CN218908985U - Wafer dish feeding structure - Google Patents
Wafer dish feeding structure Download PDFInfo
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- CN218908985U CN218908985U CN202223121462.8U CN202223121462U CN218908985U CN 218908985 U CN218908985 U CN 218908985U CN 202223121462 U CN202223121462 U CN 202223121462U CN 218908985 U CN218908985 U CN 218908985U
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- wafer
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- bearing
- wafer disc
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model relates to the field of die bonding equipment, and discloses a wafer disc feeding structure which comprises a wafer disc correction device, a wafer disc storage device, a supporting device and a feeding manipulator for transferring a wafer disc on the wafer disc storage device to the wafer disc correction device; the bearing device is arranged between the wafer disc correction device and the wafer disc storage device and comprises a bearing plate and a bearing sliding rail arranged on the bearing plate; when the feeding mechanical arm clamps the wafer disc to move towards the wafer disc correcting device, the wafer disc is propped against the bearing sliding rail and moves along the bearing sliding rail. The wafer disc feeding structure can well keep the shape of the wafer disc from being excessively deformed, and is beneficial to improving the feeding quality of the wafer disc.
Description
Technical Field
The utility model relates to the field of die bonding equipment, in particular to a wafer disc feeding structure.
Background
In the current wafer tray feeding structure, a wafer tray on a wafer tray storage device is clamped by a manipulator and then is directly transferred to a wafer tray correction device, so that the wafers on the wafer tray can be directly fed to a die bonding manipulator.
At present, the wafer disc can be directly clamped and sent to the wafer disc correction device because of the smaller diameter of the wafer disc; when the diameter of the wafer disc is larger, the wafer disc is directly clamped and sent to the wafer disc correction device by a mechanical arm, and the wafer disc is easy to bend and deform under the action of gravity due to overlong suspension time, so that the wafer disc is damaged;
in view of this, it is necessary to design a wafer tray feeding device to avoid excessive deformation of the wafer tray during the feeding process.
Disclosure of Invention
The utility model aims to provide a wafer disc feeding device so as to avoid overlarge deformation of a wafer disc in the feeding process.
To achieve the purpose, the utility model adopts the following technical scheme:
the wafer disc feeding structure comprises a wafer disc correction device, a wafer disc storage device, a bearing device and a feeding manipulator for transferring a wafer disc on the wafer disc storage device to the wafer disc correction device;
the bearing device is arranged between the wafer disc correction device and the wafer disc storage device and comprises a bearing plate and a bearing sliding rail arranged on the bearing plate;
when the feeding mechanical arm clamps the wafer disc to move towards the wafer disc correcting device, the wafer disc is propped against the bearing sliding rail and moves along the bearing sliding rail.
Optionally, two bearing sliding rails are arranged in parallel;
the feeding manipulator is provided with clamping jaws, the clamping jaws are located between the two bearing sliding rails, and the bearing plate is provided with grooves for the clamping jaws to pass through.
Optionally, the wafer disc correction device further comprises a moving platform, wherein the wafer disc correction device is installed on the moving platform;
the mobile platform comprises a first sliding rail, a fixed plate which is slidably arranged on the first sliding rail, a first driving device which is used for driving the fixed plate to move along the first sliding rail, a second sliding rail which is arranged on the fixed plate, an installation plate which is slidably arranged on the second sliding rail and a second driving device which is used for driving the installation plate to move along the second sliding rail;
the wafer disc correction device is arranged on the mounting plate, and the first sliding rail is perpendicular to the second sliding rail.
Optionally, the wafer disc correction device comprises a bearing ring for bearing the wafer disc, a compression ring for compressing and fastening the wafer disc on the bearing ring, and a tensioning disc for tensioning a disc film on the wafer disc;
and the mounting plate is also provided with a lifting mechanism for driving the bearing ring to approach or depart from the tensioning disc.
Optionally, a thimble device for jacking up the wafer on the wafer tray film is further arranged at one side of the bottom of the wafer tray correction device;
the thimble device is arranged on the mounting plate.
Optionally, the clamping jaw comprises a first clamping plate, a second clamping plate positioned at one side of the top of the first clamping plate, and a clamping driving device for driving the first clamping plate and the second clamping plate to clamp the wafer disc in opposite directions;
the plate surface of the first clamping plate, which is close to the second clamping plate, is larger than the plate surface of the second clamping plate, which is close to the first clamping plate.
Optionally, the feeding manipulator further comprises a bracket, a screw rod arranged on the bracket, a mechanical arm in threaded connection with the screw rod and a driving motor for driving the mechanical arm to move along the screw rod;
the screw rod is parallel to the bearing slide rail.
Optionally, the bearing sliding rail comprises a transverse plate and an anti-deflection plate arranged on the transverse plate, the anti-deflection plate is perpendicular to the transverse plate, and the anti-deflection plate is parallel to the screw rod;
and the transverse plate supports the wafer disc when the wafer disc moves to the wafer disc correction device.
Optionally, a lifting cylinder for driving the clamping jaw to lift along the vertical direction is further arranged on the mechanical arm.
Optionally, the wafer tray storage device comprises a storage frame, wherein the storage frame is provided with a plurality of bearing grooves for bearing the wafer tray at intervals along the vertical direction, the storage frame is provided with an opening, and the opening faces the bearing device;
the wafer disc storage device further comprises a lifting module for driving the storage frame to lift along the vertical direction.
Compared with the prior art, the utility model has the following beneficial effects:
in this embodiment, after clamping out the wafer dish in the wafer dish storage device, the manipulator drives the wafer dish and corrects the direction and remove to the wafer dish, and the bearing slide rail plays certain bearing effect to the wafer dish in the removal process, avoids the wafer dish crooked range too big to can keep the shape of wafer dish well and can not take place too big deformation, be favorable to promoting the pay-off quality to the wafer dish.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.
The structures, proportions, sizes, etc. shown in the drawings are shown only in connection with the present disclosure, and are therefore not intended to limit the scope of the utility model, since any modification, variation in proportions, or adjustment of the size, which would otherwise be used by those skilled in the art, would not have the essential significance of the present disclosure, would still fall within the scope of the present disclosure without affecting the efficacy or achievement of the present disclosure.
Fig. 1 is a schematic structural diagram of a feeding structure of a wafer tray according to an embodiment of the present utility model;
FIG. 2 is an enlarged schematic view of the position A in FIG. 1;
fig. 3 is an enlarged schematic view of the position B in fig. 1.
Illustration of: 1. a wafer tray correction device; 11. a carrier ring; 12. a clamp ring; 13. a tension disc; 14. a lifting mechanism; 15. a thimble device; 2. a wafer tray storage device; 21. a storage frame; 22. a carrying groove; 3. a support device; 31. a bearing plate; 32. bearing the slide rail; 321. a cross plate; 322. an anti-deflection plate; 33. a groove; 4. a feeding manipulator; 41. a clamping jaw; 42. a lifting cylinder; 411. a first clamping plate; 412. a second clamping plate; 413. a clamping driving device; 5. a mobile platform; 51. a fixing plate; 52. and (3) mounting a plate.
Detailed Description
In order to make the objects, features and advantages of the present utility model more comprehensible, the technical solutions in the embodiments of the present utility model are described in detail below with reference to the accompanying drawings, and it is apparent that the embodiments described below are only some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model. It is noted that when one component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.
The technical scheme of the utility model is further described below by the specific embodiments with reference to the accompanying drawings.
The embodiment of the utility model provides a wafer disc feeding structure which can effectively feed a wafer disc with a large diameter without worrying about damage of the wafer disc caused by overlarge deformation of the wafer disc.
Referring to fig. 1 to 3, the wafer tray feeding structure includes a wafer tray correction device 1, a wafer tray storage device 2, a supporting device 3, and a feeding manipulator 4 for transferring a wafer tray on the wafer tray storage device 2 to the wafer tray correction device 1;
the supporting device 3 is arranged between the wafer disc correcting device 1 and the wafer disc storing device 2, and the supporting device 3 comprises a supporting plate 31 and a supporting sliding rail 32 arranged on the supporting plate 31;
when the loading manipulator 4 clamps the wafer tray to move towards the wafer tray correction device 1, the wafer tray abuts against the bearing slide rail 32 and moves along the bearing slide rail 32.
In this embodiment, the purpose is to transfer the wafer tray, especially the wafer tray with large diameter, in the wafer tray storage device 2 to the wafer tray correction device 1;
the core point of this embodiment is that a supporting device 3 is arranged between a wafer tray storage device 2 and a wafer tray correction device 1, a feeding manipulator 4 is used for transversely clamping and pulling out a wafer tray, the bottom surface of the wafer tray is propped against a supporting slide rail 32, and the gravity of the wafer tray is dispersed to the supporting slide rail 32 in the feeding process of the wafer tray, so that the wafer tray can be effectively prevented from being deformed greatly due to overlong self-hanging time.
Preferably, the feeding hole of the wafer disc correction device 1 is flush with the bearing surface of the bearing slide rail 32, and at this time, the feeding manipulator 4 moves along the horizontal direction to realize that the wafer disc is conveyed to the set position of the wafer disc correction device 1; it should be noted that, the lifting module drives the material storage frame 21 to lift along the vertical direction, so that the bottom surface of the wafer tray needing to be discharged is flush with the bearing surface of the bearing slide rail 32.
Optionally, two bearing slide rails 32 are arranged in parallel;
the feeding manipulator 4 is provided with a clamping jaw 41, the clamping jaw 41 is positioned between the two bearing slide rails 32, and the bearing plate 31 is provided with a groove 33 for the clamping jaw 41 to pass through.
Specifically, the two bearing slide rails 32 support the two sides of the wafer tray, the clamping jaw 41 supports the middle part of the wafer tray, so that the bearing force of the wafer tray can be effectively optimized, and the wafer tray is prevented from becoming oversized.
Optionally, the wafer disc feeding structure further comprises a moving platform 5, and the wafer disc correction device 1 is installed on the moving platform 5;
the mobile platform 5 comprises a first sliding rail, a fixed plate 51 which is slidably arranged on the first sliding rail, a first driving device for driving the fixed plate 51 to move along the first sliding rail, a second sliding rail which is arranged on the fixed plate 51, an installing plate 52 which is slidably arranged on the second sliding rail, and a second driving device for driving the installing plate 52 to move along the second sliding rail;
the wafer tray correction device 1 is mounted on the mounting plate 52, and the first sliding rail is perpendicular to the second sliding rail.
Specifically, the moving platform 5 can drive the wafer disc correction device 1 to move to the first loading position, and at this time, the loading manipulator 4 moves along a straight line to transfer the wafer disc to the wafer disc correction device 1; then, the moving platform 5 can drive the wafer tray correction device 1 to move to a set wafer feeding position, so that the wafer fixing manipulator can conveniently suck wafers or chips on the wafer tray.
Alternatively, the wafer tray correction device 1 includes a carrier ring 11 for carrying the wafer tray, a pressing ring 12 for pressing and fixing the wafer tray on the carrier ring 11, and a tension tray 13 for tensioning a tray film on the wafer tray;
the mounting plate 52 is also provided with a lifting mechanism 14 for driving the carrier ring 11 toward or away from the tension disc 13.
Specifically, after the wafer tray is placed to a set position by the feeding manipulator 4, the pressing ring 12 presses the wafer tray, and then the lifting mechanism 14 drives the carrying ring 11 to descend, so that the tray film is tensioned. The bearing ring is provided with a small synchronous wheel, and the small synchronous wheel is in threaded connection with the bearing ring through a screw rod; the lifting device comprises a motor, a large synchronizing wheel arranged on a motor shaft of the motor, and a synchronous belt arranged on the large synchronizing wheel and the small synchronizing wheel in a tensioning manner, wherein the motor can drive the small synchronizing wheel to synchronously rotate so as to synchronously rotate a screw rod, and thus the bearing ring 11 descends.
Optionally, a thimble device 15 for jacking up the wafer on the wafer tray film is further arranged on one side of the bottom of the wafer tray correction device 1;
the ejector pin device 15 is mounted on the mounting plate 52.
Specifically, the ejector pin device 15 is used for ejecting the wafer or the chip on the tray film.
Optionally, the clamping jaw 41 comprises a first clamping plate 411, a second clamping plate 412 located at a top side of the first clamping plate 411, and a clamping driving device 413 for driving the first clamping plate 411 and the second clamping plate 412 to clamp the wafer disc in opposition;
the first clamping plate 411 has a plate surface closer to the second clamping plate 412 that is larger than the plate surface of the second clamping plate 412 closer to the first clamping plate 411.
Optionally, the feeding manipulator 4 further comprises a bracket, a screw rod arranged on the bracket, a mechanical arm in threaded connection with the screw rod and a driving motor for driving the mechanical arm to move along the screw rod;
the screw is parallel to the support rail 32 so that the clamping jaw 41 can move parallel to the support rail 32, thereby ensuring that the wafer disks can be carried by the support rail 32.
Optionally, the supporting slide rail 32 includes a transverse plate 321 and an anti-deviation plate 322 disposed on the transverse plate 321, the anti-deviation plate 322 is perpendicular to the transverse plate 321, and the anti-deviation plate 322 is parallel to the screw rod;
the transverse plate 321 supports the wafer tray during the movement of the wafer tray toward the wafer tray correction device 1.
Specifically, the anti-deviation plate 322 can effectively prevent the wafer tray from deviating due to vibration. Preferably, during the feeding process, the side edge of the wafer tray abuts against the anti-bias plate 322, and the side edge of the wafer tray can slide relative to the anti-bias plate 322.
Optionally, a lifting cylinder 42 for driving the clamping jaw 41 to lift in the vertical direction is further disposed on the mechanical arm, so that the clamping jaw 41 can accurately clamp the wafer tray.
Optionally, the wafer tray storage device 2 comprises a storage frame 21, wherein the storage frame 21 is provided with a plurality of bearing grooves 22 for bearing wafer trays at intervals along the vertical direction, and the storage frame 21 is provided with an opening facing the bearing device 3;
the wafer tray storage device 2 further comprises a lifting module for driving the storage frame 21 to lift along the vertical direction.
Specifically, the lifting module is further configured to lift or lower the wafer tray to a set height after the wafer tray is clamped out, so that the bottom surface of the wafer tray discharged from the next wafer tray is flush with the supporting surface of the supporting slide rail 32.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
The above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.
Claims (10)
1. The wafer disc feeding structure is characterized by comprising a wafer disc correction device (1), a wafer disc storage device (2), a supporting device (3) and a feeding manipulator (4) for transferring a wafer disc on the wafer disc storage device (2) to the wafer disc correction device (1);
the bearing device (3) is arranged between the wafer disc correcting device (1) and the wafer disc storing device (2), and the bearing device (3) comprises a bearing plate (31) and a bearing sliding rail (32) arranged on the bearing plate (31);
when the feeding mechanical arm (4) clamps the wafer disc to move towards the wafer disc correction device (1), the wafer disc is propped against the bearing sliding rail (32) and moves along the bearing sliding rail (32).
2. Wafer tray feeding structure according to claim 1, characterized in that the support slide rail (32) is provided with two parallel support slide rails;
the feeding manipulator (4) is provided with clamping jaws (41), the clamping jaws (41) are located between the two bearing sliding rails (32), and the bearing plate (31) is provided with grooves (33) for the clamping jaws (41) to pass through.
3. The wafer tray feeding structure according to claim 1, further comprising a moving platform (5), wherein the wafer tray correction device (1) is mounted on the moving platform (5);
the mobile platform (5) comprises a first sliding rail, a fixed plate (51) which is slidably mounted on the first sliding rail, a first driving device for driving the fixed plate (51) to move along the first sliding rail, a second sliding rail which is mounted on the fixed plate (51), a mounting plate (52) which is slidably mounted on the second sliding rail, and a second driving device for driving the mounting plate (52) to move along the second sliding rail;
the wafer disc correction device (1) is installed on the installation plate (52), and the first sliding rail is perpendicular to the second sliding rail.
4. A wafer tray feeding structure according to claim 3, wherein the wafer tray correction device (1) comprises a carrying ring (11) for carrying a wafer tray, a compression ring (12) for compressing and fastening the wafer tray on the carrying ring (11), and a tension tray (13) for tensioning a tray film on the wafer tray;
the mounting plate (52) is also provided with a lifting mechanism (14) for driving the bearing ring (11) to approach or separate from the tensioning disc (13).
5. The wafer tray feeding structure according to claim 4, wherein a thimble device (15) for jacking up the wafer on the wafer tray film is further arranged at one side of the bottom of the wafer tray correction device (1);
the thimble device (15) is arranged on the mounting plate (52).
6. Wafer disc loading structure according to claim 2, characterized in that the clamping jaw (41) comprises a first clamping plate (411), a second clamping plate (412) located at the top side of the first clamping plate (411), and a clamping driving device (413) for driving the first clamping plate (411) and the second clamping plate (412) to clamp the wafer disc in opposite directions;
the plate surface of the first clamping plate (411) close to the second clamping plate (412) is larger than the plate surface of the second clamping plate (412) close to the first clamping plate (411).
7. The wafer disc feeding structure according to claim 2, wherein the feeding manipulator (4) further comprises a bracket, a screw rod arranged on the bracket, a mechanical arm in threaded connection with the screw rod and a driving motor for driving the mechanical arm to move along the screw rod;
the screw rod is parallel to the bearing slide rail (32).
8. The wafer tray feeding structure according to claim 7, wherein the supporting slide rail (32) comprises a transverse plate (321) and an anti-deflection plate (322) arranged on the transverse plate (321), the anti-deflection plate (322) is perpendicular to the transverse plate (321), and the anti-deflection plate (322) is parallel to the screw rod;
and the transverse plate (321) supports the wafer disc when the wafer disc moves to the wafer disc correction device (1).
9. The wafer disc feeding structure according to claim 7, wherein the mechanical arm is further provided with a lifting cylinder (42) for driving the clamping jaw (41) to lift in the vertical direction.
10. The wafer disc feeding structure according to claim 5, wherein the wafer disc storage device (2) comprises a storage frame (21), the storage frame (21) is provided with a plurality of bearing grooves (22) for bearing wafer discs at intervals along the vertical direction, the storage frame (21) is provided with an opening, and the opening faces the bearing device (3);
the wafer disc storage device (2) further comprises a lifting module for driving the storage frame (21) to lift along the vertical direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223121462.8U CN218908985U (en) | 2022-11-23 | 2022-11-23 | Wafer dish feeding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223121462.8U CN218908985U (en) | 2022-11-23 | 2022-11-23 | Wafer dish feeding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218908985U true CN218908985U (en) | 2023-04-25 |
Family
ID=86050180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223121462.8U Active CN218908985U (en) | 2022-11-23 | 2022-11-23 | Wafer dish feeding structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218908985U (en) |
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2022
- 2022-11-23 CN CN202223121462.8U patent/CN218908985U/en active Active
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