CN219066795U - Carrier assembly and processing equipment - Google Patents

Abstract

Embodiments of the present utility model provide a carrier assembly and a processing apparatus. The carrier assembly includes: a mounting plate; the fixed ring is arranged above the mounting plate; and the sucker is arranged on the fixed ring, the fixed ring surrounds the sucker along the circumferential direction, the top surface of the sucker is provided with an adsorption groove, the fixed ring is provided with an air passage communicated with the adsorption groove, the air passage of the fixed ring is connected with an air passage connector, and the air passage connector is positioned on the radial outer side of the mounting disc and the sucker. If the gas circuit joint is abnormal or air leakage occurs, the gas circuit joint can be directly disassembled, so that the gas circuit joint can be checked or replaced. Thus, the entire carrier assembly does not need to be removed. Thus, the workload of maintenance personnel is reduced, and the maintenance cost of the carrier assembly is reduced. Based on this, the air pipe connected to the air passage joint can also be located at least partially radially outside, so that the stage assembly provides the possibility of facilitating inspection or replacement of the air pipe.

Description

Carrier assembly and processing equipment

Technical Field

The utility model relates to the technical field of material processing, in particular to a carrier assembly and processing equipment with the same.

Background

In the field of material processing, such as semiconductor devices (e.g., wafers), a dicing process for semiconductor devices is an important process. There are generally two cutting modes: one is knife wheel cutting and the other is laser cutting. Taking laser dicing (also known in the industry as stealth dicing, abbreviated as stealth dicing) as an example, a blast point is formed by focusing a laser beam inside a wafer. Micro-cracks are formed in the wafer by precisely controlling the distance between the focusing objective lens and the surface of the wafer, and then adjacent crystal grains are separated by a chopper or vacuum splinter.

The laser processing apparatus includes a stage. When the wafer is cut, the wafer needs to be carried on the sucker of the carrier. The carrier is provided with an air passage joint. Through extracting air to the gas circuit joint to make the last negative pressure environment that forms of sucking disc, and then make the wafer adsorb on the sucking disc.

However, the conventional laser processing apparatus has the following drawbacks: the air passage joint is positioned below the sucker of the carrier. If the gas circuit joint is abnormal or leaks, the whole carrier needs to be removed. The maintenance cost of the carrier is very high.

Disclosure of Invention

In order to at least partially solve the problems with the prior art, according to one aspect of the present utility model, a carrier assembly is provided. The carrier assembly includes: a mounting plate; the fixing ring is arranged above the mounting plate; and the sucker is arranged on the fixed ring, the fixed ring surrounds the sucker along the circumferential direction, the top surface of the sucker is provided with an adsorption groove, the fixed ring is provided with an air passage communicated to the adsorption groove, the air passage of the fixed ring is connected with an air passage connector, and the air passage connector is positioned on the radial outer side of the mounting plate and the sucker.

Illustratively, an annular table protruding inwards is arranged at the bottom of the inner peripheral surface of the fixing ring, the sucker is arranged on the annular table, a gap is arranged between the top of the outer peripheral surface of the sucker and the inner peripheral surface of the fixing ring, and the gap is communicated between the suction groove and the air passage.

Illustratively, the top of the inner peripheral surface of the retaining ring has a radially outwardly recessed groove that forms the gap.

Illustratively, the gaps are a plurality and are spaced around the suction cup, the bottom of the outer peripheral surface of the suction cup being spaced from the inner peripheral surface of the retaining ring to form an annular air cavity that communicates with a plurality of the gaps.

Illustratively, the air passage includes a first air passage and a second air passage, one end of the first air passage faces radially inward and is communicated with the adsorption groove, the other end of the first air passage is connected to one end of the second air passage, and the other end of the second air passage faces downward and is connected to the air passage joint.

Illustratively, the mounting plate includes a mounting seat and a base, the retaining ring is disposed above the mounting seat, and the mounting seat is disposed above the base.

Illustratively, the base is provided with a channel, the air passage connector is L-shaped, one end of the air passage connector is connected to the air passage upwards, and the other end of the air passage connector faces the channel.

Illustratively, the suction groove extends to an outer peripheral surface of the suction cup.

Illustratively, the adsorption tank includes: a first suction groove extending from a central region of the top surface to an outer peripheral surface of the suction cup; and a plurality of second adsorption grooves extending in a circumferential direction of the suction cup, the plurality of second adsorption grooves being communicated to the first adsorption groove.

Illustratively, the stationary ring is provided with an electromagnet and/or an upwardly directed nozzle assembly.

According to another aspect of the present utility model, there is also provided a processing apparatus. The processing apparatus comprises a stage assembly as described in any one of the above.

According to the carrier assembly provided by the embodiment of the utility model, as the air passage connector is positioned on the radial outer sides of the mounting disc and the sucker, if the air passage connector is abnormal or leaks air, the air passage connector can be directly disassembled, so that the air passage connector can be inspected or replaced. Thus, the entire carrier assembly does not need to be removed. Thus, the workload of maintenance personnel is reduced, and the maintenance cost of the carrier assembly is reduced. Based on this, the air pipe connected to the air passage joint may also be located at least partially radially outside said radial direction, so that the stage assembly facilitates inspection or replacement of the air pipe.

In the summary, a series of concepts in a simplified form are introduced, which will be further described in detail in the detailed description section. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

Advantages and features of the utility model are described in detail below with reference to the accompanying drawings.

Drawings

The following drawings are included to provide an understanding of the utility model and are incorporated in and constitute a part of this specification. Embodiments of the present utility model and their description are shown in the drawings to explain the principles of the utility model. In the drawings of which there are shown,

fig. 1 is a perspective view of a processing apparatus according to an exemplary embodiment of the present utility model;

FIG. 2 is a perspective view of a stage assembly according to an exemplary embodiment of the present utility model;

FIG. 3 is a top view of the stage assembly shown in FIG. 2;

FIG. 4 is a cross-sectional view of the stage assembly shown in FIG. 2;

FIG. 5 is a perspective view of a stage assembly according to another exemplary embodiment of the present utility model;

FIG. 6 is a top view of the stage assembly shown in FIG. 5; and

fig. 7 is a cross-sectional view of the stage assembly shown in fig. 5.

Wherein the above figures include the following reference numerals:

100. 100', a stage assembly; 200. a mounting plate; 210. a mounting base; 220. a base; 221. a channel; 300. a fixing ring; 310. an airway; 311. a first airway; 312. a second airway; 320. an annular table; 330. a gap; 340. a groove; 350. an annular air cavity; 360. an electromagnet; 370. a suction nozzle assembly; 371. a first suction nozzle; 372. a second suction nozzle; 380. a reversing valve; 400. a suction cup; 410. an adsorption tank; 411. a first adsorption tank; 412. a second adsorption tank; 500. the gas circuit joint; 600. a rotary driving member; 710. a first fixed limiting piece; 720. the second fixed limiting piece; 730. a movable limiting member; 740. a sensor; 750. a base; 900. processing equipment; 910. feeding and discharging devices; 920. a carrying device; 930. an anti-falling device; 940. a positioning device; 950. a material taking and discharging device; 951. a first material taking and discharging assembly; 952. the second material taking and discharging assembly; 953. a rotary driving member; 960. a processing device; 961. a Z-axis motion mechanism; 962. an optical path mechanism.

Detailed Description

In the following description, numerous details are provided to provide a thorough understanding of the utility model. However, it will be understood by those skilled in the art that the following description illustrates preferred embodiments of the utility model by way of example only and that the utility model may be practiced without one or more of these details. Furthermore, some technical features that are known in the art have not been described in detail in order to avoid obscuring the utility model.

According to one aspect of the utility model, a carrier assembly is provided. The stage assembly may be employed in any suitable apparatus including, but not limited to, a processing apparatus or a transfer apparatus. Thus, according to another aspect of the present utility model, there is also provided a processing apparatus. Machining equipment includes, but is not limited to, laser machining equipment. The processing equipment can carry out feeding, processing, discharging and other treatments on the materials. The stage assembly and the processing apparatus according to the embodiments of the present utility model are described in detail below with reference to specific embodiments.

As shown in fig. 2-4, the carrier assembly 100 may include a mounting plate 200, a retaining ring 300, a suction cup 400, and an air path adapter 500.

The retaining ring 300 may be disposed over the mounting plate 200 by welding, adhesive, or a connection by any suitable means. The securing ring 300 may have an air passage 310 provided thereon. The shape of the extension of the airway 310 may be arbitrary, including but not limited to rectilinear, polyline, or arcuate, etc.

The suction cup 400 may be provided on the retaining ring 300 by any suitable means, such as welding, adhesive, or a connector connection. The fixing ring 300 may surround the suction cup 400 in a circumferential direction of the suction cup 400. Suction cup 400 may employ various types of suction cups known in the art or that may occur in the future, including but not limited to glass suction cups or polymeric suction cups. Preferably, the glass sucker can be made of h-k9 material, so that the glass sucker has the advantages of high plane precision, high light transmittance and the like, and meets the requirements of processing (especially laser processing). The h-k9 materials are known to those skilled in the art, and the improvement of the present utility model is not the materials themselves, and they will not be described in detail herein in order to avoid obscuring. The chuck 400 may be used to hold any suitable material such as wafers.

The top surface of the suction cup 400 may be provided with a suction groove 410. The adsorption groove 410 may be formed by any suitable processing means such as etching. The adsorption tank 410 may be used to adsorb materials. Desirably, the top surface of the retaining ring 300 may be lower than the top surface of the suction cup 400. So configured, when material is placed on the suction cup 400, contact with the retaining ring 300 can be avoided, thereby preventing damage.

The wafer has the characteristics of fragility and easy scratching, and has high requirements on cleanliness of storage and processing environments, so that an iron ring and a blue film are generally adopted as carriers of the wafer in the industry. The blue film can be used for connecting the wafer and the iron ring in a bonding mode. The iron ring may be located on the outer peripheral side of the wafer. The adsorption tank 410 may adsorb the blue film to thereby realize indirect adsorption of the wafer.

The shape of the adsorption groove 410 may be arbitrary, including but not limited to circular, elliptical, hexagonal, etc. The adsorption groove 410 may be connected to the air passage 310 on the fixing ring 300. In some embodiments, the suction groove 410 may extend to the outer circumferential surface of the suction cup 400. So configured, the adsorption groove 410 may facilitate communication to the air passage 310 on the fixing ring 300.

In some embodiments, the adsorption tank 410 may include a first adsorption tank 411 and a plurality of second adsorption tanks 412. The first adsorption groove 411 may extend from a central region of the top surface of the suction cup 400 to the outer circumferential surface of the suction cup 400. The first adsorption tank 411 may be linear or arc-shaped, etc. Illustratively, the first adsorption slots 411 may be provided in pairs. The middle portions of each pair of first adsorption slots 411 may be bent away from each other in the circumferential direction. As such, each pair of first adsorption slots 411 may have a generally petal shape. The plurality of second suction grooves 412 may extend in the circumferential direction of the suction cup 400, respectively. Thus, the plurality of second adsorption grooves 412 may have a plurality of substantially circular shapes. The plurality of second adsorption tanks 412 may be connected to the first adsorption tank 411. In this way, the length of the adsorption groove 410 is longer, so that the adsorption force to the material can be improved, thereby improving the reliability of adsorption. In addition, the structure of the adsorption tank 410 is symmetrical, so that the adsorption force can be more uniform.

The air circuit connection 500 may employ various types of air circuit connections known in the art or that may occur in the future, including but not limited to quick or snap-fit connections, and the like. The shape of the air path joint 500 can be arbitrary, for example, a direct joint or an elbow joint. The air passage connection 500 may be connected to the air passage 310 on the stationary ring 300 by any suitable means, such as a threaded connection. In this manner, the air passage connector 500 may be connected to the suction groove 410 on the suction cup 400 through the air passage 310.

The air passage joint 500 may communicate with an external air passage member through an air passage. The air passage member may communicate with the adsorption tank 410 through the air pipe, the air passage joint 500 and the air passage 310 in sequence. The air path part comprises, but is not limited to, a first vacuum extractor, a first air source and the like. The first vacuumizer includes, but is not limited to, a vacuum generator. In this way, the first vacuumizer may suck the air in the adsorption tank 410, so that a negative pressure environment is formed at the adsorption tank 410. Thus, the material may be adsorbed on the suction cup 400 under the external atmospheric pressure. In this manner, the carrier assembly 100 can be implemented to hold material and thereby move the material. And, the related components can process the material. In the embodiment where the material is a wafer, since the iron ring is connected to the wafer through the blue film, and the blue film is soft and elastic, the blue film can be always in a tight state when the wafer is placed on the chuck 400, so that the blue film can cover the top surface of the entire chuck 400. After the air in the adsorption groove 410 is pumped away, the blue film can rapidly fill the adsorption groove 410, so that the wafer can be adsorbed on the chuck 400. The first air source may be fed to eliminate the negative pressure environment at the adsorption tank 410. In this way, material can be removed from the suction cup 400.

The number of air circuit connectors 500 may be any number, including but not limited to two as shown, for example, one, three, or more. In embodiments where the air circuit connection 500 is multiple, the multiple air circuit connections 500 may be the same or different. A plurality of air path connectors 500 may be respectively connected to the air paths 310 on the fixing ring 300. In other words, a plurality of air path connectors 500 may be arranged in parallel. By providing a plurality of air path connectors 500, the flow rate of the air suction and the air supply can be improved, and thus the working efficiency of the stage assembly 100 can be improved.

The air passage connection 500 may be located radially outward of the mounting plate 200 and the suction cup 400. In an embodiment where the number of the air path connectors 500 is plural, the plurality of air path connectors 500 may be sequentially distributed along the radial outer side. In the embodiment shown in the figures, two air circuit connectors 500 may be disposed opposite in the radial direction.

Therefore, in the carrier assembly 100 according to the embodiment of the present utility model, since the air path connector 500 is located at the radial outer side of the mounting plate 200 and the suction plate 400, if an abnormality or air leakage occurs in the air path connector 500, the air path connector 500 can be directly disassembled for inspection or replacement. Thus, the entire carrier assembly 100 need not be removed. In this way, the maintenance personnel effort is reduced and the maintenance cost of the carrier assembly 100 is reduced. Based on this, the air tube connected to the air circuit joint 500 may also be located at least partially radially outward of the air circuit joint, so that the stage assembly 100 facilitates inspection or replacement of the air tube.

In some embodiments, as shown in fig. 1, the carrier assembly 100 may be applied to a processing apparatus 900. The processing apparatus 900 may include a loading and unloading device 910, a handling device 920, an anti-drop device 930, a positioning device 940, a taking and placing device 950, and a processing device 960. The loading and unloading device 910 may be used to store materials (including materials to be processed and processed materials). The handling device 920 may handle material between the loading and unloading device 910 and a target location. The drop prevention device 930 may be disposed between the loading and unloading device 910 and the target position. The handling device 920 is configured to handle the material during handling of the material, and the anti-drop device 930 is configured to support the material, thereby preventing the material from dropping. After the conveying device 920 conveys the material to be processed to the target position, the positioning device 940 can adjust the posture of the material to be processed and convey the material to be processed to the waiting position. The pick and place device 950 may pick up the material to be processed in the waiting position and then carry the material to the suction cup 400 of the stage assembly 100 of the processing device 960. The first vacuumizer may then pump air, thereby creating a negative pressure environment at the suction tank 410. In this way, the material to be processed may be sucked on the suction cup 400. In this manner, the carrier assembly 100 can secure and move the material to be processed. The machining device 960 may further include a Z-axis movement mechanism 961 and an optical path mechanism 962. The stage assembly 100 may move the material to be processed below the Z-axis motion mechanism 961 and the optical path mechanism 962. The Z-axis motion mechanism 961 and the optical path mechanism 962 may process a material to be processed to form a processed material. After processing is complete, the carrier assembly 100 may move the processed material under the pick and place device 950. The first air source may then be fed to eliminate the negative pressure environment at the adsorption tank 410. In this way, the pick and place device 950 can pick up the processed material on the suction cup 400 and then carry it to a waiting position. Positioning device 940 may then adjust the attitude of the processed material at the waiting position and carry the processed material to the target location. The handling device 920 may handle the processed material at the target location to the loading and unloading device 910. The processing tool 900 may cycle through the operations described above to process more material.

In particular, pick and place device 950 may include a first pick and place assembly 951, a second pick and place assembly 952, and a rotational drive 953. The drive shaft of the rotary drive 953 may be connected to a first pick and place assembly 951 and a second pick and place assembly 952. In this way, the rotary drive 953 may drive the first pick and place assembly 951 and the second pick and place assembly 952 to alternately move along an arcuate path over the waiting position and over the carrier assembly 100, thereby alternately transporting the waiting position of the material to be processed and the processed material on the carrier assembly 100.

In some embodiments, as shown in fig. 4, the airway 310 may include a first airway 311 and a second airway 312. One end of the first passage 311 may face radially inward. And, one end of the first air passage 311 may communicate with the adsorption groove 410. The other end of the first air path 311 may be connected to one end of the second air path 312. The other end of the second air channel 312 may face downward and be connected to the air circuit connection 500. Accordingly, the extending direction of the first air passage 311 and the extending direction of the second air passage 312 are different. In this way, the extending direction of the air passage 310 can be changed, so that the limitation on the air passage connector 500 can be reduced, and the air passage connector 500 can be arranged at a proper position according to the actual use requirement.

Alternatively, the extending direction of the first air passage 311 and the extending direction of the second air passage 312 may be perpendicular. With this arrangement, the air channel 310 is easy to manufacture, thereby reducing the manufacturing cost of the carrier assembly 100.

For example, as shown in fig. 2-4, the mounting plate 200 may include a mounting base 210 and a base 220. The fixing ring 300 may be disposed above the mount 210. The mounting block 210 may be disposed above the base 220 by any suitable means, such as welding, a connector connection, or a snap fit. In this way, the mount 210 may be used to secure the retaining ring 300. The base 220 may be used to connect the carrier assembly 100 to any suitable location on equipment (e.g., processing equipment) to which it is applied.

Illustratively, the base 220 may have a channel 221 disposed therein. The air passage connector 500 may have an L shape. One end of the air passage connection 500 may be connected upward to the air passage 310. The other end of the air connection 500 may be directed toward the channel 221. In this way, the air tube may be connected to the air passage joint 500 through the passage 221. Therefore, the channel 221 can protect the air path parts such as the air pipe and the like from being damaged by external force.

Illustratively, in embodiments where there are two air circuit connectors 500, two air circuit connectors 500 may be provided on both sides of the base 220. The air tube may include a first air tube and a second air tube. The first air tube and the second air tube may be connected to the two air path connectors 500, respectively. The first air tube and the second air tube may pass through the channel 221, respectively, and communicate within the channel 221. The first air tube and the second air tube may be in direct communication, or may be in communication through an air passage such as a T-joint. The first air pipe and the second air pipe are connected in the channel 221 and then can be connected to the air path parts such as the first vacuum extractor and the first air source. A first vacuum and a first air source, etc. may be disposed within the channel 221. Or the air pipe may pass through the channel 221 so as to be connected to the air path parts such as the first vacuumizer and the first air source outside the base 220.

Illustratively, the bottom of the inner circumferential surface of the stationary ring 300 may be provided with an inwardly protruding annular land 320. The suction cup 400 may be disposed on the annular table 320. A gap 330 may be provided between the top of the outer circumferential surface of the suction cup 400 and the inner circumferential surface of the fixing ring 300. The gap 330 may be in communication between the adsorption tank 410 and the gas channel 310. By providing the gap 330, the adsorption groove 410 can facilitate communication to the air passage 310 on the fixing ring 300.

Illustratively, the top of the inner circumferential surface of the stationary ring 300 may have a radially outwardly recessed groove 340. The groove 340 may form the gap 330. So configured, the gap 330 facilitates processing and the carrier assembly 100 is inexpensive to manufacture. In other embodiments, the gap 330 may be formed in other ways, for example, the top of the outer circumferential surface of the suction cup 400 may have a radially inwardly recessed groove to form the gap 330, etc.

Illustratively, the number of gaps 330 may be any, such as one, two, or more. In embodiments where the gap 330 is multiple, the multiple gaps 330 may be spaced around the suction cup 400. The bottom of the outer circumferential surface of the suction cup 400 may be spaced apart from the inner circumferential surface of the fixing ring 300 to form an annular air chamber 350. The annular air cavity 350 may communicate with the plurality of gaps 330. In this way, the ventilation area is increased, so that the flow rate of the air suction and the air supply can be increased, and the working efficiency of the stage assembly 100 can be improved. Moreover, the air channel 310 only needs to be communicated with the annular air cavity 350, so that alignment with the gap 330 is not needed, and thus, the limitation on the position of the air channel 310 can be reduced, and the manufacturing difficulty of the carrier assembly 100 can be reduced.

For example, as shown in fig. 2-4, the stationary ring 300 may be provided with electromagnets 360. The number of electromagnets 360 may be any, for example, one, two, or more. In embodiments where the electromagnets 360 are multiple, the multiple electromagnets 360 may be spaced around the suction cup 400. The electromagnet 360 may be turned on so that material may be adsorbed. The electromagnet 360 may be turned off so that material may be removed from the electromagnet 360. Desirably, the top surface of the electromagnet 360 may be lower than the top surface of the suction cup 400. Illustratively, the electromagnet 360 may be used to attract the iron ring. In this manner, the wafer is prevented from being biased by the iron ring belt when the carrier assembly 100 is moved.

For example, as shown in fig. 5-7, in another embodiment of the carrier assembly 100', the stationary ring 300 may have a nozzle assembly 370 disposed thereon. The number of nozzle assemblies 370 may be arbitrary, and may be one, two, or more, for example. In embodiments where the suction nozzle assembly 370 is multiple, the multiple suction nozzle assemblies 370 may be spaced around the suction cup 400. The nozzle assembly 370 may be connected to a second vacuum and a second air source, etc. In this manner, the second vacuumizer may be evacuated, thereby creating a negative pressure environment at the nozzle assembly 370. In this way, material may be adsorbed onto the nozzle assembly 370 under the influence of the external atmospheric pressure. The second air source may be fed to eliminate the negative pressure environment at the suction nozzle assembly 370. In this way, material may be removed from the nozzle assembly 370. The second and first evacuators may be the same or different evacuators. In embodiments where the second and first evacuators are the same evacuator, the evacuators may pump air through the air path to the suction slot 410 and the nozzle assembly 370, respectively. Similarly, the second air source and the first air source may be the same or different air sources. In embodiments where the second air source and the first air source are the same air source, the air sources may be provided to the suction tank 410 and the nozzle assembly 370 through air path members, respectively. Desirably, the top surface of the suction nozzle assembly 370 may be lower than the top surface of the suction cup 400. Illustratively, the nozzle assembly 370 may be used to attract ferrous rings. In this manner, the wafer may be prevented from being biased by the iron ring belt as the carrier assembly 100' is moved.

The number of nozzles in each nozzle assembly 370 may be arbitrary, and may be one, two, or more, for example. In embodiments where multiple suction nozzles are included in one suction nozzle assembly 370, the positional relationship between the multiple suction nozzles may be arbitrary, such as may be spaced around the suction cup 400, etc. In the embodiment shown in the figures, the nozzle assembly 370 may include a first nozzle 371 and a second nozzle 372. The first suction nozzle 371 may be located outside the second suction nozzle 372 in the radial direction of the suction cup 400. The first suction nozzle 371 and the second suction nozzle 372 may be connected to a reversing valve 380, respectively. The reversing valve 380 may be a manual reversing valve or an electromagnetic reversing valve, etc. The reversing valve 380 may control the second vacuum pump and the second air source to communicate with the first nozzle 371. Or the reversing valve 380 may control the communication of the second vacuumizer, the second air source, and other air path members to the second suction nozzle 372. So configured, the first suction nozzle 371 is spaced from the central region of the top surface of the suction cup 400 by a greater distance than the second suction nozzle 372 is spaced from the central region of the top surface of the suction cup 400. The first suction nozzle 371 and the second suction nozzle 372 may be used to suck materials of different sizes, respectively. In some embodiments, the first suction nozzle 371 and the second suction nozzle 372 may each be used to suction iron rings of different sizes. In this way, the carrier assembly 100' can accommodate wafers of different sizes. Illustratively, the first suction nozzle 371 may be used to suction an iron ring that fits with an eight inch wafer. The second suction nozzle 372 may be used to suction an iron ring that fits a six inch wafer.

Illustratively, as shown in fig. 5, the carrier assembly 100' may further include a rotational drive 600. The rotary drive 600 may employ various types of rotary drives known in the art or that may occur in the future, including but not limited to motors or air cylinders, etc. The motor may be a DD (direct driver) motor or other type of motor. A rotary drive 600 may be coupled to the underside of the mounting plate 200 to rotate the material via the suction cup 400. Thus, the processing of materials can be better realized. In embodiments where the stage assembly 100' includes a rotary drive 600, a rotary joint may be provided on the air tube to prevent the air tube from kinking due to rotation.

The stage assembly 100' may also include a stop assembly. The spacing assembly may be used to limit to ensure that the suction cup 400 rotates the material within a predetermined angle. Specifically, the limit assembly may include a first fixed limit 710, a second fixed limit 720, a movable limit 730, and a sensor 740. The first and second fixing stoppers 710 and 720 may be spaced apart in the circumferential direction of the suction cup 400. The positions of the first and second fixing stoppers 710 and 720 are fixed. The carrier assembly 100' may also include a base 750 connected to the underside of the rotary drive 600. The position of the base 750 is fixed. The first and second fixed stoppers 710 and 720 may be connected to the base 750, respectively. The motion limiter 730 and the sensor 740 may be coupled to the rotary drive 600, respectively, to rotate with the rotary drive 600. The moving limiting member 730 and the sensor 740 may be located between the first and second fixed limiting members 710 and 720 in the circumferential direction of the suction cup 400. Therefore, the first fixing and limiting member 710, the second fixing and limiting member 720 and the moving and limiting member 730 can limit the rotation driving member 600 by means of mechanical limitation. The sensor 740 may limit the rotation driver 600 by means of electronic limiting.

Only the differences between the stage assembly 100 and the stage assembly 100 'are described above, the same reference numerals are used for the same or similar components of the stage assembly 100 and the stage assembly 100', and a detailed description of these same or similar components is omitted herein for brevity.

One or more of the features set forth above may be combined in any desired manner without being specifically described or apparent from the contrary. For example, the rotary drive 600 mentioned in fig. 5 may be coupled to the carrier assembly 100 described in fig. 1-3.

For ease of description, regional relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein to describe regional positional relationships of one or more components or features to other components or features illustrated in the figures. It will be understood that the relative terms of regions include not only the orientation of the components illustrated in the figures, but also different orientations in use or operation. For example, if the element in the figures is turned over entirely, elements "over" or "on" other elements or features would then be included in cases where the element is "under" or "beneath" the other elements or features. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". Moreover, these components or features may also be positioned at other different angles (e.g., rotated 90 degrees or other angles), and all such cases are intended to be encompassed herein.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, components, assemblies, and/or combinations thereof.

It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be implemented in sequences other than those illustrated or described herein.

The present utility model has been illustrated by the above-described embodiments, but it should be understood that the above-described embodiments are for purposes of illustration and description only and are not intended to limit the utility model to the embodiments described. In addition, it will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that many variations and modifications are possible in light of the teachings of the utility model, which variations and modifications are within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (11)

1. A carrier assembly, comprising:

a mounting plate;

the fixing ring is arranged above the mounting plate; and

the sucker is arranged on the fixed ring, the fixed ring surrounds the sucker along the circumferential direction, the top surface of the sucker is provided with an adsorption groove, the fixed ring is provided with an air passage communicated with the adsorption groove,

the fixing ring is connected with an air passage connector on the air passage, and the air passage connector is positioned on the radial outer sides of the mounting plate and the sucker.

2. The carrier assembly of claim 1, wherein the bottom of the inner peripheral surface of the stationary ring is provided with an inwardly protruding annular table, the suction cup is disposed on the annular table, a gap is provided between the top of the outer peripheral surface of the suction cup and the inner peripheral surface of the stationary ring, and the gap communicates between the suction groove and the air passage.

3. The carrier assembly of claim 2, wherein a top portion of the inner peripheral surface of the retaining ring has a radially outwardly recessed groove, the groove forming the gap.

4. The carrier assembly of claim 2, wherein the gaps are a plurality and are spaced around the suction cup, the bottom of the outer peripheral surface of the suction cup being spaced from the inner peripheral surface of the retaining ring to form an annular air cavity, the annular air cavity communicating a plurality of the gaps.

5. The carrier assembly of claim 1, wherein the air channel comprises a first air channel and a second air channel, one end of the first air channel faces radially inward and communicates with the adsorption tank, the other end of the first air channel is connected to one end of the second air channel, and the other end of the second air channel faces downward and is connected to the air channel connector.

6. The carrier assembly of claim 1, wherein the mounting plate includes a mounting seat and a base, the retaining ring being disposed above the mounting seat, the mounting seat being disposed above the base.

7. The carrier assembly of claim 6, wherein the base is provided with a channel, the air passage connector is L-shaped, one end of the air passage connector is connected to the air passage upward, and the other end of the air passage connector faces the channel.

8. The carrier assembly of claim 1, wherein the suction slot extends to an outer peripheral surface of the suction cup.

9. The carrier assembly of claim 8, wherein the adsorption tank comprises:

a first suction groove extending from a central region of the top surface to an outer peripheral surface of the suction cup; and

a plurality of second adsorption grooves extending along the circumferential direction of the suction cup, the plurality of second adsorption grooves being communicated to the first adsorption groove.

10. The carrier assembly of claim 1, wherein the stationary ring is provided with an electromagnet and/or an upwardly facing nozzle assembly.

11. A processing apparatus comprising a stage assembly according to any one of claims 1-10.

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