CN216487966U - Efficient plastic packaging device for diode production - Google Patents
Efficient plastic packaging device for diode production Download PDFInfo
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- CN216487966U CN216487966U CN202122441382.XU CN202122441382U CN216487966U CN 216487966 U CN216487966 U CN 216487966U CN 202122441382 U CN202122441382 U CN 202122441382U CN 216487966 U CN216487966 U CN 216487966U
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- electric telescopic
- telescopic handle
- water
- mount
- plastic packaging
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- 239000004033 plastic Substances 0.000 title claims abstract description 42
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000001816 cooling Methods 0.000 claims abstract description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000000498 cooling water Substances 0.000 claims abstract description 19
- 239000004593 Epoxy Substances 0.000 claims description 8
- 230000007246 mechanism Effects 0.000 claims description 8
- 239000002826 coolant Substances 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 6
- -1 polytetrafluoroethylene Polymers 0.000 claims description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 6
- 229920002379 silicone rubber Polymers 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 abstract description 10
- 239000000463 material Substances 0.000 abstract description 10
- 229920000647 polyepoxide Polymers 0.000 abstract description 10
- 239000000110 cooling liquid Substances 0.000 abstract description 6
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 description 3
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model provides a high-efficiency plastic packaging device for diode production, which relates to the technical field of diodes and comprises a fixing frame, a lead screw slide rail A, an electric telescopic rod A, a support frame A, an electric telescopic rod B, a clamping plate A and a mold. According to the utility model, liquid epoxy resin in an epoxy resin material box is quantitatively led into a die from a discharge port through a material guide hose, after a diode is wrapped, a worker controls two electric telescopic rods E to slide a supporting plate B into a sliding groove B, opens a cooling water tank and a water pump to lead water cooling liquid in the cooling water tank into a water cooling pipe, and then leads the water cooling pipe back to the cooling water tank, so that the epoxy resin in the die is rapidly cooled, and then the plastic package treatment of the diode is completed.
Description
Technical Field
The utility model relates to the technical field of diodes, in particular to a high-efficiency plastic packaging device for diode production.
Background
A diode is an electronic device fabricated using semiconductor materials, typically silicon, selenium, germanium, and the like.
Wherein, through the retrieval discovery, there is a patent No. CN201921636515.5 plastic packaging hardware for diode production, this kind of plastic packaging hardware for diode production can consolidate the vacuum pump when using through this plastic packaging hardware for diode production, can carry out effectual heat dissipation to the vacuum pump simultaneously for the vacuum pump can be continuously stable carry out the vacuum to plastic packaging hardware and bleed, the plastic packaging of the diode production of being convenient for is handled. The base plate is laid in the collecting box of the plastic packaging device for producing the diodes, the diodes can be prevented from entering the collecting box to cause damage, and meanwhile, the fan arranged above the collecting box can be used for cooling treatment, so that the diodes after plastic packaging are prevented from being adhered to each other; wherein, the deficiency points are as follows:
this kind of plastic packaging device for diode production when the staff uses, because only single one through the fan to the one side of plastic packaging device blow the cooling and handle for it is slower to carry out the liquid material cooling of plastic envelope to the diode, and the cost time is longer, makes the cooling effect comparatively poor, and this kind of plastic packaging device for diode production's plastic packaging mold is owing to can not dismantle the processing, makes the staff with special inconvenient when needing to change this plastic packaging mold or clearing up.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the problems that the cooling effect of the plastic package device for producing the diode is poor and a plastic package mold is inconvenient to disassemble in the background, thereby providing the efficient plastic package device for producing the diode.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a diode production is with high-efficient plastic envelope device, includes mount, lead screw slide rail A, electric telescopic handle A, support frame A, electric telescopic handle B, splint A, mould, mount top one end fixed mounting has lead screw slide rail A, lead screw slide rail A bottom is provided with electric telescopic handle A through the slider slip, electric telescopic handle A bottom fixed mounting has support frame A, the equal fixed mounting in both ends has electric telescopic handle B around the support frame A outer wall, the equal fixed mounting in electric telescopic handle B opposite face has splint A, be provided with the mould in the middle of the mount bottom, mount bottom both ends all are provided with adjusts fixture, be provided with cooling body in the middle of the mount bottom.
Preferably, it comprises lead screw slide rail B, support frame B, electric telescopic handle C, splint B, spout A, backup pad A to adjust fixture, the equal fixed mounting in mount bottom both ends has lead screw slide rail B, lead screw slide rail B top is provided with support frame B through the slider slip, the equal fixed mounting in both ends has electric telescopic handle C about the support frame B opposite face, the equal fixed mounting of the electric telescopic handle C other end has splint B, the equal fixed mounting in mould both ends has spout A, spout A inboard slip is provided with backup pad A, and passes through bolted connection between spout A and the backup pad A.
Preferably, one support frame B top fixed mounting has the fixed plate, fixed plate one end fixed mounting has electric telescopic handle D, electric telescopic handle D other end fixed mounting has the supporting shoe, the embedding of supporting shoe other end outer wall is provided with the discharge gate, mount top one end fixed mounting has the epoxy workbin, the embedding of epoxy workbin one end is provided with the delivery pump, mount top embedding is provided with the measuring pump, all through the guide hose connection between delivery pump, measuring pump and the discharge gate.
Preferably, cooling body comprises spout B, electric telescopic handle E, backup pad B, coolant tank, water pump and water-cooling pipe, the equal fixed mounting in both ends has electric telescopic handle E in the middle of the mount bottom, electric telescopic handle E top fixed mounting has backup pad B, the equal embedding in mould bottom both ends is provided with spout B, and backup pad B agrees with to slide and set up at spout B inboard, the equal fixed mounting in mount bottom both ends has coolant tank, the equal embedding in coolant tank other end is provided with the water pump, the inboard embedding of backup pad B is provided with the water-cooling pipe, and the water-cooling pipe is "S" type and arranges and set up in backup pad B inboard, the embedding of water-cooling pipe one end sets up in the water pump outside, and the other end embedding sets up at the coolant tank top.
Preferably, the material of the outer surface of the mold is silicon rubber.
Preferably, the material of the outer surface of the mold is polytetrafluoroethylene.
The utility model provides a high-efficiency plastic package device for diode production, which has the following beneficial effects:
1. this kind of diode production is with high-efficient plastic packaging device is through being provided with splint B and backup pad A, can make in the staff slides in the spout A at mould both ends respectively with backup pad A to fix the back through the bolt, make the backup pad A at mould both ends be in between the splint B, control electric telescopic handle C stretches out splint B among the staff, contacts backup pad A upper and lower both ends, carries out spacing centre gripping with backup pad A, makes the mould fix between support frame B.
2. This kind of diode production is with high-efficient plastic packaging device is through being provided with backup pad B and water-cooled tube, can make two electric telescopic handle E of staff control slide in the spout B with backup pad B to open in cooling water tank and the leading-in water-cooled tube of water-cooled liquid of water pump in with cooling water tank, the rethread water-cooled tube leads back cooling water tank, makes the water-cooled liquid at backup pad B internal circulation, carries out quick cooling to the epoxy in the mould.
Drawings
FIG. 1 is a schematic cross-sectional front view of a plastic packaging apparatus according to the present invention;
FIG. 2 is a side view of the supporting frame A of the present invention;
FIG. 3 is a schematic cross-sectional front view of the mold of the present invention;
fig. 4 is a schematic front sectional perspective view of the mold of the present invention.
In FIGS. 1-4: 1. a fixed mount; 101. a screw rod slide rail A; 102. an electric telescopic rod A; 103. a support frame A; 104. an electric telescopic rod B; 105. a splint A; 2. a screw rod slide rail B; 201. a support frame B; 202. an electric telescopic rod C; 203. a splint B; 204. a fixing plate; 205. an electric telescopic rod D; 206. a supporting block; 3. a mold; 301. a chute A; 302. a support plate A; 303. a chute B; 4. an electric telescopic rod E; 401. a support plate B; 5. a cooling water tank; 501. a water pump; 502. a water-cooled tube; 6. an epoxy resin bin; 601. a feed pump; 602. a metering pump; 603. and (4) a discharge port.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 4, in the embodiment of the utility model, a high-efficiency plastic package device for diode production includes a fixing frame 1, a lead screw slide rail a101, an electric telescopic rod a102, a support frame a103, an electric telescopic rod B104, a clamping plate a105, and a mold 3, wherein the lead screw slide rail a101 is fixedly installed at one end of the top of the fixing frame 1, the electric telescopic rod a102 is slidably installed at the bottom of the lead screw slide rail a101 through a slider, the support frame a103 is fixedly installed at the bottom of the electric telescopic rod a102, the electric telescopic rods B104 are fixedly installed at the front end and the rear end of the outer wall of the support frame a103, the clamping plate a105 is fixedly installed on the opposite surface of the electric telescopic rod B104, the mold 3 is arranged in the middle of the bottom of the fixing frame 1, adjusting and clamping mechanisms are arranged at the two ends of the bottom of the fixing frame 1, and a cooling mechanism is arranged in the middle of the bottom of the fixing frame 1.
Referring to fig. 1, 3, and 4, in the present embodiment: the adjusting and clamping mechanism consists of a screw rod slide rail B2, a support frame B201, an electric telescopic rod C202, a clamping plate B203, a chute A301 and a support plate A302;
lead screw slide rails B2 are fixedly installed at two ends of the bottom of the fixing frame 1, a support frame B201 is arranged at the top of each lead screw slide rail B2 in a sliding mode through a slide block, electric telescopic rods C202 are fixedly installed at the upper end and the lower end of the opposite surface of each support frame B201, clamp plates B203 are fixedly installed at the other ends of the electric telescopic rods C202, slide grooves A301 are fixedly installed at two ends of the mold 3, a support plate A302 is arranged on the inner side of each slide groove A301 in a sliding mode, the slide grooves A301 are connected with the support plate A302 through bolts, when workers need to carry produced diodes to a work place in a plastic package mode, the workers place the diodes between the clamp plates A105 and control the electric telescopic rods B104 to extend out of the clamp plates A105 to contact one ends of the diodes, the diodes are clamped, after positions needing plastic package are exposed, the workers control the lead screw slide rails B2 to drive the support frames B201 to move to a specified distance in the opposite direction through the slide blocks, the staff slides in the spout A301 at mould 3 both ends respectively with backup pad A302 to fix the back through the bolt, make the backup pad A302 at mould 3 both ends be in between splint B203, control electric telescopic handle C202 among the staff stretches out splint B203, contacts backup pad A302 upper and lower both ends, carries out spacing centre gripping with backup pad A302, makes mould 3 fix between support frame B201.
Referring to fig. 1 and 3, in the present embodiment: a fixing plate 204 is fixedly arranged on the top of a supporting frame B201, an electric telescopic rod D205 is fixedly arranged at one end of the fixing plate 204, a supporting block 206 is fixedly arranged at the other end of the electric telescopic rod D205, a discharge hole 603 is embedded in the outer wall of the other end of the supporting block 206, an epoxy resin box 6 is fixedly arranged at one end of the top of the fixing frame 1, a feeding pump 601 is embedded in the top of the fixing frame 1, the feeding pump 601, the feeding pump 602 and the discharge hole 603 are connected through a guide hose, after a worker fixes the die 3, the electric telescopic rod A102 is controlled to place one end of the diode needing plastic package in the die 3, and the electric telescopic rod D205 is controlled to extend the discharge hole 603 to the top of the die 3, the worker opens the feeding pump 601 and the feeding pump 602 to guide the liquid epoxy resin in the epoxy resin box 6 into the die 3 from the discharge hole 603 through the guide hose, the diode is encapsulated.
Referring to fig. 1 and 3, in the present embodiment: the cooling mechanism consists of a sliding chute B303, an electric telescopic rod E4, a supporting plate B401, a cooling water tank 5, a water pump 501 and a water cooling pipe 502;
an electric telescopic rod E4 is fixedly installed at both ends of the middle of the bottom of the fixed frame 1, a supporting plate B401 is fixedly installed at the top of the electric telescopic rod E4, a sliding groove B303 is embedded into both ends of the bottom of the mold 3, the supporting plate B401 is arranged inside the sliding groove B303 in a matching and sliding manner, a cooling water tank 5 is fixedly installed at both ends of the bottom of the fixed frame 1, a water pump 501 is embedded into the other end of the cooling water tank 5, a water cooling pipe 502 is embedded into the inner side of the supporting plate B401, the water cooling pipes 502 are arranged inside the supporting plate B401 in an S-shaped arrangement manner, one end of each water cooling pipe 502 is embedded into the outer side of the water pump 501, the other end is embedded into the top of the cooling water tank 5, when the liquid epoxy resin in the epoxy resin bin 6 is quantitatively led into the mold 3 from the discharge port 603 through a material guide hose, after the diode is wrapped, a worker controls the two electric telescopic rods E4 to slide the supporting plate B401 into the sliding groove B303, and the cooling water tank 5 and the water pump 501 are opened to guide the water cooling liquid in the cooling water tank 5 into the water cooling pipe 502, and then the water cooling liquid is guided back to the cooling water tank 5 through the water cooling pipe 502, so that the water cooling liquid circulates in the supporting plate B401, and after the epoxy resin in the die 3 is rapidly cooled, the plastic package treatment of the diode is completed.
Referring to fig. 1-3, in this embodiment: the screw rod slide rail A101, the electric telescopic rod A102, the electric telescopic rod B104, the screw rod slide rail B2, the electric telescopic rod C202, the electric telescopic rod D205, the electric telescopic rod E4, the cooling water tank 5, the water pump 501, the feeding pump 601 and the metering pump 602 are all electrically connected with an external power supply through a control panel.
Referring to fig. 1, 3, and 4, in the present embodiment: the material of the outer surface of the mold 3 is silicon rubber, and the silicon rubber material has the characteristic of non-adhesion, so that the epoxy resin can not be adhered to the surface of the mold 3 and is difficult to take out when being cooled and dried in the mold 3.
As shown in fig. 1, 3 and 4, in the present invention, in addition to the embodiment in which the material of the outer surface of the mold 3 is silicon rubber, there is another embodiment in which the material of the outer surface of the mold 3 is polytetrafluoroethylene, and since the polytetrafluoroethylene has high and low temperature resistance and non-adhesion properties, when the epoxy resin is cooled and dried in the mold 3, the polytetrafluoroethylene does not adhere to the surface of the mold 3 and is difficult to take out, and the polytetrafluoroethylene having corrosion resistance properties can prevent the outer surface of the mold 3 from being corroded and losing its effect due to long-term contact with the epoxy resin.
When the efficient plastic packaging device for diode production is used, firstly, when a worker needs to carry a large number of diodes to a working site for plastic packaging treatment, the worker places the diodes between the clamping plates A105 and controls the electric telescopic rod B104 to extend out of the clamping plate A105 to contact one end of the diodes to clamp the diodes, after the positions needing plastic packaging are exposed, the worker controls the lead screw slide rail B2 to drive the support frame B201 to move to a specified interval in the opposite direction through the slide block, the worker slides the support plates A302 into the slide grooves A301 at two ends of the mold 3 respectively and fixes the support plates A302 between the clamping plates B203 through the bolts, controls the electric telescopic rod C202 to extend out of the clamping plate B203 to contact the upper end and the lower end of the support plate A302 to limit and clamp the support plates A302, make mould 3 fix between support frame B201, then, control electric telescopic handle A102 places the one end that the diode needs the plastic envelope in mould 3, and control electric telescopic handle D205 stretch out behind mould 3 top with discharge gate 603, the staff opens charge pump 601 and measuring pump 602, leading-in mould 3 from discharge gate 603 through the guide hose with the liquid epoxy ration in the epoxy feed tank 6, wrap up the diode, finally, the staff controls two electric telescopic handle E4 and slides in spout B303 with backup pad B401, and open in cooling water tank 5 and water pump 501 with the leading-in water-cooling tube 502 of the water-cooling liquid in cooling water tank 5, the rethread water-cooling tube 502 leads back to cooling water tank 5, make the water-cooling liquid at backup pad B401 internal recycle, after carrying out quick cooling to the epoxy in mould 3, accomplish the plastic envelope of diode and handle.
The above is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, it is possible to make several variations and modifications without departing from the concept of the present invention, and these should be considered as the protection scope of the present invention, which will not affect the effect of the implementation of the present invention and the utility of the patent.
Claims (6)
1. The utility model provides a diode production is with high-efficient plastic envelope device, includes mount (1), lead screw slide rail A (101), electric telescopic handle A (102), support frame A (103), electric telescopic handle B (104), splint A (105), mould (3), mount (1) top one end fixed mounting has lead screw slide rail A (101), lead screw slide rail A (101) bottom is provided with electric telescopic handle A (102) through the slider slip, electric telescopic handle A (102) bottom fixed mounting has support frame A (103), the equal fixed mounting in both ends has electric telescopic handle B (104) around support frame A (103) outer wall, the equal fixed mounting in electric telescopic handle B (104) opposite face has splint A (105), be provided with mould (3) in the middle of mount (1) bottom, its characterized in that: the adjustable clamping device is characterized in that two ends of the bottom of the fixing frame (1) are respectively provided with an adjusting clamping mechanism, and a cooling mechanism is arranged in the middle of the bottom of the fixing frame (1).
2. The efficient plastic packaging device for diode production according to claim 1, wherein: the adjusting and clamping mechanism consists of a screw rod sliding rail B (2), a supporting frame B (201), an electric telescopic rod C (202), a clamping plate B (203), a sliding groove A (301) and a supporting plate A (302);
mount (1) bottom both ends all are provided with lead screw slide rail B (2), lead screw slide rail B (2) top is provided with support frame B (201) through the slider activity, both ends all are provided with electric telescopic handle C (202) about support frame B (201) opposite face, the equal fixed mounting of electric telescopic handle C (202) other end has splint B (203), mould (3) both ends all are provided with spout A (301), spout A (301) inboard activity is provided with backup pad A (302), and passes through bolted connection between spout A (301) and backup pad A (302).
3. The efficient plastic packaging device for diode production according to claim 2, wherein: one support frame B (201) top is provided with fixed plate (204), fixed plate (204) one end is provided with electric telescopic handle D (205), electric telescopic handle D (205) other end fixed mounting has supporting shoe (206), supporting shoe (206) other end outer wall embedding is provided with discharge gate (603), mount (1) top one end is provided with epoxy workbin (6), epoxy workbin (6) one end embedding is provided with charge pump (601), mount (1) top embedding is provided with measuring pump (602), all connect through the guide hose between charge pump (601), measuring pump (602) and discharge gate (603).
4. The efficient plastic packaging device for diode production according to claim 1, wherein: the cooling mechanism is composed of a sliding groove B (303), an electric telescopic rod E (4), a supporting plate B (401), a cooling water tank (5), a water pump (501) and a water cooling pipe (502);
both ends all are provided with electric telescopic handle E (4) in the middle of mount (1) bottom, electric telescopic handle E (4) top is provided with backup pad B (401), mould (3) bottom both ends all imbed and are provided with spout B (303), and backup pad B (401) agree with the slip setting at spout B (303) inboard, mount (1) bottom both ends all are provided with coolant tank (5), coolant tank (5) other end all imbeds and is provided with water pump (501), backup pad B (401) inboard embedding is provided with water-cooled tube (502), and water-cooled tube (502) are "S" type and arrange the setting in backup pad B (401) inboard, water-cooled tube (502) one end embedding sets up in the water pump (501) outside, and the other end embedding sets up at coolant tank (5) top.
5. The efficient plastic packaging device for diode production according to claim 1, wherein: the outer surface of the mould (3) is made of silicon rubber.
6. The efficient plastic packaging device for diode production according to claim 1, wherein: the outer surface of the die (3) is made of polytetrafluoroethylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122441382.XU CN216487966U (en) | 2021-10-11 | 2021-10-11 | Efficient plastic packaging device for diode production |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122441382.XU CN216487966U (en) | 2021-10-11 | 2021-10-11 | Efficient plastic packaging device for diode production |
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| Publication Number | Publication Date |
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| CN216487966U true CN216487966U (en) | 2022-05-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122441382.XU Active CN216487966U (en) | 2021-10-11 | 2021-10-11 | Efficient plastic packaging device for diode production |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115020284A (en) * | 2022-05-26 | 2022-09-06 | 先之科半导体科技(东莞)有限公司 | Plastic packaging equipment convenient for replacing die and used for diode production |
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2021
- 2021-10-11 CN CN202122441382.XU patent/CN216487966U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115020284A (en) * | 2022-05-26 | 2022-09-06 | 先之科半导体科技(东莞)有限公司 | Plastic packaging equipment convenient for replacing die and used for diode production |
| CN115020284B (en) * | 2022-05-26 | 2023-03-24 | 先之科半导体科技(东莞)有限公司 | Plastic packaging equipment convenient for replacing die and used for diode production |
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Effective date of registration: 20230328 Address after: 430000 Lihua Road, Dongxihu District, Wuhan City, Hubei Province, 399 (17) Patentee after: Wuhan Wuzheng Rectifier Co.,Ltd. Address before: 235000 No. 11, Xingfu Road, Huaibei City, Anhui Province Patentee before: Tang Teng |