CN218827043U

CN218827043U - Special loading disc for back injection of silicon wafer of ion implanter

Info

Publication number: CN218827043U
Application number: CN202222989158.9U
Authority: CN
Inventors: 陈维
Original assignee: Wuxi Kingcore Technology Co ltd
Current assignee: Wuxi Kingcore Technology Co ltd
Priority date: 2022-11-10
Filing date: 2022-11-10
Publication date: 2023-04-07
Anticipated expiration: 2032-11-10

Abstract

The utility model discloses a special loading dish of ion implantation machine silicon chip back injection, including loading the dish main part: the silicon wafer loading device comprises a loading disc main body, wherein a silicon wafer main body is arranged on the upper side of the loading disc main body, and an installation unit is arranged on the upper side of the loading disc main body and located on the outer side of the silicon wafer main body. Through the arrangement of the first clamping ring, the second clamping ring, the sliding groove, the sliding block and the spring, the second clamping ring can quickly limit the silicon wafer through the elastic force of the spring, so that the ion injection efficiency of the back of the silicon wafer is increased, and the silicon wafer is prevented from being damaged by bolt fixing.

Description

Special loading disc for back injection of silicon wafer of ion implanter

Technical Field

The utility model relates to a silicon chip preparation field, in particular to special loading dish is poured into at ion implantation machine silicon chip back.

Background

The ion implanter is one of the high-pressure compact accelerators, and is used in the largest number. The ion source obtains the needed ions, and the ions are accelerated to obtain ion beam current with hundreds of kilo electron volt energy, which is used for ion implantation of semiconductor materials, large-scale integrated circuits and devices, and is also used for surface modification and film making of metal materials and the like. And injecting ion beam current generated by an ion implanter into the silicon wafer, and injecting ions into the back of the silicon wafer to serve as a contact layer and a field stop layer.

When implanting into the ion to the silicon chip back, need use the loading dish to support the silicon chip and place, when installing the silicon chip to the loading dish, need use the bolt fastening to load the silicon chip on the dish, although bolted connection's mode fastening, the installation is more troublesome with dismantling the silicon chip, and it is damaged by inside preforming pressure easily because of the bolt rotates the tension messenger silicon chip.

Through retrieval, the application number is '202020464545.9', a hollow loading structure suitable for a silicon wafer back injection process is provided, the tightness of a pressing block 3.2 and a silicon wafer 2 is adjusted through the depth of a positioning screw 3.1 extending into a positioning hole, the screw is used for limiting the back of the silicon wafer, and the defect that the silicon wafer is easy to damage is overcome.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, an object of the present invention is to provide a loading tray for back implantation of a silicon wafer of an ion implanter. Through being provided with clamp ring one, clamp ring two, spout, slider and spring, be convenient for through the elasticity of spring, make clamp ring two carry on spacingly to the silicon chip fast, make the efficiency of silicon chip back implanted ion increase, avoid using the bolt fastening to damage the silicon chip.

The utility model discloses an one of the purpose adopts following technical scheme to realize:

the utility model provides a special loading dish of ion implantation machine silicon chip back implantation, includes the loading dish main part: a silicon wafer main body is arranged on the upper side of the loading disc main body, and an installation unit is arranged on the upper side of the loading disc main body and positioned on the outer side of the silicon wafer main body;

the mounting unit comprises a first clamping ring, the first clamping ring is fixedly connected with the upper side of the loading disc main body and located on the right side of the silicon wafer main body, sliding grooves are formed in the upper sides of the front end and the rear end of the loading disc main body, sliding blocks are connected to the inner sides of the sliding grooves in a sliding mode, connecting blocks are fixedly connected with the upper sides of the sliding blocks and the front end and the rear end of the sliding blocks, a second clamping ring is fixedly connected between the connecting blocks, and springs are fixedly connected between the sliding blocks and the sliding grooves.

According to the loading disc special for injecting the back side of the silicon wafer of the ion implanter, the inner sides of the first clamping ring and the second clamping ring are both provided with air outlet pipes, and the outer sides of the first clamping ring and the second clamping ring are fixedly connected with a connecting pipe. The air outlet pipe can blow out cold air flow conveniently, so that the silicon wafer is cooled after being implanted with ions.

According to the loading disc special for the back injection of the silicon wafer of the ion implanter, the first clamping ring and the second clamping ring are both arranged in a hollow structure. The airflow is convenient to flow in the first clamping ring and the second clamping ring.

According to the loading disc special for the back injection of the silicon wafer of the ion implanter, the second clamping ring is connected with the loading disc main body in a sliding mode. The movable clamping ring is convenient for mounting and dismounting the two pairs of silicon wafer main bodies.

According to the special loading disc for injecting the back side of the silicon wafer of the ion implanter, the connecting block is of an L-shaped structure.

According to the special loading disc for injecting the back of the silicon wafer of the ion implanter, the middle of the loading disc main body is provided with a circular hole. The silicon wafer main body is convenient to dissipate heat.

The beneficial effect that above-mentioned scheme has:

1. through being provided with clamp ring one, clamp ring two, spout, slider and spring, be convenient for through the elasticity of spring, make clamp ring two carry on spacingly to the silicon chip fast, make the efficiency of silicon chip back implanted ion increase, avoid using the bolt fastening to damage the silicon chip.

2. The air outlet pipes and the connecting pipes on the first clamping ring and the second clamping ring are convenient to communicate with an external air source, so that the air outlet pipes can discharge cold inert gas, the temperature of the back of the silicon wafer is reduced, and the back of the silicon wafer can be conveniently pasted with a film.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The present invention will be further described with reference to the accompanying drawings and examples;

fig. 1 is a Z overall structure view of a loading tray for back implantation of a silicon wafer of an ion implanter according to the present invention;

fig. 2 is a front view of the loading plate specially used for back implantation of the silicon wafer of the ion implanter of the present invention;

fig. 3 is a top view of the loading tray for back implantation of silicon wafer of the ion implanter of the present invention;

fig. 4 is an enlarged view of a portion a in fig. 3.

Illustration of the drawings:

1. loading a disc main body; 2. a mounting unit; 201. a clamping ring I; 202. an air outlet pipe; 203. a connecting pipe; 204. a chute; 205. a slider; 206. a spring; 207. connecting blocks; 208. a second clamping ring; 3. a silicon wafer body.

Detailed Description

This section will describe in detail the embodiments of the present invention, preferred embodiments of the present invention are shown in the attached drawings, which are used to supplement the description of the text part of the specification with figures, so that one can intuitively and vividly understand each technical feature and the whole technical solution of the present invention, but they cannot be understood as the limitation of the protection scope of the present invention.

Referring to fig. 1-4, the embodiment of the present invention provides a loading tray for back injection of silicon wafer of ion implanter, including loading tray main body 1: the silicon wafer main body 3 is arranged on the upper side of the loading disc main body 1, the mounting unit 2 is arranged on the upper side of the loading disc main body 1 and located on the outer side of the silicon wafer main body 3, and the mounting unit 2 is convenient for limiting the silicon wafer main body 3.

The mounting unit 2 comprises a first clamping ring 201, the first clamping ring 201 is fixedly connected with the upper side of the loading disc main body 1 and is located on the right side of the silicon wafer main body 3, sliding grooves 204 are formed in the upper sides of the front end and the rear end of the loading disc main body 1, sliding blocks 205 are connected to the inner sides of the sliding grooves 204 in a sliding mode, connecting blocks 207 are fixedly connected to the upper sides of the sliding blocks 205, a second clamping ring 208 is fixedly connected between the connecting blocks 207 on the front side and the rear side, springs 206 are fixedly connected between the sliding blocks 205 and the sliding grooves 204, when the silicon wafer main body 3 is used, the silicon wafer main body 3 is placed between the first clamping ring 201 and the second clamping ring 208, before the silicon wafer main body is placed, a worker moves the second clamping ring 208, the second clamping ring 208 drives the connecting blocks 207 to move, the sliding blocks 205 drive the springs 206 to stretch, then the worker slightly loosens the second clamping ring 208, under the elastic force of the springs 206, the inner sides of the second clamping ring 208 and the silicon wafer main body 3 are clamped and limited, the mounting and dismounting efficiency of the silicon wafer main body 3 is increased, and the silicon wafer main body 3 is prevented from being affected by bolts.

The inner sides of the first clamping ring 201 and the second clamping ring 208 are both provided with the air outlet pipe 202, the outer sides of the first clamping ring 201 and the second clamping ring 208 are fixedly connected with the connecting pipe 203, the first clamping ring 201 and the second clamping ring 208 are both of a hollow structure, the connecting pipe 203 is connected with an external air source, external air flow enters the first clamping ring 201 and the second clamping ring 208, introduced cold air flow is cold pure inert gas, after ion injection into the back of the silicon wafer main body 3 is finished, the temperature of the back of the silicon wafer main body 3 is high, the back of the silicon wafer main body 3 is cooled through the cold inert gas, and film sticking to the back of the silicon wafer main body 3 is facilitated.

Two 208 clamp rings and the loading dish main part 1 sliding connection, connecting block 207 are L shape structure, and the circular port has been seted up at the middle part of loading dish main part 1, and the silicon chip main part 3 of being convenient for of circular port is cooled down.

The working principle is as follows: when the silicon wafer loading disc is used, a worker firstly places the silicon wafer main body 3 on the loading disc main body 1, then moves the second clamping ring 208 to move, under the action of the sliding block 205 and the spring 206, the second clamping ring 208 can conveniently and rapidly clamp the silicon wafer main body 3, the installation and disassembly efficiency of the silicon wafer main body 3 is improved, the back of the silicon wafer main body 3 is cooled through the air outlet pipe 202 and the connecting pipe 203, and the back of the silicon wafer main body 3 can be conveniently pasted with a film on the background of the silicon wafer main body 3.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.

Claims

1. A loading disc special for back implantation of a silicon wafer of an ion implanter is characterized by comprising a loading disc main body (1): a silicon wafer main body (3) is arranged on the upper side of the loading disc main body (1), and a mounting unit (2) is arranged on the upper side of the loading disc main body (1) and positioned on the outer side of the silicon wafer main body (3);

installation element (2) are including clamp ring one (201), the upside of clamp ring one (201) fixedly connected with load dish main part (1) and be located the right side of silicon chip main part (3), spout (204) have all been seted up to the upside at both ends around load dish main part (1), the inboard sliding connection of spout (204) has slider (205), the upside fixedly connected with connecting block (207) of slider (205), both sides around fixedly connected with clamp ring two (208) between connecting block (207), fixedly connected with spring (206) between slider (205) and spout (204).

2. The loading tray special for implanting the back of the silicon wafer of the ion implanter according to claim 1, wherein the inner sides of the first clamping ring (201) and the second clamping ring (208) are both provided with air outlet pipes (202), and the outer sides of the first clamping ring (201) and the second clamping ring (208) are fixedly connected with connecting pipes (203).

3. The special loading disc for the implantation of the back side of the silicon wafer of the ion implanter according to claim 1, wherein the first clamping ring (201) and the second clamping ring (208) are both arranged in a hollow structure.

4. The special loading disc for the back implantation of the silicon wafer of the ion implanter according to claim 1, characterized in that the second clamping ring (208) is connected with the loading disc main body (1) in a sliding way.

5. The special loading disc for the back implantation of the silicon wafer of the ion implanter according to claim 1, characterized in that the connecting block (207) is an L-shaped structure.

6. The loading disc special for implanting the back of the silicon wafer of the ion implanter according to the claim 1, characterized in that the middle part of the loading disc main body (1) is provided with a circular hole.