CN218977115U - Active heat dissipation structure of high-heat-flux seeker simulation device - Google Patents
Active heat dissipation structure of high-heat-flux seeker simulation device Download PDFInfo
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- CN218977115U CN218977115U CN202222044354.9U CN202222044354U CN218977115U CN 218977115 U CN218977115 U CN 218977115U CN 202222044354 U CN202222044354 U CN 202222044354U CN 218977115 U CN218977115 U CN 218977115U
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Abstract
The utility model discloses an active heat dissipation structure of high heat flux density seeker simulation equipment, which comprises: the test fixture (6), the radiating bottom plate (1) and the soaking plate (9); the seeker simulation device is arranged on the test tool (6), and the electronic equipment and other parts of components of the seeker simulation device are sealed in the seeker cabin; the heat dissipation base plate (1) is arranged on the test tool (6), a heat source module (8) of the electronic equipment is intensively fixed on the inner side edge of the heat dissipation base plate (1), and the heat dissipation base plate (1) is an integrated plate embedded with the vapor chamber (9). The utility model can solve the problems of quick heat conduction and high-efficiency heat dissipation of the high-heat-flux-density seeker simulation device.
Description
Technical Field
The utility model belongs to the technical field of heat dissipation, and relates to an active heat dissipation structure of high-heat-flux-density seeker simulation equipment, which is used for active heat dissipation of the high-heat-flux-density seeker simulation equipment under a long-time working condition.
Background
The seeker simulation device is an important component of a guided weapon countermeasure simulation test system, and has the characteristics of long working time and movement along with a test turntable. The electronic equipment inside the seeker has higher power and concentrated heat flow, if the heat is not rapidly diffused and transferred, a large amount of heat can be accumulated along with the increase of working time, so that the temperature of the electronic components exceeds the junction temperature of the electronic components, the service lives of the electronic components and the equipment are further influenced, and the equipment is possibly damaged when serious.
Conventional ground electronic equipment mainly performs forced air cooling heat dissipation on the equipment through a fixed fan, and aiming at high-power expensive electronic equipment, the equipment is also subjected to heat dissipation through a liquid cooling circulation system or an active refrigeration system. For the seeker simulation equipment which works for a long time and moves along with the test turntable, if the internal heat sources are relatively dispersed, the problem of heat dissipation of the electronic equipment can be solved by reasonably arranging the heat dissipation fans, but aiming at the heat dissipation of the seeker simulation equipment with concentrated internal heat sources and high heat flux density, the study on how to realize the heat dissipation method of rapid heat conduction and high-efficiency heat dissipation is less in relevant published reports.
Disclosure of Invention
Object of the utility model
The purpose of the utility model is that: the active heat dissipation structure of the high-heat-flux-density seeker simulation device is used for solving the problems of rapid heat conduction and high-efficiency heat dissipation of the high-heat-flux-density seeker simulation device.
(II) technical scheme
In order to solve the above technical problems, the present utility model provides an active heat dissipation structure of a high heat flux density seeker simulation device, comprising: the test fixture 6, the radiating bottom plate 1 and the soaking plate 9; the seeker simulation device is arranged on the test tool 6, and the electronic equipment and other parts of components of the seeker simulation device are sealed in the seeker cabin body; the heat dissipation base plate 1 is arranged on the test tool 6, the heat source modules 8 of the electronic equipment are intensively fixed on the inner side edge of the heat dissipation base plate 1, and the heat dissipation base plate 1 is an integrated plate embedded with the vapor chamber 9.
A heat dissipation gasket 7 is arranged between the heat source module 8 and the heat dissipation base plate 1 to reduce the thermal resistance between the internal heat source and the heat dissipation base plate 1 and ensure that the heat source is conducted onto the heat dissipation base plate 1. The heat dissipation gasket 7 may be a heat dissipation rubber pad or a flexible metal gasket.
The heat dissipation bottom plate 1 is embedded with the structural arrangement of the vapor chamber 9, so that the heat dissipation bottom plate 1 has high heat conductivity, and heat sources concentrated by heat flow can be quickly transferred and diffused to the whole heat dissipation bottom plate 1 from the inner side edge, so that the temperature of electronic equipment is ensured to be in a reasonable range. Meanwhile, the outer side of the radiating bottom plate 1 is provided with radiating fins 5 so as to increase the radiating area of the surface of the radiating bottom plate.
The heat radiation fan 3 is arranged on the outer side surface of the heat radiation bottom plate 1, so that the convection heat exchange coefficient of the heat radiation bottom plate 1 and air can be increased, heat radiation is further enhanced, heat is taken away from the heat radiation bottom plate 1, and reliable operation of the seeker simulation device is ensured.
The cooling fan 3 is connected with the fan bracket 4 through the height adjusting plate 2, and then is integrally arranged on the test fixture 6.
(III) beneficial effects
The active heat dissipation structure of the high heat flux density seeker simulation device has the following beneficial effects:
(1) The heat conduction speed is high. According to the utility model, the heat source with high heat flux density is rapidly conducted to the whole heat dissipation bottom plate by embedding the temperature equalization plate with high heat conductivity into the heat dissipation bottom plate, so that the problem caused by rapid temperature rise of electronic equipment due to heat concentration can be avoided.
(2) The heat dissipation efficiency is high. According to the utility model, the heat radiating area and the convection heat exchange coefficient of the surface of the heat radiating bottom plate can be increased by combining the heat radiating fins with the heat radiating fan, the heat radiating efficiency is improved, and the heat radiating efficiency of the heat radiating fan can be further improved after the distance between the heat radiating fan and the heat radiating bottom plate is the optimal distance through the height adjusting plate.
Drawings
Fig. 1 is a schematic diagram of an active heat dissipation structure of a high heat flux density seeker simulation device according to the present utility model.
FIG. 2 is a flow chart of the heat dissipation design of the active heat dissipation structure of the high heat flux density seeker simulation device of the present utility model.
In the figure: 1-heat radiation bottom plate, 2-height adjusting plate, 3-heat radiation fan, 4-fan bracket, 5-heat radiation fin, 6-test fixture, 7-heat radiation gasket, 8-heat source module, 9-vapor chamber.
Detailed Description
To make the objects, contents and advantages of the present utility model more apparent, the following detailed description of the present utility model will be given with reference to the accompanying drawings and examples.
As shown in fig. 1, the active heat dissipation structure of the high heat flux density seeker simulation device of the present embodiment includes: the test fixture 6, the radiating bottom plate 1 and the soaking plate 9; the seeker simulation device is arranged on the test tool 6, and the electronic equipment and other parts of components of the seeker simulation device are sealed in the seeker cabin body; the heat dissipation base plate 1 is arranged on the test tool 6, the heat source modules 8 of the electronic equipment are intensively fixed on the inner side edge of the heat dissipation base plate 1, and the heat dissipation base plate 1 is an integrated plate embedded with the vapor chamber 9.
A heat dissipation gasket 7 is arranged between the heat source module 8 and the heat dissipation base plate 1 to reduce the thermal resistance between the internal heat source and the heat dissipation base plate 1 and ensure that the heat source is conducted onto the heat dissipation base plate 1. The heat dissipation gasket 7 may be a heat dissipation rubber pad or a flexible metal gasket.
The heat dissipation bottom plate 1 is internally embedded with the structure of the vapor chamber 9, so that the heat dissipation bottom plate 1 has high heat conductivity, and a heat source concentrated by heat flow can be quickly transferred and diffused to the whole heat dissipation bottom plate 1 from the inner side edge, so that the temperature of electronic equipment is ensured to be in a reasonable range; the soaking plate 9 is arranged in the middle of the radiating bottom plate 1 and is equal to the peripheral edge distance of the radiating bottom plate 1, so that the soaking effect is better. Meanwhile, the outer side of the radiating bottom plate 1 is provided with radiating fins 5 so as to increase the radiating area of the surface of the radiating bottom plate.
The heat radiation fan 3 is arranged on the outer side surface of the heat radiation bottom plate 1, so that the convection heat exchange coefficient of the heat radiation bottom plate 1 and air can be increased, heat radiation is further enhanced, heat is taken away from the heat radiation bottom plate 1, and reliable operation of the seeker simulation device is ensured.
The heat dissipation fan is connected with the fan bracket 4 through the height adjusting plate 2 and then integrally installed on the test fixture 6. Because radiator fan can influence the fan radiating effect apart from the distance of radiating bottom plate, in order to guarantee to realize high efficiency heat dissipation demand through changing the altitude mixture control board at the unchangeable condition of experimental frock and fan support, simultaneously reduce test cost, should confirm the best position of radiator fan apart from radiating bottom plate through emulation analysis at first, the structure and the mounting means of altitude mixture control board 2 are again confirmed to promote radiator fan's availability factor and whole radiating effect, preferably, can change the altitude mixture control board 2 of different altitudes, convenient dismouting.
FIG. 2 is a flow chart showing an embodiment of active heat dissipation of the high heat flux seeker simulation device of the present utility model, namely, firstly, the heat source distribution and the heat dissipation power consumption of the seeker simulation device are determined, and because of the high heat flux and the long-time working condition, the active heat dissipation design of rapid heat dissipation and forced air cooling by adopting the temperature equalization plate is adopted, so that the heat dissipation fan type selection and the temperature equalization plate design are required to be developed, the fan volume flow and the structure size are determined, and the temperature equalization heat dissipation integrated plate structure is required, then the influence of the heat dissipation fan on the heat dissipation efficiency from the heat dissipation bottom plate height is analyzed through simulation, meanwhile, the heat dissipation bottom plate fin structure is determined through simulation optimization design, and finally, the structure and the installation mode of the height adjustment plate are determined, so that the design of the efficient heat dissipation scheme is completed.
The foregoing is merely a preferred embodiment of the present utility model, and it should be noted that modifications and variations could be made by those skilled in the art without departing from the technical principles of the present utility model, and such modifications and variations should also be regarded as being within the scope of the utility model.
Claims (9)
1. The utility model provides a high heat flux seeker analog device initiative heat radiation structure which characterized in that includes: the test fixture (6), the radiating bottom plate (1) and the soaking plate (9); the seeker simulation device is arranged on the test tool (6), and the electronic equipment and other parts of components of the seeker simulation device are sealed in the seeker cabin; the heat dissipation base plate (1) is arranged on the test tool (6), a heat source module (8) of the electronic equipment is intensively fixed on the inner side edge of the heat dissipation base plate (1), and the heat dissipation base plate (1) is an integrated plate embedded with the vapor chamber (9).
2. The active heat dissipation structure of the high heat flux density seeker simulation device according to claim 1, wherein a heat dissipation gasket (7) is arranged between the heat source module (8) and the heat dissipation base plate (1).
3. The active heat dissipation structure of the high heat flux density seeker simulation device according to claim 2, wherein the heat dissipation gasket (7) is a heat dissipation rubber pad.
4. The active heat dissipation structure of the high heat flux density seeker simulation device according to claim 2, wherein the heat dissipation pad (7) is a flexible metal pad.
5. The active heat dissipation structure of the high heat flux density seeker simulation device according to claim 1, wherein the soaking plate (9) is arranged in the middle of the heat dissipation base plate (1) and is equidistant from the peripheral edges of the heat dissipation base plate (1).
6. The active heat dissipation structure of the high heat flux density seeker simulation device according to claim 1, wherein heat dissipation fins are arranged on the outer side of the heat dissipation base plate (1).
7. The active heat dissipation structure of the high heat flux density seeker simulation device according to claim 1, wherein a heat dissipation fan (3) is arranged on the outer side surface of the heat dissipation base plate (1).
8. The active heat dissipation structure of the high heat flux density seeker simulation device according to claim 7, wherein the heat dissipation fan (3) is mounted on a fan bracket (4), and the fan bracket (4) is mounted on a test fixture (6).
9. The active heat radiation structure of the high heat flux density seeker simulation device according to claim 8, wherein a height adjusting plate (2) is arranged between the heat radiation fan (3) and the fan bracket (4), and the distance between the heat radiation fan (3) and the heat radiation bottom plate (1) is adjusted through the height adjusting plate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222044354.9U CN218977115U (en) | 2022-08-04 | 2022-08-04 | Active heat dissipation structure of high-heat-flux seeker simulation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222044354.9U CN218977115U (en) | 2022-08-04 | 2022-08-04 | Active heat dissipation structure of high-heat-flux seeker simulation device |
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| Publication Number | Publication Date |
|---|---|
| CN218977115U true CN218977115U (en) | 2023-05-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222044354.9U Active CN218977115U (en) | 2022-08-04 | 2022-08-04 | Active heat dissipation structure of high-heat-flux seeker simulation device |
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| Country | Link |
|---|---|
| CN (1) | CN218977115U (en) |
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2022
- 2022-08-04 CN CN202222044354.9U patent/CN218977115U/en active Active
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