CN109786314B - Fixing device for clamping plastic package wafer and vacuum sputtering metal film process - Google Patents
Fixing device for clamping plastic package wafer and vacuum sputtering metal film process Download PDFInfo
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- CN109786314B CN109786314B CN201811562109.9A CN201811562109A CN109786314B CN 109786314 B CN109786314 B CN 109786314B CN 201811562109 A CN201811562109 A CN 201811562109A CN 109786314 B CN109786314 B CN 109786314B
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Abstract
The invention relates to the technical field of semiconductor advanced packaging technology and equipment, in particular to a fixing device for clamping a plastic package wafer, which comprises: the bottom plate is used for bearing the plastic package wafer, and the upper surface and the lower surface of the bottom plate are both planes; the fixing structure is arranged at the edge of the upper surface of the bottom plate and forms a bearing space for fixing the plastic package wafer with the bottom plate; and the pipeline structure is formed on the bottom plate and used for sucking vacuum to a gap between the plastic package wafer and the bottom plate so that the plastic package wafer and the upper surface of the bottom plate are always kept in close fit. The fixing device for clamping the plastic package wafers can enable the temperature uniformity inside each plastic package wafer and among the plastic package wafers to easily reach the technological requirement, and can enable the flatness of the plastic package wafers and the precision of various technological parameters to be higher and the technological integration effect to be better. Therefore, the physical and electrical properties of the film are improved by sputtering the metal film on the plastic-sealed wafer with the fixing device in vacuum.
Description
Technical Field
The invention relates to the technical field of advanced semiconductor packaging technology and equipment, in particular to a fixing device for clamping a plastic package wafer, a vacuum metal film sputtering technology of the plastic package wafer and mounting equipment for mounting the plastic package wafer in the fixing device.
Background
In the wafer level fan-out packaging process flow, after the temporary bonding substrate is removed from the plastic package wafer, the plastic package wafer only contains a chip to be packaged and a plastic package material containing filling particles, and the plastic package wafer mostly presents warpage of different degrees due to the difference of physical properties such as thermal expansion coefficient, elastic modulus and the like of the materials. In the subsequent process steps, for uneven wafers, it is difficult to achieve high-quality packaging process requirements on the same wafer. On the other hand, because the plastic package wafer is usually thin and has insufficient strength, the whole surface of the plastic package wafer cannot be completely contacted with a chuck of a process equipment cavity, so that the temperature required by the process cannot be reached, and the process result is influenced.
In the process of vacuum sputtering of the metal bonding layer and the seed layer for fan-out packaging application, for the independently used plastic packaging wafers, the quality of the obtained vacuum coating is different due to the reasons, so that obvious non-uniformity of performances such as film thickness, resistivity and the like in the same wafer and between the wafers is caused. More seriously, even if the thickness and uniformity of the metal film are acceptable, the resistivity of the metal film may be different, especially the difference of the interface resistance between the metal film layers is large.
Disclosure of Invention
Therefore, the technical problem to be solved by the present invention is to overcome the problem of inconsistent metal film performance of the plastic package wafer in the process of vacuum sputtering the metal bonding layer and the seed layer in the prior art, and particularly to overcome the technical defect that the temperature uniformity of the process requirement is not easily achieved inside the plastic package wafer and between the plastic package wafers, so as to affect the film performance difference, thereby providing a fixing device for clamping the plastic package wafer, which enables the temperature uniformity of the process requirement to be easily achieved inside each plastic package wafer and between the plastic package wafers, and enables the flatness and the precision of the process parameters of the plastic package wafer to be higher, the process integration effect to be better, and the plastic package wafer to easily obtain the vacuum sputtering metal film with high quality and excellent performance.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
the invention provides a fixing device for clamping a plastic package wafer, which comprises: the bottom plate is used for bearing the plastic package wafer, and the upper surface and the lower surface of the bottom plate are both planes; the fixing structure is arranged at the edge of the upper surface of the bottom plate and forms a bearing space for fixing the plastic package wafer with the bottom plate; and the pipeline structure is formed on the bottom plate and used for sucking vacuum to a gap between the plastic package wafer and the bottom plate so as to enable the plastic package wafer to be always tightly attached to the upper surface of the bottom plate.
In the fixing device for clamping the plastic package wafer, the bottom plate is a circular flat plate matched with the plastic package wafer.
In the fixing device for clamping the plastic package wafer, the pipeline structure comprises at least one through hole which is arranged through the upper surface and the lower surface of the bottom plate, and the through hole is connected with an external vacuum system.
In the fixing device for clamping the plastic package wafer, the pipeline structure further comprises a plurality of annular grooves concentrically arranged on the upper surface of the bottom plate and uniformly distributed, and the annular grooves are communicated with the through holes through at least one linear groove arranged along the radial direction of the bottom plate; and the sealing plug is detachably arranged at one end of the through hole connected with the vacuum system.
In the above-mentioned fixing device for centre gripping plastic envelope wafer, fixed knot constructs including: the side wall is arranged above the bottom plate, the cross section of the side wall is circular, and the inner diameter of the side wall is matched with the diameter of the plastic package wafer; the fixing ring is arranged above the side wall, the cross section of the fixing ring is circular, the inner diameter of the fixing ring is smaller than the diameter of the plastic package wafer, and the side wall, the fixing ring and the bottom plate form the bearing space.
In the fixing device for clamping the plastic package wafer, the side wall is fixedly connected with the bottom plate, and the fixing ring is detachably connected with the side wall.
In the fixing device for clamping the plastic package wafer, the upper part of the side wall is provided with the plurality of mounting holes, one end of the fixing ring, which is close to the side wall, is provided with the plurality of convex nails matched with the mounting holes, and the side wall is tightly connected with the fixing ring through the mounting holes and the convex nails.
The invention also provides a vacuum metal film sputtering process for the plastic package wafer, which comprises the following steps: and installing the plastic package wafer in the fixing device in the process flow of vacuum sputtering of the metal film.
In the vacuum metal film sputtering process of the plastic package wafer, the plastic package wafer is installed in the fixing device and then is subjected to temperature rise degassing;
or the step of installing the plastic package wafer in the fixing device and the process step of heating and degassing the plastic package wafer are carried out simultaneously;
before the plastic package wafer is subjected to oxide film etching, or before a metal thin film is sputtered and adhered, or before a seed metal thin film is sputtered, the plastic package wafer is installed in the fixing device.
In the vacuum sputtering metal thin film process of the plastic package wafer, the method further comprises the following steps: and taking the plastic packaging wafer out of the fixing device and then carrying out subsequent processing steps.
In the vacuum metal film sputtering process of the plastic package wafer, the step of mounting the plastic package wafer in the fixing device and the step of heating and degassing the plastic package wafer are performed simultaneously, and the plastic package wafer is taken out of the fixing device after the seed metal film sputtering process.
The present invention also provides a mounting apparatus for mounting a plastic encapsulated wafer in the above fixing device, comprising: the first platform is provided with a first cavity for bearing the fixing device, a pore passage with one end communicated with the pipeline structure is further arranged on the first platform, the other end of the pore passage is connected with an external vacuum system, and the external vacuum system sucks vacuum on a gap between the plastic package wafer and the bottom plate through the pore passage and the pipeline structure; and the heating device is at least arranged on the first platform and used for heating the fixing device and the plastic package wafer.
The mounting equipment further comprises a second platform which is arranged above the first platform and arranged in a reciprocating mode in the direction perpendicular to the first platform, and the second platform is provided with the heating device.
In the installation device, the second platform is further provided with a second chamber which is used for installing the fixed ring and corresponds to the first chamber, and the second platform is suitable for moving towards the first platform and installing the fixed ring on the side wall.
In the mounting device, the second platform is further provided with a plurality of holes for degassing the plastic package material of the plastic package wafer.
The technical scheme of the invention has the following advantages:
1. the invention provides a fixing device for clamping a plastic package wafer, which comprises: the bottom plate is used for bearing the plastic package wafer, and the upper surface and the lower surface of the bottom plate are both planes; the fixing structure is arranged at the edge of the upper surface of the bottom plate and forms a bearing space for fixing the plastic package wafer with the bottom plate; and the pipeline structure is formed on the bottom plate and used for sucking vacuum to a gap between the plastic package wafer and the bottom plate so as to enable the plastic package wafer to be always tightly attached to the upper surface of the bottom plate. Vacuum is pumped from the back of the plastic package wafer, so that the plastic package wafer can be promoted to be attached to the bottom plate, the attaching effect is better, and the flatness is higher; (ii) a The plastic package wafer is installed and fixed in the device and is applied to the process of vacuum sputtering metal thin film, and the steps from degassing treatment to seed layer sputtering are finished, so that the plastic package wafer can obtain a sputtered metal thin film layer with stable performance and uniform height; meanwhile, the lower surface of the fixing device is flat and smooth, so that the bottom surface of the fixing device can be in excellent contact with the upper surface of a cavity chuck in each process flow, and the bottom surface of the fixing device can be quickly balanced with the temperature of the chuck, so that the requirement on the chuck is greatly reduced, and a chuck with low cost can be adopted to obtain a high-performance metal film; meanwhile, the plastic package wafer is arranged in the fixing device, so that the plastic package wafer is always kept in a flat state, and a bottom plate of the fixing device is in good surface contact with the heated chuck, so that each plastic package wafer can be in the same parameter condition in the same process step in different time, and different plastic package wafers are subjected to the same process condition, so that the obtained pre-etching treatment and vacuum coating results are basically consistent; meanwhile, the design can save the time of the prior etching, vacuum titanizing and copper plating processes and improve the productivity; the fixing device is used in the front etching cavity, the temperature of the plastic package wafer is easy to control, and the etching quality can be greatly improved; in the titanium and copper sputtering chamber, a fixing device is used, and a common chuck can reach the completely controlled temperature, so that the cost is reduced; therefore, the fixing device can enable the plastic packaged wafer to easily meet the requirements of high-quality wafer level packaging technology, including wafer temperature, flatness of the plastic packaged wafer and the like. Better effect of the process integration process, including better uniformity of vacuum coating and easier maintenance of stable vacuum pumping of resistivity.
2. According to the fixing device for clamping the plastic package wafer, the bottom plate is a circular flat plate matched with the plastic package wafer. The design can enable the shapes and the sizes of the bottom plate and the plastic package wafer to be unified, and the processing is convenient.
3. The fixing device for clamping the plastic package wafer provided by the invention has the advantages that the pipeline structure comprises at least one through hole which is arranged through the upper surface and the lower surface of the bottom plate, and the through hole is connected with an external vacuum system. The pipeline structure also comprises a plurality of annular grooves which are concentrically arranged on the upper surface of the bottom plate and are uniformly distributed, and the annular grooves are communicated with the through holes through at least one linear groove arranged along the radial direction of the bottom plate; and the sealing plug is detachably arranged at one end of the through hole connected with the vacuum system. Due to the structural design, the back surface of the plastic package wafer can be tightly attached to the bottom plate after vacuum pumping, so that the overall flatness of the plastic package wafer after vacuum pumping is higher; the design of the sealing plug can ensure that the vacuum state between the bottom plate and the plastic package wafer is continuously maintained after vacuum pumping.
4. The fixing device for clamping the plastic package wafer provided by the invention comprises a fixing structure and a clamping mechanism, wherein the fixing structure comprises: the side wall is arranged above the bottom plate, the cross section of the side wall is circular, and the inner diameter of the side wall is matched with the diameter of the plastic package wafer; the fixing ring is arranged above the side wall, the cross section of the fixing ring is circular, the inner diameter of the fixing ring is smaller than the diameter of the plastic package wafer, and the side wall, the fixing ring and the bottom plate form the bearing space. The structure design can limit the plastic package wafer from different directions so that the plastic package wafer is more firmly fixed in the fixing device, and therefore different plastic package wafers can achieve basically consistent parameter conditions in the process flow, and the structure design is convenient to install.
5. According to the fixing device for clamping the plastic package wafer, the side wall is fixedly connected with the bottom plate, and the fixing ring is detachably connected with the side wall. The design makes the installation and the disassembly between the plastic package wafer and the fixing device more convenient and faster.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural view of the fixing device for clamping the plastic package wafer and the assembled plastic package wafer according to the present invention;
fig. 2 is a cross-sectional view of the fixing device for clamping the plastic packaged wafer shown in fig. 1 after being assembled with the plastic packaged wafer;
FIG. 3 is a top view of the fixing device for holding a plastic wafer according to the present invention;
fig. 4 is a schematic structural diagram of a mounting apparatus for mounting a plastic encapsulated wafer in a fixture according to the present invention;
fig. 5 is a bottom view of a second platform section area in the mounting apparatus for mounting a plastic encapsulated wafer in a fixture, as shown in fig. 4;
description of reference numerals:
1-plastic packaging the wafer; 2-a fixed ring; 3-side wall; 4-a bottom plate; 5-a through hole; 6-linear grooves; 7-an annular groove; 8-a second platform; 9-a first platform; 10-holes.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example 1
As shown in fig. 1-3, the present invention provides a fixing device for clamping a plastic package wafer, comprising: a bottom plate 4, a fixing structure and a pipeline structure.
In this embodiment, the bottom plate 4 is used for bearing the plastic package wafer 1, and the upper surface and the lower surface of the bottom plate 4 are both planar. Further, the bottom plate 4 is a circular flat plate adapted to the plastic package wafer 1. The base plate 4 is made of a metal material having good thermal conductivity, such as aluminum alloy, copper alloy, or the like. Since the bottom plate 4 is the bottom-most structure of the fixing device, the bottom surface of the bottom plate 4 is required to be very smooth so as to have good full-surface contact with the chuck of other equipment, and since the fixing device can have complete full-surface contact with the chuck surface of other chambers, the process flow can be satisfied by using a conventional heating chuck, thereby reducing the cost.
In this embodiment, the fixing structure is disposed at the edge of the upper surface of the bottom plate 4, and forms a carrying space for fixing the plastic package wafer 1 with the bottom plate 4.
Further, the fixing structure includes: the side wall 3 is arranged above the bottom plate 4, the cross section of the side wall 3 is circular, and the inner diameter of the side wall 3 is matched with the diameter of the plastic package wafer 1; and the fixing ring 2 is arranged above the side wall 3, the cross section of the fixing ring 2 is circular, the inner diameter of the fixing ring 2 is smaller than the diameter of the plastic package wafer 1, and the side wall 3, the fixing ring 2 and the bottom plate 4 form the bearing space. The plastic package wafer 1 installed in the fixing device can be slightly higher than the side wall 3 according to actual conditions, and because the periphery of the plastic package wafer 1 cannot be tightly attached to the bottom plate 4 when the back surface of the plastic package wafer 1 is vacuumized, the periphery of the plastic package wafer 1 can be pressed through the fixing ring 2 during installation, so that the periphery of the plastic package wafer 1 is flattened and tightly attached to the bottom plate 4. The retainer ring 2 may be made of VESPEL or other hard, electrically insulating material that conducts heat well. The side wall 3 and the bottom plate 4 can be integrally formed, machined and manufactured or can be an independent part, and the side wall 3 and the bottom plate 4 can be detachably mounted, so that the side wall 3 with the corresponding size can be replaced aiming at plastic package wafers 1 with different sizes.
Further, the side wall 3 is fixedly connected with the bottom plate 4, and the fixing ring 2 is detachably connected with the side wall 3. Further, 3 upper portions of lateral wall are provided with a plurality of mounting holes, the retainer plate 2 is close to the one end of lateral wall 3 be provided with a plurality of with the protruding nail of mounting hole adaptation, lateral wall 3 with retainer plate 2 passes through the mounting hole and protruding nail zonulae occludens.
In this embodiment, the pipeline structure is formed on the bottom plate 4, and is used for vacuum pumping of the gap between the plastic package wafer 1 and the bottom plate 4, so that the plastic package wafer 1 and the upper surface of the bottom plate 4 are always kept in close fit.
Further, the duct structure comprises at least one through hole 5 provided through the upper and lower surfaces of the base plate 4, the through hole 5 being connected to an external vacuum system. Further, the pipeline structure further comprises a plurality of annular grooves 7 concentrically arranged on the upper surface of the bottom plate 4 and uniformly distributed, and the annular grooves 7 are communicated with the through holes 5 through at least one linear groove 6 arranged along the radial direction of the bottom plate 4; and the sealing plug is detachably arranged at one end of the through hole 5 connected with the external vacuum system. In the present embodiment, the number of the linear grooves 6 is one. The sealing plug is designed to maintain a vacuum state. The through holes 5 can be communicated with an external vacuum system to realize vacuum suction on the back surface of the plastic package wafer 1, and meanwhile, inert gas can be introduced to realize accelerated heat conduction; when the plastic package wafer 1 needs to be removed from the bottom plate 4, the pressures of the front side and the back side of the plastic package wafer 1 can be balanced by introducing inert gas, so that the plastic package wafer 1 can be easily taken out from the fixing device. The groove depth of the annular groove 7 is set to be about 3mm, the groove width is set to be about 3mm, and the diameter of the through hole 5 can be set to be 3-6 mm according to actual needs.
Vacuum is pumped from the back of the plastic package wafer, so that the plastic package wafer can be promoted to be attached to the bottom plate, the attaching effect is better, and the flatness is higher; the plastic package wafer is installed and fixed in the device and is applied to the process of vacuum sputtering metal thin film, and the steps from degassing treatment to seed layer sputtering are finished, so that the plastic package wafer can obtain a sputtered metal thin film layer with stable performance and uniform height; meanwhile, the lower surface of the fixing device is flat and smooth, so that the bottom surface of the fixing device can be in excellent contact with the upper surface of a cavity chuck in each process flow, and the bottom surface of the fixing device can be quickly balanced with the temperature of the chuck, so that the requirement on the chuck is greatly reduced, and a chuck with low cost can be adopted to obtain a high-performance metal film; meanwhile, the plastic package wafer is arranged in the fixing device, so that the plastic package wafer is always kept in a flat state and is in good surface contact with the bottom plate of the fixing device and the surface of the heated chuck, the plastic package wafer can always obtain the same technological parameters at the same temperature, different plastic package wafers are subjected to the same technological conditions in different time and technological processes, and the obtained pre-etching treatment and vacuum coating results are basically consistent; meanwhile, the design can save the time of the prior etching, vacuum titanizing and copper plating processes and improve the productivity; in the front etching cavity, a fixing device is used, the temperature of the plastic package wafer is easy to control, and the etching quality can be greatly improved; in the titanium and copper sputtering chamber, a fixing device is used, and a common chuck can reach the completely controlled temperature, so that the cost is reduced; therefore, the structural design can enable the plastic package wafer to easily meet the requirements of high-quality wafer level packaging technology, including parameters such as flatness and temperature of the plastic package wafer. The obtained etching and vacuum sputtering coating has better quality and better redistribution process integration effect, the vacuum coating quality between wafers and in different time periods, including film thickness uniformity and resistivity, is more uniform, and the interface resistance between redistribution layers is smaller.
As an alternative embodiment, the fixing structure may also include only the sidewall 3 or other structures that can fix the mold wafer 1 on the bottom plate 4.
Example 2
The invention provides a vacuum metal film sputtering process for a plastic package wafer 1, which comprises the following steps: the plastic-encapsulated wafer 1 is mounted in the fixing device described in example 1 in a process flow of vacuum sputtering a metal thin film.
Mounting the plastic package wafer 1 in the fixing device, and then heating and degassing the plastic package wafer 1;
or the step of installing the plastic package wafer 1 in the fixing device and the process step of heating and degassing the plastic package wafer 1 are carried out simultaneously;
before the plastic package wafer 1 is subjected to oxide film etching, or before a metal thin film is sputtered and adhered, or before a seed metal thin film is sputtered, the plastic package wafer 1 is installed in the fixing device.
Further comprising: and taking the plastic package wafer 1 out of the fixing device and then carrying out subsequent processing steps.
Preferably, the step of mounting the plastic-packaged wafer 1 in the fixing device and the step of heating and degassing the plastic-packaged wafer 1 are performed simultaneously, and the plastic-packaged wafer 1 is taken out from the fixing device after the process flow of sputtering the seed metal film. Namely, in the process of vacuum sputtering metal film, the plastic package wafer 1 is always placed in the fixing device from the beginning of the heating and degassing treatment of the plastic package wafer to the end of the step of sputtering the seed metal film. Before the vacuum sputtering metal film process is carried out on each plastic package wafer 1, each plastic package wafer 1 is arranged in a fixing device, so that the plastic package wafer 1 is always in a flat state and has good surface contact with a bottom plate 4 of the fixing device, the plastic package wafers are at the same temperature, the process flows of the plastic package wafers are the same, and the obtained film coating results are basically consistent; meanwhile, the smooth bottom surface of the fixing device is in good contact with the upper surfaces of all the cavity chucks, and can quickly reach the balance with the temperature of the chucks.
As an alternative embodiment, the plastic packaged wafer 1 may be taken out from the fixing device after the temperature is raised and degassing is performed on the plastic packaged wafer 1, or after an oxide film is etched or a metal thin film is sputtered and adhered.
Example 3
As shown in fig. 4 to 5, the present invention provides a mounting apparatus for mounting a mold wafer 1 in a fixing device described in embodiment 1, comprising: a first platform 9, a second platform 8 and a heating device.
In this embodiment, the first platform 9 is provided with a first cavity for bearing the fixing device, the first platform 9 is further provided with a pore passage, one end of the pore passage is communicated with the pipeline structure, the other end of the pore passage is connected with an external vacuum system, and the external vacuum system sucks vacuum from a gap between the plastic package wafer 1 and the bottom plate 4 through the pore passage and the pipeline structure; and the heating device is arranged on the first platform 9 and used for heating the fixing device and the plastic package wafer 1.
In this embodiment, the second platform 8 is located above the first platform 9 and reciprocates in a direction perpendicular to the first platform 9, and the heating device is disposed on the second platform 8.
Further, a second chamber for installing the fixing ring 2 and corresponding to the first chamber is further disposed on the second platform 8, and the second platform 8 is adapted to move toward the first platform 9 and install the fixing ring 2 on the sidewall 3. The second chamber is a groove provided on the second stage 8.
Further, a plurality of holes 10 for degassing the plastic package material of the plastic package wafer 1 are also formed in the second platform 8. The structure design can combine the heating and degassing process steps of the plastic package wafer 1 and the step of installing the plastic package wafer 1 in the fixing device in a chamber for synchronous operation, the plastic package wafer 1 with high flatness is obtained and reaches the preset process time, and in the same vacuum system, the plastic package wafer 1 installed in the fixing device is sent to a pre-cooling chamber and then sent to a vacuum pre-cooling chamber, a pre-etching chamber, a sputtering titanium chamber and a sputtering copper plating chamber in sequence to complete the whole process.
Further, the heating device can be a resistance wire heating system arranged in the first platform 9 and the second platform 8, and can also be heated to the temperature set by the process under the protection of inert gas; in the heating, the temperatures of the first and second stages 9 and 8 may be the same or different.
Furthermore, an inert gas pipeline communicated with the pipeline structure is further arranged on the first platform 9 and used for filling inert gas into the pipeline structure to achieve accelerated heat conduction, and meanwhile when the plastic package wafer 1 needs to be removed from the bottom plate 4, the front side and the back side air pressure of the plastic package wafer 1 can be balanced through the inert gas, so that the plastic package wafer 1 can be taken out of the fixing device.
When installing the plastic package wafer, firstly introducing inert gas into the pipeline structure for flushing, then closing the gas, and heating the first platform 9 and the second platform 8 to the temperature required by the process through a heating device; placing the fixing device without the fixing ring 2 in the first chamber; then the plastic package wafer 1 is placed on the bottom plate 4; placing the fixed ring 2 in the second chamber; the second platform 8 moves along the direction vertical to the first platform 9 until the fixing ring 2 tightly presses the side wall 3, meanwhile, a pipeline structure is utilized to conduct vacuum suction on a gap between the plastic package wafer 1 and the bottom plate 4 until the plastic package wafer 1 is tightly contacted with the bottom plate 4, after a period of time is continued according to process requirements, the plastic package wafer 1 is corrected to be flat, simultaneously, after degassing is conducted, the second platform 8 is moved upwards, the plastic package wafer 1 installed in the fixing device can be taken out through a mechanical arm, then the plastic package wafer 1 is sent into a vacuum sputtering system, and the plastic package wafer and the seed metal film are subjected to vacuum sputtering bonding and a seed metal film system together according to an integration process sequence, so that the process integration of vacuum metal film plating in fan-out packaging is completed, and the process integration comprises degassing, vacuum pre-cooling, oxide removal by pre-etching, sputtering titanizing and sputtering copper plating.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (12)
1. A fixing device for centre gripping plastic envelope wafer, its characterized in that includes:
the bottom plate (4) is used for bearing the plastic package wafer (1), and the upper surface and the lower surface of the bottom plate (4) are both planes;
the fixing structure is arranged at the edge of the upper surface of the bottom plate (4) and forms a bearing space for fixing the plastic package wafer (1) with the bottom plate (4);
the pipeline structure is formed on the bottom plate (4) and used for sucking vacuum into a gap between the plastic package wafer (1) and the bottom plate (4) so that the upper surfaces of the plastic package wafer (1) and the bottom plate (4) are always tightly attached, and the pipeline structure is also communicated with an air inlet system;
the fixing structure includes:
the side wall (3) is arranged above the bottom plate (4), the cross section of the side wall (3) is circular, and the inner diameter of the side wall (3) is matched with the diameter of the plastic package wafer (1);
the fixing ring (2) is arranged above the side wall (3), the cross section of the fixing ring (2) is circular, the inner diameter of the fixing ring (2) is smaller than the diameter of the plastic package wafer (1), and the side wall (3), the fixing ring (2) and the bottom plate (4) form the bearing space;
lateral wall (3) with bottom plate (4) fixed connection, retainer plate (2) with lateral wall (3) detachable connects, lateral wall (3) upper portion is provided with a plurality of mounting holes, retainer plate (2) are close to the one end of lateral wall (3) be provided with a plurality of with the protruding nail of mounting hole adaptation, lateral wall (3) with retainer plate (2) pass through the mounting hole and protruding nail zonulae occludens.
2. A fixture for holding plastic packaged wafers according to claim 1, wherein the bottom plate (4) is a circular flat plate adapted to the plastic packaged wafer (1).
3. A holding device for holding plastic encapsulated wafers according to claim 1 or 2, wherein the conduit structure comprises at least one through hole (5) arranged through the upper and lower surfaces of the base plate (4), the through hole (5) being connected to an external vacuum system.
4. The fixing device for clamping the plastic package wafer as recited in claim 3, wherein the pipe structure further comprises a plurality of annular grooves (7) concentrically arranged on the upper surface of the bottom plate (4) and uniformly distributed, and the plurality of annular grooves (7) are communicated with the through holes (5) through at least one linear groove (6) arranged along the radial direction of the bottom plate (4);
and the sealing plug is detachably arranged at one end of the through hole (5) connected with the external vacuum system.
5. A vacuum metal film sputtering process for plastic package wafers is characterized by comprising the following steps: mounting the plastic encapsulated wafer (1) in a fixture according to any of claims 1-4 in a vacuum sputtering metal thin film process.
6. The process for sputtering metal film in vacuum on a plastic package wafer according to claim 5, wherein the process step of heating and degassing the plastic package wafer (1) is performed after the plastic package wafer (1) is mounted in the fixing device;
or the step of installing the plastic package wafer (1) in the fixing device and the process step of heating and degassing the plastic package wafer (1) are carried out simultaneously;
or before etching an oxide film on the plastic package wafer (1), or before sputtering and adhering a metal film, or before sputtering a seed metal film, the plastic package wafer (1) is installed in the fixing device.
7. The process for vacuum sputtering of a metal film on a plastic package wafer according to claim 6, further comprising: and taking the plastic packaging wafer (1) out of the fixing device and then carrying out subsequent processing steps.
8. The process for vacuum sputtering of metal films onto plastic package wafers according to claim 7, wherein the step of mounting the plastic package wafer (1) into the fixture is performed simultaneously with the step of heating and degassing the plastic package wafer (1), and the plastic package wafer (1) is removed from the fixture after the process of sputtering the seed metal film.
9. A mounting apparatus for mounting a overmolded wafer in a fixture according to any of claims 1-4, comprising:
the first platform (9) is provided with a first cavity for bearing the fixing device, one end of the first platform (9) is provided with a pore passage communicated with the pipeline structure, the other end of the pore passage is connected with an external vacuum system, and the external vacuum system sucks vacuum on a gap between the plastic package wafer (1) and the bottom plate (4) through the pore passage and the pipeline structure;
and the heating device is at least arranged on the first platform (9) and is used for heating the fixing device and the plastic package wafer (1).
10. The mounting device according to claim 9, further comprising a second platform (8) located above the first platform (9) and arranged to move back and forth in a direction perpendicular to the first platform (9), the second platform (8) having the heating means arranged thereon.
11. The mounting device according to claim 10, wherein a second chamber is provided on the second platform (8) for mounting the retaining ring (2) and arranged in correspondence with the first chamber, the second platform (8) being adapted to move towards the first platform (9) and to mount the retaining ring (2) on the side wall (3).
12. The mounting device according to claim 10, wherein a plurality of holes (10) for degassing the mold material of the mold wafer (1) are further provided on the second platform (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811562109.9A CN109786314B (en) | 2018-12-19 | 2018-12-19 | Fixing device for clamping plastic package wafer and vacuum sputtering metal film process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811562109.9A CN109786314B (en) | 2018-12-19 | 2018-12-19 | Fixing device for clamping plastic package wafer and vacuum sputtering metal film process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109786314A CN109786314A (en) | 2019-05-21 |
| CN109786314B true CN109786314B (en) | 2021-07-27 |
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| CN201811562109.9A Active CN109786314B (en) | 2018-12-19 | 2018-12-19 | Fixing device for clamping plastic package wafer and vacuum sputtering metal film process |
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| CN110416149A (en) * | 2019-07-17 | 2019-11-05 | 上海华岭集成电路技术股份有限公司 | A kind of thinned wafer bracing means |
| CN110894591A (en) * | 2019-11-12 | 2020-03-20 | 江苏长电科技股份有限公司 | Cooling disc and cooling method used in magnetron sputtering process |
| CN111809222A (en) * | 2020-08-11 | 2020-10-23 | 硅密芯镀(海宁)半导体技术有限公司 | Wafer fixing device and wafer fixing method |
| CN113436994B (en) * | 2021-06-21 | 2024-02-09 | 江苏中科智芯集成科技有限公司 | Semiconductor device and method for curing dielectric material with precise control |
| CN113539937B (en) * | 2021-07-09 | 2023-03-03 | 江西龙芯微科技有限公司 | Wafer bearing device |
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| CN102945820B (en) * | 2012-10-23 | 2015-03-18 | 北京七星华创电子股份有限公司 | Disk holding device |
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| CN1965401A (en) * | 2004-06-08 | 2007-05-16 | 松下电器产业株式会社 | Component mounting method and component mounting apparatus |
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