CN218868553U - Heat radiation structure, driver and driving system - Google Patents
Heat radiation structure, driver and driving system Download PDFInfo
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- CN218868553U CN218868553U CN202122105390.7U CN202122105390U CN218868553U CN 218868553 U CN218868553 U CN 218868553U CN 202122105390 U CN202122105390 U CN 202122105390U CN 218868553 U CN218868553 U CN 218868553U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model provides a heat radiation structure, driver and actuating system, heat radiation structure includes: the radiating frame comprises a mounting surface and a main frame body arranged on the mounting surface, and a first radiating part and a second radiating part communicated with the first radiating part are sequentially arranged on one side of the main frame body along the direction away from the mounting surface; the first mounting frame is arranged at one end of the first heat dissipation part, and the first fan is arranged on the first mounting frame; wherein, be provided with the radiating component who includes two at least heat dissipation teeth that set up with installation face parallel and interval in the first heat dissipation portion, the second heat dissipation portion is the through-hole, and first fan forms the air current and flows to first heat dissipation portion and second heat dissipation portion to solve the lower problem of radiating efficiency of the driver among the prior art.
Description
Technical Field
The utility model relates to a heat dissipation technical field particularly, relates to a heat radiation structure, driver and actuating system.
Background
The application industries of 380V and 7.5KW high-power servo drivers mainly comprise: manipulator industry (large-scale transport), photovoltaic industry (line cutting is received and is unreeled), lathe industry (forging press), packaging and printing industry (corrugated paper cutting machine, cross cutting machine), lithium electricity industry (winder) etc. its specific application requirement is: strong overload capacity, high running speed and high stability requirement.
In order to meet the heat dissipation requirements of the industries for drivers, the structural design of 380V and 7.5KW high-power servo is particularly important, and the heat dissipation requirements of the industries, including the heat dissipation of capacitors on power boards and the heat dissipation of other electronic components, need to be met.
At present, the structural design of each manufacturer is different from the industry requirement, and a plurality of manufacturers mainly adopt a single fan and radiator structure in the heat dissipation of a high-power server, so that the heat dissipation efficiency is low, the capacitor cannot be well dissipated, and even a driver is damaged in serious cases.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a heat dissipation structure, a driver and a driving system, which solve the problem of low heat dissipation efficiency of the driver in the prior art.
In order to achieve the above object, according to the first aspect of the present invention, there is provided a heat dissipation structure, the heat dissipation structure comprising: the radiating frame comprises a mounting surface and a main frame body arranged on the mounting surface, and a first radiating part and a second radiating part communicated with the first radiating part are sequentially arranged on one side of the main frame body along the direction far away from the mounting surface; the first mounting frame is arranged at one end of the first heat dissipation part, and the first fan is arranged on the first mounting frame; the first heat dissipation part is internally provided with a heat dissipation assembly comprising at least two heat dissipation teeth which are parallel to the mounting surface and are arranged at intervals, the second heat dissipation part is a through hole, and the first fan forms airflow to flow to the first heat dissipation part and the second heat dissipation part.
Further, the heat dissipation assembly is integrally formed with or detachably connected to the heat dissipation frame.
Further, the second heat dissipation part is provided with a support, the support comprises a bottom plate installed on the heat dissipation frame, a first side plate arranged on one side of the bottom plate and a second side plate arranged on the other side of the bottom plate, and the first side plate and the second side plate are respectively located on two opposite sides of the bottom plate and used for being enclosed into a second heat dissipation cavity of the second heat dissipation part.
Further, the heat dissipation structure further includes: the third side plate is arranged on the second heat dissipation part and is perpendicular to the first side plate; the third side panel includes a second mounting bracket having a vent hole.
Further, a fourth side plate which is parallel to the second side plate or forms an acute angle is arranged on the third side plate.
Further, the heat dissipation structure further comprises a second fan mounted on the second mounting frame for providing flowing air flow to the second heat dissipation chamber.
Further, the first side plate and the bottom plate are integrally formed or detachably connected; and/or the second side plate and the bottom plate are integrally formed or detachably connected; and/or the third side plate and the bottom plate are integrally formed or detachably connected; and/or the fourth side plate and the bottom plate are integrally formed or detachably connected; and/or the first side plate and the third side plate are integrally formed or detachably connected; and/or the third side plate and the fourth side plate are integrally formed or detachably connected; and/or the first side plate, the third side plate and the fourth side plate are integrally formed.
Further, heat radiation structure still includes the baffle, and the baffle is located the first heat dissipation chamber of first heat dissipation portion and the intercommunication mouth department between the second heat dissipation chamber of second heat dissipation portion to with the shutoff of intercommunication mouth, the intercommunication mouth is the at least part in the clearance between first mounting bracket and the radiator unit.
Further, the baffle and the heat dissipation frame are integrally formed or detachably connected; and/or the baffle plate and the bottom plate are integrally formed or detachably connected; and/or the baffle plate is detachably connected with the second side plate respectively; and/or the baffle plates are respectively detachably connected with the third side plates; and/or the baffle plate is detachably connected with the fourth side plate respectively.
Further, the communication opening is at least partially arranged on the second side plate; or the communication port is at least partially arranged on the fourth side plate; or the communication port is enclosed or formed by the third side plate and the second side plate at intervals; or the communication opening is formed by the second side plate and the fourth side plate at intervals or in an enclosing manner.
Furthermore, at least one notch is formed in the first side plate and used for avoiding the wiring harness of the brake resistor; and/or at least one hook is arranged on the bracket and used for fixing the wiring harness of the brake resistor.
The heat dissipation structure further comprises a first fan protection cover, the first fan and the first fan protection cover are detachably mounted on the first mounting frame, and at least part of the first fan protection cover is arranged in a first heat dissipation cavity of the first heat dissipation part; and/or the heat dissipation structure further comprises a second fan protection cover, the second fan and the second fan protection cover are both detachably mounted on the second mounting frame, and at least part of the second fan protection cover is arranged in a second heat dissipation cavity of the second heat dissipation part.
According to a second aspect of the present invention, there is provided a driver, the driver including a housing and a circuit board, the driver further including: in the heat dissipation structure, the heat dissipation structure and the shell form a closed space for placing a circuit board; the brake resistor is electrically connected with the circuit board, and is arranged in the first heat dissipation cavity of the first heat dissipation part; and/or the brake resistor is arranged in a second heat dissipation cavity of the second heat dissipation part; and/or the brake resistor is arranged on the heat dissipation component or on the side part of the heat dissipation component.
Furthermore, the circuit board comprises a power board and a control board, the power board and the control board are both arranged in the shell and are respectively positioned on two opposite sides of the main frame body of the heat dissipation frame of the heat dissipation structure, and the control board is positioned on one side, away from the first heat dissipation part, of the second heat dissipation part of the heat dissipation structure.
Furthermore, the circuit board is also provided with at least one capacitor, a bottom plate of the second heat dissipation part is provided with at least one avoidance hole for the power capacitor to pass through, and one end of the capacitor passes through the avoidance hole and then extends into a second heat dissipation cavity of the second heat dissipation part; or at least part of the capacitor on the circuit board is positioned in the second heat dissipation cavity of the second heat dissipation part.
According to a third aspect of the present invention, there is provided a drive system adapted for use in the above-mentioned drive.
Use the technical scheme of the utility model, the utility model discloses a heat radiation structure includes: the radiating frame comprises a mounting surface and a main frame body arranged on the mounting surface, and a first radiating part and a second radiating part communicated with the first radiating part are sequentially arranged on one side of the main frame body along the direction away from the mounting surface; the first mounting frame is arranged at one end of the first heat dissipation part, and the first fan is arranged on the first mounting frame; wherein, be provided with the radiating component who includes two at least heat dissipation teeth that set up with installation face parallel and interval in the first heat dissipation portion, the second heat dissipation portion is the through-hole, first fan forms the air current and flows to first heat dissipation portion and second heat dissipation portion, dispel the heat to first heat dissipation portion and second heat dissipation portion simultaneously through first fan, the radiating efficiency to the driver has been improved, the heat dissipation demand when having satisfied high-power servo driver and having used, the lower problem of radiating efficiency of the driver among the prior art has been solved.
Drawings
The accompanying drawings, which form a part of the present application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 shows a schematic structural view of a first embodiment of a heat dissipation structure according to the present invention when a circuit board, a bracket, and a baffle are mounted;
FIG. 2 illustrates a schematic view of the heat dissipation structure of FIG. 1 in a first orientation when the heat dissipation structure includes a support;
FIG. 3 is a schematic view of the heat dissipation structure of FIG. 1 in a second orientation including a support;
FIG. 4 is a schematic view of the heat dissipation structure of FIG. 1 without the bracket;
fig. 5 is a schematic view showing the structure of the heat dissipation structure shown in fig. 1 when a second heat dissipation part is mounted with only a baffle; and
fig. 6 illustrates a cross-sectional view of the heat dissipation structure shown in fig. 2.
Wherein the figures include the following reference numerals:
1. a heat dissipation frame; 11. a main frame body; 12. a substrate; 13. a grounding member;
2. a first heat sink portion; 21. a heat dissipating component; 210. a heat dissipating tooth; 22. a first fan; 23. a heat dissipation space; 24. a first mounting bracket; 25. a first fan guard;
3. a second heat sink member; 31. a support; 311. a base plate; 312. a second side plate; 313. a first side plate; 314. a third side plate; 315. a baffle plate; 316. a notch; 317. a hook; 318. avoiding holes; 32. a second fan; 33. a second mounting bracket;
4. a power board; 41. a capacitor; 42. a brake resistor; 5. and a control panel.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
As shown in fig. 1 to 6, the utility model provides a heat dissipation structure, heat dissipation structure includes: the heat dissipation frame 1 comprises a mounting surface and a main frame body 11 arranged on the mounting surface, wherein a first heat dissipation part 2 and a second heat dissipation part 3 communicated with the first heat dissipation part 2 are sequentially arranged on one side of the main frame body 11 along the direction far away from the mounting surface; a first mounting bracket 24 and a first fan 22, the first mounting bracket 24 being disposed at one end of the first heat sink member 2, the first fan 22 being disposed on the first mounting bracket 24; the first heat dissipation part 2 is internally provided with a heat dissipation assembly 21 which comprises at least two heat dissipation teeth 210 parallel to the mounting surface and arranged at intervals, the second heat dissipation part 3 is a through hole, and the first fan 22 forms airflow flowing to the first heat dissipation part 2 and the second heat dissipation part 3.
The utility model discloses a heat radiation structure includes: the heat dissipation frame 1 comprises a mounting surface and a main frame body 11 arranged on the mounting surface, wherein a first heat dissipation part 2 and a second heat dissipation part 3 communicated with the first heat dissipation part 2 are sequentially arranged on one side of the main frame body 11 along the direction far away from the mounting surface; a first mounting bracket 24 and a first fan 22, the first mounting bracket 24 being disposed at one end of the first heat sink piece 2, the first fan 22 being disposed on the first mounting bracket 24; wherein, be provided with the radiating component 21 that includes two at least heat dissipation teeth 210 that set up with the installation face is parallel and the interval in the first heat dissipation portion 2, second heat dissipation portion 3 is the through-hole, first fan 22 forms the air current and flows to first heat dissipation portion 2 and second heat dissipation portion 3, with dispel the heat to first heat dissipation portion 2 and second heat dissipation portion 3 simultaneously through first fan 22, the radiating efficiency to the driver has been improved, the heat dissipation demand when having satisfied high-power servo driver and using, the lower problem of radiating efficiency of the driver among the prior art has been solved.
Specifically, interval arrangement between first mounting bracket 24 and the radiator unit 21 to form heat dissipation space 23, first heat dissipation portion 2 has first heat dissipation chamber, and second heat dissipation portion 3 has second heat dissipation chamber, is provided with the intercommunication mouth between first heat dissipation chamber of first heat dissipation portion 2 and the second heat dissipation chamber of second heat dissipation portion 3, the intercommunication mouth be located one side of heat dissipation space 23 and with the heat dissipation space intercommunication.
The radiating frame 1 comprises a substrate 12, the substrate 12 is positioned at one end of the main frame body 11 and connected with the main frame body 11, and the substrate 12 is positioned at one side of the first radiating cavity, which is far away from the second radiating cavity, so as to be used for enclosing a first radiating cavity; the main frame 11 is provided with a grounding member 13 at an end thereof remote from the substrate 12, and the grounding member 13 is used for connecting a grounding wire.
The utility model discloses a heat radiation structure's concrete embodiment as follows:
example one
The heat dissipation structure of the present embodiment includes: the heat dissipation frame comprises a heat dissipation frame 1, wherein the heat dissipation frame 1 comprises a mounting surface and a main frame body 11 arranged on the mounting surface, and a first heat dissipation part 2 and a second heat dissipation part 3 are sequentially arranged on one side of the main frame body 11 along the direction far away from the mounting surface; a first mounting bracket 24 and a first fan 22, the first mounting bracket 24 being disposed at one end of the first heat sink member 2, the first fan 22 being disposed on the first mounting bracket 24; the first heat dissipation part 2 is internally provided with a heat dissipation assembly 21 which comprises at least two heat dissipation teeth 210 parallel to the mounting surface and arranged at intervals, a first heat dissipation cavity for air flow circulation is formed between the first fan 22 and the heat dissipation assembly 21, and one side of the second heat dissipation part 3 close to the first heat dissipation part 2 is provided with a communication port so that air flow in the first heat dissipation cavity flows into the second heat dissipation part 3 through the communication port.
Example two
The present embodiment is further limited to the first embodiment, in which the heat dissipation assembly 21 is integrally formed with or detachably connected to the heat dissipation frame 1.
EXAMPLE III
The present embodiment is further limited to the first or second embodiment, in the present embodiment, the second heat sink component 3 is provided with a bracket 31, the bracket 31 includes a bottom plate 311 mounted on the heat sink frame 1, a first side plate 313 disposed on one side of the bottom plate 311, and a second side plate 312 disposed on the other side of the bottom plate 311, and the first side plate 313 and the second side plate 312 are respectively located on two opposite sides of the bottom plate 311 to enclose a second heat sink cavity of the second heat sink component 3.
Example four
In this embodiment, the heat dissipation structure further includes: a third side plate 314, the third side plate 314 being provided at the second heat sink member 3 and being perpendicular to the first side plate 313; the third side plate 314 includes a second mounting bracket 33 having a vent hole.
EXAMPLE five
The present embodiment is further limited to the fourth embodiment, in which a fourth side plate parallel to or forming an acute angle with the second side plate 312 is disposed on the third side plate 314.
EXAMPLE six
The present embodiment is further limited to the fourth embodiment, in the present embodiment, the heat dissipation structure further includes a second fan 32, and the second fan 32 is mounted on the second mounting rack 33 for providing flowing air flow to the second heat dissipation chamber.
EXAMPLE seven
The fifth embodiment is further limited to the fifth embodiment, in the present embodiment, the first side plate 313 is integrally formed with or detachably connected to the bottom plate 311; and/or the second side panel 312 is integrally formed with or removably attached to the bottom panel 311; and/or the third side plate 314 is integrally formed with or detachably connected to the bottom plate 311; and/or the fourth side panel is integrally formed with or detachably connected to the bottom panel 311; and/or the first side panel 313 is integrally formed with or detachably connected to the third side panel 314; and/or the third side panel 314 is integrally formed with or removably attached to the fourth side panel; and/or the first side panel 313, the third side panel 314 and the fourth side panel are integrally formed.
Example eight
This embodiment is further defined by the seventh embodiment, in which the heat dissipation structure further includes a baffle 315, and the baffle 315 is located at a communication port between the first heat dissipation chamber of the first heat dissipation part 2 and the second heat dissipation chamber of the second heat dissipation part 3 to close the communication port, which is at least part of a gap between the first mounting bracket 24 and the heat dissipation assembly 21.
Thus, on the one hand, the first fan 22 of the first heat dissipation chamber blows directly against the heat dissipation assembly 21: the wind power of the first fan 22 is concentrated on the heat dissipation assembly 21, and the insufficient heat dissipation caused by disordered wind channels is prevented; on the other hand, the second heat dissipation cavity is an independent heat dissipation air duct for dissipating heat of the capacitor, and is isolated from the heat dissipation assembly 21 through the baffle 315, so that the heat dissipation efficiency of the capacitor is improved, and heat dissipation unconcentration caused by disorder of the air duct is avoided.
Example nine
This embodiment is a further limitation of the eighth embodiment, in this embodiment, the baffle 315 is integrally formed with the heat dissipation frame or detachably connected to the heat dissipation frame; and/or the baffle 315 is integrally formed with the base plate or removably attached thereto; and/or the baffle 315 is detachably connected with the second side plate 312; and/or the baffle 315 is detachably connected with the third side plate 314; and/or the baffle 315 is removably attached to the fourth side panel, respectively.
Example ten
This embodiment is a further definition of the ninth embodiment, and in this embodiment, the communication port is at least partially provided on the second side plate 312; or the communication opening is at least partially arranged on the fourth side plate; or the communication port is enclosed or formed by the third side plate 314 and the second side plate 312 at intervals; or the communication opening is formed by the second side plate 312 and the fourth side plate in a spaced or enclosed manner.
EXAMPLE eleven
In this embodiment, at least one notch 316 is provided on the first side plate 313, and the notch 316 is used for avoiding the wiring harness of the brake resistor 42.
EXAMPLE twelve
In this embodiment, at least one hook 317 is disposed on the first side plate 313 of the bracket 31 for fixing the wiring harness of the braking resistor 42.
EXAMPLE thirteen
In this embodiment, at least one notch 316 is provided on the first side plate 313, and the notch 316 is used for avoiding the wiring harness of the brake resistor 42; and at least one hook 317 is disposed on the first side plate 313 of the bracket 31 for fixing the wiring harness of the braking resistor 42.
Example fourteen
The sixth embodiment is further limited, in the present embodiment, the heat dissipation structure further includes a first fan protection cover 25, the first fan 22 and the first fan protection cover are both detachably mounted on the first mounting frame 24, and at least a portion of the first fan protection cover 25 is disposed in the first heat dissipation cavity of the first heat dissipation portion 2.
Example fifteen
The present embodiment is further limited to the sixth embodiment, and the difference between the present embodiment and the fourteenth embodiment lies in the difference of the arrangement positions of the fan protection covers, in the present embodiment, the heat dissipation structure further includes a second fan protection cover, the second fan 32 and the second fan protection cover are both detachably mounted on the second mounting frame 33, and at least a part of the second fan protection cover is disposed in the second heat dissipation cavity of the second heat dissipation portion 3.
Example sixteen
In this embodiment, the heat dissipation structure further includes a first fan protection cover 25 and a second fan protection cover, wherein the first fan 22 and the first fan protection cover are both detachably mounted on the first mounting frame 24, and at least a portion of the first fan protection cover 25 is disposed in the first heat dissipation cavity of the first heat dissipation portion 2; the second fan 32 and the second fan guard are both detachably mounted on the second mounting bracket 33, and at least part of the second fan guard is disposed in the second heat dissipation chamber of the second heat dissipation portion 3.
The utility model provides a driver, driver include casing and circuit board, and the driver still includes: in the heat dissipation structure, the heat dissipation structure and the shell form a closed space for placing the circuit board; a brake resistor 42 electrically connected to the circuit board, wherein the brake resistor 42 is disposed in the first heat dissipation cavity of the first heat dissipation part 2; and/or the brake resistor 42 is arranged in the second heat dissipation cavity of the second heat dissipation part 3; and/or, the braking resistor 42 is disposed on the heat sink assembly 21 or on a side portion of the heat sink assembly 21.
In particular, the drive is an ac servo drive.
The utility model discloses a specific embodiment of driver as follows:
example one
The utility model discloses a driver includes casing and circuit board, and the driver still includes: in the heat dissipation structure, the heat dissipation structure and the shell form a closed space for placing the circuit board; a brake resistor 42 electrically connected to the circuit board, wherein the brake resistor 42 is disposed in the first heat dissipation cavity of the first heat dissipation part 2; and/or the brake resistor 42 is arranged in the second heat dissipation cavity of the second heat dissipation part 3; and/or, the braking resistor 42 is disposed on the heat sink assembly 21 or on a side of the heat sink assembly 21.
Example two
The present embodiment is further limited to the first embodiment, in the present embodiment, the circuit board includes a power board 4 and a control board 5, the power board 4 and the control board 5 are disposed in the housing and located at two opposite sides of the main frame 11 of the heat dissipation frame 1 of the heat dissipation structure, respectively, and the control board 5 is located at one side of the second heat dissipation portion 3 of the heat dissipation structure, which is far away from the first heat dissipation portion 2.
EXAMPLE III
In this embodiment, the circuit board is further provided with at least one capacitor 41, the bottom plate 311 of the second heat dissipation portion is provided with at least one avoidance hole 318 for the capacitor 41 to pass through, and one end of the capacitor 41 passes through the avoidance hole 318 and then extends into the second heat dissipation cavity of the second heat dissipation portion 3; or, at least part of the capacitor 41 on the circuit board is located in the second heat dissipation cavity of the second heat dissipation part 3.
The utility model also provides a driving system is applicable to foretell driver.
Specifically, the utility model discloses a actuating system is the high-power servo actuating system of 380V.
From the above description, it can be seen that the above-mentioned embodiments of the present invention achieve the following technical effects:
the utility model discloses a heat radiation structure includes: the heat dissipation frame 1 comprises a mounting surface and a main frame body 11 arranged on the mounting surface, wherein a first heat dissipation part 2 and a second heat dissipation part 3 communicated with the first heat dissipation part 2 are sequentially arranged on one side of the main frame body 11 along the direction far away from the mounting surface; a first mounting bracket 24 and a first fan 22, the first mounting bracket 24 being disposed at one end of the first heat sink member 2, the first fan 22 being disposed on the first mounting bracket 24; wherein, be provided with the radiating component 21 that includes two at least heat dissipation teeth 210 that set up with the installation face is parallel and the interval in the first heat dissipation portion 2, second heat dissipation portion 3 is the through-hole, first fan 22 forms the air current and flows to first heat dissipation portion 2 and second heat dissipation portion 3, dispel the heat to first heat dissipation portion 2 and the first heat dissipation chamber of second heat dissipation portion 3 simultaneously through first fan 22, the radiating efficiency to the driver has been improved, the heat dissipation demand when having satisfied high-power servo driver and having used, the lower problem of radiating efficiency of the driver among the prior art has been solved.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
In the description of the present application, it is to be understood that the directions or positional relationships indicated by the directional terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc., are generally based on the directions or positional relationships shown in the drawings, and are for convenience of description and simplicity of description only, and in the case of not making a reverse description, these directional terms do not indicate and imply that the device or element being referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore should not be construed as limiting the scope of the present application; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.
For ease of description, spatially relative terms such as "over 8230," "upper surface," "above," and the like may be used herein to describe the spatial positional relationship of one device or feature to other devices or features as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary terms "at 8230; \8230; 'above" may include both orientations "at 8230; \8230;' above 8230; 'at 8230;' below 8230;" above ". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, so that the scope of the present application is not to be construed as being limited.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (15)
1. A heat dissipation structure, comprising:
the radiating frame (1) comprises a mounting surface and a main frame body (11) arranged on the mounting surface, wherein a first radiating part (2) and a second radiating part (3) communicated with the first radiating part (2) are sequentially arranged on one side of the main frame body (11) along the direction away from the mounting surface;
a first mounting bracket (24) and a first fan, wherein the first mounting bracket (24) is arranged at one end of the first heat dissipation part (2), and the first fan is arranged on the first mounting bracket (24);
the heat dissipation device comprises a first heat dissipation part (2), a second heat dissipation part (3) and a fan, wherein the first heat dissipation part (2) is internally provided with a heat dissipation assembly (21) comprising at least two heat dissipation teeth (210) which are parallel to the mounting surface and are arranged at intervals, the second heat dissipation part (3) is a through hole, and the first fan forms airflow which flows to the first heat dissipation part (2) and the second heat dissipation part (3);
the second heat dissipation part (3) is provided with a support (31), the support (31) comprises a bottom plate (311) installed on the heat dissipation frame (1), a first side plate (313) arranged on one side of the bottom plate (311) and a second side plate (312) arranged on the other side of the bottom plate (311), and the first side plate (313) and the second side plate (312) are respectively located on two opposite sides of the bottom plate (311) and used for enclosing a second heat dissipation cavity of the second heat dissipation part (3);
the heat radiation structure is used for dispelling the heat to the driver, be provided with at least one on bottom plate (311) of second heat dissipation portion (3) and be used for the confession dodge hole (318) that electric capacity (41) of driver passed, at least part of electric capacity (41) passes stretch into behind dodge hole (318) the second heat dissipation intracavity.
2. The heat dissipation structure according to claim 1, wherein the heat dissipation assembly (21) is integrally formed with or detachably connected to the heat dissipation frame (1).
3. The heat dissipation structure according to claim 1, further comprising:
a third side panel (314), the third side panel (314) being disposed at the second heat sink piece (3) and being perpendicular to the first side panel (313); the third side panel (314) includes a second mounting bracket (33) having a vent hole.
4. The heat dissipation structure of claim 3, wherein a fourth side plate is disposed on the third side plate (314) and is parallel to or forms an acute angle with the second side plate (312).
5. The heat dissipation structure of claim 3, further comprising a second fan (32), the second fan (32) being mounted on the second mounting bracket (33) for providing a flowing air flow to the second heat dissipation chamber.
6. The heat dissipation structure according to claim 4,
the first side plate (313) is integrally formed with or detachably connected with the bottom plate (311); and/or
The second side plate (312) is integrally formed with or detachably connected with the bottom plate (311); and/or
The third side plate (314) is integrally formed with or detachably connected with the bottom plate (311); and/or
The fourth side plate is integrally formed with the bottom plate (311) or detachably connected with the bottom plate; and/or
The first side plate (313) and the third side plate (314) are integrally formed or detachably connected; and/or
The third side plate (314) and the fourth side plate are integrally formed or detachably connected; and/or
The first side plate (313), the third side plate (314) and the fourth side plate are integrally formed.
7. The heat dissipation structure according to claim 4,
the heat dissipation structure further comprises a baffle (315), the baffle (315) is located at a communication port between the first heat dissipation cavity of the first heat dissipation part (2) and the second heat dissipation cavity of the second heat dissipation part (3), so that the communication port is blocked, and the communication port is at least part of a gap between the first mounting frame (24) and the heat dissipation assembly (21).
8. The heat dissipation structure according to claim 7,
the baffle (315) is integrally formed with or detachably connected with the heat dissipation frame (1); and/or
The baffle plate (315) is integrally formed with or detachably connected with the bottom plate (311); and/or
The baffles (315) are respectively detachably connected with the second side plates (312); and/or
The baffles (315) are respectively detachably connected with the third side plates (314); and/or
The baffles (315) are detachably connected with the fourth side plates respectively.
9. The heat dissipation structure according to claim 7,
the communication opening is at least partially disposed on the second side plate (312); or
The communication opening is at least partially arranged on the fourth side plate; or
The communication opening is enclosed or formed by the third side plate (314) and the second side plate (312) at intervals; or
The communication opening is formed by the second side plate (312) and the fourth side plate in a spaced or enclosed mode.
10. The heat dissipation structure according to claim 1,
the first side plate (313) is provided with at least one notch (316), and the notch (316) is used for avoiding a wiring harness of the brake resistor (42); and/or
At least one hook (317) is arranged on the bracket (31) and used for fixing a wiring harness of the brake resistor (42).
11. The heat dissipation structure according to claim 5,
the heat dissipation structure further comprises a first fan protection cover (25), the first fan and the first fan protection cover are both detachably mounted on the first mounting frame (24), and at least part of the first fan protection cover (25) is arranged in a first heat dissipation cavity of the first heat dissipation part (2); and/or
The heat dissipation structure further comprises a second fan protection cover, the second fan (32) and the second fan protection cover are detachably mounted on the second mounting frame (33), and at least part of the second fan protection cover is arranged in a second heat dissipation cavity of the second heat dissipation portion (3).
12. A driver comprising a housing and a circuit board, the driver further comprising: the heat dissipation structure of any one of claims 1 to 11, the heat dissipation structure and the housing forming a closed space for placement of the circuit board; a brake resistor (42) electrically connected to the circuit board, wherein,
the brake resistor (42) is arranged in a first heat dissipation cavity of the first heat dissipation part (2); and/or the brake resistor (42) is arranged in a second heat dissipation cavity of the second heat dissipation part (3); and/or the brake resistor (42) is arranged on the heat dissipation component (21) or on the side part of the heat dissipation component (21).
13. An actuator according to claim 12, wherein the circuit board comprises a power board (4) and a control board (5), the power board (4) and the control board (5) are both disposed in the housing and located on opposite sides of a main frame body (11) of a heat dissipation frame (1) of the heat dissipation structure, respectively, and the control board (5) is located on a side of the second heat dissipation portion (3) of the heat dissipation structure away from the first heat dissipation portion (2).
14. The driver according to claim 12 or 13, wherein at least one capacitor (41) is further disposed on the circuit board, and one end of the capacitor (41) passes through the avoiding hole and then extends into the second heat dissipation cavity of the second heat dissipation part (3); or at least part of the capacitor (41) on the circuit board is positioned in the second heat dissipation cavity of the second heat dissipation part (3).
15. A drive system adapted for use with a drive according to any one of claims 12 to 14.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122105390.7U CN218868553U (en) | 2021-08-31 | 2021-08-31 | Heat radiation structure, driver and driving system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122105390.7U CN218868553U (en) | 2021-08-31 | 2021-08-31 | Heat radiation structure, driver and driving system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218868553U true CN218868553U (en) | 2023-04-14 |
Family
ID=87375867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122105390.7U Active CN218868553U (en) | 2021-08-31 | 2021-08-31 | Heat radiation structure, driver and driving system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218868553U (en) |
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2021
- 2021-08-31 CN CN202122105390.7U patent/CN218868553U/en active Active
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