CN218835408U - Silicon wafer cleaning equipment - Google Patents

Abstract

The utility model relates to a silicon chip washs the field, especially relates to a silicon chip cleaning equipment. The silicon wafer cleaning equipment comprises an ultrasonic cleaning machine and a driving assembly; the drive assembly passes through electric putter and sets up inside ultrasonic cleaner, drive assembly includes the carriage, the four corners at carriage top all is equipped with the motor, every the top of motor all is equipped with the rolling disc, every the top of rolling disc all is equipped with the sand grip, just carriage top four corners motor outside all is equipped with telescopic link and extension spring. The utility model provides a silicon chip cleaning equipment, through drive assembly's work, can drive inside go-between and rotate and reciprocating motion from top to bottom, the go-between can be smoothly through the inside frame of placing and drive required abluent silicon chip and rotate and reciprocating motion, change the contact position between silicon chip and the card frame, the phenomenon at dead angle appears in the silicon chip when consequently reducing the washing, can make the washing at silicon chip later stage more comprehensive.

Description

Silicon wafer cleaning equipment

Technical Field

The utility model relates to a silicon chip washs the field, especially relates to a silicon chip cleaning equipment.

Background

In the production of semiconductor devices, silicon wafers are strictly cleaned, and the devices are also failed due to trace pollution. The cleaning is intended to remove surface contaminating impurities, including organic and inorganic substances. Some of these impurities exist in an atomic state or an ionic state, and some exist in a thin film form or a particle form on the surface of the silicon wafer. The cleanliness of the surface of the silicon wafer is a key factor influencing the qualified rate of the silicon wafer.

The prior application document with the publication number of (CN 207615278U) discloses a silicon wafer degumming cleaning device, which is mainly characterized by comprising the following steps: the cleaning device comprises an electric telescopic rod, a movable rod, an ultrasonic generator, a cleaning box, an energy converter, a heater, a cleaning tank, a frame body and a silicon wafer slot, wherein a silicon wafer is placed in the cleaning tank for cleaning;

mainly be the extension that drives the movable rod through electric telescopic handle, extend the framework to the inside washing tank and carry out abluent, in the cleaning process, the framework is not mobilizable, and single ultrasonic cleaning that passes through, the phenomenon that the washing is unclean then appears very easily in the position that silicon chip and framework are connected, after the washing simultaneously, directly upwards carry the framework through electric telescopic handle, impurity such as the dust under the washing also has partly through water stain be infected with on the silicon chip outer wall.

Therefore, it is necessary to provide a new silicon wafer cleaning apparatus to solve the above-mentioned problems.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a silicon chip cleaning equipment.

The utility model provides a silicon chip cleaning equipment includes:

an ultrasonic cleaning machine and a driving component;

the drive assembly passes through electric putter and sets up inside ultrasonic cleaner, drive assembly includes the carriage, the four corners at carriage top all is equipped with the motor, every the top of motor all is equipped with the rolling disc, every the top of rolling disc all is equipped with the sand grip, just carriage top four corners motor outside all is equipped with telescopic link and extension spring.

Preferably, a connecting ring is rotatably connected with the inside of the supporting frame, a magnetic ring is fixedly connected with the inside of the connecting ring, and the outer wall of the connecting ring is abutted against the outer walls of the plurality of rotating discs.

Preferably, the movably connected placing frame is inserted into the connecting ring, a plurality of clamping frames are uniformly distributed in the placing frame, the placing frame and the clamping frames are hollow meshes, and rubber pads are arranged on the inner walls of the placing frame and the clamping frames.

Preferably, the inside top of ultrasonic cleaner erects the drainage frame that is equipped with fixed connection, the top of drainage frame is equipped with the drain bar of rotation connection through the hinge, just drainage frame and drain bar inside all are equipped with the aqueduct of intercommunication.

Preferably, the outer wall of the ultrasonic cleaning machine is provided with a controller fixedly connected with the outer wall of the ultrasonic cleaning machine, heating rods are arranged on two sides of the inside of the ultrasonic cleaning machine, and the heating rods are in telecommunication connection with the controller.

Preferably, a water inlet pipe is inserted into the side wall of the ultrasonic cleaning machine, a water drain pipe is arranged at the bottom of the ultrasonic cleaning machine, a communicated overflow pipe is arranged on the other side wall of the ultrasonic cleaning machine, and the overflow pipe is lower than the water inlet pipe.

Preferably, the top ends of the telescopic rod and the extension spring are fixedly connected with the bottom of the same baffle, and the bottom ends of the telescopic rod and the extension spring are fixedly connected with the top of the supporting frame.

Preferably, a plurality of electric putter's fixed point pole all passes through support frame and ultrasonic cleaner's top fixed connection, electric putter's bottom and the top fixed connection who corresponds the baffle.

Compared with the prior art, the utility model provides a silicon chip cleaning equipment has following beneficial effect:

1. the utility model discloses a drive assembly's setting, in the later stage use, through drive assembly's work, can drive inside go-between and rotate and reciprocating motion from top to bottom, the go-between can smoothly through the inside frame of placing drive required abluent silicon chip rotate and reciprocating motion, change the contact position between silicon chip and the card frame, the phenomenon at dead angle appears in the silicon chip when consequently reducing the washing, can make the washing in silicon chip later stage more comprehensive.

2. The utility model discloses an erect fixed connection's row frame above ultrasonic cleaner, accomplish the washing back to the silicon chip at ultrasonic cleaner, can remove the silicon chip to the drainage frame in through electric putter, can outwards discharge the clear water from the drainage frame through the aqueduct this moment, can be smooth wash the silicon chip after the washing, consequently can reduce the impurity after the washing and remain on the silicon chip surface through water stain.

Drawings

Fig. 1 is a schematic structural diagram of a preferred embodiment of a silicon wafer cleaning apparatus provided by the present invention;

FIG. 2 is a schematic view of the driving assembly shown in FIG. 1;

FIG. 3 is a cross-sectional view of the drive assembly and attachment ring of FIG. 1;

FIG. 4 is a schematic view of the attachment ring shown in FIG. 3;

FIG. 5 is a schematic view of the structure of the drain frame and its connection shown in FIG. 1;

FIG. 6 is a schematic structural view of the placement frame and the card frame shown in FIG. 1;

FIG. 7 is a schematic structural view of the card frame shown in FIG. 6;

fig. 8 is a schematic structural view of a cross section of the ultrasonic cleaning machine shown in fig. 1.

Reference numbers in the figures: 1. an ultrasonic cleaning machine; 11. a controller; 12. a heating rod; 13. a water inlet pipe; 14. a drain pipe; 15. an overflow pipe; 2. a drive assembly; 21. a support frame; 22. a motor; 221. rotating the disc; 222. a convex strip; 23. a telescopic rod; 24. an extension spring; 25. a baffle plate; 3. a connecting ring; 31. a magnetic ring; 4. placing a frame; 41. clamping a frame; 5. a drainage frame; 51. a drain plate; 52. a water conduit; 6. an electric push rod; 61. a support frame.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The following detailed description is provided for the specific embodiments of the present invention.

Referring to fig. 1 to 8, an embodiment of the present invention provides a silicon wafer cleaning apparatus, including: an ultrasonic cleaning machine 1 and a drive assembly 2.

In the embodiment of the present invention, please refer to fig. 1, fig. 2 and fig. 3, the driving assembly 2 is disposed inside the ultrasonic cleaning machine 1 through the electric push rod 6, the driving assembly 2 includes the supporting frame 21, the four corners of the top of the supporting frame 21 are all provided with the motor 22, each of the top of the motor 22 is all provided with the rotating disc 221, each of the top of the rotating disc 221 is all provided with the protruding strip 222, the outside of the top four corners motor 22 of the supporting frame 21 is all provided with the telescopic rod 23 and the extension spring 24, the top of the telescopic rod 23 and the extension spring 24 is fixedly connected with the bottom of the same baffle 25, and the bottom of the telescopic rod 23 and the extension spring 24 is fixedly connected with the top of the supporting frame 21, a plurality of the fixed point rods of the electric push rod 6 are all fixedly connected with the top of the ultrasonic cleaning machine 1 through the supporting frame 61, and the bottom of the electric push rod 6 is fixedly connected with the top of the corresponding baffle 25.

It should be noted that: in the later use process, the connecting ring 3 in the silicon wafer cleaning device can be driven to rotate and reciprocate up and down by the work of the driving component 2, the connecting ring 3 can smoothly drive the silicon wafer to be cleaned to rotate and reciprocate through the placing frame 4 in the silicon wafer cleaning device, and the contact position between the silicon wafer and the clamping frame 41 is changed, so that the phenomenon of dead angles of the silicon wafer during cleaning is reduced, and the later cleaning of the silicon wafer can be more comprehensive;

it should also be noted that: through the arrangement of the telescopic rod 23 and the extension spring 24, when the extension spring 24 drives the supporting frame 21 to move through the extrusion force of the extension spring 24, the telescopic rod 23 can guide the movement of the supporting frame 21, so that the movement of the supporting frame 21 is more stable;

by fixedly connecting the top of the baffle 25 with the bottom end of the electric push rod 6, when the electric push rod 6 works in the later period, the electric push rod 6 can smoothly drive the driving component 2 below to move up and down through the baffle 25, and then the silicon wafer can be smoothly placed in the ultrasonic cleaning machine 1 for cleaning through the driving component 2;

meanwhile, in the initial state of the extension spring 24, the bottom of the baffle 25 and the top of the rotating disc 221 are in the same horizontal plane, when the rotating disc 221 rotates to the position below the baffle 25 along with the protruding strip 222, the supporting frame 21 can be driven to move downwards through the motor 22 in the opposite direction by the extrusion between the protruding strip 222 and the baffle 25, and the supporting frame 21 can smoothly move up and down in a reciprocating manner by the downward extrusion between the protruding strip 222 and the baffle 25 and the upward pulling force of the extension spring 24.

In the embodiment of the present invention, please refer to fig. 3, fig. 4, fig. 6 and fig. 7, the inside of the supporting frame 21 is provided with a connecting ring 3 for rotation connection, the inside of the connecting ring 3 is provided with a magnetic ring 31 for fixed connection, and the outer wall of the connecting ring 3 offsets with the outer walls of the plurality of rotating discs 221, the inside of the connecting ring 3 is inserted with a placing frame 4 provided with a movable connection, the inside of the placing frame 4 is provided with a plurality of uniformly distributed clamping frames 41, the placing frame 4 and the clamping frames 41 are net-shaped with a hollow out, and the inner walls of the placing frame 4 and the clamping frames 41 are provided with rubber pads.

It should be noted that: the magnetic ring 31 is fixedly connected with the inside of the connecting ring 3, and the placing frame 4 is placed in the connecting ring 3 at a later stage, so that after the bottom of the placing frame is abutted against the top of the magnetic ring 31, the magnetic ring 31 can smoothly adsorb the placing frame 4, and the placing frame 4 can be more stably connected with the connecting ring 3;

meanwhile, the placing frame 4 and the clamping frame 41 are arranged to be in a hollow mesh shape, so that the contact area between the placing frame 4 and the clamping frame 41 can be reduced, the contact dead angle of the silicon wafer can be reduced, and meanwhile, the damage of the connection part of the silicon wafer and the placing frame 4 with the clamping frame 41 can be reduced by arranging rubber pads on the inner walls of the placing frame 4 and the clamping frame 41;

meanwhile, after the silicon wafer is inserted between the two opposite clamping frames 41, the silicon wafer is in clearance fit with the frames, so that a certain moving space is formed after the silicon wafer is placed in the clamping frames 41, the silicon wafer can smoothly move along with the driving assembly 2 to a certain extent at the later stage, and the contact position between the placing frame 4 and the clamping frames 41 is changed.

In an embodiment of the present invention, please refer to fig. 1 and 5, a fixedly connected drainage frame 5 is erected above the inside of the ultrasonic cleaning machine 1, a drainage plate 51 rotatably connected is arranged on the top of the drainage frame 5 through a hinge, and a water guiding pipe 52 communicated with the inside of the drainage frame 5 and the drainage plate 51 is arranged.

It should be noted that: by erecting the fixedly connected row frame above the ultrasonic cleaning machine 1, after the ultrasonic cleaning machine 1 finishes cleaning the silicon wafer, the silicon wafer can be moved into the drainage frame 5 through the electric push rod 6, clear water can be discharged outwards from the drainage frame 5 through the water guide pipe 52 at the moment, the cleaned silicon wafer can be smoothly washed, and therefore impurities after cleaning can be reduced to remain on the surface of the silicon wafer through water stains.

In the embodiment of the present invention, please refer to fig. 1 and 8, the outer wall of the ultrasonic cleaning machine 1 is provided with a controller 11 fixedly connected, both sides of the inside of the ultrasonic cleaning machine 1 are provided with heating rods 12, and the heating rods 12 are connected with the controller 11 in a telecommunication manner, the sidewall of the ultrasonic cleaning machine 1 is inserted with a water inlet pipe 13 provided with a communication, the bottom of the ultrasonic cleaning machine 1 is provided with a water outlet pipe 14 provided with a communication, another sidewall of the ultrasonic cleaning machine 1 is provided with an overflow pipe 15 provided with a communication, and the position of the overflow pipe 15 is lower than the position of the water inlet pipe 13.

It should be noted that: through the arrangement of the heating rod 12, in the cleaning process, the cleaning liquid in the ultrasonic cleaning machine 1 can be smoothly heated by the heating rod 12, so that the dissolution of the glue on the outer wall of the silicon wafer can be accelerated, and the later cleaning efficiency of the device can be improved to a certain extent;

meanwhile, through the arrangement of the overflow pipe 15, when the cleaned silicon wafer is washed by the drainage frame 5 and the drainage plate 51 in the later period, the water source falling into the ultrasonic cleaning machine 1 can smoothly flow out through the overflow pipe 15.

The utility model provides a silicon chip cleaning equipment's theory of operation as follows:

later when the silicon wafer cleaning equipment is used, workers can firstly insert the silicon wafers to be cleaned into the corresponding clamping frames 41 one by one, then place the placing frame 4 into the connecting ring 3, so that the bottom of the placing frame 4 is abutted against the magnetic ring 31 in the connecting ring 3, and the magnetic ring 31 can adsorb the placing frame 4;

at the moment, a worker can put the lower part of the silicon wafer into the ultrasonic cleaning machine 1 through the electric push rod 6, and then control the ultrasonic cleaning machine 1 and the heating rod 12 to work;

meanwhile, the motor 22 in the driving assembly 2 can be controlled to work, the working motor 22 can drive the rotating disc 221 at the output end to rotate, and at the moment, the rotating disc 221 can drive the connecting ring 3 to rotate through the friction between the outer wall and the connecting ring 3;

when the rotating disc 221 rotates, after the protruding strip 222 at the top moves to the lower part of the baffle 25, the supporting frame 21 can be smoothly driven to move downwards at the bottom of the electric push rod 6 through the motor 22 by the abutting of the protruding strip 222 and the baffle 25, after the protruding strip 222 rotates away from the lower part of the baffle 25, the extension spring 24 in the driving assembly 2 can drive the supporting frame 21 to move upwards through the self-pulling force to reset, and at the moment, the silicon wafer can be smoothly rotated and moved up and down in the ultrasonic cleaning process;

in addition, as the silicon wafer is in clearance fit with the placing frame 4, the position between the silicon wafer and the placing frame 4 can be changed in the process, so that the silicon wafer can be in more comprehensive contact with the cleaning fluid;

after the silicon wafer is cleaned, the silicon wafer can be moved into the drainage frame 5 through the electric push rod 6, clear water can be discharged from the drainage frame 5 through the water guide pipe 52, and the cleaned silicon wafer can be smoothly washed, so that impurities after cleaning can be reduced to remain on the surface of the silicon wafer through water stains, and the silicon wafer can be smoothly cleaned.

The utility model discloses circuit and control that relate to are prior art, do not carry out too much repetition here.

The above-mentioned only be the embodiment of the present invention, not consequently the restriction of the patent scope of the present invention, all utilize the equivalent structure or equivalent flow transform made of the content of the specification and the attached drawings, or directly or indirectly use in other relevant technical fields, all including in the same way the patent protection scope of the present invention.

Claims (8)

1. A silicon wafer cleaning apparatus, characterized by comprising:

the ultrasonic cleaning machine comprises an ultrasonic cleaning machine (1) and a driving assembly (2);

drive assembly (2) set up inside ultrasonic cleaner (1) through electric putter (6), drive assembly (2) include carriage (21), the four corners at carriage (21) top all is equipped with motor (22), every the top of motor (22) all is equipped with rolling disc (221), every the top of rolling disc (221) all is equipped with sand grip (222), just carriage (21) top four corners motor (22) outside all is equipped with telescopic link (23) and extension spring (24).

2. The silicon wafer cleaning equipment as recited in claim 1, wherein the support frame (21) is provided with a rotatably connected connection ring (3) inside, the connection ring (3) is provided with a fixedly connected magnetic ring (31) inside, and the outer wall of the connection ring (3) abuts against the outer walls of the plurality of rotating discs (221).

3. The silicon wafer cleaning equipment according to claim 2, wherein a movably connected placing frame (4) is inserted into the connecting ring (3), a plurality of clamping frames (41) are uniformly distributed in the placing frame (4), the placing frame (4) and the clamping frames (41) are both hollow meshes, and rubber pads are arranged on the inner walls of the placing frame (4) and the clamping frames (41).

4. The silicon wafer cleaning equipment according to claim 1, wherein a fixedly connected drainage frame (5) is erected above the inside of the ultrasonic cleaning machine (1), a drainage plate (51) which is rotatably connected is arranged at the top of the drainage frame (5) through a hinge, and communicated water guide pipes (52) are arranged inside the drainage frame (5) and the drainage plate (51).

5. The silicon wafer cleaning equipment according to claim 1, wherein the outer wall of the ultrasonic cleaning machine (1) is provided with a fixedly connected controller (11), the two sides of the inside of the ultrasonic cleaning machine (1) are provided with heating rods (12), and the heating rods (12) are electrically connected with the controller (11).

6. The silicon wafer cleaning equipment according to claim 5, wherein a communicated water inlet pipe (13) is inserted into a side wall of the ultrasonic cleaning machine (1), a communicated water outlet pipe (14) is arranged at the bottom of the ultrasonic cleaning machine (1), a communicated overflow pipe (15) is arranged on the other side wall of the ultrasonic cleaning machine (1), and the position of the overflow pipe (15) is lower than that of the water inlet pipe (13).

7. The silicon wafer cleaning equipment according to claim 1, wherein the top ends of the telescopic rods (23) and the extension springs (24) are fixedly connected with the bottom of the same baffle plate (25), and the bottom ends of the telescopic rods (23) and the extension springs (24) are fixedly connected with the top of the support frame (21).

8. The silicon wafer cleaning equipment according to claim 1, wherein the fixed-point rods of the electric push rods (6) are fixedly connected with the top of the ultrasonic cleaning machine (1) through a support frame (61), and the bottom ends of the electric push rods (6) are fixedly connected with the tops of the corresponding baffle plates (25).

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