rolling shafts are arranged in the placing seats; the two sides of the bearing plate are abutted on the rolling shaft.
Further, the base comprises a bottom plate, an upper cover, side plates and a back plate, wherein the upper cover is opposite to the bottom plate, and two sides of the upper cover are connected with two sides of the bottom plate through the side plates; the backboard is perpendicular to the side plates and is connected with the upper cover and the bottom plate.
Further, a buffer strip is arranged on the backboard along the height direction of the backboard.
Further, one side of the upper cover facing the bottom plate is provided with a plurality of upper cover posts arranged along the outline of the upper cover posts; the upper ends of the side plates and the back plate are provided with a plurality of jacks which are matched with the upper cover column.
Further, the side surface of the base is provided with a label corresponding to each tray groove.
The utility model has the beneficial effects that: the plurality of carrier disc grooves arranged in the base are used as placement positions of the carrier discs, so that the plurality of carrier discs can be uniformly sent into etching equipment without being placed one by one, and the processing waiting time of the equipment is reduced; meanwhile, the partition plate between the tray carrying grooves is used for separating the tray carrying grooves, so that the phenomenon that the particles on the back side of the upper tray are stained with particles on the front side of the lower tray is avoided, and meanwhile, the partition plate and the plate grooves are inserted, so that the partition plate can be timely detached and cleaned after being used, and dust particles are prevented from being stained, and the etching process is prevented from being influenced.
Drawings
FIG. 1 is a schematic diagram of an LED wafer carrier storage device according to an embodiment of the present utility model;
fig. 2 is a top view of an LED wafer carrier storage device according to an embodiment of the present utility model with an upper cover removed.
Description of the reference numerals:
1. a base; 11. a tray slot; 12. a partition plate; 13. a plate groove; 14. a placement seat; 15. a roller; 16. a bottom plate; 17. an upper cover; 171. a top cap post; 18. a side plate; 181. a jack; 19. a back plate; 191. a buffer strip;
2. a carrying tray; 3. and (3) a label.
Detailed Description
In order to describe the technical contents, the achieved objects and effects of the present utility model in detail, the following description will be made with reference to the embodiments in conjunction with the accompanying drawings.
Referring to fig. 1 and 2, a storage device for an LED wafer carrier 2 includes a base 1, wherein a plurality of carrier grooves 11 are provided in the base 1 along a height direction thereof, and the carrier grooves 11 are provided with the carrier 2; a partition plate 12 for separating the two tray grooves 11 is arranged between the adjacent tray grooves 11, two sides of the base 1 corresponding to the partition plate 12 are provided with plate grooves 13, and two sides of the partition plate 12 are inserted into the plate grooves 13.
From the above description, the beneficial effects of the utility model are as follows: the plurality of carrier plate grooves 11 arranged in the base 1 are used as placement positions of the carrier plates 2, so that the plurality of carrier plates 2 can be uniformly fed into etching equipment without being placed one by one, and the equipment processing waiting time is reduced; meanwhile, the partition plates 12 between the carrying disc grooves 11 are used for separating the carrying disc grooves 11, so that the phenomenon that particles and pollutants on the back side of the upper carrying disc 2 fall into the front side of the lower carrying disc 2 is avoided, and meanwhile, the partition plates and the plate grooves 13 are inserted, so that the partition plates can be timely detached and cleaned after being used, and dust particles are prevented from being polluted, and the etching process is influenced.
Further, two sides of the tray groove 11 are protruded with a placing seat 14, and a rolling shaft 15 is arranged in the placing seat 14; the two sides of the bearing plate 2 are abutted against the rolling shafts 15.
As can be seen from the above description, the middle part of the carrying tray 2 is suspended by the arrangement of the placement seats 14 at both sides to reduce the contact area, so as to avoid the frequent placement and friction with the base 1 to generate foreign matters such as particles; by the cooperation design of the two sides of the bearing plate 2 and the rolling shafts 15, the friction between the bearing plate 2 and the base 1 during taking and placing is reduced, and abrasion and particles generated by hard friction on the back of the bearing plate 2 are avoided.
Further, the base 1 comprises a bottom plate 16, an upper cover 17, side plates 18 and a back plate 19, wherein the upper cover 17 is opposite to the bottom plate 16, and two sides of the upper cover 17 are connected with two sides of the bottom plate 16 through the side plates 18; the back plate 19 is perpendicular to the side plates 18, and the back plate 19 connects the upper cover 17 and the bottom plate 16.
As is apparent from the above description, the base 1 is composed of the bottom plate 16, the upper cover 17, the side plate 18 and the back plate 19, and the plurality of tray grooves 11 are formed by dividing the space between the side plate 18 and the back plate 19 by the upper cover 17 and the plurality of partition plates 12; wherein the side opposite to the back plate 19 is not closed, and is the picking and placing side of the carrying tray 2.
Further, the back plate 19 is provided with a buffer strip 191 along the height direction thereof.
As can be seen from the above description, the buffer strips 191 provided on the back plate 19 enable the loaded carrier plate 2 to abut against the buffer strips 191 to avoid damage caused by direct impact with the back plate 19.
Further, the side of the upper cover 17 facing the bottom plate 16 is provided with a plurality of upper cover posts 171 arranged along the outline thereof; the upper ends of the side plate 18 and the back plate 19 are provided with a plurality of jacks 181 corresponding to the upper cover posts 171.
As can be seen from the above description, the upper cover 17 can be conveniently detached for cleaning and replacement by the cooperation of the upper cover posts 171 of the upper cover 17 with the insertion holes 181 of the side plates 18 and the back plate 19.
Further, the side surface of the base 1 is provided with a label 3 corresponding to each tray groove 11.
As can be seen from the above description, the identification of the different tray slots 11 is facilitated by the placement of the labels 3 on the base 1.
Referring to fig. 1 and 2, a first embodiment of the present utility model is:
the application scene of the utility model is as follows: in the conventional ICP etching procedure, the carrying discs 2 of 5 carrying sheet sources are required to be sequentially sent into the equipment cavity; the existing placement mode of the carrying disc 2 is directly placed on a table top, so that particles are easy to be stained, the etching effect is affected when the particles are fed into the equipment cavity for etching, and longer equipment waiting time can be generated when the particles are sequentially fed into the carrying disc 2, so that the remaining efficiency is affected.
As shown in fig. 1 and 2, the storage device of the LED wafer carrier 2 in this embodiment includes a base 1 and a carrier 2, where the base 1 includes a bottom plate 16, an upper cover 17, a side plate 18, a back plate 19, and a plurality of partitions 12, the upper cover 17 is opposite to the bottom plate 16, and two sides of the upper cover 17 are connected to two sides of the bottom plate 16 through the side plate 18; the backboard 19 is perpendicular to the side boards 18, the backboard 19 is connected with the upper cover 17 and the bottom board 16, and the backboard 19 is provided with a buffer strip 191 along the height direction.
As shown in fig. 1, the side of the upper cover 17 facing the bottom plate 16 is provided with a plurality of upper cover posts 171 arranged along the outline thereof; the upper ends of the side plate 18 and the back plate 19 are provided with a plurality of jacks 181 corresponding to the upper cover posts 171.
The side plate 18 is provided with a plurality of plate grooves 13 along the height direction thereof, and the two sides of the partition plate 12 are inserted into the plate grooves 13.
In the height direction of the base 1, the space surrounded by the side plate 18 and the back plate 19 is divided into a plurality of tray grooves 11 by the upper cover 17 and the plurality of partition plates 12 from top to bottom.
As shown in fig. 2, two sides of the tray groove 11 are protruded with a placement seat 14, and a plurality of rollers 15 are arranged in the placement seat 14; the two sides of the bearing plate 2 are abutted on the rolling shafts 15, and a plurality of grooves for placing LED wafers are formed in the bearing plate 2.
Specifically, the height of the bearing plate 2 is 10mm, the slot spacing of the bearing plate slots 11 is 50mm, and the bearing plate has higher capacity and is convenient to assemble and disassemble the bearing plate 2.
The side surface of the base 1 is provided with a label 3 corresponding to each tray groove 11.
The working principle of the utility model is as follows: when the bearing plate 2 is assembled, the plurality of bearing plates 2 are pushed into the corresponding bearing plate grooves 11 according to the sequence of the labels 3 on the side plates 18 of the base 1, the friction amount is small and the pushing is smooth in the pushing process due to the arrangement of the rolling shafts 15 propped against the two sides of the bearing plate 2 in the pushing process, then the bearing plate 2 is propped against the buffer strips 191 on the back plate 19 of the base 1, and then the assembly of the plurality of bearing plates 2 is sequentially completed. Compared with the traditional mode that the carrying plates 2 are placed into etching equipment one by one, the dust falling into the base 1 can be reduced, the carrying plates can be uniformly placed, and the waiting time of the equipment is reduced.
When the base 1 needs to be cleaned, the upper cover 17 can be detached by releasing the cooperation of the upper cover column 171 and the insertion hole 181, and then the partition plate 12 can be pulled out of the plate groove 13, so that deep cleaning can be performed.
In summary, according to the storage device for the LED wafer carrier disc provided by the utility model, the plurality of carrier disc grooves arranged in the base are used as the placement positions of the carrier discs, so that the plurality of carrier discs can be uniformly sent into etching equipment without being placed one by one, and the waiting time of equipment processing is reduced; meanwhile, the partition plate between the tray carrying grooves is used for separating the tray carrying grooves, so that the phenomenon that the particles on the back side of the upper tray are stained with particles on the front side of the lower tray is avoided, and meanwhile, the partition plate and the plate grooves are inserted, so that the partition plate can be timely detached and cleaned after being used, and dust particles are prevented from being stained, and the etching process is prevented from being influenced.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent changes made by the specification and drawings of the present utility model, or direct or indirect application in the relevant art, are included in the scope of the present utility model.
Claims (6)
1. The LED wafer bearing disc storage device is characterized by comprising a base and a bearing disc, wherein a plurality of bearing disc grooves are formed in the base along the height direction of the base, and the bearing disc is placed in the bearing disc grooves; a partition plate for separating the two tray carrying grooves is arranged between the adjacent tray carrying grooves, plate grooves are formed in the base at two sides of the partition plate, and two sides of the partition plate are inserted into the plate grooves.
2. The LED wafer carrier disk storage device of claim 1, wherein two sides of said carrier disk slot are raised with placement seats having rollers therein; the two sides of the bearing plate are abutted on the rolling shaft.
3. The LED wafer carrier disk storage device of claim 1, wherein the base comprises a bottom plate, an upper cover, side plates, and a back plate, the upper cover being opposite the bottom plate, both sides of the upper cover being connected to both sides of the bottom plate by the side plates; the backboard is perpendicular to the side plates and is connected with the upper cover and the bottom plate.
4. The LED wafer carrier disk storage device of claim 3, wherein said back plate has a bumper strip disposed thereon along its height.
5. The LED wafer carrier disk storage device of claim 3, wherein said upper cover has a plurality of upper cover posts disposed along a contour thereof on a side thereof facing the bottom plate; the upper ends of the side plates and the back plate are provided with a plurality of jacks which are matched with the upper cover column.
6. The LED wafer carrier disk storage device of claim 1, wherein the base side is provided with a label corresponding to each carrier slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223165494.8U CN219203115U (en) | 2022-11-28 | 2022-11-28 | LED wafer bearing disc storage device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223165494.8U CN219203115U (en) | 2022-11-28 | 2022-11-28 | LED wafer bearing disc storage device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219203115U true CN219203115U (en) | 2023-06-16 |
Family
ID=86713104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223165494.8U Active CN219203115U (en) | 2022-11-28 | 2022-11-28 | LED wafer bearing disc storage device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219203115U (en) |
-
2022
- 2022-11-28 CN CN202223165494.8U patent/CN219203115U/en active Active
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