CN218822834U - Temperature measuring mechanism of semiconductor machine - Google Patents
Temperature measuring mechanism of semiconductor machine Download PDFInfo
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- CN218822834U CN218822834U CN202222982001.3U CN202222982001U CN218822834U CN 218822834 U CN218822834 U CN 218822834U CN 202222982001 U CN202222982001 U CN 202222982001U CN 218822834 U CN218822834 U CN 218822834U
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- temperature
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- temperature measuring
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- temperature measurement
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a temperature measurement mechanism of semiconductor board, include: the base, the upper portion of base is provided with places the platform and places the inside of platform and be provided with the standing groove, the inside of standing groove is provided with the temperature measurement platform, the inside of placing the platform is provided with the surface that mounting groove and temperature measurement platform are located the mounting groove, the inboard blue membrane surface that the surface of temperature measurement platform was provided with wafer frame and wafer frame is provided with the wafer body. The utility model discloses the temperature measuring platform is provided with the backup pad including leading the temperature board and leading the lower part of temperature board, the side that the lower part of backup pad was provided with terminal block and terminal block is provided with the connecting wire, the connecting wire extends to place the platform outside and be connected between the display module, the inside of leading the temperature board is provided with heat conduction silicon mud and wafer body back of the body on rather than upper portion mutual contact, heat conduction silicon mud guarantees the temperature equilibrium with wafer body back of the body heat in certain extent, turn into the signal of telecommunication with the heat signal through temperature sensor, realize the temperature measurement to the wafer body.
Description
Technical Field
The utility model relates to the field of semiconductor technology, more specifically are temperature measurement mechanism of semiconductor board.
Background
Semiconductor (semiconductor) refers to a material having a conductive property between a conductor and an insulator at normal temperature. Semiconductors are used in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power conversion, etc., for example, diodes are devices fabricated using semiconductors. The importance of semiconductors is enormous, both from a technological and economic point of view. Most electronic products, such as computers, mobile phones or digital audio recorders, have a core unit closely related to a semiconductor. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., with silicon being one of the most influential of various semiconductor material applications.
At present, one-point or multi-point temperature measurement is mostly adopted in the temperature measurement of the wafer, but the temperature measurement can only be carried out aiming at a certain point, and the overall temperature of the wafer cannot be detected. Therefore, a new technical solution needs to be provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a temperature measurement mechanism of semiconductor board has solved and has adopted one more point or multipoint mode temperature measurement in the temperature measurement to the wafer at present, but it can only carry out the temperature measurement to a certain bit, can't carry out the problem that detects to the comprehensive temperature of wafer.
In order to achieve the above purpose, the utility model provides a following technical scheme: a temperature measuring mechanism of a semiconductor machine comprises: the base, the upper portion of base is provided with places the platform and places the inside of platform and be provided with the standing groove, the inside of standing groove is provided with the temperature measurement platform, the inside of placing the platform is provided with the surface that mounting groove and temperature measurement platform are located the mounting groove, the surface of temperature measurement platform is provided with the inboard blue membrane surface of wafer frame and is provided with the wafer body, the temperature measurement platform is provided with the backup pad including leading the temperature board and leading the lower part of temperature board, the side that the lower part of backup pad is provided with lug and lug is provided with the connecting wire, the connecting wire extend to place the platform outside and be connected between the display module, the inside of leading the temperature board is provided with temperature sensor and is connected through between wire and the lug.
As an embodiment of the present invention, the edge of the placement groove is provided with a plurality of sets of fixture blocks and the fixture blocks contact with the wafer frame.
As an preferable embodiment of the present invention, the inside of the temperature guide plate is provided with the heat conductive silicon mud and the heat conductive silicon mud contacts with the back of the wafer body on the upper portion thereof.
As a preferred embodiment of the present invention, the lower portion of the supporting plate is provided with a spring post and the supporting plate passes through the telescopic connection between the spring post and the mounting groove.
Compared with the prior art, the beneficial effects of the utility model are as follows:
the utility model discloses the inside that is provided with on the upper portion of base and places the platform is provided with the standing groove, the inside of standing groove is provided with the temperature measurement platform, the inside of placing the platform is provided with the surface that mounting groove and temperature measurement platform are located the mounting groove, the temperature measurement platform is provided with the backup pad including leading the temperature board and leading the lower part of temperature board, the side that the lower part of backup pad is provided with terminal block and terminal block is provided with the connecting wire, the connecting wire extends to place the platform outside and is connected with between the display module, the inside of leading the temperature board is provided with heat conduction silicon mud and wafer body back of the body on its upper portion mutual contact, heat conduction silicon mud guarantees the temperature equilibrium with wafer body back of the body heat in certain extent, turn into the signal of telecommunication through temperature sensor, realize the temperature measurement to wafer body.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the internal structure of the present invention;
fig. 3 is a schematic structural view of the temperature measuring table of the present invention.
In the figure: 1. a base; 2. a placing table; 3. a placement groove; 4. a temperature measuring table; 5. a clamping block; 6. mounting grooves; 7. a spring post; 8. a support plate; 9. a connecting wire; 10. a wafer frame; 11. a wafer body; 12. a heat conducting plate; 13. heat-conducting silicon mud; 14. a temperature sensor; 15. a junction block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a temperature measuring mechanism of a semiconductor machine comprises: the temperature measuring device comprises a base 1, wherein a placing table 2 is arranged on the upper portion of the base 1, a placing groove 3 is arranged in the placing table 2, a temperature measuring table 4 is arranged in the placing groove 3, a mounting groove 6 is arranged in the placing table 2, the temperature measuring table 4 is positioned on the surface of the mounting groove 6, a wafer frame 10 is arranged on the surface of the temperature measuring table 4, a wafer body 11 is arranged on the inner side blue film surface of the wafer frame 10, the temperature measuring table 4 comprises a temperature guide plate 12, a supporting plate 8 is arranged on the lower portion of the temperature guide plate 12, a wiring block 15 is arranged on the lower portion of the supporting plate 8, a connecting wire 9 is arranged on the side surface of the wiring block 15, the connecting wire 9 extends to the outside of the placing table 2 and is connected with a display module, a temperature sensor 14 is arranged in the temperature guide plate 12, and the temperature sensor 14 is connected with the wiring block 15 through a wire, be provided with on the upper portion of base 1 and place platform 2 and place the inside of platform 2 and be provided with standing groove 3, the inside of standing groove 3 is provided with temperature measurement platform 4, be provided with mounting groove 6 and temperature measurement platform 4 in the inside of placing platform 2 and be located the surface of mounting groove 6, temperature measurement platform 4 is provided with backup pad 8 including leading temperature board 12 and the lower part of leading temperature board 12, the side that the lower part of backup pad 8 was provided with terminal block 15 and terminal block 15 is provided with connecting wire 9, connecting wire 9 extends to place 2 outsides and is connected with between the display module, be provided with heat conduction silicon mud 13 and the wafer body 11 back mutual contact on its upper portion in the inside of leading temperature board 12, heat conduction silicon mud 13 guarantees the temperature equilibrium with wafer body 11 back heat in certain extent, turn into the signal of telecommunication through temperature sensor 14, realize the temperature measurement to wafer body 11.
Further improved, as shown in fig. 1: the edge of the placing groove 3 is provided with the fixture blocks 5, the fixture blocks 5 are provided with a plurality of groups and are in contact with the wafer frame 10, and the arrangement ensures the installation stability of the wafer frame 10.
Further improved, as shown in fig. 3: the inside of heat conduction board 12 is provided with heat conduction silicon mud 13 and the wafer body 11 back of its upper portion contact each other, and heat conduction silicon mud 13 can guarantee the temperature equilibrium with wafer body 11 back of the body heat in certain extent.
Further improved, as shown in fig. 2: the lower part of the supporting plate 8 is provided with a spring column 7, the supporting plate 8 is in telescopic connection with the mounting groove 6 through the spring column 7, and the arrangement ensures the contact between the temperature guide plate 12 and the wafer body 11.
The utility model discloses be provided with on base 1's upper portion and place platform 2 and place the inside of platform 2 and be provided with standing groove 3, the inside of standing groove 3 is provided with temperature measurement platform 4, be provided with mounting groove 6 and temperature measurement platform 4 and be located the surface of mounting groove 6 in the inside of placing platform 2, temperature measurement platform 4 is provided with backup pad 8 including leading temperature board 12 and the lower part of leading temperature board 12, the side that backup pad 8's lower part was provided with terminal block 15 and terminal block 15 is provided with connecting wire 9, connecting wire 9 extends to place 2 outsides of platform and be connected with between the display module, be provided with heat conduction silicon mud 13 and the 11 back of wafer body on rather than the upper portion mutual contact in the inside of leading temperature board 12, heat conduction silicon mud 13 guarantees the temperature equilibrium with 11 back heats of wafer body in certain extent, turn into the signal of telecommunication with the heat signal through temperature sensor 14, the realization is to the temperature measurement of wafer body 11.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. The utility model provides a temperature measurement mechanism of semiconductor board which characterized in that: the method comprises the following steps: the temperature measuring device comprises a base (1), wherein a placing table (2) is arranged on the upper portion of the base (1), a placing groove (3) is formed in the placing table (2), a temperature measuring table (4) is arranged in the placing groove (3), a mounting groove (6) is formed in the placing table (2), the temperature measuring table (4) is located on the surface of the mounting groove (6), a wafer frame (10) is arranged on the surface of the temperature measuring table (4), a wafer body (11) is arranged on the surface of an inner side blue membrane of the wafer frame (10), the temperature measuring table (4) comprises a temperature guide plate (12) and a support plate (8) is arranged on the lower portion of the temperature guide plate (12), a connecting wire (9) is arranged on the side face, provided with a wiring block (15) and the wiring block (15), the connecting wire (9) extends to the outside of the placing table (2) and is connected with a display module, a temperature sensor (14) is arranged in the temperature guide plate (12), and the temperature sensor (14) is connected with the wiring block (15) through a wire.
2. The temperature measuring mechanism of a semiconductor machine as claimed in claim 1, wherein: the edge of the placing groove (3) is provided with clamping blocks (5), the clamping blocks (5) are provided with a plurality of groups, and the clamping blocks are in contact with the wafer frame (10).
3. The temperature measuring mechanism of a semiconductor machine as claimed in claim 1, wherein: the heat conducting silicon mud (13) is arranged in the heat conducting plate (12), and the heat conducting silicon mud (13) is in mutual contact with the back of the wafer body (11) on the upper portion of the heat conducting silicon mud.
4. The temperature measuring mechanism of a semiconductor machine as claimed in claim 1, wherein: the lower part of the supporting plate (8) is provided with a spring column (7) and the supporting plate (8) is in telescopic connection with the mounting groove (6) through the spring column (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222982001.3U CN218822834U (en) | 2022-11-09 | 2022-11-09 | Temperature measuring mechanism of semiconductor machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222982001.3U CN218822834U (en) | 2022-11-09 | 2022-11-09 | Temperature measuring mechanism of semiconductor machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218822834U true CN218822834U (en) | 2023-04-07 |
Family
ID=87247957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222982001.3U Active CN218822834U (en) | 2022-11-09 | 2022-11-09 | Temperature measuring mechanism of semiconductor machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218822834U (en) |
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2022
- 2022-11-09 CN CN202222982001.3U patent/CN218822834U/en active Active
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