CN219042084U - Printed wiring board - Google Patents

Printed wiring board Download PDF

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Publication number
CN219042084U
CN219042084U CN202223406841.1U CN202223406841U CN219042084U CN 219042084 U CN219042084 U CN 219042084U CN 202223406841 U CN202223406841 U CN 202223406841U CN 219042084 U CN219042084 U CN 219042084U
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CN
China
Prior art keywords
substrate
reinforcing plate
inner reinforcing
printed wiring
holes
Prior art date
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Active
Application number
CN202223406841.1U
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Chinese (zh)
Inventor
曾繁赟
凌志强
黄朝安
崔会娟
杨卫东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meizhou Hangding Technology Co ltd
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Meizhou Hangding Technology Co ltd
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Priority to CN202223406841.1U priority Critical patent/CN219042084U/en
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Publication of CN219042084U publication Critical patent/CN219042084U/en
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Abstract

The utility model discloses a printed wiring board, which comprises a board body, wherein the board body consists of an upper substrate, an inner reinforcing plate and a lower substrate, wherein: a cavity groove is formed at the opposite surface of the inner side of the upper substrate and the lower substrate, an inner reinforcing plate is placed in the cavity groove, connecting parts are formed at the end surfaces of the two ends of the inner reinforcing plate, the connecting parts penetrate through the cavity groove to the outer parts of the upper substrate and the lower substrate, elastic sheets are arranged at the upper end surface and the lower end surface of the inner reinforcing plate, a gap is formed between the elastic sheets and the inner wall of the cavity groove, and through holes are uniformly formed in the surface of the inner reinforcing plate; the integrated substrate is divided into a multi-layer combined structure, and the deformation resistance and the impact resistance of the whole substrate can be improved on the premise of ensuring normal use, so that the situation that the substrate is broken is avoided, the rated value of the bending capacity of the substrate is greatly improved, the integrated structure is simple, and the service performance of the printed circuit board is improved more quickly compared with a new material research and development mode.

Description

Printed wiring board
Technical Field
The utility model belongs to the technical field of circuit boards, and particularly relates to a printed circuit board.
Background
A printed circuit board, also known as a printed circuit board, is a provider of electrical connections for electronic components; printed circuit boards are commonly referred to as "PCBs" and cannot be referred to as "PCBs"; the design of the printed circuit board is mainly layout design; the main advantages of the circuit board are greatly reduced wiring and assembly errors, and improved automation level and production labor rate.
The existing printed circuit board may malfunction due to mechanical stress or physical stress in use, and when the board is subjected to vibration or repeated impact, if the rated value of bending capability is exceeded, the board may break, and the existing conventional processing mode is realized by changing the material of the circuit board, but the mode has higher cost and long early development period, and meanwhile, in the scene that the substrate of the circuit board is mature, the space for improving the performance of the circuit board is smaller by improving the material, so that there is room for improvement.
Disclosure of Invention
The utility model aims to provide a printed circuit board to solve the problems that the prior circuit board provided in the background art is poor in deformation resistance and easy to break to influence use.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a printed wiring board, includes the plate body, the plate body comprises upper base plate, interior reinforcing plate and lower base plate, wherein:
the inner opposite surfaces of the upper substrate and the lower substrate are provided with cavity grooves, the inner reinforcing plate is placed in the cavity grooves, the end surfaces of the two ends of the inner reinforcing plate are provided with connecting parts, and the connecting parts penetrate through the cavity grooves to the outer parts of the upper substrate and the lower substrate.
Preferably, elastic sheets are arranged at the upper end face and the lower end face of the inner reinforcing plate, and gaps exist between the elastic sheets and the inner walls of the cavity grooves.
Preferably, through holes are uniformly formed in the surface of the inner reinforcing plate, and radiating holes are uniformly formed in the lower substrate and coincide with vertical projections of the through holes.
Preferably, the cross sections of the through holes and the radiating holes are in a regular polygon structure.
Preferably, the connecting part is a connecting strip, a hole for the connecting strip to penetrate is formed in the end faces of the upper substrate and the lower substrate, a placing groove communicated with the hole is further formed in the end face of the lower substrate, and the connecting strip is embedded into the inner side of the placing groove through bending.
Preferably, a double-sided adhesive tape is further arranged on the inner side of the placement groove, and the double-sided adhesive tape is in adhesive connection with the connecting strip.
Preferably, an electronic element is further mounted on the top of the upper substrate, and a resistor is further mounted on the upper substrate.
Compared with the prior art, the utility model has the beneficial effects that:
the integrated substrate is divided into a multi-layer combined structure, and the deformation resistance and the impact resistance of the whole substrate can be improved on the premise of ensuring normal use, so that the situation that the substrate is broken is avoided, the rated value of the bending capacity of the substrate is greatly improved, the integrated structure is simple, and the service performance of the printed circuit board is improved more quickly compared with a new material research and development mode.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a top view of the inner reinforcement plate of the present utility model;
fig. 3 is an end schematic view of the lower substrate of the present utility model.
In the figure: 100. a plate body; 101. an upper substrate; 101a, electronic components; 102. an inner reinforcing plate; 102a, connecting strips; 102b, through holes; 102c, an elastic sheet; 103. a lower substrate; 103a, a placement groove; 103b, heat dissipation holes; 103c, double faced adhesive tape.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1 to 3, the present utility model provides a technical solution: the utility model provides a printed wiring board, includes plate body 100, and plate body 100 comprises upper base plate 101, interior reinforcing plate 102 and lower base plate 103 combination from top to bottom in proper order, replaces current integral type base plate structure, wherein:
a cavity is formed at the opposite side of the inner sides of the upper substrate 101 and the lower substrate 103, and the inner reinforcing plate 102 is placed in the cavity, and connecting parts for limiting the installation of the inner reinforcing plate 102 are formed at the end surfaces of the two ends of the inner reinforcing plate 102, and penetrate through the cavity to the outer parts of the upper substrate 101 and the lower substrate 103.
In this embodiment, preferably, the upper and lower end surfaces of the inner reinforcing plate 102 are provided with elastic pieces 102c, the elastic pieces 102c are made of silica gel, a gap exists between the elastic pieces 102c and the inner wall of the cavity, when the upper substrate 101 or the lower substrate 103 is bent under vibration protection, deformation occurs on the elastic pieces themselves, after the deformation degree is greater than the gap, the elastic pieces 102c are contacted with the inner reinforcing plate 102, and finally, the deformation preventing capability is improved through the inner reinforcing plate 102.
In this embodiment, preferably, the surface of the inner reinforcing plate 102 is equidistantly spaced from the surface of the lower substrate 103 and provided with through holes 102b, and the cross sections of the through holes 102b and the through holes 103b are equal, so that in use, the through holes 102b and the through holes 103b are in regular hexagonal structure to form a similar honeycomb structure, and the overall strength is higher.
In this embodiment, preferably, the connection portion is a connection bar 102a, a bar-shaped hole through which the connection bar 102a penetrates is formed at the end faces of the upper substrate 101 and the lower substrate 103, a placement groove 103a is formed at the end face of the lower substrate 103, during installation, the connection sleeve 102a penetrates out of the placement groove 103a, the connection bar 102a is embedded into the inner side of the placement groove 103a through bending, so that limit installation of the inner reinforcing plate 102 is completed, a double faced adhesive tape 103c is adhered to the inner side of the placement groove 103a, and the double faced adhesive tape 103c is adhered to the connection bar 102a, so that stability is improved.
In this embodiment, preferably, the electronic component 101a is further mounted on the top of the upper substrate 101, and the resistor is further mounted on the upper substrate 101 as an output structure.
Although embodiments of the present utility model have been shown and described in detail with reference to the foregoing detailed description, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations may be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. A printed wiring board comprising a board body (100), characterized in that: the plate body (100) is composed of an upper substrate (101), an inner reinforcing plate (102) and a lower substrate (103), wherein:
the inner opposite surfaces of the upper substrate (101) and the lower substrate (103) are provided with cavity grooves, the inner reinforcing plate (102) is placed in the cavity grooves, and connecting parts are formed on the end surfaces of the two ends of the inner reinforcing plate (102) and penetrate through the cavity grooves to the outer parts of the upper substrate (101) and the lower substrate (103).
2. A printed wiring board according to claim 1, wherein: elastic pieces (102 c) are arranged at the upper end face and the lower end face of the inner reinforcing plate (102), and gaps exist between the elastic pieces (102 c) and the inner walls of the cavity grooves.
3. A printed wiring board according to claim 2, wherein: through holes (102 b) are uniformly formed in the surface of the inner reinforcing plate (102), radiating holes (103 b) are uniformly formed in the lower substrate (103), and the radiating holes (103 b) are overlapped with the vertical projection of the through holes (102 b).
4. A printed wiring board according to claim 3, wherein: the cross sections of the through holes (102 b) and the radiating holes (103 b) are of regular polygon structures.
5. A printed wiring board according to claim 1, wherein: the connecting part is a connecting strip (102 a), holes for the connecting strip (102 a) to penetrate are formed in the end faces of the upper substrate (101) and the lower substrate (103), a placing groove (103 a) communicated with the holes is further formed in the end face of the lower substrate (103), and the connecting strip (102 a) is embedded into the inner side of the placing groove (103 a) through bending.
6. A printed wiring board according to claim 5, wherein: the inner side of the placing groove (103 a) is also provided with a double faced adhesive tape (103 c), and the double faced adhesive tape (103 c) is in adhesive connection with the connecting strip (102 a).
7. A printed wiring board according to claim 1, wherein: an electronic element (101 a) is further mounted on the top of the upper substrate (101), and a resistor is further mounted on the upper substrate (101).
CN202223406841.1U 2022-12-20 2022-12-20 Printed wiring board Active CN219042084U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223406841.1U CN219042084U (en) 2022-12-20 2022-12-20 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223406841.1U CN219042084U (en) 2022-12-20 2022-12-20 Printed wiring board

Publications (1)

Publication Number Publication Date
CN219042084U true CN219042084U (en) 2023-05-16

Family

ID=86287751

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202223406841.1U Active CN219042084U (en) 2022-12-20 2022-12-20 Printed wiring board

Country Status (1)

Country Link
CN (1) CN219042084U (en)

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