TW202310133A - Transfer preparation method of frame unit capable of confirming whether the unit for transferring a frame unit in a processing device is adjusted in a manner to match the size of an annular frame - Google Patents

Abstract

Capable of confirming whether the unit for transferring a frame unit in a processing device is adjusted in a manner to match the size of an annular frame. To register in advance the size of the annular frame of the frame unit in which the substrate is held in the opening of the annular frame through a sheet, and adjust the spacing between a pair of guide units carrying the annular frame in a manner of matching the registered size. A suction unit (83) of a conveying arm (8) is positioned at a position in contact with the upper surface (42) of the guide units and carries out suction. When the measured value of the pressure gauge at this time is greater than the threshold value, it is determined that the position of the suction unit (83) of the conveying arm (8) is consistent with the size of the annular frame.

Description

Transport preparation method of frame unit

The present invention relates to a transport preparation method of a frame unit, which confirms the size of the ring frame before transporting the frame unit formed by holding the substrate in the opening of the ring frame through a sheet.

The ring frame of the frame unit formed by passing through the sheet and supporting the substrate by the ring frame has various sizes. Moreover, in various devices for processing frame units, in order to correspond to various sizes of ring frames, the suction pads provided in the transfer arms in the devices, the frame support units that support the frames around the holding table, etc., have become able to respond to ring frames. The position is adjusted according to the size of the frame (for example, refer to Patent Document 1 and Patent Document 2). [Prior art literature] [Patent Document]

[Patent Document 1] Japanese Unexamined Patent Application Publication No. 2019-220634. [Patent Document 2] Japanese Patent No. 5956112.

[Problems to be Solved by the Invention] If the suction pad of the transfer arm and the frame support unit installed around the holding table are inadvertently adjusted in position, the frame unit may be transferred in a state that does not match the size of the ring frame, and errors may occur.

On the other hand, in order to confirm whether the size of the ring frame matches the size of each unit such as the frame support unit, a sensor or a camera can also be provided, but the cost will increase.

The present invention was made in view of such a problem, and an object of the present invention is to confirm whether each unit that transports or holds a frame unit in a processing device is adjusted to match the size of the ring frame without incurring an increase in cost.

[Technical means to solve the problem] The present invention relates to a transport preparation method of a frame unit. It is confirmed in a processing device whether the suction part is adjusted to match the size of the ring frame. The two ends of the frame unit formed by the opening of the circular frame; the holding table, which includes the frame support unit supporting the ring frame; the processing unit, which handles the frame unit held on the holding table; the transfer arm, which has corresponding The size of the ring frame can be movably arranged and adsorbed by the suction part of the ring frame, and the frame unit is transported from the guide part to the holding table; the pressure gauge is arranged so that the suction part and the suction source a connected suction path; a drive unit that adjusts the interval of the guide unit in accordance with the size of the ring frame; The size of the guide part is registered in the control part; the guide part adjustment step, which adjusts the interval of the guide part to the size registered in the size registration step; the first suction step, after implementing the guide part adjustment step, positioning the suction portion at a position in contact with the upper surface of the guide portion and performing suction; and a first judging step of judging whether the position of the suction portion of the transfer arm is consistent with The ring frame is uniform in size. In the above frame unit transfer preparation method, preferably in the case where the frame support unit is movably provided outside the holding table according to the size of the ring frame, the frame unit transfer preparation method includes: a second attracting step of positioning and attracting the suction part judged to be consistent with the size of the ring frame in the first judging step at a position in contact with the frame supporting unit; and a second judging step of When the measured value of the pressure gauge is greater than the threshold, it is determined that the position of the frame support unit is consistent with the size of the ring frame.

[Efficacy of the invention] In the present invention, since the position of the suction part of the transfer arm is confirmed based on the guide part adjusted according to the size of the ring frame, it is possible to confirm whether the position of the suction part of the transfer arm is correct without using additional parts or the like. Therefore, it is possible to prevent errors in transporting the frame unit by the transport arm. In addition, since the position of the frame support unit is confirmed based on the suction portion determined to match the size of the ring frame in the first determination step, it is possible to confirm whether the frame support unit fits the ring frame without using additional parts or the like. size.

1 The composition of the cutting device The cutting device 1 shown in FIG. 1 is a device for cutting various substrates 11. The processed object, that is, the substrate 11, is pasted on the sheet 12. The sheet 12 is pasted in such a way as to block the opening of the ring frame 13, and the whole is constituted as Frame unit 10. An example of the substrate 11 shown in FIG. 2 is a semiconductor wafer divided by dividing lines 110 and having a plurality of elements 111 formed on the front surface. The inner circumference of the ring frame 13 is formed in a circular shape, and the outer circumference is provided with a linear portion 130 . The ring frame 13 is prepared in various sizes according to the diameter of the substrate 11 . For example, when the substrate 11 is a semiconductor wafer, the size of the substrate 11 is, for example, 6 inches and 8 inches, and the ring frame 13 is also matched with this to prepare two types with different sizes. The distances 14 between the two facing parallel straight portions 130 of the annular frames 13 with different sizes are different.

The cutting device 1 is equipped with: a cassette loading area 2, which is loaded with a cassette 21 for accommodating a plurality of frame units 10; a push-pull mechanism 3, which carries out the frame unit 10 into and out of the cassette 21; a positioning mechanism 4, which places the frame The unit 10 is positioned at a fixed position; the holding table 5 holds the frame unit 10; two cutting units 6 cut and hold the substrate 11 held on the holding table 5; the cleaning mechanism 7 cleans the cut substrate 11; and conveys The arm 8 transports the frame unit 10 between the positioning mechanism 4 and the cleaning mechanism 7 .

The cassette loading area 2 can be raised and lowered. The cassette 2 has multiple layers of grooves inside, and each groove accommodates the frame unit 10 .

The push-pull mechanism 3 is provided with: a clamping part 31, which clamps the annular frame 13; an arm 32, which supports the clamping part 31; an elevating driving part 33, which lifts the clamping part 31 and the arm 32 in the Z-axis direction; The part 34 moves the lifting driving part 33 in the Y-axis direction along the guide rail 35 extending in the Y-axis direction.

The positioning mechanism 4 is provided with a pair of guide parts 41 extending in the Y-axis direction. Each guide portion 41 is a member having an L-shaped cross-section formed by a mounting surface 42 and a wall portion 43. The mounting surface 42 is a plane parallel to the XY plane on which the annular frame 13 is placed. The portion 43 stands upright from the end portion of the mounting surface 42 in the X-axis direction, and the wall portion 43 of one guide portion 41 and the wall portion 43 of the other guide portion 41 face each other in the X-axis direction. The positioning mechanism 4 is equipped with a driving part 44 that drives a pair of guide parts 41 to approach or separate in the X-axis direction, and can adjust the size of the ring frame 13 according to the size of the ring frame memorized in the memory part. The interval of each guide part 41.

As shown in FIG. 3 , the holding table 5 is provided with: a suction part 51, which sucks and holds the substrate 11 through the sheet 12; a frame body 52, which supports the suction part 51; and four frame support units 53, which are fixed to the outer periphery of the frame body 52. section; and a rotation drive section 57 that rotates these around the rotation axis in the Z-axis direction. The holding surface 510 which is the upper surface of the suction part 51 and the upper surface 520 of the housing 52 are formed to be flush with each other. Each frame supporting unit 53 can slide along a pair of shafts 530 extending outward from the frame body 52 , and can move according to the size of the ring frame 13 . Each frame support unit 53 is constituted by the following members: a support plate 54, which supports the ring frame 13 from below; The annular frame 13 mounted on the support plate 54 is pressed from above, and the annular frame 13 is sandwiched between the support plate 54 ; and the driving unit 56 rotates and drives the pressing unit 55 .

The dicing unit 6 shown in FIG. 1 is a processing unit for dicing a substrate 11, and the two dicing units 6 include a dicing blade 61 that rotates around an axis in the Y-axis direction. The two cutting units 6 can move in the Y-axis direction and the Z-axis direction.

The cleaning mechanism 7 is equipped with: a rotary table 71, which can rotate and lift, and holds the cut workpiece unit 10 of the substrate 10 and can rotate at a high speed; 11Spray out the cleaning fluid.

As shown in FIG. 4 , the transfer arm 8 is provided with: a first arm 81 extending in the X-axis direction; a pair of second arms 82 extending in the Y-axis direction intersecting with the first arm 81 in the horizontal direction; and Two adsorption parts 83 are attached to the lower surfaces of the second arms 82 . The suction part 83 communicates with the negative pressure generating unit 84 through the suction path 85 . Furthermore, a pressure gauge 86 is connected to the suction path 85 . A plunger (not shown) is disposed on the lower surface side of the second arm 82 , and a plurality of concave fitted portions 810 that are fitted to the tip end of the plunger are provided on the upper surface of the first arm 81 . That is, the second arm 82 can be slid in the direction of the arrow 820 which is the extension direction of the first arm 81, and the front end of the plunger can be fitted into the fitted portion 810 to be fixed, and the second arm 82 can be manually changed. The position of the two arms 82 can match the size of the ring frame 13 to adjust the position of the adsorption part 83 . As shown in FIG. 1 , the first arm 81 is supported by a lift drive unit 87 so as to be able to move up and down. The lift driving part 87 can move in the Y-axis direction along the guide rail 88 extending in the Y-axis direction.

The cutting device 1 includes: a cassette loading area 2, a push-pull mechanism 3, a positioning mechanism 4, a holding table 5, a cutting unit 6, a cleaning mechanism 7, a transfer arm 8, and a control unit 9 for controlling each unit.

2 Actions during cutting In the cutting device 1 shown in FIG. 1 , a cassette 21 accommodating a plurality of frame units 10 in multiple layers is placed on the cassette mounting area 2 . Firstly, the cassette loading area 2 is raised and lowered so that the height position of the slot containing the frame unit 10 with the substrate 11 to be cut matches the height position of the clamping portion 31 of the push-pull mechanism 3 . Then, first make the distance between the wall parts 43 of the two guide parts 41 slightly larger than the size of the ring frame 13. Clamp the ring-shaped frame 13, and then move the push-pull mechanism 3 in the +Y direction, place the frame unit 10 on the mounting surface 42 of the guide part 41, and support the X position of the frame unit 10 by the guide part 41. both ends of the axis. Thereafter, the clamping of the annular frame 13 by the clamping portion 31 is released, and the push-pull mechanism 3 is withdrawn in the +Y direction.

Next, the driving part 44 moves the pair of guide parts 41 toward each other, and pushes the two ends of the ring frame 13 through the wall part 43, thereby positioning the frame unit 10 at a fixed position. Then, the transport arm 8 is moved in the -Y direction and positioned above the frame unit 10. In this state, the transport arm 8 is lowered so that the suction part 83 contacts the upper surface of the ring frame 13, and the suction part 83 and the negative The pressure generating unit 84 communicates, whereby the annular frame 13 is adsorbed. Then, after the driving unit 44 moves the pair of guide units 41 in a direction away from each other, the lifting driving unit 87 raises the transport arm 8 to thereby raise the frame unit 10 .

By moving the holding table 5 in the +X direction, the holding table 5 is first positioned below the frame unit 10 held by the transfer arm 8 . Then, in the state where the guide part 41 is separated, the lifting drive part 87 lowers the conveyance arm 8 and mounts the frame unit 10 held by the suction part 83 on the holding table 5 . That is, the substrate 11 is placed on the holding surface 510 , and the ring frame 13 is placed on the support plate 54 of the frame support unit 53 . Then, a suction force is applied to the suction portion 51 of the holding table 5 , and the ring-shaped frame 13 is held between the support plate 54 by the pressing portion 55 of the frame support unit 53 . Then, the suction by the suction unit 83 of the transport arm 8 is released, and the lift drive unit 87 lifts the transport arm 8 and withdraws it.

Next, the holding table 5 moves in the −X direction and approaches the cutting unit 6 . Then, after the planned dividing line 110 to be cut is detected, the holding table 5 moves in the −X direction and the rotating cutting blade 61 cuts into the detected planned dividing line 110 to cut the planned dividing line 110 . Then, by repeating the same cutting while moving the cutting blade 61 in the Y-axis direction, all the planned dividing lines 110 in the same direction are cut. Furthermore, when the same dicing is performed after the holding table 5 is rotated by 90 degrees, all the planned dividing lines 110 are cut vertically and horizontally, and are divided into individual wafers having elements 111 .

After the cutting is completed, the holding table 5 returns to its original position (below the guide portion 41 ). Then, in the state where the guide part 41 has been separated, the lifting drive part 87 lowers the conveying arm 8, makes the suction part 83 contact the upper surface of the ring frame 13, and makes the suction part 83 communicate with the negative pressure generating unit 84, and Suction ring frame 13. Then, the lifting drive unit 87 raises the conveying arm 8, lifts the frame unit 10 above the guide portion 41 and brings the guide portion 41 slightly close to it, then lowers the conveying arm 8 to place the frame unit 10 on the guide. The mounting surface 42 of the lead portion 41 . Then, after the suction of the suction part 83 is released and the transfer arm 8 is raised, the guide part 41 is approached and the frame unit 10 is pushed from both sides by the wall part 43 to position the frame unit 10 .

After the frame unit 10 is positioned in this way, the lifting drive part 87 lowers the conveying arm 8 again, makes the adsorption part 83 contact the upper surface of the annular frame 13, makes the adsorption part 83 communicate with the negative pressure generating unit 84, and adsorbs the annular frame. frame13. Then, after separating the guide part 41, the conveyance arm 8 is raised.

Next, the transport arm 8 is moved in the +Y direction to position the frame unit 10 above the turntable 71 of the cleaning mechanism 7 , and then the transport arm 8 is lowered to place the frame unit 10 on the turntable 71 . Then, the frame unit 10 is sucked and held on the turntable 71 , the suction of the suction unit 83 is released, and the transfer arm 8 is raised. Next, while rotating the turntable 71 at a high speed, the cleaning liquid is sprayed onto the substrate 11 to clean the surface of the substrate 11 . After the cleaning is completed, spray high-pressure gas to the substrate 10 to remove the cleaning liquid, stop the rotation of the turntable 71, lower the transfer arm 8, make the adsorption part 83 contact the ring frame 13, and connect the adsorption part 83 and the negative pressure generating unit 84. , so that the transfer arm 8 rises.

Next, the transfer arm 8 is moved in the −Y direction and positioned above the guide portion 41 . Then, the transport arm 8 is lowered to place the frame unit 10 on the placement surface 42 of the guide part 41 . Then, after the guide part 41 is approached to position the frame unit 10, the ring frame 13 is clamped by the clamping part 31 of the push-pull mechanism 3, and the push-pull mechanism 3 is moved in the -Y direction to accommodate the frame unit 10. in the original slot of the cassette 21.

By performing the above operation on all the frame units 10 accommodated in the cassette 21, all the substrates 11 constituting the frame units 10 are cut.

3 Transfer preparation method The substrate 11 has various sizes, and accordingly, the size of the ring frame 13 is also different. Therefore, when cutting the substrate 11 as described above, it is necessary to smoothly transport the frame unit 10 within the cutting device 1 while coping with the difference in size of the ring frame 13 . Then, before actual cutting in the cutting device 1 , it is confirmed as follows whether or not the suction portion 83 of the transport arm 8 is adjusted in accordance with the size of the ring frame 13 .

1 Size registration steps The size of the supporting ring frame 13 including the substrate 11 to be cut is registered in the memory unit included in the control unit 9 . This registration is input using an input means included in the cutting device 1, for example, a touch panel not shown. For example, if the input substrate 11 is six inches or eight inches, the corresponding size of the ring frame 13 can be stored in the memory part. And, because also have the situation that the size of ring frame 13 and the size of base plate 11 such as supporting the base plate 11 of six inches in the ring frame 13 that can support eight inches of eight inches of specifications are inconsistent, so also can make the size of ring frame 13 It is input separately from the size of the substrate 11 and registered in the memory. The size of the ring frame 13 is represented by the distance 14 between the straight portions 130 of the ring frame 13 shown in FIG. 2 , for example. In addition, the inner diameter of the ring frame 13 and the size of the substrate 11 with the largest diameter that can be supported may be used as the size of the ring frame 13 .

2. Guidance adjustment steps Next, the control unit 9 adjusts the interval between the guide portions 41 of the positioning mechanism 4 so as to match the size of the annular frame 13 registered in the control unit 9 in the size registration step. That is, the driving part 44 drives the guide part 41 so that the distance 45 between the two wall parts 43 forming the guide part 41 shown in FIG. . The distance between the two wall parts 43 is slightly (about several millimeters) larger than the distance 14 of the ring frame 13 .

3 The first attraction step After implementing the guide part adjustment step, move the lifting drive part 87 and the transfer arm 8 in the Y-axis direction along the guide rail 88 shown in FIG. 1 , and position the suction part 83 above the guide part 41 . Then, the lift drive unit 87 lowers the transfer arm 8 to position the suction unit 83 at a position in contact with the placement surface 42 of the guide unit 41 . Then, the suction portion 83 is communicated with the negative pressure generating unit 84 , and suction is applied to the suction portion 83 .

4 The first judgment step Next, the control unit 9 reads the measured value of the pressure gauge 86 shown in FIG. 4, and when the absolute value of the measured value of the negative pressure is greater than a predetermined threshold value, as shown in FIG. 42 in close contact, it is determined that the position of the suction portion 83 matches the size of the ring frame 13 . In addition, in the illustrated example, since there are four adsorption parts 83, the absolute value of the measured value of the negative pressure is greater than the threshold value only when all the adsorption parts 83 are in close contact with the mounting surface 42. The memory unit memorizes a predetermined threshold value. On the other hand, when the absolute value of the negative pressure measured by the pressure gauge 86 is smaller than the predetermined threshold value, it is considered that the adsorption portion 83 is not in close contact with the mounting surface 42, and it is determined that the position of the adsorption portion 83 does not correspond to the size of the ring frame 13. . For example, as shown in FIG. 6 , when the adsorption portion 83 is located inside the guide portion 41 and is not in contact with the mounting surface 42, it is determined that the adsorption portion 83 is located at a position corresponding to a size smaller than the size of the corresponding ring frame 13, It also performs operations such as displaying an error message on a display unit not shown in the figure.

In addition, in the example of the transfer arm 8 shown in FIG. A pressure gauge may be individually connected to the suction path corresponding to each suction part 83 . In this case, the measured value of the negative pressure is read individually, and when the absolute value of the measured value of the individual negative pressure among all the pressure gauges is greater than a predetermined threshold value, it is determined that the position of the adsorption part 83 is suitable for the position of the ring frame 13. size.

In this way, before cutting the substrate 11, it is confirmed in advance whether the suction part 83 is suitable for the size of the ring frame 13 based on the guide part 41 adjusted by the control part 9 in response to the size of the ring frame 13, thereby eliminating the need to use Adding parts and the like prevents errors from occurring during the conveyance of the frame unit 10 by the conveyance arm 8 .

5 Second Attraction Step Then, release the communication between the suction part 83 and the negative pressure generating unit 84, and release the suction force of the suction part 83, separate the pair of guide parts 41, and lower the transfer arm 8. As shown in Figure 7, the first The suction portion 83 determined to match the size of the frame unit 10 in the determination step is positioned in contact with the support plate 54 or the pressing portion 55 of the frame support unit 53 constituting the holding table 5 . Then, the suction portion 83 is communicated with the negative pressure generating unit 84 , and suction is applied to the suction portion 83 . In addition, in FIG. 7, illustration of the pressing part 55 shown in FIG. 3 is abbreviate|omitted.

6 The second judgment step Next, the control unit 9 reads the measured value of the pressure gauge 86 shown in FIG. 4, and when the absolute value of the measured value of the negative pressure is greater than a predetermined threshold value, it is considered that the adsorption unit 83 is in close contact with the support plate 54 or the pressing unit 55. , so it is determined that the position of the frame support unit 53 is consistent with the size of the ring frame 13 . On the other hand, when the absolute value of the negative pressure measured by the pressure gauge 86 is smaller than the predetermined threshold value, it is considered that the adsorption portion 83 is not in close contact with the support plate 54, and it is determined that the position of the frame support unit 53 is not in contact with the position of the ring frame 13. It corresponds to the size, and performs operations such as displaying error messages on the display part not shown in the figure. For example, as shown in FIG. 8 , the position of the adsorption portion 83 is located inside the support plate 54 , and the adsorption portion 83 is not in contact with the support plate 54 . In addition, in FIG. 8 , illustration of the pressing portion 55 shown in FIG. 3 is omitted.

There is also a situation where the second arm 89 shown in FIG. 9 is a long conveying arm 8. In this case, even if the position of the adsorption portion 83 corresponds to the size of the ring frame 13, only two of the four adsorption portions 83 are compatible with the support. The plate 54 is in contact, and the remaining two are not in contact with the support plate 54 . In this case, each suction path corresponding to each suction portion 83 is individually connected to a pressure gauge. For example, as shown in FIG. If the absolute value of the measured value of the negative pressure during suction is greater than a predetermined value, it is determined that the frame unit 10 corresponds. In addition, in FIG. 9, illustration of the pressing part 55 shown in FIG. 3 is abbreviate|omitted.

In this way, since the position of the frame support unit 53 of the holding table 5 is confirmed based on the suction portion 83 determined to match the size of the ring frame 13 in the first determination step, the frame support can be confirmed without using additional parts or the like. Whether the unit 53 fits the size of the ring frame 13 or not. Therefore, it is possible to prevent errors in the transfer of the frame unit 10 by the transfer arm 8 .

In addition, in this embodiment, although the cutting unit 6 of the frame unit 10 in the processing and cutting device 1 is described as an example of the processing unit, as the processing unit, there are also laser processing units in the laser processing device, grinding devices, etc. Among them, the grinding unit and the like are not limited to devices as long as the ring-shaped frame is sucked by the suction unit and the frame unit is transported.

1: Cutting device 2: Cassette loading area 21: Cassette 3: Push-pull mechanism 31: clamping part 32: arm 33: Lifting drive unit 34: Mobile Department 35: guide rail 4: Positioning mechanism 41: Guide Department 42: Loading surface 43: wall 44: Drive Department 5: Holding table 51: Department of Attraction 510: keep surface 52: frame 520: upper surface 53:Frame support unit 530: Shaft 54: support plate 55: Pushing part 56: Drive Department 57:Rotary drive unit 6: Cutting unit 61: Cutting blade 7: Cleaning mechanism 71:Rotary table 8: Transfer arm 81: First Arm 810: Fitted part 82:Second Arm 83: Adsorption part 84: Negative pressure generating unit 85: Attraction path 86: Pressure gauge 87: Lifting drive unit 88: guide rail 89:Second Arm 9: Control Department 10:Frame unit 11: Substrate 110:Split scheduled line 111: Element 12: flakes 13: ring frame 130: straight line 14: Distance

Fig. 1 is a perspective view showing an example of a cutting device as an example of a processing device. Fig. 2 is a perspective view showing an example of a frame unit. Fig. 3 is a perspective view showing an example of a holding table. Fig. 4 is a perspective view showing an example of a transport mechanism. Fig. 5 is a plan view showing a state where the suction portion of the transport mechanism is in contact with the guide portion of the positioning mechanism. 6 is a plan view showing a state where the suction portion of the transport mechanism is not in contact with the guide portion of the positioning mechanism. Fig. 7 is a plan view showing a state where the suction portion of the transport mechanism is in contact with the frame support unit of the holding table. Fig. 8 is a plan view showing a state where the suction portion of the transport mechanism is not in contact with the frame support unit of the holding table. 9 is a plan view showing a state where a part of the suction portion of the transport mechanism is in contact with the frame support unit of the holding table.

4: Positioning mechanism

8: Transfer arm

42: Loading surface

43: wall

44: Drive Department

45:Interval

81: First Arm

82:Second Arm

83: Adsorption part

810: Fitted part

Claims (2)

A transport preparation method for a frame unit, which checks whether the suction unit is adjusted in accordance with the size of the ring frame in a processing device, characterized in that, The processing unit has: a guide part supporting both ends of a frame unit formed by holding the substrate at the opening of the ring frame through the thin sheet; A holding table comprising a frame support unit supporting the ring frame; a handling unit that handles the frame unit held on the holding table; a transfer arm, which has the adsorption portion that is movably provided according to the size of the ring frame and adsorbs the ring frame, and transfers the frame unit from the guide portion to the holding table; a pressure gauge installed on a suction path that communicates the suction portion with the suction source; a driving part, which adjusts the interval of the guide part according to the size of the ring frame; and control department; The transfer preparation method of the frame unit has: a size registration step of registering the size of the annular frame in the control unit; a guide part adjustment step of adjusting the interval of the guide part to the size registered in the size registration step; a first suction step of positioning the suction part at a position in contact with the upper surface of the guide part and performing suction after implementing the guide part adjustment step; and The first determination step is to determine that the position of the suction portion of the transfer arm is consistent with the size of the ring frame when the measured value of the pressure gauge is greater than a threshold value. The transport preparation method of the frame unit as claimed in item 1, wherein, The frame support unit is movably arranged on the outside of the holding table due to the size of the ring frame, The transfer preparation method of the frame unit has: a second attracting step of positioning and attracting the absorbing portion determined to be consistent with the size of the ring frame in the first determining step at a position in contact with the frame supporting unit; and The second determination step is to determine that the position of the frame support unit is consistent with the size of the ring frame when the measured value of the pressure gauge is greater than a threshold.

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