CN218782545U - Temperature control system and sequencing device with same - Google Patents

Abstract

The utility model discloses a temperature control system and sequencing device who has it, temperature control system includes: a thermoelectric cooler comprising first and second heat exchange surfaces adapted for heat exchange therebetween; a heat sink in heat exchange with the second heat exchange surface; the cooling device is formed with a refrigerating chamber, and at least part of the radiator is arranged in the refrigerating chamber. The utility model relates to a temperature control system, thermoelectric cooler's second heat exchange surface temperature is low, and thermoelectric cooler refrigeration efficiency is high, can show and reduce the cool down time, improves work efficiency.

Description

Temperature control system and sequencing device with same

Technical Field

The utility model belongs to the technical field of biotechnology and specifically relates to a temperature control system and have its sequencing device is related to.

Background

Because a TEC (short for Thermo Electric Cooler), i.e., a thermoelectric Cooler, can cool and heat, and has a small volume and a small thermal inertia, the TEC is widely used in a gene velocimeter and a PCR instrument (polymerase chain reaction instrument) to control a reaction temperature. According to the working characteristics of the TEC refrigerating plate, the lower the temperature of the heat dissipation surface is when the TEC refrigerates, the faster the temperature rising and falling rate of the temperature control surface is. At present, the heat dissipation mode of the heat dissipation surface of the TEC refrigeration plate is limited to air cooling, water cooling and phase change cooling, but the three modes are affected by the environment, the temperature of the heat dissipation surface is always higher than the room temperature, the heat dissipation capacity of the heat dissipation surface is insufficient, and the temperature rise and fall efficiency of the TEC is affected. The present application is directed to a temperature control system to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. To this end, it is an object of the present invention to provide a temperature control system. The utility model relates to a temperature control system, thermoelectric cooler's second heat exchange surface temperature is low, and thermoelectric cooler refrigeration efficiency is high, can show and reduce the cool down time, improves work efficiency.

The utility model also provides a sequencing device of having above-mentioned temperature control system.

According to some embodiments of the invention, the temperature control system comprises: a thermoelectric cooler comprising first and second heat exchange surfaces adapted for heat exchange therebetween; a heat sink in heat exchange with the second heat exchange surface; the cooling device, the cooling device is formed with the walk-in, at least part of radiator set up in the walk-in.

The utility model relates to a temperature control system, the at least part of radiator sets up in the freezer, because the temperature of freezer is lower, obviously is less than the room temperature, and when the radiator carried out the heat exchange through heat transfer medium and second heat exchange surface, the heat transfer medium of lower temperature can make the temperature of second heat exchange surface reduce fast, and then improves thermoelectric cooler's refrigeration efficiency, is showing and shortens the cool down time, improves work efficiency.

According to some embodiments of the present invention, the temperature control system further comprises: the reaction device is arranged in the thermoelectric cooler, and the first heat exchange surface is suitable for heating or refrigerating the reaction device.

According to some embodiments of the utility model, the reaction unit with be provided with the heat-conducting layer between the first heat exchange surface.

According to some embodiments of the invention, the reaction device comprises: a reactor; and the bearing part is arranged on the reactor, and the bearing part is provided with the heat conduction layer and supports the first heat exchange surface.

According to some embodiments of the present invention, the temperature control system further comprises: a temperature sensor disposed within the carrier and configured to detect a temperature of the reactor.

According to some embodiments of the invention, the temperature control system further comprises: and the control unit is respectively electrically connected with the temperature sensor and the thermoelectric cooler and is suitable for controlling the temperature difference between the first heat exchange surface and the second heat exchange surface according to the temperature detected by the temperature sensor.

According to some embodiments of the invention, the heat sink comprises: a first heat exchanger adapted to be in contact with the second heat exchange surface; the second heat exchanger is arranged in the refrigerating chamber, the second heat exchanger is communicated with the first heat exchanger through a loop, and a heat exchange medium flows between the first heat exchanger and the second heat exchanger.

According to some embodiments of the present invention, the temperature control system further comprises: the water pump is arranged in the loop and is suitable for driving the heat exchange medium in the loop to flow, the water pump is connected with the control unit, and the control unit is suitable for adjusting the output power of the water pump.

According to some embodiments of the present invention, the temperature control system further comprises: the water tank, be provided with the water storage chamber in the water tank, the water storage chamber with the return circuit intercommunication.

According to some embodiments of the invention, the temperature control system further comprises: a reagent cartridge stored within the refrigerated compartment; a heat sink fin configured as a heat sink end of the temperature reduction device; a fan disposed in the refrigerated compartment, the fan providing an airflow toward at least one of the reagent cartridge, the heat sink fins, and the second heat exchanger.

In another aspect of the present invention, a sequencing device is provided, the sequencing device comprising the aforementioned temperature control system. Thus, the sequencing device has all the features and advantages of the temperature control system described above, and will not be described herein again. Generally, the method has the advantages of high refrigeration efficiency, low energy consumption and low cost.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a temperature control system according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a refrigerator according to an embodiment of the present invention;

fig. 3 is a schematic view of an internal structure of a refrigerator according to an embodiment of the present invention;

fig. 4 is a control schematic of a temperature control system according to an embodiment of the present invention;

fig. 5 is a control flow chart of a temperature control system according to an embodiment of the present invention.

Reference numerals:

100: a temperature control system; 1: a reactor; 2: a carrier; 3: a heat conducting layer; 4: a thermoelectric cooler; 41: a first heat exchange surface; 42: a second heat exchange surface; 5: a temperature sensor; 6: a first heat exchanger; 7: a second heat exchanger; 8: a fan; 9: a water tank; 10: a filling port; 11: a water pump; 12: cooling equipment; 13: a pipeline; 14: a heat dissipating fin; 15: a refrigerator thermoelectric cooler; 16: a kit; 17: pagoda street.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for explaining the present invention, and should not be construed as limiting the present invention.

The working principle of the TEC refrigerating plate is as follows: the semiconductor material is doped with a large amount of N-type and P-type bismuth telluride, and when a direct current power supply passes through the two semiconductors, energy transfer can be generated, which is expressed by heat absorption at one end and heat release at the other end. Physical field process of appearance: the movement of charge carriers in the conductor forms a current which, due to the different energy levels of the charge carriers in the different materials, releases excess heat (i.e. exhibits heating) as it moves from a high level to a low level; instead, it is necessary to absorb heat from the outside (i.e., exhibit refrigeration).

With the development of detection technology, high throughput sequencing technology has been widely used in clinic, the sequencing process includes library preparation, amplification and synthesis or ligation sequencing, the temperature required in different stages is different, and a temperature control submodule is required to provide a suitable temperature. Therefore, the speed of temperature increase and decrease will directly affect the efficiency of sequencing. The TEC can refrigerate and heat, has small volume and small thermal inertia, and is widely applied to gene sequencers and PCR instruments to realize the control of reaction temperature. According to the working characteristics of the TEC refrigerating plate, the lower the temperature of the heat dissipation surface is when the TEC refrigerates, the faster the cooling rate of the temperature control surface is.

The main factors influencing the efficiency of the TEC refrigerating plate are current and heat dissipation capacity of a heat dissipation end. Under the condition of constant current, the heat dissipation mode determines the efficiency of the refrigerating fin. The TEC refrigerating sheet has larger calorific capacity per unit area, the radiator is overlarge due to the air cooling mode, and the layout of the radiator cannot be met due to the undersize of a chip clamping platform. The phase change cooling has the problems of liquid leakage, safety risk, immature technology and unsuitability for a gene sequencer. The liquid cooling system has the advantages of large cooling capacity, small heat dissipation plate, low requirement on air and the like, and the selected liquid cooling system is relatively in accordance with the structural requirement of the instrument. At present, when a liquid cooling system adjusts the temperature of a TEC, a heat exchange medium absorbs heat or cold of the surface of the TEC, which is in contact with a heat dissipation end, a radiator is in contact with air, and the heat or cold is naturally transmitted to the air, so that a relatively stable reference of the temperature is provided. However, the existing radiator is in a room temperature environment, the temperature of a heat exchange medium is higher than the room temperature, when the heat dissipation capability of the radiator is insufficient, the low temperature requirement cannot be met, the cooling efficiency is lower and lower, and finally the effect is that the actual temperature of the chip cannot reach the target temperature.

A temperature control system 100 according to an embodiment of the present invention is described below with reference to fig. 1-5.

According to some embodiments of the present invention, a temperature control system 100 is provided, referring to fig. 1, the temperature control system 100 comprising: thermoelectric cooler 4, radiator and cooling device 12, thermoelectric cooler 4 includes first heat exchange surface 41 and second heat exchange surface 42, is suitable for the heat exchange between first heat exchange surface 41 and the second heat exchange surface 42, contains the heat transfer medium in the radiator, and through heat transfer medium and second heat exchange surface 42 heat exchange, cooling device 12 is formed with the walk-in, and at least part of radiator sets up in the walk-in. Specifically, when the temperature control system 100 is used for cooling, the direct-current power supply provides a forward voltage for the thermoelectric refrigerator 4, the temperature of the first heat exchange surface 41 is lower than that of the second heat exchange surface 42, at this time, the first heat exchange surface 41 can absorb heat from the outside to perform cooling, the second heat exchange surface 42 releases heat to perform heating, that is, heat is transferred from the first heat exchange surface 41 to the second heat exchange surface 42, and the heat exchange medium in the radiator flows; when the temperature control system 100 is used for temperature rise, the dc power supply provides negative voltage for the thermoelectric refrigerator 4, the temperature of the first heat exchange surface 41 is higher than that of the second heat exchange surface 42, at this time, the first heat exchange surface 41 releases heat, heating is shown, the second heat exchange surface 42 absorbs heat from the external environment, refrigeration is shown, the heat exchange medium in the radiator does not flow, the second heat exchange surface 42 can absorb heat of the heat exchange medium, the temperature difference between the first heat exchange surface 41 and the second heat exchange surface 42 is reduced, and therefore the heating efficiency of the thermoelectric refrigerator 4 is effectively improved.

The utility model relates to a temperature control system 100, the at least part of radiator sets up in the freezer, when temperature control system 100 is used for the cooling, because the temperature of walk-in is lower, generally be 2 ℃ -8 ℃, far below the room temperature, the outer heat transfer medium temperature of cooling equipment flows to the back in the freezer, it is great with the difference in temperature of walk-in, the heat exchange efficiency of heat transfer medium in the radiator will be improved greatly, and the heat transfer medium temperature after the heat transfer is showing and is reducing, when heat transfer medium and second heat exchange surface 42 carry out the heat exchange once more, can cool down second heat exchange surface 42 fast, thereby reduce the difference in temperature between second heat exchange surface 42 and the first heat exchange surface 41, and then improve thermoelectric cooler 4's refrigeration efficiency, show and shorten the cooling time, improve work efficiency.

The type of the cooling device 12 is not limited, as long as the cooling device 12 includes a refrigerating chamber and can cool the heat transfer medium. Specifically to the present application, referring to fig. 2, the temperature reduction device 12 may be a refrigerator, which can be used to store the low-temperature reaction reagent and reduce the temperature of the heat exchange medium, so as to increase the cooling rate of the heat sink without adding other devices, thereby simplifying the temperature control system 100.

According to some embodiments of the present invention, referring to fig. 1, the temperature control system 100 further comprises a reaction device, the reaction device is arranged in the thermoelectric cooler 4, and the first heat exchange surface 41 is adapted to heat or refrigerate the reaction device. Specifically, the reaction device is disposed on the first heat exchange surface 41 of the thermoelectric cooler 4, and when the reaction in the reaction device needs heating or cooling, the reaction device can directly perform heating or cooling through the thermoelectric cooler 4. Because at least part of the radiators of the temperature control system 100 are arranged in the refrigerating chamber, especially when the reaction device needs to be cooled, the cooling rate of the reaction device can be increased, the cooling time can be shortened, and the working efficiency can be improved.

According to some embodiments of the present invention, referring to fig. 1, a heat conducting layer 3 may also be provided between the reaction device and the first heat exchanging surface 41. The rate of heat transfer between the reaction device and the first heat exchange surface 41 can be increased, further increasing the rate at which the reaction device absorbs or releases heat.

Specifically, referring to fig. 1, the reaction apparatus includes: reactor 1 and carrier 2, reactor 1 sets up in carrying carrier 2, carries and is provided with heat-conducting layer 3 on carrier 2 and supports in first heat exchange surface 41. In particular, the reaction means is arranged on the side of the heat conducting layer 3 facing away from the thermoelectric cooler 4, and the reaction means can be detachably connected with the thermoelectric cooler 4. For example, when the temperature control system 100 is used in a gene sequencer, the reactor 1 may be configured as a chip, and the carrier 2 may be configured as an aluminum plate, and the chip may be fixed to the aluminum plate first, and then the aluminum plate may be closely attached to the thermoelectric cooler 4. It should be noted that the gaps between the thermoelectric cooler 4 and the heat conducting layers 3 and the heat sink on the two sides in fig. 1 are only for illustrating the first heat exchange surface 41 and the second heat exchange surface 42.

According to some embodiments of the utility model, referring to fig. 1, in order to realize accurate accuse temperature, the temperature control unit can also include: and the temperature sensor 5 is arranged in the bearing piece 2 and used for detecting the temperature of the reactor 1 and determining the heating or cooling rate of the thermoelectric cooler 4 according to the collected temperature data.

According to some embodiments of the present invention, the temperature control unit may further comprise: and a control unit (not shown in the figure) electrically connected to the temperature sensor 5 and the thermoelectric cooler 4, respectively, and adapted to control the thermoelectric cooler 4 according to the temperature detected by the temperature sensor 5. Specifically, the control unit may control the voltage of the thermoelectric cooler 4 according to the temperature data collected by the temperature sensor 5, and further control the operating mode and the heating or cooling rate of the thermoelectric cooler 4, so as to reduce the temperature difference between the first heat exchanging surface 41 and the second heat exchanging surface 42. For example, if the actual temperature of the reactor 1 is greatly different from the target temperature of the reactor 1, the voltage input by the thermoelectric cooler 4 can be increased, and the heating or cooling power can be increased; if the difference between the actual temperature of the reactor 1 and the target temperature is small, the voltage input by the thermoelectric cooler 4 can be reduced, the heating or refrigerating power can be reduced, the power consumption can be reduced, and the cost can be saved. It should be noted that the kind of the control unit is not particularly limited, and those skilled in the art can select the control unit according to actual needs.

According to some embodiments of the utility model, referring to fig. 1 and fig. 3, in order to further improve the heat transfer effect, the radiator can also include: a first heat exchanger 6 and a second heat exchanger 7, the first heat exchanger 6 being adapted to be in contact with the second heat exchange surface 42 for direct heat exchange with the second heat exchange surface 42; the second heat exchanger 7 is arranged in the refrigerating chamber, the second heat exchanger 7 is communicated with the first heat exchanger 6 through a loop, namely a pipeline 13 is arranged between the second heat exchanger 7 and the first heat exchanger 6, a heat exchange medium flows in the pipeline 13, and the pipeline 13 comprises a first pipeline and a second pipeline. For example, the first heat exchanger 6 may be a water-cooled tank, and the second heat exchanger 7 may be a water-cooled heat exchanger. Specifically, a heat exchange medium is contained in the water cooling tank, a first through hole is formed in the refrigerator, a first pipeline penetrates through the first through hole to communicate the water cooling tank with the water cooling radiator, and the heat exchange medium in the water cooling tank can enter the water cooling radiator along the first pipeline for cooling; the refrigerator is also provided with a second through hole, the second pipeline penetrates through the second through hole to communicate the water-cooled heat exchanger with the water-cooled tank, the cooled heat exchange medium flows into the water-cooled tank from the water-cooled radiator along the second pipeline, and the first pipeline and the second pipeline are in sealing connection with the water-cooled radiator through the pagoda joint 17 to prevent the heat exchange medium from seeping out.

It should be noted that the positions of the first through hole and the second through hole are not particularly limited, and may be on the upper surface or the side surface of the refrigerator; the number of the second heat exchangers 7 is not particularly limited, and may be designed to be one or more according to the refrigeration requirement of the temperature control system 100.

According to some embodiments of the utility model, refer to fig. 3, when cooling device 12 is the refrigerator, temperature control system 100 still includes kit 16, radiating fin 14 and fan 8 and refrigerator thermoelectric cooler 15, kit 16 is stored and is used for storing low temperature reaction reagent in the freezer, radiating fin 14 constructs the heat dissipation end of cooling device 12, in order to cool down cooling device 12, fan 8 sets up in the freezer, fan 8 provides the air current towards at least one among kit 16, radiating fin 14 and the second heat exchanger 7, fan 8's specific number is unrestricted, can construct one or more, refrigerator thermoelectric cooler 15 is used for refrigerating the refrigerator. Specifically, the second heat exchanger 7 can be located between the fan 8 and the radiating fins 14, and the fan 8 can radiate heat to the second heat exchanger 7 and the refrigerating chamber at the same time, so that power consumption is reduced, and cost is reduced.

It should be noted that, when the cooling device 12 is a refrigerator, the position of the second heat exchanger 7 in the refrigerator is not particularly limited, and those skilled in the art can design the cooling device according to the internal structure of the refrigerator, so that the layout in the refrigerator is more reasonable, and the energy consumption is reduced.

According to the utility model discloses a some embodiments, temperature control system 100 still includes water pump 11, and water pump 11 sets up in the return circuit and is suitable for the heat transfer medium flow in the drive circuit, and water pump 11 is connected with the control unit, and the control unit is suitable for the output who adjusts water pump 11. Specifically, the water pump 11 may be disposed in the second pipe between the water-cooled radiator and the water-cooled tank. Referring to fig. 4 and 5, when the temperature control system 100 includes the water pump 11, the specific temperature adjustment process is: firstly, setting a target temperature of a reaction device, and simultaneously, measuring an actual temperature of the reaction device by a temperature sensor 5; according to the difference value between the target temperature and the actual temperature, the control unit controls the voltage anode, the voltage cathode and the voltage magnitude of the thermoelectric cooler 4; and controlling the start-stop and power regulation of the water pump 11 according to the state of the thermoelectric cooler 4: when the temperature control system 100 is used for refrigerating the reaction device, the water pump 11 is started, the heat exchange medium flows along a loop between the water cooling tank and the second heat exchanger 7, the heat exchange medium absorbs heat in the water cooling tank and flows into the water cooling radiator, and the heat exchange medium flows into the water cooling tank again through the cooling of the refrigerating chamber of the refrigerator so as to realize the rapid cooling of the thermoelectric cooler 4, when the difference between the actual temperature of the reactor 1 and the target temperature of the reactor 1 is larger, the control unit can not only increase the input voltage of the thermoelectric cooler 4, but also increase the output power of the water pump 11, so that the flow of the heat exchange medium in the loop is increased, and the cooling speed of the radiator on the second heat exchange surface 42 is increased; when the temperature control system 100 is used for heating the reaction device, the water pump 11 is turned off, and the thermoelectric cooler 4 heats the reaction device.

In general, the temperature control system 100 of the present application has three main operating conditions, and the following describes the working process under different operating conditions in detail:

when the reactor 1 needs to be cooled down, the direct current power supply provides a positive voltage, which is expressed in that the first exchanging surface 41 of the thermoelectric cooler 4 absorbs the energy of the heat conducting layer 3 to cool down the reactor 1. The second heat exchange surface 42 emits heat, the heat is transferred to the water cooling tank, the water pump 11 is operated to force the heat exchange medium to be brought into the water cooling tank, the heat of the water cooling tank is brought into the water cooling radiator, the water cooling radiator is arranged inside the refrigerator at the moment, the fan 8 inside the refrigerator blows cold air to the water cooling radiator so as to cool the heat exchange medium inside the water cooling radiator, therefore, the temperature of the heat exchange medium can be reduced to be lower than the room temperature, the cold heat exchange medium enters the water cooling tank again, the heat dissipation effect of the second heat exchange surface 42 is enhanced, the temperature of the second heat exchange surface 42 can be reduced to be lower, and the refrigeration efficiency of the thermoelectric refrigerator 4 is effectively improved.

When the reactor 1 needs to be heated up, the direct current power supply provides reverse voltage, which shows that the first coke-exchanging surface 41 of the thermoelectric cooler 4 releases heat to heat up the reactor 1; the second heat exchange surface 42 absorbs heat of the water cooling tank, and the water pump 11 does not operate. Thereby reducing the temperature difference between the first heat exchange surface 41 and the second heat exchange surface 42 and improving the heating efficiency.

When the reactor 1 needs to be thermostatted: it is a balanced process under this state, does not have the special requirement to the speed of going up the cooling, but thermoelectric cooler 4 can produce joule heat and then influence the temperature balance at balanced process, so need water pump 11 to take away the heat, through the power of control water pump 11, makes the lasting effectual second heat exchange surface 42 of heat transfer medium dispel the heat.

According to some embodiments of the present invention, the temperature control system 100 may further include a human-machine interface, which may monitor the operation state of the temperature control system 100 in real time.

According to some embodiments of the utility model, referring to fig. 1, for the convenience to supply heat transfer medium to temperature control system 100, temperature control system 100 can also include water tank 9, is provided with the water storage chamber in the water tank 9, and the water storage chamber communicates with the return circuit. When the content of the heat exchange medium in the loop is reduced, the heat exchange medium can be directly supplemented through the water tank 9. The water tank 9 is further provided with a filling port 10 adapted to supplement the heat exchange medium to the water tank 9.

The utility model also provides a sequencing device, including aforementioned temperature control system 100. Thus, the sequencing device has all the features and advantages of the temperature control system 100 described above, and thus, the description thereof is omitted. Generally, the method has the advantages of high refrigeration efficiency, low energy consumption and low cost.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A temperature control system, comprising:

a thermoelectric cooler comprising first and second heat exchange surfaces adapted for heat exchange therebetween;

a heat sink in heat exchange with the second heat exchange surface;

the cooling device, the cooling device is formed with the walk-in, at least part of radiator set up in the walk-in.

2. The temperature control system of claim 1, further comprising:

the reaction device is arranged on the thermoelectric cooler, and the first heat exchange surface is suitable for heating or refrigerating the reaction device.

3. The temperature control system of claim 2, wherein a thermally conductive layer is disposed between the reaction device and the first heat exchange surface.

4. The temperature control system of claim 3, wherein the reaction device comprises:

a reactor;

and the bearing part is arranged on the reactor, and the bearing part is provided with the heat conduction layer and supports the first heat exchange surface.

5. The temperature control system of claim 4, further comprising: a temperature sensor disposed within the carrier and configured to detect a temperature of the reactor.

6. The temperature control system of claim 5, further comprising: and the control unit is respectively electrically connected with the temperature sensor and the thermoelectric cooler and is suitable for controlling the temperature difference between the first heat exchange surface and the second heat exchange surface according to the temperature detected by the temperature sensor.

7. The temperature control system of claim 6, wherein the heat sink comprises:

a first heat exchanger adapted to be in contact with the second heat exchange surface;

the second heat exchanger is arranged in the refrigerating chamber, the second heat exchanger is communicated with the first heat exchanger through a loop, and a heat exchange medium flows between the first heat exchanger and the second heat exchanger.

8. The temperature control system of claim 7, further comprising: the water pump is arranged in the loop and is suitable for driving the heat exchange medium in the loop to flow, the water pump is connected with the control unit, and the control unit is suitable for adjusting the output power of the water pump.

9. The temperature control system of claim 8, further comprising: the water tank is internally provided with a water storage cavity, and the water storage cavity is communicated with the loop;

optionally, the temperature control system further comprises:

a reagent cartridge stored within the refrigerated compartment;

a heat sink fin configured as a heat sink end of the temperature reduction device;

a fan disposed in the fresh food compartment, the fan providing an airflow toward at least one of the reagent cartridge, the heat sink fin, and the second heat exchanger.

10. A sequencing device comprising the temperature control system of any one of claims 1 to 9.

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