CN218918829U - Wafer fixing assembly and wafer marking equipment - Google Patents
Wafer fixing assembly and wafer marking equipment Download PDFInfo
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- CN218918829U CN218918829U CN202222868802.7U CN202222868802U CN218918829U CN 218918829 U CN218918829 U CN 218918829U CN 202222868802 U CN202222868802 U CN 202222868802U CN 218918829 U CN218918829 U CN 218918829U
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- 238000003825 pressing Methods 0.000 claims abstract description 49
- 235000012431 wafers Nutrition 0.000 abstract description 219
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application relates to the field of mechanical equipment, and relates to a wafer fixing assembly and wafer marking equipment. The wafer fixing assembly comprises a vacuum chuck and a first wafer pressing ring, wherein the first wafer pressing ring is detachably connected with the body, and the first wafer pressing ring is positioned around the vacuum chuck. Even if the wafer warpage is serious, the first wafer press ring can correct partial warpage, so that the gap between the wafer and the vacuum chuck is reduced, good contact between the wafer and the vacuum chuck is ensured, and the vacuum chuck can well adsorb the wafer. In addition, the wafer holding assembly of the present application may be used to position wafers of various sizes. The suitability of the wafer-holding assembly can be increased.
Description
Technical Field
The application relates to the field of mechanical equipment, in particular to a wafer fixing assembly and wafer marking equipment.
Background
In the chip manufacturing process, a mark is required to be prepared for a wafer so as to facilitate management, reading and the like of chip information. In the process of preparing the identification, the wafer needs to be positioned, but the positioning of the wafer is not easy due to the special nature of the material.
For example, CN202011512291.4 discloses a structure for achieving rapid wafer positioning. The vacuum chuck comprises a rotary power unit, a vacuum adsorption unit and a positioning ring, wherein the positioning ring is sleeved outside the vacuum chuck and covers part of the adsorption hole, so that the positioning ring is adsorbed on the vacuum chuck under the action of a vacuum generator, and the inner diameter of the positioning ring is matched with the outer diameter of a wafer to be positioned.
However, the wafer is liable to warp, and the vacuum suction unit cannot perform good suction on the wafer with serious warp.
Disclosure of Invention
An object of an embodiment of the present application is to provide a wafer fixing component and a wafer marking apparatus, which aim to position a wafer with serious warpage.
The application provides a wafer fixing assembly, the wafer fixing assembly includes:
a body;
the vacuum chuck is connected with the body; and
the first wafer clamping ring is detachably connected with the body and is positioned around the vacuum chuck.
In some embodiments of the present application, the wafer fixing assembly further includes a plurality of vacuum nozzles, and the plurality of vacuum nozzles are spaced around the vacuum chuck.
In some embodiments of the present application, the first wafer pressure ring is detachably connected to the body by magnetic attraction.
In some embodiments of the present application, the first wafer pressure ring is a closed loop structure.
In some embodiments of the present application, the wafer holding assembly further comprises a wafer positioning ring and a second wafer clamping ring; the second wafer pressing ring and the wafer positioning plate are detachably connected with the body, the wafer positioning ring is located at the inner ring of the first wafer pressing ring, and the second wafer pressing ring is located at the inner ring of the wafer positioning ring.
In some embodiments of the present application, the wafer positioning ring is an open loop structure.
In some embodiments of the present application, the wafer positioning ring includes a ring body and a flange connected to each other, the flange for abutting the wafer.
In some embodiments of the present application, the second wafer ring is in a closed loop structure.
In some embodiments of the present application, the wafer fixing assembly further includes a positioning shaft, the positioning shaft is connected to the body, and when the first wafer press ring is in a connection state with the body, the first wafer press ring is abutted to the positioning shaft.
The application also provides wafer marking equipment, the wafer marking equipment comprises a marking component and the wafer fixing component.
The wafer fixing assembly and the wafer marking equipment provided by the embodiment of the application have the beneficial effects that:
after the wafer can be abutted by the vacuum chuck, the negative pressure in the vacuum chuck can enable the wafer to be adsorbed, so that the effect of initial positioning is achieved. If the wafer warps severely, the gap between the wafer and the vacuum chuck may lose the positioning function of the negative pressure. In the embodiment of the application, the periphery of the wafer is pressed by adopting a first wafer pressing ring. Even if the wafer warpage is serious, the first wafer press ring can correct partial warpage, so that the gap between the wafer and the vacuum chuck is reduced, good contact between the wafer and the vacuum chuck is ensured, and the vacuum chuck can well adsorb the wafer.
In some embodiments, the wafer holding assembly may be used to position wafers of different sizes. For example, a wafer holding assembly may be used to position 8 inch wafers and 12 inch wafers. The suitability of the wafer-holding assembly can be increased. The same wafer fixing assembly can fix wafers with different sizes.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a wafer fixing assembly according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a first wafer pressing ring according to an embodiment of the present application.
Fig. 3 is an enlarged schematic view at a in fig. 1.
Fig. 4 is a schematic structural diagram of a wafer positioning ring according to an embodiment of the present application.
Fig. 5 is a schematic structural diagram of a wafer positioning ring and a second wafer pressing ring according to an embodiment of the present application.
Icon: 100-wafer holding assembly; 101-positioning a shaft; 110-body; 120-vacuum chuck; 130-a first wafer press ring; 140-vacuum nozzle; 150-a wafer positioning ring; 151-ring body; 152-flanges; 160-a second wafer press ring.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, as provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the embodiments of the present application, it should be understood that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like indicate orientations or positional relationships based on those shown in the drawings, or those conventionally put in place when the product of the application is used, or those conventionally understood by those skilled in the art, merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the application.
Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
In the description of the embodiments of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.
Examples
Fig. 1 is a schematic structural diagram of a wafer fixing assembly 100 according to an embodiment of the present application, referring to fig. 1, the embodiment provides a wafer fixing assembly 100, and the wafer fixing assembly 100 is used for positioning a wafer.
The wafer fixing assembly 100 includes a body 110, a vacuum chuck 120, and a first wafer pressing ring 130. The vacuum chuck 120 is connected with the body 110; the first wafer pressing ring 130 is detachably connected to the body 110, and the first wafer pressing ring 130 is located around the vacuum chuck 120.
Therefore, after the wafer is abutted with the vacuum chuck 120, the negative pressure in the vacuum chuck 120 can enable the wafer to be adsorbed, so that the effect of initial positioning is achieved. If the wafer warps severely, the gap between the wafer and the vacuum chuck 120 may lose the positioning function of the negative pressure. In the embodiment of the present application, the first wafer pressing ring 130 is used to press the periphery of the wafer. Even if the wafer warpage is serious, the first wafer press ring 130 can correct part of the warpage, so that the gap between the wafer and the vacuum chuck 120 is reduced, good contact between the wafer and the vacuum chuck 120 is ensured, and the vacuum chuck 120 can absorb the wafer well.
In some embodiments of the present application, the wafer fixing assembly 100 further includes a plurality of vacuum suction nozzles 140, and the plurality of vacuum suction nozzles 140 are spaced around the vacuum chuck 120. The vacuum nozzle 140 is provided on the surface of the vacuum chuck 120.
Fig. 2 is a schematic structural diagram of a first wafer pressing ring 130 according to an embodiment of the present application.
The shape of the first wafer pressing ring 130 is not limited in the embodiment of the present application, and in the embodiment of the present application, the first wafer pressing ring 130 is in a closed-loop structure.
In other embodiments of the present application, the first wafer clamping ring 130 may be an open loop structure. In some embodiments, the first wafer pressing ring 130 may be irregularly shaped, and the first wafer pressing ring 130 may press the wafer surface.
In the embodiment of the present application, the size of the first wafer pressing ring 130 is not limited, and in the embodiment of the present application, the first wafer pressing ring 130 is used to press the periphery of a 12 inch wafer. Therefore, the inner diameter of the first wafer press ring 130 is smaller than 12 inches, and the outer diameter of the first wafer press ring 130 is larger than 12 inches.
It is understood that, in embodiments in which the first wafer press ring 130 is used to press wafers of other sizes, the size of the first wafer press ring 130 may be adjusted accordingly.
The detachable connection manner of the first wafer pressing ring 130 and the body 110 is not limited in the embodiment of the present application.
For example, in the embodiment of the present application, the first wafer pressing ring 130 is detachably connected to the body 110 through magnetic attraction. The magnetic attraction can be quickly assembled and disassembled, so that the magnetic attraction speed is higher in the process that the first wafer pressing ring 130 and the body 110 are detachable.
In other embodiments of the present application, the first wafer clamping ring 130 and the body 110 may be detachably connected in other manners. For example, the first wafer pressing ring 130 is engaged with the body 110 by a fastening, a threaded connection, or the like.
Fig. 3 is an enlarged schematic view of fig. 1 a, referring to fig. 3, in some embodiments of the present application, the wafer fixing assembly 100 further includes a positioning shaft 101, the positioning shaft 101 is connected to the body 110, and when the first wafer pressing ring 130 is in a connected state with the body 110, the first wafer pressing ring 130 abuts against the positioning shaft 101.
In this way, the positioning shaft 101 can position the mounting position of the first wafer pressing ring 130, which is beneficial to rapid mounting of the first wafer pressing ring 130.
The number of positioning shafts 101 is not limited in this embodiment, and for example, the number of positioning shafts 101 may be 2, 3 or more, and the plurality of positioning shafts 101 may be distributed at intervals along the circumference of the vacuum chuck 120.
The structure of the positioning shaft 101 is not limited in the embodiment of the present application, for example, in the embodiment of the present application, the positioning shaft 101 may have a columnar structure.
In the process of placing the wafer, the wafer can be adsorbed by the vacuum nozzle 140 arranged on the surface of the vacuum chuck 120, so that the wafer is adsorbed by the vacuum chuck 120 after approaching the vacuum chuck 120, and the vacuum nozzle 140 has the function of pre-positioning, thereby increasing the positioning efficiency and assisting the use of the vacuum chuck 120.
The number of vacuum nozzles 140 is not limited in the embodiments of the present application, and may be 2, 3, 4, or more, for example.
In some embodiments of the present application, vacuum nozzle 140 and vacuum chuck 120 may be configured with a pressure detector for detecting pressure within vacuum nozzle 140 and vacuum chuck 120.
Further, in some embodiments, the pressure detector may be configured with an alarm.
When the pressure detected by the pressure detector is not within the preset range, the alarm gives an alarm. In this manner, the alarm can monitor whether the pressure within the vacuum nozzle 140 and vacuum cup 120 is within a preset range.
In some embodiments of the present application, the wafer holding assembly 100 may be used to position wafers of different sizes. The wafer holder assembly 100 may be used to position 8 inch wafers and 12 inch wafers. The suitability of the wafer holding assembly 100 may be increased. The same wafer holding assembly 100 may hold wafers of different sizes.
The embodiment of the application does not limit the size of the wafer to be fixed. The embodiments of the present application are described with wafer sizes of 8 inches and 12 inches as examples.
The wafer holder assembly 100 further includes a wafer retaining ring 150 and a second wafer clamping ring 160; the wafer positioning ring 150 and the second wafer pressing ring 160 are both detachably connected to the body 110. The wafer positioning ring 150 is positioned at the inner periphery of the first wafer pressing ring 130, and the second wafer pressing ring 160 is positioned at the inner periphery of the wafer positioning ring 150.
The wafer positioning ring 150 and the second wafer clamping ring 160 are used to hold one size wafer. The first wafer press ring 130 is used to hold another size wafer. The following is an example of a first wafer clamping ring 130 for holding a 12 inch wafer, and a wafer retaining ring 150 and a second wafer clamping ring 160 for holding an 8 inch wafer.
When the wafer positioning ring 150 and the second wafer pressing ring 160 are used for fixing an 8-inch wafer, the wafer positioning ring 150 and the second wafer pressing ring 160 are respectively located on two opposite sides of the wafer. The wafer positioning ring 150 is abutted against the outer periphery of the 8-inch wafer, and the second wafer pressing ring 160 presses the periphery of the 8-inch wafer.
The shapes of the wafer positioning ring 150 and the second wafer pressing ring 160 are not limited in the embodiments of the present application.
Fig. 4 is a schematic structural diagram of a wafer positioning ring 150 according to an embodiment of the present application, and in fig. 4, the wafer positioning ring 150 is an open loop structure. In this manner, the weight and materials of wafer positioning ring 150 may be reduced.
The embodiment of the present application does not limit the radian of the ring of the wafer positioning ring 150, and is set according to actual requirements.
In fig. 4, wafer positioning ring 150 includes ring 151 and flange 152, ring 151 and flange 152 being connected to each other. In use, flange 152 abuts an 8 inch wafer.
Thus, flange 152 limits the position of the 8 inch wafer, defining the position of the 8 inch wafer.
The number of flanges 152 is not limited in this embodiment, and in fig. 4, the number of flanges 152 is 2, and it is understood that in other embodiments of this application, the number of flanges 152 may be 3, 4, or more.
The shape of the flange 152 is not limited in this embodiment, and in fig. 4, the end of the flange 152 has an arc transition, and in other embodiments of the present application, the flange 152 may have other shapes, which is not limited in this embodiment.
Fig. 5 is a schematic structural diagram of a wafer positioning ring 150 and a second wafer pressing ring 160 according to an embodiment of the present application, and in fig. 5, the second wafer pressing ring 160 is in a closed-loop structure. In other words, the second wafer pressing ring 160 is in an end-to-end structure.
Thus, the second wafer press ring 160 can position the periphery of the 8-inch wafer, so that the periphery of the 8-inch wafer is in good contact with the vacuum chuck 120, and the 8-inch wafer can be well positioned.
The detachable connection manner of the second wafer pressing ring 160 and the body 110 is not limited in the embodiment of the present application.
For example, in an embodiment of the present application, the second wafer ring 160 is detachably connected to the body 110 by magnetic attraction. The magnetic attraction can be quickly installed and removed, so that the magnetic attraction speed is higher in the process that the second wafer pressing ring 160 is detachable from the body 110.
In other embodiments of the present application, the second wafer ring 160 may be detachably connected to the body 110 in other manners. For example, the second wafer pressing ring 160 is engaged with the body 110 by a fastening, screwing, or the like.
Similarly, in other embodiments of the present application, the wafer positioning ring 150 is detachably connected to the body 110 by magnetic attraction. Alternatively, the wafer positioning ring 150 and the body 110 may be detachably connected by a clamping connection, a threaded connection, or the like, which will not be described herein.
It should be further noted that, in the embodiments of the present application, wafers with different sizes may be positioned, so that the distance between the wafer and the vacuum chuck 120 is reduced, and thus the vacuum chuck 120 has a good adsorption effect on the wafer. Even if the wafer is warped, the wafer can be well fixed by the second wafer pressing ring 160 or the first wafer pressing ring 130.
Similarly, in some embodiments of the present application, the wafer holder assembly 100 may also be used to position single-particle chips, and the structure is similar.
For example, a chip positioning plate is provided, and the chip positioning plate is detachably connected with the body 110.
The chip positioning plate is used for limiting the mounting position of the chip. And positioning the chip.
A chip pressing plate is provided for pressing the chip so that the chip is sucked by the vacuum chuck 120.
Thus, the problem that the chip is difficult to adsorb due to the warpage of the chip can be avoided.
The wafer fixing assembly 100 provided by the embodiment of the application can position a wafer with serious warping problem, so that the vacuum adsorption disc has excellent adsorption effect on the wafer.
In addition, the wafer positioning ring 150 and the second wafer pressing ring 160 can hold and position a wafer of one size. The first wafer press ring 130 may hold and position wafers of another size. The same wafer holding assembly 100 may hold wafers of different sizes. The wafer holder assembly 100 may be used to position wafers of different sizes. The suitability of the wafer holding assembly 100 may be increased.
The embodiment of the application also provides a wafer marking device, which comprises a marking component and the wafer fixing component 100. Since the wafer fixing assembly 100 has a good fixing effect on the wafer, even the chips having serious warpage can be well fixed. Therefore, the wafer marking equipment has high efficiency in the process of preparing the marks for the wafer, and the marks are not easy to deviate.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims (10)
1. A wafer holding assembly, the wafer holding assembly comprising:
a body;
the vacuum chuck is connected with the body; and
the first wafer clamping ring is detachably connected with the body and is positioned around the vacuum chuck.
2. The wafer holding assembly of claim 1, further comprising a plurality of vacuum nozzles spaced around the periphery of the vacuum chuck.
3. The wafer holding assembly of claim 1, wherein the first wafer press ring is detachably coupled to the body by magnetic attraction.
4. The wafer holding assembly of claim 3, wherein the first wafer clamping ring is a closed loop structure.
5. The wafer holding assembly of any one of claims 1-4, further comprising a wafer retaining ring and a second wafer press ring; the second wafer pressing ring and the wafer positioning plate are detachably connected with the body, the wafer positioning ring is located at the inner ring of the first wafer pressing ring, and the second wafer pressing ring is located at the inner ring of the wafer positioning ring.
6. The wafer holding assembly of claim 5, wherein the wafer positioning ring is an open loop structure.
7. The wafer holding assembly of claim 5, wherein the wafer positioning ring comprises a ring body and a flange connected to each other, the flange adapted to abut a wafer.
8. The wafer holding assembly of claim 5, wherein the second wafer clamping ring is a closed loop structure.
9. The wafer holding assembly of claim 1, further comprising a positioning shaft coupled to the body, the first wafer press ring abutting the positioning shaft when the first wafer press ring is coupled to the body.
10. A wafer marking apparatus comprising a marking assembly and a wafer holding assembly according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222868802.7U CN218918829U (en) | 2022-10-28 | 2022-10-28 | Wafer fixing assembly and wafer marking equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222868802.7U CN218918829U (en) | 2022-10-28 | 2022-10-28 | Wafer fixing assembly and wafer marking equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218918829U true CN218918829U (en) | 2023-04-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222868802.7U Active CN218918829U (en) | 2022-10-28 | 2022-10-28 | Wafer fixing assembly and wafer marking equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218918829U (en) |
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2022
- 2022-10-28 CN CN202222868802.7U patent/CN218918829U/en active Active
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