CN218975396U - Separating mechanism for multiple semiconductor devices - Google Patents

Abstract

The application discloses a separation mechanism for a plurality of semiconductor devices, which belongs to the field of semiconductor device separation and comprises a first support frame, a feeding platform, a separation module and a receiving assembly, wherein a feeding cavity is formed in the feeding platform along the length direction of the feeding platform, a feeding track for supporting the semiconductor devices is formed in the inner bottom surface of the feeding cavity, a strip-shaped notch communicated with the feeding cavity is formed in the position, close to the separation module, of the upper surface of the feeding platform, the separation module comprises a thrust assembly and a driving assembly for driving the thrust assembly to reciprocate along the vertical direction, and the thrust assembly comprises a pressing clamp capable of extending into or separating from the strip-shaped notch along the vertical direction; an air injection channel communicated with the upper surface of the feeding track is arranged in the feeding platform, the other end of the air injection channel is communicated with a compressed air source, and the air injection channel is obliquely arranged towards the feeding direction of the semiconductor device. The method and the device can separate a plurality of semiconductor devices at one time and feed the semiconductor devices, and have the effect of improving the conveying efficiency of the semiconductor devices.

Description

Separating mechanism for multiple semiconductor devices

Technical Field

The present application relates to the field of semiconductor device sorting, and in particular, to a multiple semiconductor device separation mechanism.

Background

Semiconductor devices are electronic devices that have electrical conductivity between good electrical conductors and insulators, and that utilize the specific electrical characteristics of semiconductor materials to perform specific functions, and can be used to generate, control, receive, transform, amplify signals, and perform energy conversion.

In the related art, chinese patent publication No. CN207266941U discloses a sorting machine comprising a controller, a table, a feeding device controlled by the controller and fixedly installed at the table for providing semiconductor devices, a marking device controlled by the controller and fixedly installed at the table for marking the semiconductor devices, a distributing device controlled by the controller and fixedly installed at the table for sorting and storing the semiconductor devices, and a turntable device controlled by the controller and installed at the table for picking up and lowering the semiconductor devices to transport the semiconductor devices; the material distribution device comprises a material distribution frame, a feeding component, a material distribution component and a photoelectric counter, wherein the feeding component is close to one side of the turntable device and is used for enabling the semiconductor devices to enter the material distribution device, the material distribution component is used for conveying the semiconductor devices in a classified mode, and the photoelectric counter is used for recording the passing quantity of the semiconductor devices.

With respect to the related art described above, the inventors consider that the delivery mechanism can only deliver one semiconductor device at a time, and the delivery efficiency of the semiconductor device is low.

Disclosure of Invention

In order to improve the transport efficiency of semiconductor devices, the present application provides a plurality of semiconductor device separating mechanisms.

The application provides a many semiconductor device separating mechanism adopts following technical scheme:

the separating mechanism for the plurality of semiconductor devices comprises a first supporting frame, a feeding platform fixedly connected to the top of the first supporting frame, a sorting module arranged at one end of the feeding platform and used for separating the plurality of semiconductor devices, and a receiving assembly used for receiving the separated plurality of semiconductor devices which are juxtaposed, wherein a feeding cavity for feeding the semiconductor devices is formed in the feeding platform along the length direction of the feeding platform, a feeding track for supporting the semiconductor devices is arranged on the inner bottom surface of the feeding cavity, a strip-shaped notch communicated with the feeding cavity is formed in the position, close to the sorting module, of the upper surface of the feeding platform, and the sorting module comprises a thrust assembly positioned at one side of the strip-shaped notch and a driving assembly used for driving the thrust assembly to reciprocate along the vertical direction, and the thrust assembly comprises a pressing clamp capable of extending into or separating from the strip-shaped notch along the vertical direction; the material feeding platform is internally provided with an air injection channel communicated with the upper surface of the material feeding track, the other end of the air injection channel is communicated with a compressed air source, and the air injection channel is obliquely arranged towards the material feeding direction of the semiconductor device.

Through adopting above-mentioned technical scheme, the semiconductor device of completion of making gets into in proper order and walks the material cavity, and the semiconductor device that gets into and walk the material cavity contacts with walking the material track, and the gas that compressed air source produced gets into in the jet-propelled passageway, and the gas slope upwards blows the semiconductor device along walking the material track removal to reduce the frictional resistance between semiconductor device and the material track that walks, and then improve conveying efficiency. After a plurality of semiconductor devices enter the bearing assembly, the pressing clamp enters the feeding cavity along the strip-shaped notch under the action of the driving assembly, so that follow-up semiconductor devices are prevented from moving continuously, and after an operator transfers the plurality of semiconductor devices on the bearing assembly to other equipment, the driving assembly enables the pressing clamp to be lifted, and the follow-up semiconductor devices are pushed into the bearing assembly by gas. The arrangement of the bearing assembly enables a plurality of semiconductor devices to be transferred at one time, and compared with the existing single semiconductor device transfer mode, the conveying efficiency of the semiconductor devices is greatly improved.

Preferably, the top of the first support frame is fixedly connected with a cleaning assembly, the cleaning assembly comprises a cleaning motor fixedly connected to the first support frame and a brush disc fixedly sleeved on an output shaft of the cleaning motor, and the outer periphery of the lower portion of the brush disc extends into the strip-shaped notch and is in contact with the upper surface of the semiconductor device.

Through adopting above-mentioned technical scheme, operating personnel starts and cleans the motor, cleans the output shaft rotation of motor and drives the brush dish and rotate, and the brush dish rotates and is favorable to cleaning the dust of semiconductor device upper surface to play certain promotion effect to the removal of semiconductor device.

Preferably, the thrust component is installed on the second support frame, the thrust component comprises a regulating block fixedly arranged on the second support frame and a cam follower block hinged to the regulating block, the side surface, close to the feeding platform, of the regulating block is provided with a mounting groove for accommodating the cam follower block, the cam follower block is far away from a pressure spring is arranged between one end of the bearing component and the lower side wall of the mounting groove, and the other end of the cam follower block is fixedly connected with the pressing clamp.

Through adopting above-mentioned technical scheme, the setting of regulating block makes things convenient for operating personnel to install cam follower and pressure spring, and the setting of pressure spring makes cam follower guarantee certain inclination under not receiving external force effect, and at this moment, the pressure material clamp stretches into through the bar notch and walks the material cavity in, presses the material clamp to prevent follow-up semiconductor device to continue to go ahead.

Preferably, the driving assembly comprises a motor mounting seat fixedly connected to the second supporting frame and a driving motor mounted on the motor mounting seat, an output shaft of the driving motor is fixedly connected with a rocker which is horizontally arranged, a first cam follower which is vertically arranged is mounted at the other end of the rocker, a receiving table is slidably arranged on the motor mounting seat along the feeding direction, a connecting plate is fixedly connected to the receiving table, and a containing notch matched with the first cam follower is formed in one end of the connecting plate; the bearing table is provided with a second cam follower which is horizontally arranged, and the end face of the cam follower block, which is close to the connecting plate, is provided with a slope surface which is contacted with the second cam follower.

Through adopting above-mentioned technical scheme, operating personnel starts driving motor, and driving motor's output shaft rotates and drives the rocker and rotate, and the rocker rotates and makes first cam follower rotate, and first cam follower drive connecting plate reciprocating motion in the horizontal direction. When the connecting plate moves to the feeding platform, the moving plate moves to enable the bearing platform to be close to the feeding platform, the bearing platform drives the second cam follower to be close to the cam follower block, and the cam follower pushes the slope surface of the cam follower block, so that the material pressing clamp is lifted, and the semiconductor device blocked by the material pressing clamp continues to move; when the connecting plate moves towards the direction away from the feeding platform, the bearing table drives the second cam device to be away from the cam follower block, and the end part of the cam follower block with the slope surface descends under the action of the spring of the pressure spring, so that the feeding clamp falls down to block the movement of the following semiconductor devices, and the separation effect on a plurality of semiconductor devices is achieved.

Preferably, the receiving assembly comprises a material waiting block fixedly connected to the receiving table and a limiting block fixedly connected to one end of the material waiting block far away from the feeding platform; and a bearing rail for being butted with the feeding rail is integrally formed on the material waiting block.

Through adopting above-mentioned technical scheme, when accepting the platform to walk the material platform and remove, accepting the platform and remove and drive and wait that the material piece removes until accepting the rail and walk the butt joint of material track, walk the semiconductor device on the material track and remove to accepting the rail under the promotion effect of air current, stopper and walk the material rail and be favorable to operating personnel control to isolate the quantity of semiconductor device.

Preferably, the bearing rail is provided with a plurality of air passage holes at intervals along the length direction, a plurality of negative pressure channels used for being communicated with the air passage holes are formed in the bearing table, and the negative pressure channels are communicated with a negative pressure source through negative pressure pipelines.

Through adopting above-mentioned technical scheme, the negative pressure source makes negative pressure channel and air flue hole produce the negative pressure to make between semiconductor device and the accepting rail through the negative pressure connection, improve the stability of accepting rail transportation semiconductor device.

Preferably, the side surface of the limiting block, which is close to the feeding platform, is provided with a negative pressure groove, and the negative pressure groove is communicated with the negative pressure channel.

Through adopting above-mentioned technical scheme, the side of the semiconductor device that the setting up of negative pressure groove made to be close to the stopper also is adsorbed fixedly, further improves the stability of semiconductor device transportation, prevents that semiconductor device from breaking away from the bearing rail.

Preferably, the position department of accepting the platform is provided with the subassembly that compresses tightly, compress tightly the subassembly including the cylinder mount pad of vertical setting, install in drive cylinder on the cylinder mount pad, fixed connection in fixed plate on drive cylinder's the piston rod, slidable mounting in on the accepting the platform and with fixed plate fixed connection's gate-type support, fixed connection in be used for on the gate-type support with the briquetting of semiconductor device butt.

Through adopting above-mentioned technical scheme, operating personnel starts the actuating cylinder, and the piston rod of actuating cylinder retrieves and drives the fixed plate and descend, and the fixed plate descends and drives the portal frame and descend, and then makes the briquetting descend, briquetting and semiconductor device butt to make semiconductor device hug closely the joint rail, and the setting of briquetting can ensure the condition that can not appear the edge overlapping between a plurality of semiconductor devices.

Preferably, the optical fiber mounting seat is fixedly connected to the bearing table, the first photoelectric sensor is mounted on the optical fiber mounting seat, a plurality of sensing holes for the detection light path to pass through are formed in two inner side walls of the optical fiber mounting seat, and the sensing holes correspond to the positions of the semiconductor devices.

Through adopting above-mentioned technical scheme, the detection light of first photoelectric sensor passes through the sensing hole and jets out to detect the placement condition of the semiconductor device of corresponding position department, the semiconductor device on the support rail is favorable to helping the operating personnel to detect to be provided with first photoelectric sensor and sensing hole.

In summary, the present application includes at least one of the following beneficial technical effects:

the gas blows the semiconductor devices upwards obliquely to move along the feeding track, so that the friction resistance between the semiconductor devices and the feeding track is reduced, the transportation efficiency is improved, the sorting module is favorable for separating out a plurality of semiconductor devices at one time, and the carrying assembly is arranged to transfer the plurality of semiconductor devices at one time, so that the transportation efficiency of the semiconductor devices is greatly improved compared with the existing single semiconductor device transfer mode;

the arrangement of the adjusting block is convenient for operators to install the cam follower block and the pressure spring, the cam follower block is enabled to ensure a certain inclination angle under the action of no external force by the arrangement of the pressure spring, and at the moment, the material pressing clamp stretches into the material feeding cavity through the strip-shaped notch, so that the follow-up semiconductor device is prevented from going forward continuously;

the piston rod of the driving cylinder is recovered to drive the fixed plate to descend, the fixed plate descends to drive the portal frame to descend, then the pressing block descends, and the pressing block is abutted with the semiconductor device, so that the semiconductor device is tightly attached to the bearing rail, the function of pressing and preventing falling is achieved, and the situation that edge overlapping cannot occur among a plurality of semiconductor devices can be ensured due to the arrangement of the pressing block.

Drawings

Fig. 1 is a schematic structural view of a plurality of semiconductor device separating mechanisms according to an embodiment of the present application.

Fig. 2 is a schematic diagram of an internal structure of the feeding platform according to an embodiment of the present application.

Fig. 3 is a schematic view of the internal structure of the compression assembly according to the embodiment of the present application.

Fig. 4 is a schematic structural view of a sorting module according to an embodiment of the present application.

Fig. 5 is an enlarged schematic view at a in fig. 4.

Fig. 6 is a schematic view of the internal structure of the receiving assembly according to the embodiment of the present application.

Fig. 7 is an enlarged schematic view at B in fig. 6.

Reference numerals illustrate:

1. a first supporting frame; 11. a first support plate; 12. a first mounting plate; 13. a second mounting plate; 2. a second supporting frame; 3. a feeding platform; 31. a feeding cavity; 32. a feeding track; 33. an air intake cavity; 34. a jet channel; 35. an air inlet pipe; 36. a bar-shaped notch; 37. a mounting bracket; 38. a second photosensor; 4. a sorting module; 41. a thrust assembly; 411. an adjusting block; 4111. a mounting groove; 412. a cam follower block; 4121. a slope surface; 413. a pressing clamp; 414. a pressure spring; 42. a drive assembly; 421. a motor mounting seat; 4211. a guide rail; 4212. a third photosensor; 422. a driving motor; 423. a rocker; 424. a receiving table; 4241. a slide block; 4242. a negative pressure channel; 4243. a negative pressure pipe; 4244. an induction plate; 425. a connecting plate; 4251. a receiving notch; 426. a first cam follower; 427. a second cam follower; 5. a receiving assembly; 51. a material block is to be formed; 511. a receiving rail; 512. an airway aperture; 52. a limiting block; 521. a negative pressure tank; 6. cleaning the assembly; 61. a cleaning motor; 62. a brush plate; 7. an optical fiber mounting seat; 71. a first photosensor; 72. an induction hole; 8. a compression assembly; 81. a cylinder mounting seat; 82. a driving cylinder; 83. a fixing plate; 84. a door-type bracket; 841. a vertical plate; 842. a connecting rod; 85. briquetting; 9. a semiconductor device.

Detailed Description

The present application is described in further detail below in conjunction with figures 1-7.

The embodiment of the application discloses a separation mechanism for a plurality of semiconductor devices. Referring to fig. 1, the separation mechanism for a plurality of semiconductor devices comprises a first support frame 1, a second support frame 2, a feeding platform 3, a sorting module 4 and a receiving assembly 5.

Referring to fig. 1 and 2, the first support frame 1 includes a first support plate 11, a first mounting plate 12 and a second mounting plate 13, where the first support plate 11 is vertically disposed, the first mounting plate 12 and the second mounting plate 13 are disposed at the upper end of the first support plate 11, the first support plate 11 is disposed between the first mounting plate 12 and the second mounting plate 13, one side surface of the first support plate 11 is fixedly connected with the first mounting plate 12, and the other side surface of the first support plate 11 is fixedly connected with the second mounting plate 13.

Referring to fig. 1 and 2, a feeding platform 3 is disposed at the upper end of a first support frame 1, and the bottom surface of the feeding platform 3 is fixedly connected with the upper surface of a first mounting plate 12. The length direction of the feeding platform 3 is consistent with the length direction of the first mounting plate 12. The feeding platform 3 is provided with a feeding cavity 31, and the length direction of the feeding cavity 31 is consistent with the length direction of the feeding platform 3. The inner bottom surface of the feeding cavity 31 is provided with a feeding track 32 for supporting the semiconductor device 9, and the length direction of the feeding track 32 is consistent with the length direction of the feeding cavity 31.

Referring to fig. 1 and 2, an air inlet cavity 33 is formed in the feeding platform 3, a plurality of air inlet cavities 33 are formed, and the plurality of air inlet cavities 33 are sequentially arranged along the length direction of the feeding platform 3. An air injection channel 34 is arranged between the inner top surface of the air inlet cavity 33 and the upper surface of the feeding track 32. The air injection channel 34 is obliquely arranged towards the feeding direction of the semiconductor device 9, one end of the air injection channel 34 is communicated with the air inlet cavity 33, and the other end of the air injection channel 34 is communicated with the feeding cavity 31. The intake cavity 33 communicates with a compressed air source via an intake pipe 35.

Referring to fig. 1 and 2, a cleaning assembly 6 is arranged on a first support frame 1, the cleaning assembly 6 comprises a cleaning motor 61 and a brush plate 62, the cleaning motor 61 is fixedly installed on a second installation plate 13, and the extending direction of the axis of an output shaft of the cleaning motor 61 is perpendicular to the length direction of the feeding platform 3. The brush plate 62 is sleeved on the output shaft of the cleaning motor 61, and the brush plate 62 is fixedly connected with the output shaft of the cleaning motor 61. The feeding platform 3 is provided with a plurality of strip-shaped notches 36, the strip-shaped notches 36 are uniformly distributed along the length direction of the feeding platform 3, the strip-shaped notches 36 are communicated with the feeding cavity 31, the outer edge of the lower part of the brush disc 62 extends into the strip-shaped notches 36, and the outer peripheral surface of the brush disc 62 is in contact with the upper surface of the semiconductor device 9. The operator starts the cleaning motor 61, and the output shaft of the cleaning motor 61 rotates to drive the brush plate 62 to rotate, and the arrangement of the brush plate 62 is beneficial to cleaning dust on the semiconductor device 9.

Referring to fig. 1 and 3, two mounting brackets 37 arranged at intervals are mounted on the feeding platform 3, second photoelectric sensors 38 for detecting and counting the semiconductor devices 9 are mounted on the two mounting brackets 37, and detection light paths of the two second photoelectric sensors 38 vertically penetrate through the feeding cavity 31.

Referring to fig. 4 and 5, the sorting module 4 includes a thrust assembly 41 and a driving assembly 42, the thrust assembly 41 includes an adjusting block 411, a cam follower block 412 and a pressing clamp 413, the second support frame 2 is vertically arranged, the adjusting block 411 is fixedly mounted at the upper end of the second support frame 2, a mounting groove 4111 is formed in a side surface, close to the feeding platform 3, of the adjusting block 411, and an opening of the mounting groove 4111 is rectangular. As shown in fig. 3, the cam follower block 412 is disposed in the mounting groove 4111, and the cam follower block 412 is hinged to the mounting groove 4111 away from the inner side wall of the feeding platform 3. The end of the cam follower block 412, which is close to the first support frame 1, is provided with a pressure spring 414, one end of the pressure spring 414 is fixedly connected with the cam follower block 412, and the other end of the pressure spring 414 is fixedly connected with the lower side wall of the mounting groove 4111. The other end of the cam follower block 412 is fixedly connected with a pressing clamp 413, the tip of the pressing clamp 413 far away from the cam follower block 412 is triangular, the triangular tip of the pressing clamp 413 extends into the strip-shaped notch 36 along the vertical direction, and the triangular tip of the pressing clamp 413 extends into the gap between the adjacent semiconductor devices 9 and is abutted against the semiconductor devices 9. Due to the arrangement of the pressure spring 414, one end of the cam follower block 412 away from the material pressing clamp 413 keeps a certain distance from the lower side face of the mounting groove 4111, so that the positions of the other end of the cam follower block 412 and the material pressing clamp 413 are kept unchanged, at the moment, the triangular tip of the material pressing clamp 413 stretches into the material feeding cavity 31 along the strip-shaped notch 36, and the material pressing clamp 413 further prevents the semiconductor device 9 from continuously advancing along the material feeding track 32.

Referring to fig. 4 and 5, the driving assembly 42 includes a motor mounting seat 421, a driving motor 422, a rocker 423, a receiving table 424, a first cam follower 426 of a connecting plate 425, and a second cam follower 427, where the motor mounting seat 421 is horizontally disposed, the length direction of the motor mounting seat 421 is consistent with the length direction of the feeding track 32, the bottom surface of the motor mounting seat 421 is fixedly connected with the upper surface of the second support frame 2, and the motor mounting seat 421 is fixedly connected with the adjusting block 411. The driving motor 422 is disposed below the motor mounting seat 421, and the driving motor 422 is fixedly connected with the motor mounting seat 421. The rocker 423 is horizontally arranged, one end of the rocker 423 is fixedly connected with an output shaft of the driving motor 422, and the other end of the rocker 423 is rotatably connected with the first cam follower 426 which is vertically arranged.

Referring to fig. 4 and 5, a rail 4211 is fixedly connected to the upper surface of the motor mount 421, and the longitudinal direction of the rail 4211 is identical to the direction of the motor mount 7. The bottom surface of the bearing table 424 is fixedly connected with a sliding block 4241 which is in sliding fit with the guide rail 4211, a connecting plate 425 is fixedly connected to the upper surface of the bearing table 424, the connecting plate 425 is arranged on the end part of the bearing table 424, which is close to the first cam follower 426, a containing notch 4251 which is used for being matched with the first cam follower 426 is formed in the connecting plate 425, and the inner side wall of the containing notch 4251 is in sliding fit with the outer peripheral surface of the first cam follower 426.

Referring to fig. 4 and 5, a second cam follower 427 is mounted to the end of the receiving table 424 near the cam follower block 412, the second cam follower 427 being horizontally disposed, and the second cam follower 427 being rotatably coupled to the receiving table 424. The end of the cam follower block 412 near the connection plate 425 is provided with a ramp surface 4121 that contacts the second cam follower 427. When the operator starts the driving motor 422, the output shaft of the driving motor 422 rotates to drive the rocker 423 to rotate, the rocker 423 rotates to enable the connecting plate 425 to approach the feeding platform 3 through the first cam follower 426, the connecting plate 425 moves to drive the receiving platform 424 to move towards the feeding platform 3, and the receiving platform 424 moves to drive the second cam follower 427 to move towards the cam follower block 412. The second cam follower 427 pushes the ramp surface 4121 of the cam follower block 412, the cam follower block 412 is lifted away from the end of the compression spring 414, at this time, the triangular tip of the pressing clamp 413 is lifted, the pressing clamp 413 does not block the semiconductor device 9 from continuing to advance, and the compression spring 414 is in a compressed state. When the second cam follower 427 is away from the slope surface 4121 of the cam follower block 412, the end of the cam follower block 412 on which the press nip 413 is mounted is lifted up by the elastic force of the press spring 414, so that the triangular tip of the press nip 413 enters the gap of the semiconductor device 9 again along the bar-shaped notch 36, thereby blocking the semiconductor device 9 from proceeding.

Referring to fig. 6 and 7, the receiving assembly 5 includes a to-be-fed block 51 and a limiting block 52, the to-be-fed block 51 is disposed at an end of the receiving platform 424 away from the second support frame 2, and a bottom surface of the to-be-fed block 51 is fixedly connected with an upper surface of the receiving platform 424. As described in connection with fig. 3, the receiving rail 511 is disposed on the material block 51, the receiving rail 511 and the material block 51 are integrally formed, the length direction of the receiving rail 511 is consistent with the length direction of the feeding rail 32, the receiving rail 511 is slidably matched with the semiconductor devices 9, the length of the receiving rail 511 is longer than that of a group of semiconductor devices 9, and a group of semiconductor devices 9 comprises six semiconductor devices 9 sequentially connected along the feeding direction. The limiting block 52 is disposed at one end of the receiving rail 511 away from the second support frame 2, and the other end of the receiving rail 511 is abutted with the feeding rail 32. The driving motor 422 makes the receiving platform 424 lean against the feeding platform 3, and the receiving rail 511 moves towards the feeding platform 3 until the receiving rail 511 is in butt joint with the feeding rail 32, at this time, the pressing clamp 413 is lifted upwards, and a group of semiconductor devices 9 on the feeding rail 32 enter the receiving rail 511 under the pushing action of gas. When the motor 422 is driven to move the receiving table 424 away from the feeding platform 3, the presser finger 413 falls down to prevent the next group of semiconductor devices 9 from moving out of the feeding track 32.

Referring to fig. 6 and 7, the upper surface of the receiving rail 511 is provided with air passage holes 512, six air passage holes 512 are provided, the six air passage holes 512 are uniformly arranged along the length direction of the receiving rail 511, and the six air passage holes 512 are in one-to-one correspondence with the six semiconductor devices 9. A negative pressure channel 4242 is arranged in the bearing table 424, one end of the negative pressure channel 4242 is communicated with the air passage hole 512, and the other end of the negative pressure channel 4242 is communicated with a negative pressure source through a negative pressure pipe 4243. The stopper 52 is provided with a negative pressure groove 521 on a side surface thereof close to the semiconductor device 9, and the negative pressure groove 521 communicates with the negative pressure passage 4242. The air passage holes 512 and the negative pressure channels 4242 generate negative pressure so that the semiconductor device 9 is closely attached to the supporting rail 511, and the negative pressure grooves 521 are arranged to be favorable for further absorbing the semiconductor device 9 from the side surface, so that the fixing effect of the semiconductor device 9 is enhanced.

Referring to fig. 3 and 4, the optical fiber mounting seat 7 is fixedly connected to the upper surface of the receiving table 424, the first photoelectric sensor 71 is mounted on the optical fiber mounting seat 7, six sensing holes 72 for the detection light path to pass through are formed in two inner side walls of the optical fiber mounting seat 7, the sensing holes 72 in the two inner side walls of the optical fiber mounting seat 7 are correspondingly matched with each other, and the six sensing holes 72 in one inner side wall of the optical fiber mounting seat 7 are in one-to-one correspondence with the positions of the six semiconductor devices 9. The provision of the first photosensor 71 is advantageous in helping an operator to detect whether the semiconductor device 9 is mounted in place on the receiving rail 511.

Referring to fig. 1 and 3, an induction plate 4244 is fixedly connected to an outer side wall of the receiving table 424, which is close to the second cam follower 427, and a third photoelectric sensor 4212 for detecting the position of the induction plate 4244 is mounted on the motor mounting seat 421, and the third photoelectric sensor 4212 determines whether the receiving table 424 returns to the original position by detecting the position of the induction plate 4244.

Referring to fig. 1 and 3, a compression assembly 8 is disposed on the receiving table 424, the compression assembly 8 includes a cylinder mount 81, a driving cylinder 82, a fixing plate 83, a door-type bracket 84, and a pressing block 85, the cylinder mount 81 is vertically disposed, the driving cylinder 82 is fixedly mounted on the upper end of the cylinder mount 81, and a piston rod of the driving cylinder 82 is vertically disposed. The fixed plate 83 is horizontally arranged, and the bottom surface of the fixed plate 83 is fixedly connected with a piston rod of the driving cylinder 82. The door bracket 84 includes two vertical plates 841 and a connecting rod 842, the two vertical plates 841 are respectively disposed on two sides of the receiving platform 424, and the side surface of the vertical plate 841, which is close to the receiving platform 424, is slidably matched with the receiving platform 424 through a sliding rail. The connecting rod 842 is horizontally arranged, the connecting rod 842 is arranged between the two vertical plates 841, one end of the connecting rod 842 is fixedly connected with one vertical plate 841, and the other end of the connecting rod 842 is fixedly connected with the other vertical plate 841. The briquetting 85 is arranged in the middle of the connecting rod 842, the upper surface of the briquetting 85 is fixedly connected with the bottom surface of the connecting rod 842, and the lower surface of the briquetting 85 is abutted with the upper surfaces of a group of semiconductor devices 9. When a group of semiconductor devices 9 moves from the feeding track 32 to the receiving track 511, an operator starts the driving cylinder 82, a piston rod of the driving cylinder 82 drives the fixing plate 83 to descend, the fixing plate 83 descends to drive the door-type bracket 84 to descend, and accordingly the connecting rod 842 drives the pressing block 85 to abut against the upper surface of the group of semiconductor devices 9, and the group of semiconductor devices 9 are tightly attached to the receiving track 511.

The implementation principle of the separation mechanism of the plurality of semiconductor devices in the embodiment of the application is as follows: the manufactured semiconductor devices 9 sequentially enter the feeding cavity 31, the semiconductor devices 9 entering the feeding cavity 31 are contacted with the feeding track 32, gas generated by a compressed gas source sequentially passes through the gas inlet pipe 35, the gas inlet cavity 33 and is sprayed out from the gas spraying channel 34, and the gas obliquely upwards blows the semiconductor devices 9 to move along the feeding track 32, so that the friction resistance between the semiconductor devices 9 and the feeding track 32 is reduced, and the transportation efficiency is improved.

The setting of the adjusting block 411 and the pressure spring 414 ensures that the cam follower block 412 can ensure a certain inclination angle under the action of no external force, at this time, the pressure clamp 413 extends into the feeding cavity 31 through the strip-shaped notch 36, and the pressure clamp 413 prevents the following semiconductor device 9 from going forward. An operator starts a driving motor 422, the driving motor 422 enables a connecting plate 425 to reciprocate in the horizontal direction through the cooperation of a rocker 423 and a first cam follower 426, and the connecting plate 425 reciprocates to drive a bearing table 424 to reciprocate. When the receiving table 424 brings the second cam follower 427 close to the cam follower block 412, the cam follower pushes the slope surface 4121 of the cam follower block 412, so that the press nip 413 is lifted, and the semiconductor device 9 blocked by the press nip 413 continues to move. When the semiconductor device 9 moves onto the receiving rail 511, the driving cylinder 82 drives the gate bracket 84 to descend, the gate bracket 84 descends to enable the pressing block 85 to descend, the pressing block 85 enables the semiconductor device 9 to be tightly attached to the receiving rail 511, and negative pressure is generated by the air passage hole 512 and the negative pressure groove 521 to prevent the semiconductor device 9 from being separated from the receiving rail 511.

When the semiconductor devices 9 enter the bearing rail 511, the driving assembly 42 enables the bearing table 424 to move away from the feeding platform 3, and an operator transfers the semiconductor devices 9 on the bearing rail 511 to other equipment; the other side of the drive assembly 42 lowers the nip 413, and the subsequent semiconductor device 9 is blocked by the nip 413. The receiving assembly 5 is provided so that a plurality of semiconductor devices 9 can be transferred at one time, and the conveying efficiency of the semiconductor devices 9 is greatly improved.

The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.

Claims (9)

1. The utility model provides a many semiconductor device separating mechanism, includes support frame one (1), fixed connection in walk material platform (3) at support frame one (1) top, set up in walk separation module (4) that are used for separating many semiconductor device (9) of material platform (3) one end, its characterized in that: the semiconductor device sorting device comprises a sorting module (4), and is characterized by further comprising a receiving component (5) for receiving a plurality of separated juxtaposed semiconductor devices (9), wherein a feeding cavity (31) for feeding the semiconductor devices (9) is formed in the feeding platform (3) along the length direction of the feeding platform, a feeding track (32) for supporting the semiconductor devices (9) is arranged on the inner bottom surface of the feeding cavity (31), a strip-shaped notch (36) communicated with the feeding cavity (31) is formed in the upper surface of the feeding platform (3) at a position close to the sorting module (4), the sorting module (4) comprises a thrust component (41) positioned on one side of the strip-shaped notch (36) and a driving component (42) for driving the thrust component (41) to reciprocate along the vertical direction, and the thrust component (41) comprises a pressing clamp (413) capable of extending into or separating from the strip-shaped notch (36) along the vertical direction; an air injection channel (34) communicated with the upper surface of the feeding track (32) is arranged in the feeding platform (3), the other end of the air injection channel (34) is communicated with a compressed air source, and the air injection channel (34) is obliquely arranged towards the feeding direction of the semiconductor device (9).

2. A multiple semiconductor device separating mechanism according to claim 1, wherein: the top of support frame one (1) still fixedly connected with clearance subassembly (6), clearance subassembly (6) including fixed connection in clean motor (61) on support frame one (1) and fixed cover are located brush dish (62) on clean motor (61) output shaft, the outer periphery of brush dish (62) lower part stretches into in bar notch (36) and with the upper surface of semiconductor device (9) contacts.

3. A multiple semiconductor device separating mechanism according to claim 1, wherein: the anti-thrust assembly (41) is arranged on the support frame II (2), the anti-thrust assembly (41) comprises an adjusting block (411) fixedly arranged on the support frame II (2) and a cam follower block (412) hinged to the adjusting block (411), the adjusting block (411) is close to a mounting groove (4111) for accommodating the cam follower block (412) is formed in the side face of the feeding platform (3), the cam follower block (412) is far away from a pressure spring (414) is arranged between one end of the bearing assembly (5) and the lower side wall of the mounting groove (4111), and the other end of the cam follower block (412) is fixedly connected with the pressing clamp (413).

4. A multiple semiconductor device separating mechanism according to claim 3, wherein: the driving assembly (42) comprises a motor mounting seat (421) fixedly connected to the second supporting frame (2), and a driving motor (422) mounted on the motor mounting seat (421), wherein an output shaft of the driving motor (422) is fixedly connected with a rocker (423) horizontally arranged, a first cam follower (426) vertically arranged is mounted at the other end of the rocker (423), a bearing table (424) is slidably arranged on the motor mounting seat (421) along the feeding direction, a connecting plate (425) is fixedly connected to the bearing table (424), and a containing notch (4251) matched with the first cam follower (426) is formed in one end of the connecting plate (425); the bearing table (424) is provided with a second cam follower (427) which is horizontally arranged, and the end surface of the cam follower block (412) close to the connecting plate (425) is provided with a slope surface (4121) which is contacted with the second cam follower (427).

5. A multiple semiconductor device separating mechanism according to claim 4, wherein: the receiving assembly (5) comprises a material waiting block (51) fixedly connected to the receiving table (424), and a limiting block (52) fixedly connected to one end, far away from the feeding platform (3), of the material waiting block (51); and the material waiting block (51) is integrally formed with a receiving rail (511) which is used for being butted with the material conveying rail (32).

6. A multiple semiconductor device separating mechanism according to claim 5, wherein: the bearing rail (511) is provided with a plurality of air passage holes (512) at intervals along the length direction, a plurality of negative pressure channels (4242) which are communicated with the air passage holes (512) are formed in the bearing table (424), and the negative pressure channels (4242) are communicated with a negative pressure source through negative pressure pipes (4243).

7. A multiple semiconductor device separating mechanism according to claim 6, wherein: the side surface of the limiting block (52) close to the feeding platform (3) is provided with a negative pressure groove (521), and the negative pressure groove (521) is communicated with the negative pressure channel (4242).

8. A multiple semiconductor device separating mechanism according to claim 4, wherein: the position department of accepting platform (424) is provided with compresses tightly subassembly (8), compress tightly subassembly (8) including vertical setting cylinder mount pad (81), install in drive cylinder (82) on cylinder mount pad (81), fixed connection in fixed plate (83) on the piston rod of drive cylinder (82), slidable mounting in on accepting platform (424) and with fixed plate (83) fixed connection's door type support (84), fixed connection in be used for on door type support (84) with briquetting (85) of semiconductor device (9) butt.

9. A multiple semiconductor device separating mechanism according to claim 4, wherein: the optical fiber sensor is characterized in that an optical fiber mounting seat (7) is fixedly connected to the bearing table (424), a first photoelectric sensor (71) is mounted on the optical fiber mounting seat (7), a plurality of sensing holes (72) for allowing a detection light path to pass through are formed in two inner side walls of the optical fiber mounting seat (7), and the sensing holes (72) correspond to the positions of the semiconductor devices (9).

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