CN220155508U - Placement rack for wafer electrophoresis - Google Patents
Placement rack for wafer electrophoresis Download PDFInfo
- Publication number
- CN220155508U CN220155508U CN202321713276.5U CN202321713276U CN220155508U CN 220155508 U CN220155508 U CN 220155508U CN 202321713276 U CN202321713276 U CN 202321713276U CN 220155508 U CN220155508 U CN 220155508U
- Authority
- CN
- China
- Prior art keywords
- frame
- wafer
- bearing frame
- electrophoresis
- bearing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001962 electrophoresis Methods 0.000 title claims abstract description 22
- 235000012431 wafers Nutrition 0.000 claims abstract description 38
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 238000013016 damping Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
A carrier for wafer electrophoresis, comprising: a supporting frame and a bearing frame. The support frame length direction both ends are equipped with a plurality of bracing pieces, bear the frame and wear to locate on the bracing piece, bear the frame and be equipped with a plurality of bearing frames along its length direction, bear the frame inboard along its length direction and be equipped with a plurality of draw-in grooves for bear the wafer. The support rod is provided with a baffle ring, the baffle ring is positioned above the bearing frame, the support rod is sleeved with two springs, and the springs are respectively positioned at the upper side and the lower side of the bearing frame and are always in a compressed state; the upper part of the bearing frame is provided with a bracket, a plurality of rows of electrode plates are arranged on the bracket along the width direction of the bracket, each row of electrode plates is provided with a plurality of electrode plates, and two adjacent electrode plates are connected with each other and used for being contacted with the side surface of the wafer, wherein the electrode plates at the two ends are connected with a connecting sheet, and the connecting sheet is electrically connected with an external circuit. More wafers can be placed, the electrophoresis efficiency is improved, a damping effect is provided, and the wafers are prevented from being broken due to hard contact.
Description
Technical Field
The utility model relates to the technical field of semiconductor device production, in particular to a placement frame for wafer electrophoresis.
Background
In the prior art, a layer of glass powder is generally adhered to the surface of a wafer by three methods, namely a knife coating method, a photoresist method and an electrophoresis method, wherein the operation is the simplest, namely the electrophoresis method, an acetone glass powder solution is placed in an electrophoresis tank, a frame carrying the wafer is only required to be placed in the electrophoresis tank, but in the actual production process, in order to ensure that the glass powder can be smoothly adhered to the wafer, the wafers are required to be arranged at a relatively large distance on the frame, and only one row of wafers can be placed on the frame, so that the number of wafers for each electrophoresis is small, the production efficiency is not improved, and the wafers are in hard contact with the frame after being placed on the frame, and are easy to collide when being transferred, so that the wafers are cracked.
Disclosure of Invention
In order to overcome the defects of the related prior art, the utility model provides the placement frame for wafer electrophoresis, which can be used for placing more wafers, improving the electrophoresis efficiency, providing a damping effect, avoiding the breakage of the wafers due to hard contact, and has strong practicability.
In order to achieve the above object, the present utility model adopts the following technique:
a carrier for wafer electrophoresis, comprising: a supporting frame and a bearing frame.
The support frame length direction both ends are equipped with a plurality of bracing pieces, bear the frame and wear to locate on the bracing piece, bear the frame and be equipped with a plurality of bearing frames along its length direction, bear the frame inboard along its length direction and be equipped with a plurality of draw-in grooves for bear the wafer.
Further, the supporting rod is provided with a baffle ring, the baffle ring is positioned above the bearing frame, the supporting rod is sleeved with two springs, the springs are respectively positioned on the upper side and the lower side of the bearing frame and are always in a compressed state, two ends of the spring positioned above are respectively connected with the baffle ring and the bearing frame, and two ends of the spring positioned below are respectively connected with the bearing frame and the supporting frame.
Further, a support is arranged above the bearing frame, a plurality of rows of electrode plates are arranged on the support along the width direction of the support, each row of electrode plates is provided with a plurality of electrode plates, two adjacent electrode plates are connected with each other and used for being in contact with the side face of the wafer, the electrode plates at the two ends are connected with a connecting sheet, and the connecting sheet is electrically connected with an external circuit.
Further, the upper end of the supporting rod is connected to a connecting frame, and a handle is arranged on the connecting frame.
Further, the clamping groove is arc-shaped.
Further, the support frame is also provided with a guide rod, and the bearing frame and the support are all arranged on the guide rod in a penetrating way.
The utility model has the beneficial effects that:
more wafers can be placed by arranging a plurality of bearing frames, so that the electrophoresis efficiency is improved; and the springs provide damping effect for the carrier, so that the wafer is prevented from being broken due to hard contact.
Drawings
The drawings described herein are for illustration of selected embodiments only and not all possible implementations, and are not intended to limit the scope of the utility model.
Fig. 1 is a schematic perspective view of an overall structure according to an embodiment of the present utility model.
Fig. 2 is an enlarged schematic view at a of fig. 1.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the following detailed description of the embodiments of the present utility model will be given with reference to the accompanying drawings, but the described embodiments of the present utility model are some, but not all embodiments of the present utility model.
As shown in fig. 1-2, this example provides a placement frame for wafer electrophoresis, including: a supporting frame 100 and a bearing frame 200.
The two ends of the support frame 100 in the length direction are provided with a plurality of support rods 101, the bearing frame 200 is arranged on the support rods 101 in a penetrating manner, the bearing frame 200 is provided with a plurality of bearing frames 201 along the length direction, and the inner sides of the bearing frames 201 are provided with a plurality of clamping grooves 202 along the length direction for bearing wafers.
Specifically, the supporting rod 101 is provided with the baffle ring 102, the baffle ring 102 is located above the bearing frame 200, the supporting rod 101 is sleeved with two springs 103, the springs 103 are respectively located on the upper side and the lower side of the bearing frame 200 and are always in a compressed state, two ends of the spring 103 located above are respectively connected with the baffle ring 102 and the bearing frame 200, two ends of the spring 103 located below are respectively connected with the bearing frame 200 and the supporting frame 100, when the supporting frame 100 is placed on a tabletop, the springs 103 provide a buffer effect, and the impact of the tabletop to the supporting frame 100 is avoided to cause the wafer to be broken.
Specifically, a support 203 is disposed above the carrier 200, a plurality of electrode plates 204 are disposed on the support 203 along the width direction thereof, each row of electrode plates 204 is provided with a plurality of electrode plates, and two adjacent electrode plates 204 are connected with each other for contacting with the side surface of the wafer, wherein the electrode plates 204 at two ends are connected with a connecting sheet 205, and the connecting sheet 205 is electrically connected with an external circuit, so that the acetone glass powder solution in the electrophoresis cell moves, and a layer of glass powder is attached to the surface of the wafer.
Specifically, the upper end of the supporting rod 101 is connected to a connecting frame 104, and a handle is provided on the connecting frame 104 to facilitate grabbing the supporting frame 100.
Specifically, the clamping groove 202 is arc-shaped, and can be better attached to the side surface of the wafer, so that the wafer is clamped in the clamping groove 202 more firmly.
Specifically, the support frame 100 is further provided with a guide rod 105, and the bearing frame 200 and the support 203 are respectively arranged on the guide rod 105 in a penetrating manner, so that the movement of the bearing frame 200 is guided and limited, and the shaking of the bearing frame 200 is reduced.
The above is only a preferred embodiment of the present utility model and is not intended to limit the present utility model, and it is obvious that those skilled in the art can make various modifications and variations to the present utility model without departing from the spirit and scope of the present utility model. Thus, it is intended that the present utility model also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (6)
1. The utility model provides a rack for wafer electrophoresis which characterized in that includes:
a plurality of support rods (101) are arranged at two ends of the support frame (100) in the length direction,
the bearing frame (200) is arranged on the supporting rod (101) in a penetrating mode, a plurality of bearing frames (201) are arranged on the bearing frame (200) along the length direction of the bearing frame, and a plurality of clamping grooves (202) are formed in the inner side of the bearing frame (201) along the length direction of the bearing frame and used for bearing wafers.
2. The placement frame for wafer electrophoresis according to claim 1, wherein a baffle ring (102) is arranged on the supporting rod (101), the baffle ring (102) is located above the bearing frame (200), two springs (103) are sleeved on the supporting rod (101), the springs (103) are respectively located on the upper side and the lower side of the bearing frame (200) and are always in a compressed state, two ends of the spring (103) located above are respectively connected with the baffle ring (102) and the bearing frame (200), and two ends of the spring (103) located below are respectively connected with the bearing frame (200) and the supporting frame (100).
3. The carrier for wafer electrophoresis according to claim 1, wherein a support (203) is provided above the carrier (200), a plurality of rows of electrode pads (204) are provided on the support (203) along a width direction thereof, each row of electrode pads (204) is plural, and two adjacent electrode pads (204) are connected to each other for contacting with a wafer side, wherein the electrode pads (204) at two ends are connected to a connecting piece (205), and the connecting piece (205) is electrically connected to an external circuit.
4. The placement frame for wafer electrophoresis according to claim 1, wherein the upper end of the supporting rod (101) is connected to a connecting frame (104), and a handle is arranged on the connecting frame (104).
5. The wafer electrophoresis rack according to claim 1, wherein the clamping groove (202) is arc-shaped.
6. A wafer electrophoresis rack according to claim 3 wherein the support frame (100) is further provided with a guide bar (105), and the carrier (200) and the support frame (203) are both disposed on the guide bar (105) in a penetrating manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321713276.5U CN220155508U (en) | 2023-07-03 | 2023-07-03 | Placement rack for wafer electrophoresis |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321713276.5U CN220155508U (en) | 2023-07-03 | 2023-07-03 | Placement rack for wafer electrophoresis |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220155508U true CN220155508U (en) | 2023-12-08 |
Family
ID=89017550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321713276.5U Active CN220155508U (en) | 2023-07-03 | 2023-07-03 | Placement rack for wafer electrophoresis |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220155508U (en) |
-
2023
- 2023-07-03 CN CN202321713276.5U patent/CN220155508U/en active Active
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |