CN218849446U

CN218849446U - Silicon wafer conveying mechanism

Info

Publication number: CN218849446U
Application number: CN202223294738.2U
Authority: CN
Inventors: 赖学明
Original assignee: Suzhou Yaode Semiconductor Co ltd
Current assignee: Suzhou Yaode Semiconductor Co ltd
Priority date: 2022-12-08
Filing date: 2022-12-08
Publication date: 2023-04-11
Anticipated expiration: 2032-12-08

Abstract

The utility model discloses a silicon chip transport mechanism, including conveying the chamber and around a plurality of process chambers that conveying chamber set up, the conveying intracavity is equipped with the flexible arm that can move towards arbitrary process chamber under rotary mechanism effect, installs the clamp that can stretch into the process chamber on the flexible arm and gets the piece fork. The silicon wafer clamping device comprises a clamping piece fork, a first detection assembly and a second detection assembly, wherein the clamping piece fork is used for clamping a silicon wafer; the second detection assembly is arranged at the top of the process cavity and comprises second detection parts which are in one-to-one correspondence with the process cavity, each second detection part comprises a pair of vision cameras which can move in the opposite direction or the opposite direction under the action of the driving part, and the connecting line of the vision cameras and the corresponding middle point of the process cavity projected along the vertical direction is perpendicular to the connecting line of the pair of vision cameras projected along the vertical direction. The utility model discloses a silicon chip transport mechanism can carry out position detection to the silicon chip of different specifications, improves production efficiency.

Description

Silicon wafer conveying mechanism

Technical Field

The utility model relates to a semiconductor processing equipment technical field especially relates to a silicon chip transport mechanism.

Background

In the semiconductor industry, silicon wafers are usually processed through a plurality of processes to become integrated circuit products with specific electrical functions. Currently, robots are commonly used to transfer wafers between different process chambers. In order to prevent the position deviation of the silicon wafer in the conveying process, a detection mechanism is generally arranged in a conveying device to detect the position of the silicon wafer, but because the model specifications of the silicon wafer are different, the position of the detection mechanism needs to be adjusted according to the model specifications of the silicon wafer in actual detection, but the position adjustment of the existing detection mechanism is difficult, and the production efficiency is seriously influenced.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects, the utility model aims to provide a silicon wafer conveying mechanism, which can detect the positions of silicon wafers with different specifications and improve the production efficiency.

In order to achieve the above purpose, the utility model discloses a technical scheme is: a silicon wafer conveying mechanism comprises a conveying cavity and a plurality of process cavities arranged around the conveying cavity, wherein telescopic arms capable of facing any process cavity under the action of a rotating mechanism are arranged in the conveying cavity, and clamping fork capable of extending into the process cavities are mounted on the telescopic arms; the silicon wafer clamping device further comprises a detection mechanism, wherein the detection mechanism comprises a first detection assembly and a second detection assembly which are matched with each other, and the first detection assembly is arranged on the wafer clamping fork and used for detecting whether the silicon wafer is clamped or not; the second detection assembly is arranged at the top of the conveying cavity and comprises second detection parts which are in one-to-one correspondence with the process cavities, each second detection part comprises a pair of vision cameras which can move in the opposite direction or the opposite direction under the action of a driving part, and the connecting line between the connecting line midpoint of the pair of vision cameras and the corresponding midpoint of the process cavity projected along the vertical direction is perpendicular to the connecting line between the pair of vision cameras projected along the vertical direction.

Before working, firstly, a silicon wafer is placed on the wafer clamping fork (the position of the silicon wafer is used as an undeflected reference position), then the pair of vision cameras are driven to move through the driving piece, so that the pair of vision cameras move to the edge aligned with the silicon wafer, and at the moment, the pair of vision cameras can detect the silicon wafer; when the telescopic arm faces any process cavity under the action of the rotating mechanism, the telescopic arm is driven to extend out towards the process cavity, so that the clamping piece fork can enter the process cavity to clamp a silicon wafer (or clamp the silicon wafer into the process cavity); when the silicon wafer is clamped on the clamping piece fork, the first detection part can detect the silicon wafer; then the telescopic arm retracts to enable the clamping piece fork to drive the silicon chip to enter the conveying cavity, and at the moment, if the position of the silicon chip is not deviated, the two vision cameras corresponding to the process cavity can detect the silicon chip; if the silicon wafer is deviated, a visual camera cannot detect the silicon wafer, and the silicon wafer position deviation can be judged at the moment.

The beneficial effects of the utility model reside in that:

in the detection mechanism, whether the silicon wafer is clamped on the clamping fork or not can be detected through the first detection component, and then the position of the silicon wafer is detected through the two vision cameras of the second detection part in a matched mode, namely the position of the silicon wafer can be determined through three points (the first detection component and the two vision cameras); the driving part drives the pair of vision cameras to move, so that the positions of the vision cameras can be adjusted according to the specification of the silicon wafer, and the projections of the connecting line middle points of the vision cameras and the middle points of the process cavity along the vertical direction are always positioned on the same straight line when the pair of vision cameras move in the opposite direction or in the back direction through limiting the positions of the connecting line middle points of the pair of vision cameras, so that the detection of the position deviation of the silicon wafer is realized; the position detection can be carried out on the silicon wafers of different specifications, and the production efficiency is improved.

Further, the driving part comprises a bidirectional screw rod which is installed at the top of the conveying cavity through an installation seat, a pair of nut seats which can move oppositely or back to back are in threaded connection with the bidirectional screw rod, and the lower end of each nut seat is connected with the vision camera through a connecting piece. The two-way screw rod is matched with the nut seat, so that the pair of vision cameras can move oppositely or reversely.

Furthermore, the connecting piece comprises an L-shaped plate and a connecting plate, wherein the L-shaped plate is fixedly connected to the nut seat, and one side of the L-shaped plate is connected with the connecting plate for mounting the vision camera.

Furthermore, one side of the L-shaped plate is provided with waist-shaped holes distributed along the vertical direction, the connecting plate is provided with screw holes, and screws capable of penetrating through the waist-shaped holes penetrate through the screw holes. Vertical micro-movement of the connecting plate relative to the L-shaped plate is achieved through matching of the waist-shaped holes, the screw holes and the screws, and the vertical position of the vision camera is convenient to adjust.

Further, the first detection assembly comprises a slot arranged on the clamping piece fork, and an in-place sensor is arranged in the slot; when the silicon wafer is clamped by the clamping piece fork, the silicon wafer can shield the open slot.

Further, the telescopic arm comprises a fixed arm fixedly connected with the rotating mechanism, a telescopic plate is slidably arranged on the fixed arm along the length direction of the fixed arm, and the clamping piece fork is mounted on the telescopic plate. The telescopic movement of the clamping piece fork is realized through the matching of the fixed arm and the telescopic plate.

Further, a conveying base platform fixedly connected with the rotating mechanism is arranged in the conveying cavity, and a plurality of telescopic arms capable of facing different process cavities simultaneously are arranged on the conveying base platform. The operation of a plurality of process chambers can be realized simultaneously through the arrangement of a plurality of telescopic arms, and the production efficiency is improved.

Drawings

Fig. 1 is a schematic structural diagram of a silicon wafer conveying mechanism according to an embodiment of the present invention;

FIG. 2 is a partial enlarged view of portion A of FIG. 1;

FIG. 3 is a schematic structural view of the top of the transfer chamber according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a second detection portion according to an embodiment of the present invention.

In the figure:

1-a transfer chamber; 2-a process chamber; 3-a telescopic arm; 31-a fixed arm; 32-a retractable plate; 4-clamping a piece fork; 41-slotting; 5-a silicon wafer; 61-a vision camera; 62-a bidirectional screw rod; 63-nut seats; 64-L-shaped plates; 65-connecting plate.

Detailed Description

The following description of the preferred embodiments of the present invention will be provided with reference to the accompanying drawings, so that the advantages and features of the present invention can be easily understood by those skilled in the art, and the scope of the present invention can be clearly and clearly defined.

Examples

Referring to the attached drawings 1-4, the silicon wafer conveying mechanism of the utility model comprises a conveying cavity 1 and a plurality of process cavities 2 arranged around the conveying cavity 1, wherein a telescopic arm 3 which can face any process cavity 2 under the action of a rotating mechanism is arranged in the conveying cavity 1, and a clamping piece fork 4 which can extend into the process cavity 2 is arranged on the telescopic arm 3; the silicon wafer conveying mechanism further comprises a detection mechanism, the detection mechanism comprises a first detection assembly and a second detection assembly which are matched with each other, and the first detection assembly is arranged on the clamping piece fork 4 and used for detecting whether the silicon wafer 5 is clamped or not; the second detection assembly is arranged at the top of the transfer chamber 2 and comprises second detection parts which are in one-to-one correspondence with the process chambers 2, each second detection part comprises a pair of vision cameras 61 which can move towards or away from each other under the action of the driving part, and the connecting line between the connecting line of the vision cameras 61 and the corresponding middle point of the process chamber 2 projected along the vertical direction is perpendicular to the connecting line between the vision cameras 61 projected along the vertical direction.

Before work, firstly, a silicon wafer 5 is placed on the clamping piece fork 4 (the position of the silicon wafer 5 is used as an undeflected reference position), then the pair of vision cameras 61 are driven to move through the driving part, so that the pair of vision cameras 61 move to the edge aligned with the silicon wafer 5, at the moment, the pair of vision cameras 61 can detect the silicon wafer 5, then when the telescopic arm 3 faces any process cavity 2 under the action of the rotating mechanism, the telescopic arm 3 is firstly driven to extend towards the direction of the process cavity 2, so that the clamping piece fork 4 can enter the process cavity 2 to clamp the silicon wafer 5 (or clamp the silicon wafer 5 into the process cavity 2); when the silicon wafer 5 is clamped on the clamping fork 4, the first detection part can detect the silicon wafer 5; then the telescopic arm 3 retracts to enable the clamping piece fork 4 to drive the silicon chip 5 to enter the conveying cavity 1, and at the moment, if the position of the silicon chip 1 is not deviated, the two vision cameras 61 corresponding to the process cavity 2 can detect the silicon chip 5; if the silicon wafer 5 is displaced, a vision camera 61 cannot detect the silicon wafer 5, and at this time, it can be determined that the silicon wafer 5 is displaced.

In some embodiments, referring to fig. 3-4, the driving member comprises a bidirectional screw 62 mounted on the top of the transferring chamber 1 through a mounting seat, one end of the bidirectional screw 62 is connected with a driving motor, a pair of nut seats 63 moving towards or away from each other are screwed on the bidirectional screw 62, and the lower end of the nut seats 63 is connected with a vision camera 61 through a connecting member. The two-way screw 62 is matched with the nut seat 63 to realize the opposite or back movement of the pair of vision cameras 61. Furthermore, the connecting member comprises an L-shaped plate 64 and a connecting plate 65, wherein the L-shaped plate 64 is fixedly connected to the nut base 63, and one side of the L-shaped plate is connected with the connecting plate 65 for installing the vision camera 61.

In some embodiments, a waist-shaped hole is formed in one side of the L-shaped plate 65 and arranged along the vertical direction, a screw hole is formed in the connecting plate 65, and a screw capable of passing through the waist-shaped hole is inserted into the screw hole. The vertical micro-movement of the connecting plate 65 relative to the L-shaped plate 65 is realized through the matching of the waist-shaped holes, the screw holes and the screws, so that the vertical position of the vision camera 61 can be conveniently adjusted.

In some embodiments, referring to fig. 2, the first detecting assembly includes a slot 41 opened on the blade-gripping fork 4, and a position sensor is installed in the slot 41; when the silicon wafer 5 is clamped by the clamping piece fork 4, the silicon wafer 5 can shield the open slot 41. It should be noted that the structure and the working principle of the in-place sensor are the prior art, and are not described in detail in this embodiment, but when the in-place sensor is deployed, it is necessary to ensure that the projections of the in-place sensor and the pair of vision cameras in the vertical direction are arranged in a non-collinear manner when the telescopic arm is in the retracted state.

In some embodiments, referring to fig. 1, the telescopic arm 3 includes a fixed arm 31 fixedly connected to the rotating mechanism, the fixed arm 31 is slidably provided with a telescopic plate 32 along a length direction thereof, and the telescopic plate 32 is provided with a clip blade fork 4. The telescopic movement of gripping blade fork 4 is achieved by the cooperation of fixed arm 31 and telescopic plate 32.

In some embodiments, to improve the production efficiency, a plurality of independently rotatable telescopic arms 3 may be provided, and the plurality of telescopic arms 3 may face different process chambers at the same time. The operation of a plurality of process chambers can be realized simultaneously through the setting of a plurality of flexible arms, improves production efficiency.

The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, so as not to limit the protection scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.

Claims

1. A silicon wafer conveying mechanism comprises a conveying cavity and a plurality of process cavities arranged around the conveying cavity, wherein telescopic arms capable of facing any process cavity under the action of a rotating mechanism are arranged in the conveying cavity, and clamping piece forks capable of extending into the process cavities are mounted on the telescopic arms; the method is characterized in that: the silicon wafer clamping device further comprises a detection mechanism, wherein the detection mechanism comprises a first detection assembly and a second detection assembly which are matched with each other, and the first detection assembly is arranged on the wafer clamping fork and used for detecting whether the silicon wafer is clamped or not; the second detection assembly is arranged at the top of the conveying cavity and comprises second detection parts which are in one-to-one correspondence with the process cavities, each second detection part comprises a pair of vision cameras which can move in the opposite direction or the opposite direction under the action of a driving part, and the connecting line between the connecting line midpoint of the pair of vision cameras and the corresponding midpoint of the process cavity projected along the vertical direction is perpendicular to the connecting line between the pair of vision cameras projected along the vertical direction.

2. The silicon wafer conveying mechanism according to claim 1, wherein: the driving part comprises a bidirectional screw rod arranged at the top of the conveying cavity through a mounting seat, the bidirectional screw rod is in threaded connection with a pair of nut seats capable of moving in opposite directions or in the back direction, and the lower end of each nut seat is connected with the vision camera through a connecting piece.

3. The silicon wafer conveying mechanism according to claim 2, characterized in that: the connecting piece comprises an L-shaped plate and a connecting plate, the L-shaped plate is fixedly connected to the nut seat, and one side of the L-shaped plate is connected with the connecting plate used for installing the vision camera.

4. The silicon wafer conveying mechanism according to claim 3, characterized in that: one side of the L-shaped plate is provided with waist-shaped holes distributed along the vertical direction, the connecting plate is provided with screw holes, and screws capable of penetrating through the waist-shaped holes penetrate through the screw holes.

5. The silicon wafer conveying mechanism according to any one of claims 1 to 4, wherein: the first detection assembly comprises a slot arranged on the clamping piece fork, and an in-place sensor is arranged in the slot; when the silicon wafer is clamped by the clamping piece fork, the silicon wafer can shield the open slot.

6. The silicon wafer conveying mechanism according to claim 1, characterized in that: the telescopic arm comprises a fixed arm fixedly connected with the rotating mechanism, a telescopic plate is arranged on the fixed arm in a sliding mode along the length direction of the fixed arm, and the clamping piece fork is installed on the telescopic plate.

7. The silicon wafer conveying mechanism according to claim 6, wherein: the conveying chamber is internally provided with a conveying base platform fixedly connected with the rotating mechanism, and the conveying base platform is provided with a plurality of telescopic arms capable of facing different process chambers simultaneously.