CN219017585U - Wafer test system - Google Patents

Abstract

The application discloses a wafer test system. The wafer test system comprises an upper and lower material loading device, a baking device, a transfer device and a plurality of test devices, wherein the upper and lower material loading device can be used for loading the wafers for the plurality of test devices, and after the test devices complete the detection of the wafers and the marking of ink points, the detected wafers are transferred into the accommodating grooves of the second material boxes of the upper and lower material loading devices so as to realize the separation placement of the wafers. The loading and unloading device transfers marked wafers to the transfer device, the transfer device transfers the second material box to the baking cavity device to bake the wafers, and after ink points are dried, the subsequent stacking and placing of each wafer can be realized, so that the space utilization rate is improved. Compared with the mode that a baking tray is compounded on a testing device in the related art, the wafer testing system of the application is used for intensively drying the wafers marked by the ink points, the testing device can continue testing the next wafer without waiting for the completion of drying the wafers, and the testing procedure of the wafers is more compact and the efficiency is higher.

Description

Wafer test system

Technical Field

The utility model relates to the technical field of wafer detection, in particular to a wafer testing system.

Background

In the step of wafer detection, ink dot marking is performed on the wafer with the defect, so that the wafer after detection needs to be placed at intervals in order to avoid the ink dots which are not dried being smeared on other wafers. In the related art, through being provided with the baking tray at the wafer detection device and carrying out the ink dot stoving to the wafer after single detection is accomplished to the stack that realizes between the wafer is placed, makes the quantity of the wafer that can deposit in the unit space improve. However, a baking tray needs a certain time for drying wafers, the single wafers are dried one by one to influence the production takt, the production efficiency of the wafers is further influenced, the floor area of the wafer detection device is increased due to the arrangement of the baking tray, and the arrangement and layout of other devices such as the wafer detection device and the transfer device are not facilitated. Therefore, it is necessary to solve the above problems.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, the utility model provides a wafer test system which can improve the production efficiency of wafers.

The utility model also provides a wafer testing system with the wafer testing device.

According to an embodiment of the utility model, a wafer test system includes:

the testing device comprises a wafer detection assembly and a marking assembly, wherein the wafer detection assembly is used for detecting a wafer, and the marking assembly is used for marking ink points of defects of the wafer;

the baking device is provided with a baking cavity and is used for baking ink marks on the wafer, and the baking device and the testing device are sequentially arranged along a first direction;

the feeding and discharging device comprises a first main body, a feeding assembly, a discharging assembly, a first material box and a second material box, wherein the first main body can move along a first direction, the feeding assembly, the discharging assembly, the first material box and the second material box are respectively arranged on the first main body, the first material box is used for placing undetected wafers, and the feeding assembly is used for transferring the wafers in the first material box to the testing device; the second material box is provided with a plurality of containing grooves which are arranged at intervals, and the blanking component is used for transferring the wafers after the ink points are marked into the containing grooves;

and the transferring device is used for transferring the second material box into the baking cavity.

The wafer testing system provided by the embodiment of the utility model has at least the following beneficial effects: through last unloader, can carry out the wafer material loading for a plurality of testing arrangement to after testing arrangement accomplishes the detection and the black spot mark of wafer, with the wafer transfer that detects the completion to the storage tank of second magazine in, with the realization to the separation of wafer place. After the feeding and discharging assembly finishes collecting the wafers marked by the ink points, the wafers move to the transfer device along the first direction, the transfer device transfers the second material box into the baking cavity to bake the wafers, and after the ink points are dried, the subsequent stacking and placing of the wafers can be realized, so that the space utilization rate is improved. Compared with the mode that a baking tray is compounded on a testing device in the related art, the wafer testing system of the embodiment of the application is used for intensively drying the wafers marked by the ink points, the testing device can continue testing the next wafer without waiting for the completion of drying the wafers, and the testing procedure of the wafers is more compact and the efficiency is higher. And the staff only need carry out the material loading to first magazine, can realize the feed supplement to a plurality of testing arrangement, and the feed supplement is convenient and fast more. When the wafers after drying are stored in a lamination mode, the wafers are more concentrated during subsequent transferring due to the fact that the plurality of wafers are dried along with the whole second material box, transferring efficiency of the wafers is improved, and production efficiency is further improved.

According to some embodiments of the utility model, the blanking assembly comprises a first driver and a supporting tray, the supporting tray comprises a supporting portion and a connecting portion which are connected with each other, the supporting portion is used for carrying wafers, the connecting portion is connected with the first driver, the first driver is used for driving the supporting tray to perform telescopic movement, at least part of the supporting portion can extend into the second material box, the feeding and blanking device further comprises a second driver, the second driver is mounted on the first main body, and the second driver is used for driving the second material box to move along the vertical direction.

According to some embodiments of the utility model, the loading and unloading device further comprises a limiting rod, the limiting rod is fixed on the first main body, the limiting rod extends along the vertical direction, the limiting rod is arranged between the second material box and the connecting part, and the limiting rod is used for limiting the movement of the wafer which is separated from the accommodating groove.

According to some embodiments of the utility model, the wafer inspection assembly includes a first carrier for carrying the wafer, and the test apparatus further includes a lift assembly for lifting the wafer on the first carrier; the blanking assembly further comprises a third driver, the third driver is connected with the bearing plate, the third driver is used for driving the bearing plate to rotate in a rotating mode, the bearing plate is provided with a first avoiding groove, and the first avoiding groove is used for avoiding the jacking assembly.

According to some embodiments of the utility model, the feeding and discharging device further comprises a second driver, wherein the second driver comprises a second main body and a driving rod which are connected with each other, the second main body is installed on the first main body, and the driving rod is used for propping against the second material box and driving the second material box to move along the vertical direction; the transfer device comprises a fixing frame and a bearing platform, wherein the bearing platform is connected to the fixing frame and used for bearing the second material box, the bearing platform is provided with a second avoidance groove, the feeding and discharging device can move to the driving rod enters the second avoidance groove, and the driving rod can move in the second avoidance groove along the vertical direction.

According to some embodiments of the utility model, the baking device is provided with a feeding hole communicated with the baking cavity, the feeding hole is arranged opposite to the second avoiding groove in the vertical direction, the transferring device further comprises a fourth driver, the fourth driver is installed on the fixing frame, and the fourth driver is used for driving the second material box to be close to or far away from the baking device in the vertical direction.

According to some embodiments of the utility model, the transfer device further includes a fifth driver, the fifth driver is mounted on the fixing frame, the fifth driver is connected with the bearing platform, the fifth driver is used for driving the bearing platform to rotate, the bearing platform is provided with a plurality of second avoidance grooves, and each second avoidance groove is distributed along the rotation direction of the bearing platform.

According to some embodiments of the present utility model, the transfer device is provided with a feeding level, a baking level, a cooling level and a discharging level, and the feeding level, the baking level, the cooling level and the discharging level are sequentially arranged along the rotation direction of the bearing platform, and the second avoidance groove can be respectively rotated to the positions of the feeding level, the baking level, the cooling level and the discharging level.

According to some embodiments of the utility model, the transfer device further comprises a sixth driver mounted to the fixed frame, the sixth driver being configured to drive the second cartridge of the outfeed station to move in a vertical direction; the bottom of second magazine is provided with the third and dodges the groove, the wafer test system still includes discharging device, discharging device includes seventh driver, eighth driver, third main part, third magazine and conveyer belt, seventh driver install in the mount, the third main part with seventh driver is connected, seventh driver is used for order about the third main part is close to or keeps away from go out the material level, eighth driver install in the third main part, eighth driver with the third magazine is connected, eighth driver is used for order about the third magazine is along vertical direction motion, the conveyer belt install in the third main part, the third magazine set up in the one end of conveyer belt, the other end of conveyer belt can be along vertical direction in the third is dodged the inslot and is moved, the conveyer belt is used for with the wafer in the second magazine of ejection of compact position department is conveyed to in the third magazine.

According to some embodiments of the utility model, the wafer test system further comprises a rail extending along the first direction, the first body further being provided with a guide block slidably connected to the rail.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The utility model is further described with reference to the accompanying drawings and examples, in which:

FIG. 1 is a schematic diagram of a wafer inspection system according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram of a loading and unloading device according to an embodiment of the present utility model;

FIG. 3 is a schematic diagram of a testing apparatus according to an embodiment of the present utility model;

FIG. 4 is a schematic view of the first stage and lift assembly of FIG. 3;

FIG. 5 is a schematic diagram of a portion of a wafer inspection system according to an embodiment of the present utility model;

FIG. 6 is a schematic view of the transfer device and the discharge device of FIG. 5;

fig. 7 is a schematic view of the transfer device and the discharging device in fig. 6 from another view.

Reference numerals:

wafer test system 100, wafer 110;

the wafer test device 200, the wafer detection assembly 210, the first bearing table 211, the marking assembly 220 and the jacking assembly 230;

the feeding and discharging device 300, a first main body 310, a guide block 311, a feeding assembly 320, a discharging assembly 330, a first driver 331, a bearing disc 332, a bearing part 333, a connecting part 334, a first avoiding groove 335, a third driver 336, a first material box 340, a second material box 350, a containing groove 351, a third avoiding groove 352, a second driver 360, a second main body 361, a driving rod 362 and a limiting rod 370;

the transfer device 400, the fixing frame 410, the bearing platform 420, the second avoiding groove 421, the fourth driver 430, the fifth driver 440, the sixth driver 450, the feeding position 460, the baking position 470, the cooling position 480 and the discharging position 490;

a discharging device 500, a seventh driver 510, an eighth driver 520, a third main body 530, a third cartridge 540, and a conveyor belt 550;

a baking device 600 and a feeding port 610;

a guide rail 700.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

In the description of the present utility model, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present utility model and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.

In the description of the present utility model, the meaning of a number is one or more, the meaning of a number is two or more, and greater than, less than, exceeding, etc. are understood to exclude the present number, and the meaning of a number is understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present utility model, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present utility model can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.

In the description of the present utility model, the descriptions of the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The wafer test system according to the embodiments of the present application is described below with reference to the drawings. It should be noted that, fig. 7 conceals the fixing frame 410 for clarity of the structure, and fig. 3 conceals a part of the housing of the test apparatus 200 for clarity of the structure. A portion of the second body 361 and the drive lever 362 are simply illustrated by dashed lines in fig. 2.

Referring to fig. 1 to 7, a wafer testing system 100 according to an embodiment of the present utility model includes a loading and unloading device 300, a baking device 600, a transferring device 400, and a plurality of testing devices 200, wherein each testing device 200 is arranged along a first direction. The bake apparatus 600 has a bake chamber for baking ink on the wafer 110, and the bake apparatus 600 and the test apparatus 200 are sequentially arranged in the first direction. The test apparatus 200 includes a wafer inspection assembly 210 and a marking assembly 220, wherein the wafer inspection assembly 210 is used for inspecting the wafer 110, and the marking assembly 220 is used for marking ink points of defects of the wafer 110. The loading and unloading device 300 comprises a first main body 310, a loading assembly 320, a unloading assembly 330, a first material box 340 and a second material box 350, wherein the first main body 310 can move along a first direction, the loading assembly 320, the unloading assembly 330, the first material box 340 and the second material box 350 are respectively installed on the first main body 310, the first material box 340 is used for placing an undetected wafer 110, and the loading assembly 320 is used for transferring the wafer 110 in the first material box 340 to the testing device 200. The second magazine 350 is provided with a plurality of accommodating grooves 351 arranged at intervals, and the blanking assembly 330 is used for transferring the wafer 110 after the ink dot marking is completed into the accommodating grooves 351. The transfer device 400 is used to transfer the second cartridge 350 into a baking chamber (not shown). Through the loading and unloading device 300, the wafer 110 can be loaded for a plurality of testing devices 200, and after the testing devices 200 complete the detection and the ink dot marking of the wafer 110, the detected wafer 110 is transferred into the accommodating groove 351 of the second material box 350, so as to realize the separation placement of the wafer 110. After the loading and unloading assembly 330 finishes collecting the wafers 110 marked by the ink dots, the wafers move to the transfer device 400 along the first direction, the transfer device 400 transfers the second material box 350 into the baking cavity to bake the wafers, and after the ink dots are dried, the subsequent stacking and placing of each wafer 110 can be realized, so that the space utilization rate is improved.

Compared with the mode of compounding the bake plate on the test device 200 in the related art, the test device 200 of the wafer test system 100 of the embodiment of the application occupies a smaller space, facilitates the transfer and assembly of the test device 200, and facilitates the arrangement and position layout of a plurality of test devices 200. In addition, the wafer testing system 100 of the embodiment of the present application centrally dries the wafers 110 after the ink dots are marked, the testing device 200 can continue testing the next wafer 110 without waiting for the completion of drying the wafers 110, and the testing procedure of the wafers 110 is more compact and has higher efficiency. And the staff only need go on the material loading to first magazine 340, can realize the feed supplement to a plurality of testing arrangement 200, and the feed supplement is convenient and fast more. When the dried wafers 110 are stacked and stored later, the wafers 110 are more concentrated during subsequent transfer due to the fact that the plurality of wafers 110 are dried along with the whole second material box 350, and transfer efficiency of the wafers 110 is improved, and production efficiency is further improved.

Specifically, referring to fig. 3, the wafer inspection assembly 210 is selected as a wafer inspection instrument as is conventional in the art, the marking assembly 220 is selected as a dot marking robot as is conventional in the art, and the wafer inspection assembly 210 and the marking assembly 220 are respectively mounted on the body of the inspection apparatus. The wafer detecting assembly 210 includes a first carrying table 211, where the first carrying table 211 is used to carry the wafer 110, and in some embodiments, the first carrying table 211 can move relative to the machine body, so as to move to a suitable position to facilitate the loading and unloading device 300 to load and unload the wafer 110, so that possible interference is reduced. The baking apparatus 600 is selected to be a conventional oven in the art.

In the loading and unloading device 300, the first main body 310 can realize the movement of the loading and unloading device 300 in a wheel transmission or caterpillar transmission mode and the like, in order to guide the movement direction of the first main body 310, the wafer testing system 100 is further provided with a guide rail 700, the guide rail 700 extends along the first direction, the first main body 310 is provided with a guide block 311, the guide block 311 is in sliding connection with the guide rail 700, the movement direction of the first main body 310 can be guided through the cooperation of the guide block 311 and the guide rail 700, the distance between the guide rail 700 and each testing device 200 and each transferring device 400 is controlled, and the distance between the first main body 310 and each testing device 200 and each transferring device 400 is controlled, so that the positioning difficulty when the wafer 110 is picked up or placed by the loading assembly 320 and the unloading assembly 330 is reduced. The loading assembly 320 and the unloading assembly 330 may each be selected from vacuum chuck robots or jaw robots as is conventional in the art. The transfer device 400 can be selected as a transfer robot, a conveyor 550, or a combination of a transfer robot and a conveyor 550, as is conventional in the art, to effect transfer of the second cassette 350 loaded with wafers 110 into the bake chamber for baking.

The specific test flow of the wafer test system 100 is as follows: the loading and unloading device 300 moves to the corresponding testing device 200, the loading assembly 320 transfers the wafer 110 in the first material box 340 to the bearing table of the wafer detecting assembly 210, the wafer detecting assembly 210 detects the wafer 110, and the marking assembly 220 marks the detected wafer 110 with ink dots. After loading of one testing device 200 is completed, the loading and unloading device 300 moves to the next testing device 200 to load, so that the detection beat is more compact, and the efficiency is improved. After the wafer 110 is marked, the blanking assembly 330 transfers the marked wafer 110 into the second magazine 350 for placement. When the wafers 110 of the second material box 350 are loaded to a certain number, the loading and unloading device 300 moves to the transferring device 400, the transferring device 400 transfers the second material box 350 and the wafers 110 therein to the baking cavity for baking, and the baked wafers 110 can be stacked and placed subsequently.

When the blanking assembly 330 places the wafer 110 in the second material box 350, the wafer 110 needs to be inserted into the accommodating groove 351 along a certain direction, and when the wafer 110 is blanked by using the vacuum chuck manipulator or the clamping jaw manipulator, the structure of the vacuum chuck manipulator and the clamping jaw manipulator is complex, the volume is large, and interference with the second material box 350 or other components of the loading and blanking assembly 330 is easy to occur. In order to solve the above problems, the present application also provides an improvement. Referring to fig. 2, the blanking assembly 330 includes a first driver 331 and a supporting plate 332, the supporting plate 332 includes a supporting portion 333 and a connecting portion 334 connected to each other, the supporting portion 333 is used for carrying the wafer 110, the connecting portion 334 is connected to the first driver 331, the first driver 331 is used for driving the supporting plate 332 to perform telescopic motion, at least a portion of the supporting portion 333 can extend into the second magazine 350, the feeding and blanking device 300 further includes a second driver 360, the second driver 360 is mounted on the first body 310, and the second driver 360 is used for driving the second magazine 350 to move in a vertical direction.

The bottom of the wafer 110 is supported by the supporting portion 333 and extends into the second material box 350 under the driving of the first driver 331, so that the wafer 110 can be inserted into the corresponding accommodating groove 351 following the movement of the supporting tray 332, and after the wafer 110 is inserted into the accommodating groove 351, the second driver 360 drives the second material box 350 to move upwards in the vertical direction, so that the wafer 110 abuts against the groove wall of the accommodating groove 351 and is separated from the supporting of the supporting tray 332, and the supporting tray 332 contracts under the driving of the first driver 331 and is separated from the second material box 350, so that the next unloading operation of the wafer 110 is performed. Because the tray 332 only needs to support the wafer 110 at the bottom of the wafer 110, the volume of the tray 332 is smaller than that of the vacuum chuck manipulator and the clamping jaw manipulator, so that interference with the second material box 350 can be effectively reduced, and the vacuum chuck manipulator or the clamping jaw manipulator can place the wafer 110 on the tray 332 in an empty space outside the second material box 350.

Specifically, the first driver 331 and the second driver 360 can be selected as a linear driving motor or a linear driving cylinder, which are conventional in the art. The vertical direction refers to a direction perpendicular to the horizontal plane.

Further, referring to fig. 2, in order to reduce the probability that the wafer 110 is separated from the accommodating groove 351, the loading and unloading device 300 further includes a limiting rod 370, the limiting rod 370 is fixed to the first body 310, the limiting rod 370 extends along a vertical direction, the limiting rod 370 is disposed between the second magazine 350 and the connecting portion 334, and the limiting rod 370 is used for limiting the movement of the wafer 110 separated from the accommodating groove 351. When the second magazine 350 is driven by the second driver 360 to move along the vertical direction, the relative positions of the limiting rod 370 and the second magazine 350 are also continuously changed, and when the wafer 110 is inserted into the accommodating groove 351, the second driver 360 drives the second magazine 350 to move upwards in the vertical direction until the limiting rod 370 shields the notch of the accommodating groove 351, so that when the wafer 110 moves away from the accommodating groove 351, the limiting rod 370 abuts against the wafer 110, and the probability of the wafer 110 being separated from the accommodating groove 351 is reduced. And, since the limit lever 370 shields only the accommodating groove 351 in which the wafer 110 is inserted at the upper portion of the second magazine 350, the loading operation of the accommodating groove 351 in which the wafer 110 is not loaded at the lower portion of the second magazine 350 is not affected.

As an improvement of the above-mentioned aspect, referring to fig. 3 and 4, the wafer inspection assembly 210 includes a first carrying table 211, where the first carrying table 211 is used to carry the wafer 110, and the test apparatus 200 further includes a lifting assembly 230, where the lifting assembly 230 is used to lift the wafer 110 on the first carrying table 211; the blanking assembly 330 further comprises a third driver 336, the third driver 336 is connected to the support plate 332, the third driver 336 is configured to drive the support plate 332 to rotate, the support plate 332 is provided with a first avoiding groove 335, and the first avoiding groove 335 is configured to avoid the jacking assembly 230.

After the wafer is detected, the lifting assembly 230 lifts the wafer 110, so that the bottom of the wafer 110 has a larger moving space, the supporting portion 333 is driven by the third driver 336 to rotate until the connection line between the supporting portion 333 and the first carrying table 211 is in the driving direction of the first driver 331, the supporting portion 333 extends into the bottom of the wafer 110 under the driving of the first driver 331, the lifting assembly 230 retracts to release the supporting of the wafer 110, and the wafer 110 falls onto the supporting portion 333. The supporting part 333 is retracted under the driving of the first driver 331 and rotated to align with the second magazine 350 under the driving of the third driver 336, and then the wafer 110 is inserted into the accommodating groove 351 under the driving of the first driver 331, so as to complete the material taking and discharging operations of the wafer 110. Through setting up jacking subassembly 230 and jack-up to wafer 110 to set up the rotation of third driver 336 drive tray 332, make tray 332 can realize getting the material operation to wafer 110, need not additionally set up other manipulators such as vacuum chuck manipulator and get the material to wafer 110, reduced the quantity of manipulator, and reduced the cost of wafer test system 100.

Specifically, the third driver 336 can be selected as a rotary motor or rotary cylinder as is conventional in the art.

Referring to fig. 2, according to some embodiments of the present utility model, the feeding and discharging device 300 further includes a second driver 360, the second driver 360 includes a second body 361 and a driving rod 362, the second body 361 is mounted on the first body 310, and the driving rod 362 is used for abutting against the second cartridge 350 and driving the second cartridge 350 to move in a vertical direction. The transfer device 400 comprises a fixing frame 410 and a bearing platform 420, the bearing platform 420 is connected to the fixing frame 410, the bearing platform 420 is used for bearing the second material box 350, the bearing platform 420 is provided with a second avoidance groove 421, the feeding and discharging device 300 can move to the driving rod 362 to enter the second avoidance groove 421, and the driving rod 362 can move in the second avoidance groove 421 along the vertical direction. After the driving rod 362 enters the second avoidance groove 421 along with the movement of the feeding and discharging device 300, the second main body 361 drives the driving rod 362 to shrink, so that the second material box 350 moves downwards along with the driving rod 362 in the vertical direction, when the second material box 350 moves to the bottom to be propped against the bearing platform 420, the second material box 350 loses the propping with the driving rod 362 to stay on the bearing platform 420, and therefore the transfer of the second material box 350 from the feeding and discharging device 300 to the transferring device 400 is realized, the transfer method is simple and high in efficiency, and a mechanical arm is not required to be additionally arranged for transferring the second material box 350.

Further, in order to reduce the probability that the second material box 350 is separated from the driving rod 362 or the bearing platform 420, the second material box 350 can be provided with a positioning hole extending along the vertical direction, the driving rod 362 and the bearing platform 420 can be correspondingly provided with a positioning block, and the positioning block is inserted into the positioning hole, so that the relative movement between the second material box 350 and the driving rod 362 or the bearing platform 420 is limited, and the transportation stability of the second material box 350 is improved.

As an improvement of the above-mentioned solution, referring to fig. 1, the baking device 600 has a feed port 610 connected to the baking chamber, the feed port 610 is shown by a dotted line in fig. 1, the feed port 610 is disposed opposite to the second avoiding groove 421 in the vertical direction, the transferring device 400 further includes a fourth driver 430, the fourth driver 430 is mounted on the fixing frame 410, and the fourth driver 430 is used for driving the second magazine 350 to approach or depart from the baking device 600 in the vertical direction. The fourth driver 430 drives the second material box 350 to move along the vertical direction, so that after the second material box 350 is transferred to the bearing platform 420, the ink is driven by the fourth driver 430 to enter the baking cavity from the material inlet 610 to finish the ink drying operation, the vertical three-dimensional space is reasonably utilized to set the position of the baking device 600, and the space utilization rate is improved. In particular, the fourth driver 430 can be selected as a linear drive motor or a linear drive cylinder as is conventional in the art.

As another improvement of the above solution, referring to fig. 5 to 7, the transferring device 400 further includes a fifth driver 440, where the fifth driver 440 is mounted on the fixing frame 410, the fifth driver 440 is connected to the carrying platform 420, the fifth driver 440 is used for driving the carrying platform 420 to rotate, the carrying platform 420 is provided with a plurality of second avoidance grooves 421, and each second avoidance groove 421 is distributed along the rotation direction of the carrying platform 420. Through setting up a plurality of second dodging grooves 421 for bearing platform 420 has a plurality of stations to bear a plurality of second magazine 350, thereby improve single bearing platform 420's bearing capacity, and conveniently to the circulation of second magazine 350, for example, in some embodiments, testing arrangement 200's test efficiency is higher, need be provided with a plurality of baking equipment 600 and dry the wafer 110 in a plurality of second magazine 350, can buffer a plurality of second magazine 350 through bearing platform 420 that is provided with a plurality of second dodging grooves 421, and rotate second magazine 350 to the great position of operating space, so that transfer manipulator or other transfer device 400 are to second magazine 350 transport to baking equipment 600 in, reduce the interference that probably takes place in the transportation process.

Further, referring to fig. 6, the transferring device 400 is provided with a feeding position 460, a baking position 470, a cooling position 480 and a discharging position 490, and along the rotation direction of the carrying platform 420, the feeding position 460, the baking position 470, the cooling position 480 and the discharging position 490 are sequentially arranged, and the second avoiding groove 421 can be respectively rotated to the positions of the feeding position 460, the baking position 470, the cooling position 480 and the discharging position 490. After the second magazine 350 of the loading and unloading device 300 is transferred to the position of the loading platform 420 corresponding to the feeding position 460, the second magazine 350 located at the feeding position 460 moves to the baking position 470 along with the rotation of the loading platform 420, and the second magazine 350 located at the baking position 470 is transferred to the baking device 600 for drying ink marks. The dried second material box 350 returns to the position of the bearing platform 420 corresponding to the baking position 470, and moves to the cooling position 480 along with the rotation of the bearing platform 420, so that natural heat dissipation is performed in the process of baking at the baking position 470 and waiting for feeding at the feeding position 460, and the probability of affecting the treatment of the wafer 110 due to heat accumulation is reduced. After the wafer 110 is cooled, the wafer 110 is moved to the discharging position 490 along with the rotation of the carrying platform 420, so as to stack and discharge the wafer 110. The arrangement of the feeding position 460, the baking position 470, the cooling position 480 and the discharging position 490 enables the wafer 110 to smoothly flow on the bearing platform 420, the beats of each process are compact, and the production efficiency of the wafer 110 is improved.

Specifically, the fifth driver 440 can be selected as a rotary motor or rotary cylinder as is conventional in the art.

In some embodiments, a fourth driver 430 is disposed at a corresponding position of the baking position 470, and the fourth driver 430 drives the second magazine 350 into the baking device 600 in the vertical direction for baking, and drives the second magazine 350 back to the baking position 470 after baking is completed, so as to move to the cooling position 480 along with the rotation of the carrying platform 420.

In order to improve the efficiency of stacking and discharging the wafers 110, the embodiment of the present application further provides an improvement, referring to fig. 5 to 7, the transferring device 400 further includes a sixth driver 450, where the sixth driver 450 is installed on the fixing frame 410, and the sixth driver 450 is used to drive the second magazine 350 of the discharging material level 490 to move in the vertical direction; the bottom of the second material box 350 is provided with a third avoiding groove 352, the wafer test system 100 further comprises a discharging device 500, the discharging device 500 comprises a seventh driver 510, an eighth driver 520, a third main body 530, a third material box 540 and a conveying belt 550, the seventh driver 510 is installed on the fixing frame 410, the third main body 530 is connected with the seventh driver 510, the seventh driver 510 is used for driving the third main body 530 to be close to or far away from a material outlet position 490, the eighth driver 520 is installed on the third main body 530, the eighth driver 520 is connected with the third material box 540, the eighth driver 520 is used for driving the third material box 540 to move along the vertical direction, the conveying belt 550 is installed on the third main body 530, the third material box 540 is arranged at one end of the conveying belt 550, the other end of the conveying belt 550 can move in the third avoiding groove 352 along the vertical direction, and the conveying belt 550 is used for conveying the wafers 110 in the second material box 350 at the material outlet position into the third material box 540.

When the second cartridge 350 moves to the outfeed position 490, the sixth driver 450 drives the second cartridge 350 upward in the vertical direction to avoid interference with the outfeed device 500. Subsequently, the seventh driver 510 drives the third body 530 close to the discharge level 490 such that the conveyor belt 550 at least partially overlaps the second magazine 350 in the vertical direction. Subsequently, the sixth driver 450 drives the second magazine 350 downward in the vertical direction, the conveyor 550 passes through the third avoiding groove 352 to directly contact the wafer 110, and transfers the contacted wafer 110 into the third magazine 540, and after the third magazine 540 receives the single wafer 110, the eighth driver 520 drives the third magazine 540 downward in the vertical direction to ensure that the next wafer 110 can be stacked on the previous wafer 110. The sixth driver 450 repeats the driving action of the second magazine 350 and the eighth driver 520 repeats the driving action of the third magazine 540 until the wafers 110 in the second magazine 350 are all stacked in the third magazine 540. Since the wafers 110 in the third magazine 540 are stacked, the third magazine 540 has a smaller volume than the second magazine 350 when the same number of wafers 110 are stored, so that more wafers 110 can be placed in the same space when the wafers 110 are transported later, and space utilization and transportation efficiency are improved.

Specifically, the sixth driver 450, the seventh driver 510, and the eighth driver 520 can be selected as a linear driving motor or a linear driving cylinder, which are conventional in the art. The conveyor belt can be selected as a belt conveyor belt or a conveyor roller.

The embodiments of the present utility model have been described in detail with reference to the accompanying drawings, but the present utility model is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present utility model. Furthermore, embodiments of the utility model and features of the embodiments may be combined with each other without conflict.

Claims (10)

1. A wafer testing system, comprising:

the testing device comprises a wafer detection assembly and a marking assembly, wherein the wafer detection assembly is used for detecting a wafer, and the marking assembly is used for marking ink points of defects of the wafer;

the baking device is provided with a baking cavity and is used for baking ink marks on the wafer, and the baking device and the testing device are sequentially arranged along a first direction;

the feeding and discharging device comprises a first main body, a feeding assembly, a discharging assembly, a first material box and a second material box, wherein the first main body can move along a first direction, the feeding assembly, the discharging assembly, the first material box and the second material box are respectively arranged on the first main body, the first material box is used for placing undetected wafers, and the feeding assembly is used for transferring the wafers in the first material box to the testing device; the second material box is provided with a plurality of containing grooves which are arranged at intervals, and the blanking component is used for transferring the wafers after the ink points are marked into the containing grooves;

and the transferring device is used for transferring the second material box into the baking cavity.

2. The wafer test system of claim 1, wherein the blanking assembly comprises a first driver and a holding tray, the holding tray comprises a holding portion and a connecting portion connected to each other, the holding portion is configured to hold a wafer, the connecting portion is connected to the first driver, the first driver is configured to drive the holding tray to perform a telescopic motion, at least a portion of the holding portion can extend into the second magazine, the loading and blanking device further comprises a second driver, the second driver is mounted to the first body, and the second driver is configured to drive the second magazine to move in a vertical direction.

3. The wafer testing system of claim 2, wherein the loading and unloading device further comprises a stop lever, the stop lever is fixed on the first main body, the stop lever extends along the vertical direction, the stop lever is disposed between the second magazine and the connecting portion, and the stop lever is used for limiting the movement of the wafer out of the accommodating groove.

4. The wafer test system of claim 2, wherein the wafer inspection assembly comprises a first carrier for carrying wafers, the test apparatus further comprising a lift assembly for lifting wafers on the first carrier; the blanking assembly further comprises a third driver, the third driver is connected with the bearing plate, the third driver is used for driving the bearing plate to rotate in a rotating mode, the bearing plate is provided with a first avoiding groove, and the first avoiding groove is used for avoiding the jacking assembly.

5. The wafer test system of claim 1, wherein the loading and unloading device further comprises a second driver, the second driver comprising a second body and a driving rod, the second body being mounted on the first body, the driving rod being configured to abut against the second magazine and to drive the second magazine to move in a vertical direction; the transfer device comprises a fixing frame and a bearing platform, wherein the bearing platform is connected to the fixing frame and used for bearing the second material box, the bearing platform is provided with a second avoidance groove, the feeding and discharging device can move to the driving rod enters the second avoidance groove, and the driving rod can move in the second avoidance groove along the vertical direction.

6. The wafer testing system of claim 5, wherein the baking device has a feed port communicating with the baking chamber, the feed port being disposed opposite the second avoidance slot in a vertical direction, and the transfer device further comprises a fourth driver mounted to the mount, the fourth driver being configured to drive the second magazine to approach or depart from the baking device in the vertical direction.

7. The wafer test system of claim 5 or 6, wherein the transfer device further comprises a fifth driver, the fifth driver is mounted on the fixing frame, the fifth driver is connected with the carrying platform, the fifth driver is used for driving the carrying platform to rotate, the carrying platform is provided with a plurality of second avoidance grooves, and each second avoidance groove is distributed along the rotation direction of the carrying platform.

8. The wafer testing system of claim 7, wherein the transfer device is provided with a feed station, a bake station, a cool station, and a discharge station, and the feed station, bake station, cool station, and discharge station are sequentially disposed along a rotation direction of the load platform, and the second avoidance groove is capable of being rotated to a position of the feed station, bake station, cool station, and discharge station, respectively.

9. The wafer test system of claim 8, wherein the transfer device further comprises a sixth driver mounted to the mount for driving the second magazine of the outfeed station to move in a vertical direction; the bottom of second magazine is provided with the third and dodges the groove, the wafer test system still includes discharging device, discharging device includes seventh driver, eighth driver, third main part, third magazine and conveyer belt, seventh driver install in the mount, the third main part with seventh driver is connected, seventh driver is used for order about the third main part is close to or keeps away from go out the material level, eighth driver install in the third main part, eighth driver with the third magazine is connected, eighth driver is used for order about the third magazine is along vertical direction motion, the conveyer belt install in the third main part, the third magazine set up in the one end of conveyer belt, the other end of conveyer belt can be along vertical direction in the third is dodged the inslot and is moved, the conveyer belt is used for with the wafer in the second magazine of ejection of compact position department is conveyed to in the third magazine.

10. The wafer test system of claim 1, further comprising a rail extending in the first direction, the first body further provided with a guide block slidably coupled to the rail.

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