CN211630645U - Electric control device for heat exchange system and heat exchange system - Google Patents

Electric control device for heat exchange system and heat exchange system Download PDF

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Publication number
CN211630645U
CN211630645U CN202020346013.5U CN202020346013U CN211630645U CN 211630645 U CN211630645 U CN 211630645U CN 202020346013 U CN202020346013 U CN 202020346013U CN 211630645 U CN211630645 U CN 211630645U
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China
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heat dissipation
heat
control device
cavity
circuit board
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CN202020346013.5U
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陈偲
吉群
周勇刚
杨昆
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Lengwang Shanghai Industrial Co ltd
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Lengwang Shanghai Industrial Co ltd
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Abstract

The present disclosure provides an electric control device for a heat exchange system and a heat exchange system. The electric control device comprises: box, control assembly and radiator unit. The box is formed with and holds the chamber and communicate the first louvre that holds the chamber. The control assembly comprises at least two circuit boards, the at least two circuit boards are arranged in the accommodating cavity in a layered mode, and a gap is formed between the at least two circuit boards which are arranged in the layered mode. The heat dissipation assembly is arranged in the accommodating cavity and matched with the first heat dissipation hole to dissipate heat of the control assembly. The electric control device can effectively dissipate heat, solves the problems of inconvenient installation and difficult later maintenance caused by the scattered arrangement of a plurality of circuit boards, and is high in integration level and small in size.

Description

Electric control device for heat exchange system and heat exchange system
Technical Field
The disclosure relates to the technical field of heat management systems, in particular to an electric control device for a heat exchange system and the heat exchange system.
Background
The heat exchange system can be used for an air conditioner, and can heat up an area needing air conditioning by releasing heat so as to achieve the purpose of heating, or absorb heat so as to cool the area so as to achieve the purpose of refrigerating. The heat exchange system comprises an electric control device and is used for controlling the working states of the heat exchange system such as heating and refrigerating based on user requirements.
SUMMERY OF THE UTILITY MODEL
The present disclosure provides an improved electric control device for a heat exchange system and a heat exchange system.
One aspect of the present disclosure provides an electrical control device for a heat exchange system, the electrical control device comprising:
the box body is provided with a containing cavity and a first heat dissipation hole communicated with the containing cavity;
the control assembly comprises at least two circuit boards, the at least two circuit boards are arranged in the accommodating cavity in a layered mode, and a gap is formed between the at least two circuit boards arranged in the layered mode; and
and the heat dissipation assembly is arranged in the accommodating cavity and is matched with the first heat dissipation hole to dissipate heat of the control assembly.
Optionally, the circuit boards include a first circuit board and a second circuit board which are arranged in layers;
the heat dissipation assembly comprises a first heat dissipation piece and a second heat dissipation piece which are arranged in a layered mode, the first heat dissipation piece is arranged on the first circuit board, and the second heat dissipation piece is arranged on the second circuit board.
Optionally, the first heat dissipation element is disposed above the second heat dissipation element, and the first circuit board and the second circuit board are disposed on two sides of the first heat dissipation element.
Optionally, the first heat dissipation member is provided with a second heat dissipation hole, and the second heat dissipation hole is communicated with the upper portion of the first circuit board and the lower portion of the first heat dissipation member.
Optionally, the heat dissipation assembly further includes a heat dissipation fan, a mounting opening communicated with the accommodating cavity is formed in the side wall of the box body, the heat dissipation fan is assembled to the mounting opening, a heat dissipation channel is formed among the heat dissipation fan, the inner wall of the box body and the first heat dissipation hole, and the second heat dissipation member is arranged in the heat dissipation channel.
Optionally, the heat dissipation assembly further comprises at least one blocking member, and the number of the second heat dissipation members is at least two;
a first heat dissipation gap is formed between every two adjacent second heat dissipation pieces, the extending direction of the first heat dissipation gap is the same as the heat dissipation direction of the heat dissipation channel, the blocking piece is arranged in the first heat dissipation gap, and the blocking surface of the blocking piece is intersected with the extending direction of the first heat dissipation gap; and/or the presence of a gas in the gas,
a second heat dissipation gap is formed between the second heat dissipation piece and the inner wall of the box body, the extending direction of the second heat dissipation gap is the same as the heat dissipation direction of the heat dissipation channel, the blocking piece is arranged in the second heat dissipation gap, and the blocking surface of the blocking piece is intersected with the extending direction of the second heat dissipation gap.
Optionally, a first bracket is arranged in the accommodating cavity to divide the accommodating cavity into a component cavity and a heat dissipation cavity, the first bracket is provided with an opening for communicating the component cavity and the heat dissipation cavity, the second circuit board is connected with one side of the first bracket facing the component cavity, the second heat dissipation member penetrates into the heat dissipation cavity through the opening, and the heat dissipation fan and the first heat dissipation hole are communicated with the heat dissipation cavity;
the box body is further provided with a third heat dissipation hole communicated with the component cavity and the heat dissipation cavity.
Optionally, the mounting opening is provided with a butt plate protruding towards the accommodating cavity, the butt plate is covered on the upper portion of the heat dissipation fan, the butt plate abuts against the first support, the third heat dissipation hole is formed in the butt plate, one end of the third heat dissipation hole is opposite to the heat dissipation fan, and the other end of the third heat dissipation hole is opposite to the component cavity.
Optionally, the first heat dissipation element includes a heat dissipation plate, and the second heat dissipation element includes a heat dissipation plate group.
Another aspect of the present disclosure provides a heat exchange system comprising any one of the above-mentioned electric control devices.
The electric control device provided by the embodiment of the disclosure has the advantages that the at least two circuit boards are arranged in the accommodating cavity in a layered mode, and the at least two circuit boards arranged in a layered mode are provided with the gap, so that heat exchange between the circuit boards on different layers is facilitated, and the heat dissipation assembly and the first heat dissipation hole are matched to effectively dissipate heat of the control assembly. And control assembly and radiator unit all locate the chamber that holds of box, have solved the problem that a plurality of circuit boards dispersion were laid and the installation that causes is inconvenient and the difficult maintenance in later stage to improve electrically controlled device's integrated level, do benefit to the volume that reduces electrically controlled device.
Drawings
FIG. 1 is a schematic structural diagram of an electric control device;
FIG. 2 is a schematic diagram illustrating the construction of an electrical control device according to an exemplary embodiment of the present disclosure;
FIG. 3 is an exploded view of the electronic control unit of FIG. 2;
FIG. 4 is a partial cross-sectional view of the electronic control unit of FIG. 2;
fig. 5 is a schematic view showing heat exchange among the first circuit board, the second circuit board, the first heat dissipating member, and the second heat dissipating member of fig. 3;
FIG. 6 is a schematic view of the case of FIG. 3 from one perspective;
FIG. 7 is a schematic view of the case of FIG. 3 from another perspective;
FIG. 8 is another partial cross-sectional view of the electronic control device of FIG. 2;
fig. 9 is a schematic assembly flow chart of the electric control device in fig. 2.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.
The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in the description and claims does not indicate any order, quantity, or importance, but rather is used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. Unless otherwise indicated, the word "comprise" or "comprises", and the like, means that the element or item listed before "comprises" or "comprising" covers the element or item listed after "comprises" or "comprising" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect.
As used in this disclosure and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
In some embodiments, the heat exchange system may be used for a bus air conditioner, the heat exchange system including an electrical control device, the electrical control device including: a plurality of circuit boards and a heat dissipation assembly. A plurality of circuit boards expose and the dispersion sets up, and occupation space is great, and a plurality of circuit board intervals are far away, are unfavorable for installation and later stage maintenance. In addition, the heat dissipation assembly is arranged near part of the circuit board and can only dissipate heat of the part of the circuit board, so that the heat dissipation effect of the electric control device is poor.
In other embodiments, referring to the schematic structural diagram of the electronic control device 100 shown in fig. 1, the electronic control device 100 includes: a case 110, a heat sink 120, and a control assembly (not shown). The case 110 is integrally formed, and the control assembly includes a plurality of circuit boards, which are disposed in the case 110 without a gap therebetween. The heat sink 120 is disposed in the case 110, and is used for dissipating heat from the control components in the case 110. Although the electric control device can solve the problems of inconvenient installation and later maintenance of a plurality of circuit boards, the heat dissipation effect of the heat dissipation member 120 on the control assembly is poor.
In order to solve the above problems, the present disclosure provides an electric control device for a heat exchange system and a heat exchange system. The heat exchange system comprises an electric control device which comprises: box, control assembly and radiator unit. Wherein, the box is formed with the first louvre that holds the chamber and the intercommunication holds the chamber. The control assembly comprises at least two circuit boards, the at least two circuit boards are arranged in the accommodating cavity in a layered mode, and a gap is formed between the at least two circuit boards which are arranged in the layered mode. The heat dissipation assembly is arranged in the accommodating cavity and matched with the first heat dissipation hole to dissipate heat of the control assembly.
The electric control device provided by the embodiment of the disclosure has the advantages that the at least two circuit boards are arranged in the accommodating cavity in a layered mode, and the at least two circuit boards arranged in a layered mode are provided with the gap, so that heat exchange between the circuit boards on different layers is facilitated, and the heat dissipation assembly and the first heat dissipation hole are matched to effectively dissipate heat of the control assembly. And control assembly and radiator unit all locate the chamber that holds of box, have solved the problem that a plurality of circuit boards dispersion were laid and the installation that causes is inconvenient and the difficult maintenance in later stage to improve electrically controlled device's integrated level, do benefit to the volume that reduces electrically controlled device.
Fig. 2 is a schematic structural diagram of an electronic control device 200 according to an exemplary embodiment of the present disclosure. Fig. 3 is an exploded view of the electronic control device 200 shown in fig. 2. Fig. 4 is a partial cross-sectional view of the electronic control device 200 of fig. 2. Referring to fig. 2 to 4 in combination, the electronic control device 200 includes: a case 210, a control assembly 220 and a heat dissipation assembly 230.
The case 210 has a receiving cavity 211 and a first heat dissipation hole 212 communicating with the receiving cavity 211. The accommodating cavity 211 is used for filling the control component 220 and the heat dissipation component 230, and the first heat dissipation hole 212 and the heat dissipation component 230 cooperate to dissipate heat of the control component 220. In some embodiments, the box 210 includes a main body 213 and a cover plate 214 detachably covering the main body 213, and the main body 213 and the cover plate 214 cooperate to form the receiving cavity 211. In some embodiments, the first heat dissipation holes 212 may be grid holes, and a plurality of grid holes are regularly disposed on the wall of the main body 213.
In some embodiments, the box 210 has a regular or irregular structure, such as a square structure, a cylindrical structure, or the like. In some embodiments, the material of the box 210 includes a metal plate, the box 210 is formed by a sheet metal process, which avoids the processes of mold opening and the like, does not need to be integrally purchased, and is beneficial to reducing the manufacturing cost of the box 210, compared to the related art that forms the box 210, and the metal plate is a good thermal conductor and is beneficial to dissipating heat of the electronic control device 200.
The control assembly 220 includes at least two circuit boards 221, the at least two circuit boards 221 are layered in the accommodating cavity 211, and a gap is formed between the at least two layered circuit boards 221, so as to facilitate heat exchange between the circuit boards 221 of different layers. In some embodiments, the wiring board 221 includes, but is not limited to: an ECU (Electronic Control Unit) board 224, a fan overcurrent protection board 225, a DCDC (direct current voltage reducer) board 226, and a frequency conversion board 227.
The heat dissipation assembly 230 is disposed in the accommodating cavity 211, and the heat dissipation assembly 230 cooperates with the first heat dissipation hole 212 to dissipate heat of the control assembly 220.
In the electric control device 200 provided in the embodiment of the present disclosure, the at least two circuit boards 221 are layered in the accommodating cavity 211, and a gap is formed between the at least two circuit boards 221 that are layered, so as to facilitate heat exchange between the circuit boards 221 of different layers, and further facilitate cooperation between the heat dissipation assembly 230 and the first heat dissipation hole 212 to effectively dissipate heat of the control assembly 220. In addition, the control assembly 220 and the heat dissipation assembly 230 are both disposed in the accommodating cavity 211 of the box body 210, so that the problems of inconvenience in installation and difficulty in later maintenance caused by the scattered arrangement of the circuit boards 221 are solved, the integration level of the electric control device 200 is improved, and the reduction of the size of the electric control device 200 is facilitated.
In some embodiments, with continued reference to fig. 1, the wiring board 221 includes a first wiring board 222 and a second wiring board 223 arranged in layers; the heat dissipation assembly 230 includes a first heat dissipation member 231 and a second heat dissipation member 232 layered in the accommodation cavity 211, the first circuit board 222 is disposed on the first heat dissipation member 231, and the second circuit board 223 is disposed on the second heat dissipation member 232. In some embodiments, by disposing the first circuit board 222 on the first heat dissipation member 231, the first heat dissipation member 231 absorbs the heat of the first circuit board 222, thereby facilitating heat dissipation of the first circuit board 222. By arranging the second circuit board 223 on the second heat dissipation member 232, the second heat dissipation member 232 absorbs heat of the second circuit board 223, which is beneficial to dissipating heat of the second circuit board 223. The first heat sink 231 and the second heat sink 232 can be used as the support of the first circuit board 222 and the second circuit board 223, respectively. The number of the first circuit boards 222 is at least one, and the plurality of first circuit boards 222 may be disposed on the same first heat dissipation member 231, or may be disposed on a plurality of first heat dissipation members 231. The number of the second circuit boards 223 is at least one, and a plurality of second circuit boards 223 may be disposed on the same second heat dissipation member 232, or may be disposed on a plurality of second heat dissipation members 232 separately.
The first wiring board 222 and the second wiring board 223 may be layered in a variety of ways, and in some embodiments, the first wiring board 222 and the second wiring board 223 are layered in a lateral direction. In other embodiments, the first wiring board 222 and the second wiring board 223 are layered in the longitudinal direction. Further, the first heat sink 231 may be disposed above the second heat sink 232, and the first and second circuit boards 222 and 223 are disposed at both sides of the first heat sink 231. In this way, the first heat dissipation element 231 is facilitated to absorb or transfer heat of the first circuit board 222 and the second circuit board 223, thereby facilitating efficient heat dissipation of the control component 220.
Fig. 5 is a schematic diagram illustrating heat exchange among the first circuit board 222, the second circuit board 223, the first heat dissipation member 231, and the second heat dissipation member 232 of fig. 3, and arrows in fig. 5 indicate air flow directions. In some embodiments, referring to fig. 5, the first heat dissipation member 231 is provided with a second heat dissipation hole 234, and the second heat dissipation hole 234 communicates the upper side of the first circuit board 222 and the lower side of the first heat dissipation member 231. In some embodiments, convection can be formed between the air above the first circuit board 222 and the air below the first heat sink 231 (below the second circuit board 223), which is beneficial to effectively dissipate heat of the first circuit board 222 and the second circuit board 223.
With continued reference to fig. 3, the inner wall of the main body 213 is provided with a second bracket 215, the first circuit board 222 is fixed to the first heat sink 231, and the first heat sink 231 is fixed to the second bracket 215. In some embodiments, the second bracket 215 includes two supporting bodies 216 disposed oppositely, the supporting bodies 216 protrude inward from the inner wall of the main body 213, and the supporting bodies 216 are used for supporting the first heat dissipation member 231 and connected to the first heat dissipation member 231. Exemplarily, the supporting body 216 and the first heat sink 231 are connected by screws.
In some embodiments, with continued reference to fig. 3 and 4, the heat dissipation assembly 230 further includes a heat dissipation fan 233, a mounting opening 217 is formed in a side wall of the box 210 and is communicated with the accommodating cavity 211, the heat dissipation fan 233 is assembled in the mounting opening 217, a heat dissipation channel is formed among the heat dissipation fan 233, an inner wall of the box 210 and the first heat dissipation hole 212, and the second heat dissipation member 232 is disposed in the heat dissipation channel. In some embodiments, the first circuit board 222 may transfer heat to the second circuit board 223, the second circuit board 223 may transfer heat to the second heat dissipation member 232, and the heat dissipation fan 233 and the first heat dissipation hole 212 cooperate to dissipate heat of the second heat dissipation member 232, so that the second heat dissipation member 232 effectively absorbs the heat transferred by the second circuit board 223, and further, the first circuit board 222 and the second circuit board 223 effectively dissipate heat.
The box 210 may further include a packaging plate 218, the packaging plate 218 is provided with an air guiding hole 219, after the heat dissipating fan 233 is assembled to the mounting hole 217, the packaging plate 218 is packaged at the mounting hole 217, and the air guiding hole 219 is opposite to the heat dissipating fan 233, so as to facilitate air flow circulation. In some embodiments, the air outlet surface of the heat dissipation fan 233 faces the accommodating cavity 211, so that the wind carries heat and is output by the first heat dissipation hole 212. In other embodiments, the air outlet surface of the heat dissipation fan 233 faces away from the accommodating cavity 211 to suck heat from the accommodating cavity 211 and drive the external air to enter the accommodating cavity 211 through the first heat dissipation hole 212.
Fig. 6 is a schematic structural view of the case 210 in fig. 3 from one perspective, and fig. 7 is a schematic structural view of the case 210 in fig. 3 from another perspective. With reference to fig. 3, 4, 6 and 7, a first bracket 201 is arranged in the accommodating cavity 211 to divide the accommodating cavity 211 into an element cavity 202 and a heat dissipation cavity 203, the first bracket 201 is provided with an opening 204 for communicating the element cavity 202 and the heat dissipation cavity 203, the second circuit board 223 is connected with one side of the first bracket 201 facing the element cavity 202, the second heat dissipation member 232 penetrates into the heat dissipation cavity 203 from the opening 204, and the heat dissipation fan 233 and the first heat dissipation hole 212 are communicated with the heat dissipation cavity 203; the box 210 is further provided with a third heat dissipation hole 205 communicating the component cavity 202 and the heat dissipation cavity 203. In some embodiments, the heat of the first circuit board 222 may be transferred to the second circuit board 223, the heat of the second circuit board 223 may be transferred to the second heat dissipation member 232, and the heat dissipation fan 233 cooperates with the first heat dissipation hole 212 to dissipate the heat of the component cavity 202 to the heat dissipation cavity 203. Through setting up third louvre 205, make and to realize the air convection between components and parts chamber 202 and the heat dissipation chamber 203, further dispel the heat to components and parts chamber 202, do benefit to and make control assembly 220 effectively dispel the heat.
In some embodiments, the first bracket 201 and the second circuit board 223 cooperate to hermetically separate the receiving cavity 211 into the component cavity 202 and the heat dissipation cavity 203. Therefore, the heat dissipation channel of the heat dissipation cavity 203 is formed by matching the heat dissipation fan 233, the inner wall of the box body 210 and the first heat dissipation hole 212, the effective heat dissipation of the second heat dissipation member 232 is realized by matching the heat dissipation fan 233 and the first heat dissipation hole 212, and the control assembly 220 in the component cavity 202 is further waterproofed by sealing and separating.
In some embodiments, with reference to fig. 4, 6 and 7, an abutting plate 206 protruding toward the accommodating cavity 211 is disposed at the mounting opening 217, the abutting plate 206 is covered on the top of the heat dissipating fan 233, the abutting plate 206 abuts against the first bracket 201, the third heat dissipating hole 205 is disposed on the abutting plate 206, one end of the third heat dissipating hole 205 is opposite to the heat dissipating fan 233, and the other end is opposite to the component cavity 202. In this way, the airflow in the heat dissipation cavity 203 can easily enter the component cavity 202 through the third heat dissipation hole 205, so that air convection between the heat dissipation cavity 203 and the component cavity 202 is realized, and effective heat dissipation for the first circuit board 222 and the second circuit board 223 is facilitated.
With continued reference to FIG. 7, the wall of the main body 213 is also provided with a wire passage hole 207 for passing a wire through and connecting with the control assembly 220. After the cable passes through the wire passing hole 207, the wire passing hole 207 may be sealed to prevent external water, dust, etc. from entering the case 210 to damage the control assembly 220.
Fig. 8 is another partial cross-sectional view of the electronic control device of fig. 2. In some embodiments, heat dissipation assembly 230 further includes at least one blocker 235, and the number of second heat dissipation elements 232 is at least two; a first heat dissipation gap 208 is formed between two adjacent second heat dissipation members 232, the extending direction of the first heat dissipation gap 208 is the same as the heat dissipation direction of the heat dissipation channel, the blocking member 235 is arranged in the first heat dissipation gap 208, and the blocking surface of the blocking member 235 intersects with the extending direction of the first heat dissipation gap 208; and/or a second heat dissipation gap 209 is formed between the second heat dissipation member 232 and the inner wall of the box body 210, the extending direction of the second heat dissipation gap 209 is the same as the heat dissipation direction of the heat dissipation channel, the blocking member 235 is arranged in the second heat dissipation gap 209, and the blocking surface of the blocking member 235 intersects with the extending direction of the second heat dissipation gap 209. In some embodiments, providing the blocking member 235 in the first heat dissipation gap 208 and/or the second heat dissipation gap 209 facilitates heat to be transmitted along the second heat dissipation member 232 rather than being transmitted in the first heat dissipation gap 208 and/or the second heat dissipation gap 209, which further facilitates the second heat dissipation member 232 to absorb heat sufficiently to effectively dissipate heat from the control assembly 220.
In some embodiments, the blocking member 235 has a regular or irregular structure such as a block, a bar, a column, etc., which is not specifically limited by the present disclosure.
In some embodiments, first heat dissipation element 231 and second heat dissipation element 232 are selected from at least one of a heat dissipation plate and a heat dissipation plate group. In some embodiments, the first heat sink 231 is a heat sink, and the heat sink has a second heat sink 234 to facilitate heat exchange between the first circuit board 222 and the second circuit board 223. In some embodiments, the second heat dissipation member 232 is a heat dissipation plate set, so as to facilitate sufficient heat dissipation of the second heat dissipation member 232 by the heat dissipation fan 233. In some embodiments, the heat sink set includes a plurality of heat sinks, and a heat dissipation gap is formed between the heat sinks to facilitate heat dissipation.
Fig. 9 is a schematic assembly flow chart of the electronic control device 200 in fig. 2. Referring to fig. 9, the assembly of the electronic control device 200 includes the steps of:
the assembled second heat sink 232 and the second circuit board 223 are assembled to the opening 204 of the first bracket 201. In some embodiments, the DCDC board 226 and the frequency conversion board 227 are assembled to the opening 204 of the first bracket 201.
The assembled first heat sink 231 and the first circuit board 222 are assembled on the second bracket 215, and the first circuit board 222 is located above the second circuit board 223.
The heat dissipation fan 233 is assembled to the mounting opening 217, and the package plate 218 is packaged, such that the air guiding hole 219 of the package plate 218 is opposite to the heat dissipation fan 233, thereby facilitating air flow.
The cover plate 214 is assembled to the main body 213 to complete the packaging of the electronic control device 200, thereby obtaining the electronic control device 200.
Some embodiments of the present disclosure also provide a heat exchange system including any one of the above-mentioned electronic control devices 200.
The heat exchange system provided by the embodiment of the present disclosure includes an electric control device 200, and at least two circuit boards 221 are layered in the accommodating cavity 211, and a gap is formed between at least two circuit boards 221 that are layered, so as to facilitate heat exchange between circuit boards 221 of different layers, and further facilitate cooperation between the heat dissipation assembly 230 and the first heat dissipation hole 212 to effectively dissipate heat of the control assembly 220. In addition, the control assembly 220 and the heat dissipation assembly 230 are both arranged in the accommodating cavity 211 of the box body 210, so that the problems of inconvenience in installation and difficulty in later maintenance caused by the scattered arrangement of the circuit boards 221 are solved, the integration level of the heat exchange system is improved, and the volume of the heat exchange system is favorably reduced.
In some embodiments, the heat exchange system provided by the present disclosure is used for a bus air conditioner, and includes any one of the above mentioned electric control devices 200, the electric control device 200 has a high integration level, is convenient for installation and maintenance of the control assembly 220, has a low manufacturing cost, and can meet the requirements of the bus air conditioner and other heat exchange systems.
The above embodiments of the present disclosure may be complementary to each other without conflict.
The above description is only exemplary of the present disclosure and should not be taken as limiting the disclosure, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present disclosure should be included in the scope of the present disclosure.

Claims (10)

1. An electrical control device for a heat exchange system, the electrical control device comprising:
the refrigerator comprises a box body (210) and a first heat dissipation hole (212), wherein an accommodating cavity (211) and the first heat dissipation hole (212) communicated with the accommodating cavity (211) are formed in the box body;
the control assembly (220) comprises at least two circuit boards (221), the at least two circuit boards (221) are layered in the accommodating cavity (211), and a gap is formed between the layered at least two circuit boards (221); and
the heat dissipation assembly (230) is arranged in the accommodating cavity (211), and the heat dissipation assembly (230) is matched with the first heat dissipation hole (212) to dissipate heat of the control assembly (220).
2. The electric control device according to claim 1, wherein the circuit board (221) includes a first circuit board (222) and a second circuit board (223) arranged in layers;
the heat dissipation assembly (230) comprises a first heat dissipation piece (231) and a second heat dissipation piece (232) which are arranged in the accommodating cavity (211) in a layered mode, the first circuit board (222) is arranged on the first heat dissipation piece (231), and the second circuit board (223) is arranged on the second heat dissipation piece (232).
3. The electric control device according to claim 2, wherein the first heat dissipation member (231) is provided above the second heat dissipation member (232), and the first and second circuit boards (222, 223) are provided separately on both sides of the first heat dissipation member (231).
4. The electric control device according to claim 3, wherein the first heat dissipating member (231) is provided with a second heat dissipating hole (234), and the second heat dissipating hole (234) communicates between the upper side of the first circuit board (222) and the lower side of the first heat dissipating member (231).
5. The electric control device according to claim 3, wherein the heat dissipation assembly (230) further comprises a heat dissipation fan (233), a mounting opening (217) communicating with the accommodating cavity (211) is formed in a side wall of the box body (210), the heat dissipation fan (233) is assembled to the mounting opening (217), a heat dissipation channel is formed among the heat dissipation fan (233), an inner wall of the box body (210) and the first heat dissipation hole (212), and the second heat dissipation member (232) is disposed in the heat dissipation channel.
6. The electric control device according to claim 5, characterized in that said heat dissipating assembly (230) further comprises at least one blocking member (235), said second heat dissipating member (232) being at least two in number;
a first heat dissipation gap (208) is formed between every two adjacent second heat dissipation members (232), the extending direction of the first heat dissipation gap (208) is the same as the heat dissipation direction of the heat dissipation channel, the blocking member (235) is arranged in the first heat dissipation gap (208), and the blocking surface of the blocking member (235) is intersected with the extending direction of the first heat dissipation gap (208); and/or the presence of a gas in the gas,
second heat dissipation piece (232) with form second heat dissipation clearance (209) between the inner wall of box (210), the extending direction of second heat dissipation clearance (209) with heat dissipation channel's heat dissipation direction is the same, stop piece (235) locate second heat dissipation clearance (209), just stop the face of stopping piece (235) with the extending direction of second heat dissipation clearance (209) is crossing.
7. The electric control device according to claim 5, characterized in that a first bracket (201) is arranged in the accommodating cavity (211) to divide the accommodating cavity (211) into a component cavity (202) and a heat dissipation cavity (203), the first bracket (201) is provided with an opening (204) for communicating the component cavity (202) with the heat dissipation cavity (203), the second circuit board (223) is connected with one side of the first bracket (201) facing the component cavity (202), the second heat dissipation member (232) penetrates into the heat dissipation cavity (203) through the opening (204), and the heat dissipation fan (233) and the first heat dissipation hole (212) are communicated with the heat dissipation cavity (203);
the box body (210) is further provided with third heat dissipation holes (205) communicated with the component cavity (202) and the heat dissipation cavity (203).
8. The electric control device according to claim 7, wherein an abutting plate (206) protruding toward the accommodating cavity (211) is disposed at the mounting opening (217), the abutting plate (206) is covered on the upper portion of the heat dissipation fan (233), the abutting plate (206) abuts against the first bracket (201), the third heat dissipation hole (205) is disposed on the abutting plate (206), one end of the third heat dissipation hole (205) is opposite to the heat dissipation fan (233), and the other end of the third heat dissipation hole is opposite to the component cavity (202).
9. An electric control device according to any one of claims 2-8, characterized in that the first heat dissipation element (231) comprises a heat dissipation plate and the second heat dissipation element (232) comprises a set of heat dissipation plates.
10. A heat exchange system comprising an electrically controlled device according to any one of claims 1 to 9.
CN202020346013.5U 2020-03-18 2020-03-18 Electric control device for heat exchange system and heat exchange system Active CN211630645U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020346013.5U CN211630645U (en) 2020-03-18 2020-03-18 Electric control device for heat exchange system and heat exchange system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020346013.5U CN211630645U (en) 2020-03-18 2020-03-18 Electric control device for heat exchange system and heat exchange system

Publications (1)

Publication Number Publication Date
CN211630645U true CN211630645U (en) 2020-10-02

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Application Number Title Priority Date Filing Date
CN202020346013.5U Active CN211630645U (en) 2020-03-18 2020-03-18 Electric control device for heat exchange system and heat exchange system

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Country Link
CN (1) CN211630645U (en)

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