CN217763721U - Heat exchange system and air conditioner - Google Patents
Heat exchange system and air conditioner Download PDFInfo
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- CN217763721U CN217763721U CN202221589087.7U CN202221589087U CN217763721U CN 217763721 U CN217763721 U CN 217763721U CN 202221589087 U CN202221589087 U CN 202221589087U CN 217763721 U CN217763721 U CN 217763721U
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- 239000004065 semiconductor Substances 0.000 claims abstract description 106
- 230000007246 mechanism Effects 0.000 claims abstract description 82
- 239000003507 refrigerant Substances 0.000 claims abstract description 10
- 238000005057 refrigeration Methods 0.000 claims description 71
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 63
- 230000017525 heat dissipation Effects 0.000 claims description 26
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 238000004378 air conditioning Methods 0.000 abstract description 22
- 230000002035 prolonged effect Effects 0.000 abstract description 10
- 238000005265 energy consumption Methods 0.000 abstract description 8
- 238000010438 heat treatment Methods 0.000 description 23
- 238000000034 method Methods 0.000 description 16
- 238000001816 cooling Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 230000005679 Peltier effect Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010981 drying operation Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
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Abstract
The utility model discloses a heat transfer system and air conditioner relates to the air conditioner field, in a period after having solved the cavity switching machine in the prior art, the indoor set of air conditioning can't blow off cold wind or hot-blast problem. The utility model discloses a heat transfer system, including first heat transfer mechanism and second heat transfer mechanism, first heat transfer mechanism is refrigerant heat transfer mechanism, and first heat transfer mechanism is used for carrying out a heat transfer to the air, and second heat transfer mechanism is semiconductor heat transfer mechanism, and second heat transfer mechanism is used for carrying out the secondary heat transfer to the at least partial air after carrying out a heat transfer. The heat exchange system of the utility model combines the first heat exchange mechanism and the second heat exchange mechanism, so that the first gust felt after the indoor unit of the air conditioner is started is cold air or hot air, and the use body feeling of users is improved; on the other hand, the time for the compressor to maintain strong load operation in the first heat exchange mechanism can be reduced, the energy consumption is reduced, the service life of the compressor can be prolonged, and the service cycle of the air conditioner is prolonged.
Description
Technical Field
The utility model relates to an air conditioning technology field especially relates to a heat transfer system and air conditioner.
Background
In the prior art, an air-conditioning heat exchange system comprises a compressor, a condenser, a liquid storage dryer, an expansion valve, an evaporator, a blower and the like, and all the components are connected into a closed system by adopting a copper pipe (or an aluminum pipe) and a high-pressure rubber pipe. The compressor is driven by the motor to start working, and drives the refrigerant to circularly flow in the sealed air-conditioning system so as to realize refrigeration or heating.
However, the applicant finds that the existing air conditioner heat exchange system has at least the following defects: (1) After the air conditioner is started, the compressor and the fan act firstly, the compressor needs to circulate the refrigerant in the whole air conditioner pipeline system, after the refrigerant circulates, the air blown out by the indoor unit through the evaporator is the real cold air or hot air, and the compressor needs a certain time for the refrigerant to circulate, so that the indoor unit of the air conditioner cannot blow out the cold air or the hot air within a period of time after the air conditioner is started; (2) When rapid cooling or heating is desired to be achieved in a short time, the compressor needs to be maintained in a strong load state, which affects the service life of the compressor.
The prior art discloses a Peltier effect environment-friendly air conditioner which comprises an indoor host system, a heat dissipation system and a hot water supply system, wherein low temperature generated by a semiconductor refrigerating sheet set of the indoor host system is blown out by a cooling fan, namely cold air generated by the refrigerating air conditioner can cool the indoor space, high temperature generated by the semiconductor refrigerating sheet set of a refrigerating device is conducted to a hot end water tank, and hot water in the hot end water tank is conveyed to the heat dissipation system through a pipeline; or the hot water in the hot end water tank is conveyed to a hot water supply system through a pipeline, and the hot water can be supplied to people for living. Although the environment-friendly air conditioner with the Peltier effect can realize refrigeration without using a compressor and a refrigerant, the refrigeration effect of the environment-friendly air conditioner is still to be improved, and the use experience effect is not good.
SUMMERY OF THE UTILITY MODEL
The utility model discloses an one of them purpose is to provide a heat transfer system, has solved in a period after the prior art air conditioner is started, and the indoor set of air conditioning can't blow off cold wind or hot-blast technical problem. The technical effects that the preferred technical scheme of the utility model can produce are explained in detail in the following.
In order to achieve the above purpose, the utility model provides a following technical scheme:
the utility model discloses a heat transfer system, including first heat transfer mechanism and second heat transfer mechanism, wherein, first heat transfer mechanism is refrigerant heat transfer mechanism, and first heat transfer mechanism is used for carrying out a heat transfer to the air, second heat transfer mechanism is semiconductor heat transfer mechanism, and second heat transfer mechanism is used for carrying out the secondary heat transfer to the at least partial air that carries out after the heat transfer once.
According to a preferred embodiment, the second heat exchange mechanism comprises a semiconductor refrigeration piece and a power supply, the semiconductor refrigeration piece is electrically connected with the power supply, and the power supply is used for supplying power to the semiconductor refrigeration piece.
According to a preferred embodiment, the second heat exchange mechanism further comprises an air duct, the semiconductor refrigeration piece is fixed in the air duct, and the air duct is divided into a cold air duct and a hot air duct by the semiconductor refrigeration piece.
According to a preferred embodiment, the second heat exchange mechanism further comprises a cold air cavity and a hot air cavity, the cold air cavity is communicated with the cold air duct, and the hot air cavity is communicated with the hot air duct.
According to a preferred embodiment, the second heat exchange mechanism further comprises a first fan and a second fan, wherein the first fan is disposed at a joint of the cold air cavity and the cold air duct, and the second fan is disposed at a joint of the hot air cavity and the hot air duct.
According to a preferred embodiment, the air duct is of an arc-shaped structure, the cold air cavity and the hot air cavity are arranged at two ends of the air duct, and the semiconductor refrigeration piece is arranged in the middle of the air duct.
According to a preferred embodiment, the air duct is provided with a first air hole, and the first air hole is used for air circulation.
According to a preferred embodiment, a second air hole is arranged on one of the cold air cavity and the hot air cavity, and the second air hole is used for air circulation; the other one of the cold air cavity and the hot air cavity is of a closed structure.
According to a preferred embodiment, the hot air chamber is located above a water pan of the air conditioner.
According to a preferred embodiment, the heat end face of the semiconductor refrigeration piece is provided with a heat dissipation assembly, and the heat dissipation assembly is used for dissipating heat generated by the heat end face of the semiconductor refrigeration piece.
According to a preferred embodiment, the heat dissipation assembly comprises a heat dissipation paste layer and/or a heat dissipation aluminum block, wherein the heat dissipation paste layer is coated on the hot end surface of the semiconductor refrigeration sheet, and the thickness of the heat dissipation paste layer is 0.1-0.5 mm; the heat dissipation aluminum block is fixed on the hot end face of the semiconductor refrigerating sheet.
The utility model provides a heat transfer system has following beneficial technological effect at least:
the utility model discloses a heat transfer system is through combining together first heat transfer mechanism and second heat transfer mechanism for at least partial air can carry out dual heat transfer, thereby can realize quick refrigeration or heat fast, makes air conditioning system can the fastest speed reach the settlement temperature and carry out long-time maintenance, realizes the rationalization application of energy. Therefore, the heat exchange system of the utility model can make the first gust of wind sensed by the air-conditioning indoor unit after the air-conditioning indoor unit is started up be cold wind or hot wind, thereby improving the user feeling, and solving the technical problem that the air-conditioning indoor unit can not blow out cold wind or hot wind in a period of time after the air-conditioning indoor unit is started up in the prior art; on the other hand, through combining together first heat transfer mechanism and second heat transfer mechanism, still can reduce the time that the compressor maintained the heavy load operation in first heat transfer mechanism, reduce the energy consumption, still can increase the life of compressor, the life of extension air conditioner has solved the air conditioner among the prior art and hopes to realize quick refrigeration or heating in the short time, needs the compressor to maintain and operate under the heavy load state, influences the problem of the life of compressor.
A second object of the present invention is to provide an air conditioner.
The utility model discloses an air conditioner, including casing and heat transfer system, wherein, heat transfer system does the utility model discloses well arbitrary technical scheme heat transfer system, heat transfer system set up in the casing, still be provided with the air outlet on the casing, with heat transfer system carries out the air after heat transfer and the secondary heat transfer and all follows the air outlet blows out.
According to a preferred embodiment, a water receiving tray is further arranged in the machine shell, the water receiving tray is located below a hot air cavity of the heat exchange system, and the water receiving tray is of a structure which inclines downwards towards the direction of an inlet of the hot air cavity.
According to a preferred embodiment, a humidity sensor is arranged in the water receiving tray, the humidity sensor is located at one end, close to the inlet of the hot air cavity, in the water receiving tray, and the humidity sensor is used for detecting the humidity in the water receiving tray.
The utility model provides an air conditioner has following beneficial technological effect at least:
the utility model discloses an air conditioner has the utility model discloses in any one of technical scheme's heat transfer system, can realize quick refrigeration or heat fast for air conditioning system can the fastest speed reach the settlement temperature and carry out long-time maintenance, realizes the rationalization application of energy. Therefore, the air conditioner of the utility model can make the first gust sensed by the air conditioner indoor unit after the air conditioner indoor unit is started up be cold air or hot air, thus improving the user feeling, and solving the technical problem that the air conditioner indoor unit can not blow out cold air or hot air in a period of time after the air conditioner is started up in the prior art; on the other hand, through combining together first heat transfer mechanism and second heat transfer mechanism, still can reduce the time that the compressor maintained the heavy load operation in first heat transfer mechanism, reduce the energy consumption, still can increase the life of compressor, the life of extension air conditioner has solved the air conditioner among the prior art and hopes to realize quick refrigeration or heating in the short time, needs the compressor to maintain and operate under the heavy load state, influences the problem of the life of compressor.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a first partial schematic view of a preferred embodiment of the air conditioner of the present invention;
FIG. 2 is a second partial schematic view of a preferred embodiment of the air conditioner of the present invention;
FIG. 3 is a schematic diagram of a preferred embodiment of a second heat exchange mechanism of the present invention;
fig. 4 is a schematic diagram of the semiconductor refrigerating sheet of the present invention connected to a power supply;
fig. 5 is a schematic diagram of a preferred embodiment of the control method of the air conditioner of the present invention;
fig. 6 is a schematic diagram of the control method of the air conditioner in the instant fast heat exchange mode.
In the figure: 101. a semiconductor refrigeration sheet; 102. a power source; 103. an air duct; 1031. a first air vent; 104. a cold air chamber; 1041. a second air hole; 105. a hot air cavity; 106. a first fan; 107. a second fan; 20. a housing; 201. an air outlet; 202. a water pan.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The heat exchange system, the air conditioner and the control method of the present invention will be described in detail with reference to the accompanying drawings 1 to 6 and embodiments 1 to 3 of the specification.
Example 1
This embodiment is right the utility model discloses a heat transfer system carries out the detailed description.
The heat exchange system of this embodiment includes first heat exchange mechanism and second heat exchange mechanism. Preferably, the first heat exchange mechanism is a refrigerant heat exchange mechanism, and the first heat exchange mechanism is used for carrying out primary heat exchange on air. Preferably, the second heat exchange mechanism is a semiconductor heat exchange mechanism, and the second heat exchange mechanism is used for performing secondary heat exchange on at least part of air subjected to primary heat exchange. The first heat exchange mechanism is a heat exchange mechanism commonly used by the existing air conditioning system, and specifically comprises a compressor, a condenser, a liquid storage dryer, an expansion valve, an evaporator, a blower and the like, wherein a refrigerant is driven by the compressor to circularly flow in each part so as to realize refrigeration or heating. The structure and the working principle of the first heat exchange mechanism are not detailed here. More preferably, part of the air after heat exchange by the first heat exchange mechanism is blown out from an air outlet of the air conditioner; the rest air can enter the second heat exchange mechanism, secondary heat exchange is carried out on the second heat exchange mechanism, the air becomes cold air with lower temperature (the air conditioner is in a refrigeration mode) or hot air with higher temperature (the air conditioner is in a heating mode), and the air after the secondary heat exchange is blown out from an air outlet of the air conditioner, so that the air felt by a user is mixed air of primary heat exchange and secondary heat exchange, quick refrigeration or quick heating can be realized, the air conditioning system can reach the set temperature at the fastest speed and maintain for a long time, and the use experience of the user can be improved.
The heat exchange system of this embodiment combines together through with first heat transfer mechanism and second heat transfer mechanism for at least part air can carry out dual heat transfer, thereby can realize quick refrigeration or heat fast, makes air conditioning system can the fastest speed reach the settlement temperature and carry out long-time maintenance, realizes the rationalization application of energy. Therefore, the heat exchange system of the embodiment can enable the first gust of wind sensed by the air-conditioning indoor unit after the air-conditioning indoor unit is started to be cold wind or hot wind, improve the user feeling, and solve the technical problem that the air-conditioning indoor unit cannot blow out the cold wind or the hot wind within a period of time after the air-conditioning indoor unit is started in the prior art; on the other hand, through combining together first heat transfer mechanism and second heat transfer mechanism, still can reduce the time that the compressor maintained the heavy load operation in first heat transfer mechanism, reduce the energy consumption, still can increase the life of compressor, the life of extension air conditioner has solved the air conditioner among the prior art and hopes to realize quick refrigeration or heating in the short time, needs the compressor to maintain and operate under the heavy load state, influences the problem of the life of compressor.
According to a preferred embodiment, the second heat exchanging mechanism comprises a semiconductor chilling plate 101 and a power supply 102, the semiconductor chilling plate 101 is electrically connected with the power supply 102, and the power supply 102 is used for supplying power to the semiconductor chilling plate 101, as shown in fig. 4. Preferably, the semiconductor cooling plate 101 is also called a thermoelectric cooling plate, and is a heat pump, and generates heat and cold by using peltier effect of semiconductor materials. More preferably, one surface of the semiconductor cooling plate 101 is an N-type semiconductor and the other surface is a P-type semiconductor. The material of the semiconductor may be of the type known in the art and is not limited thereto. Specifically, when the power source 102 supplies power to the semiconductor refrigeration chip 101 and direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, so that the purposes of refrigeration and heating can be achieved. It can be understood that when direct current is applied to the semiconductor chilling plate 101, the semiconductor chilling plate 101 can produce both cooling and heating. More specifically, by changing the direction of the current, the semiconductor cooling sheet 101 can be heated while being cooled before, and can be cooled while being heated before. According to the heat exchange system adopting the technical scheme, the second heat exchange mechanism comprises the semiconductor chilling plates 101 and the power supply 102, the power supply 102 is used for supplying power to the semiconductor chilling plates 101, the semiconductor chilling plates 101 can be refrigerated and heated at the same time, and therefore the first heat exchange mechanism can be assisted to refrigerate or heat so as to realize quick refrigeration or quick heating, the air conditioning system can reach the set temperature at the fastest speed and maintain for a long time, and reasonable application of energy is achieved.
According to a preferred embodiment, the second heat exchange mechanism further comprises an air duct 103, the semiconductor chilling plates 101 are fixed in the air duct 103, and the air duct 103 is divided into a cold air duct and a hot air duct by the semiconductor chilling plates 101, as shown in fig. 2 and 3. Preferably, the air duct 103 is provided with a first air hole 1031, and the first air hole 1031 is used for air circulation, as shown in fig. 3. The first wind hole 1031 may have various shapes, such as a circle, a square, a triangle, etc.; the number of the first wind holes 1031 may be determined based on the size of the wind tunnel 103 and the hole diameter of the first wind holes 1031. In the heat exchange system according to the preferred technical solution of this embodiment, the second heat exchange mechanism further includes an air duct 103, the air duct 103 not only can be used for fixing the semiconductor chilling plate 101, but also can be used for circulating cold air and hot air generated by the semiconductor chilling plate 101, and specifically, the arrow direction in fig. 2 shows the flow direction of the cold air and the hot air generated by the semiconductor chilling plate 101. Further, the air duct 103 is provided with a first air hole 1031, and the cold air and the hot air generated by the semiconductor chilling plate 101 can exchange heat with the rest air through the action of the first air hole 1031.
According to a preferred embodiment, the second heat exchanging mechanism further comprises a cold air chamber 104 and a hot air chamber 105, and the cold air chamber 104 is communicated with the cold air duct, and the hot air chamber 105 is communicated with the hot air duct, as shown in fig. 2 and 3. Preferably, one of the cold air chamber 104 and the hot air chamber 105 is provided with a second air hole 1041, and the second air hole 1041 is used for air circulation; the other of the cold air chamber 104 and the hot air chamber 105 is a closed structure, as shown in fig. 2 and 3. More preferably, when the heat exchange system is a refrigeration system, the cold air chamber 104 is provided with a second air hole 1041, and the hot air chamber 105 is of a closed structure; when the heat exchange system is a heating system, the hot air cavity 105 is provided with a second air hole 1041, and the cold air cavity 104 is of a closed structure. The heat exchange system of the preferred technical scheme of this embodiment, second heat exchange mechanism still includes cold wind chamber 104 and hot-blast chamber 105, cold wind chamber 104 and cold wind channel intercommunication, hot-blast chamber 105 and hot wind channel intercommunication, thereby can make during the cold wind that semiconductor refrigeration piece 101 produced gets into cold wind chamber 104, during the hot-blast chamber 105 that gets into of semiconductor refrigeration piece 101 production, so that the air after the heat transfer of first heat exchange mechanism carries out the secondary heat transfer at cold wind chamber 104 or hot-blast chamber 105, thereby realize quick refrigeration or heat fast.
According to a preferred embodiment, the second heat exchanging mechanism further includes a first fan 106 and a second fan 107, wherein the first fan 106 is disposed at a connection position of the cold air cavity 104 and the cold air duct, and the second fan 107 is disposed at a connection position of the hot air cavity 105 and the hot air duct, as shown in fig. 2 and 3. Preferably, the first fan 106 and the second fan 107 are conventional low-power fans. In the heat exchange system of the preferred technical scheme of this embodiment, the second heat exchange mechanism further includes the first fan 106 and the second fan 107, and the speed of the cold air and the hot air generated on the two sides of the semiconductor chilling plate 101 entering the cold air cavity 104 and the hot air cavity 105 can be increased by the action of the first fan 106 and the second fan 107.
According to a preferred embodiment, the air duct 103 is an arc-shaped structure, the cold air chamber 104 and the hot air chamber 105 are disposed at both ends of the air duct 103, and the semiconductor chilling plates 101 are disposed at the middle portion of the air duct 103, as shown in fig. 3. The heat exchange mechanism of the preferred technical scheme of this embodiment, semiconductor refrigeration piece 101 sets up in the middle part in wind channel 103, cold wind chamber 104 and hot-blast chamber 105 set up in the both ends in wind channel 103, first fan 106 sets up in the junction in cold wind chamber 104 and cold wind channel, second fan 107 sets up in the junction in hot wind chamber 105 and hot-blast channel, thereby can make the distance between first fan 106 and second fan 107 and semiconductor refrigeration piece 101 as little as possible, so that the transmission of energy, make the cold wind that semiconductor refrigeration piece 101 two-sided produced and hot-blast entering cold wind chamber 104 and hot-blast chamber 105's efficiency the highest.
According to a preferred embodiment, the hot blast chamber 105 is located above the water pan 202 of the air conditioner, as shown in fig. 2. Preferably, when the heat exchange system is a refrigeration system, the hot air cavity 105 penetrates out of the unit and is in the same path with a drain pipe of the air conditioner, so that heat in the hot air cavity 105 can be discharged to the outside. Preferably, the cold air chamber 104 is disposed near an electrical box of the air conditioner, and the heat generating component of the electrical box can be cooled by cold air in the cold air chamber 104. According to the heat exchange mechanism in the preferred technical scheme of the embodiment, the hot air cavity 105 is positioned above the water pan 202 of the air conditioner, accumulated water in the water pan 202 can be dried through heat in the hot air cavity 105, and filth blockage caused by long-time accumulated water in the water pan 202 is prevented; the cold air cavity 104 is arranged near an electrical box of the air conditioner, and the heating piece of the electrical box can be cooled through cold air in the cold air cavity 104, so that the reliability of the electrical box can be improved. In the heat exchange system in the preferred technical scheme of this embodiment, the cold air chamber 104 and the hot air chamber 105 are disposed at corresponding positions, so that the cold energy and the heat energy generated by the semiconductor chilling plates 101 can be used for multiple purposes.
According to a preferred embodiment, the hot end face of the semiconductor chilling plate 101 is provided with a heat dissipation assembly, and the heat dissipation assembly is used for dissipating heat generated by the hot end face of the semiconductor chilling plate 101. Preferably, the heat dissipation assembly comprises a heat dissipation paste layer and/or a heat dissipation aluminum block, wherein the heat dissipation paste layer is coated on the hot end surface of the semiconductor refrigeration sheet 101, and the thickness of the heat dissipation paste layer is 0.1-0.5 mm; the heat dissipation aluminum block is fixed on the hot end face of the semiconductor chilling plate 101. More preferably, the thickness of the thermal paste layer is 0.2mm. According to the heat exchange system in the preferred technical scheme of the embodiment, when the heat exchange system is used for refrigeration, the heat radiating assembly is arranged on the hot end face of the semiconductor refrigeration piece 101, and heat generated by the hot end face of the semiconductor refrigeration piece 101 can be better radiated through the heat radiating assembly, so that the refrigeration effect of the cold end face of the semiconductor refrigeration piece 101 is enhanced, and the refrigeration effect of the heat exchange system can be improved; correspondingly, when the heat exchange system is used for heating, the cooling capacity generated by the cold end face of the semiconductor chilling plate 101 can be better dissipated through the heat dissipation assembly, so that the heating effect of the hot end face of the semiconductor chilling plate 101 can be enhanced, and the heating effect of the heat exchange system can be improved.
Example 2
This embodiment will explain the air conditioner of the present invention in detail.
The air conditioner of the present embodiment includes a cabinet 20 and a heat exchange system, as shown in fig. 1 and 2. Preferably, the heat exchange system is the heat exchange system according to any one of the technical solutions in embodiment 1, the heat exchange system is disposed in the casing 20, the casing 20 is further provided with an air outlet 201, and air after primary heat exchange and secondary heat exchange with the heat exchange system is blown out from the air outlet 201, as shown in fig. 1 and 2. The rest of the structure of the air conditioner can be the same as the prior art, and the description is omitted.
The air conditioner of this embodiment, have the heat exchange system of any one of embodiment 1 technical scheme, can realize quick refrigeration or quick heating for air conditioning system can reach the settlement temperature and maintain for a long time the fastest, realizes the rationalization of energy and uses. Therefore, the air conditioner of the embodiment can enable the first gust of wind sensed by the air conditioner indoor unit after the air conditioner indoor unit is started to be cold wind or hot wind, so that the user feeling is improved, and the technical problem that the air conditioner indoor unit cannot blow out the cold wind or the hot wind within a period of time after the air conditioner is started in the prior art is solved; in addition, by combining the first heat exchange mechanism and the second heat exchange mechanism, the time for maintaining the strong load operation of the compressor in the first heat exchange mechanism can be reduced, the energy consumption is reduced, the service life of the compressor can be prolonged, the service cycle of the air conditioner is prolonged, and the problem that when the air conditioner in the prior art hopes to realize quick refrigeration or heating in a short time, the compressor needs to be maintained to operate in a strong load state, and the service life of the compressor is influenced is solved.
According to a preferred embodiment, a water receiving tray 202 is further disposed in the cabinet 20, and the water receiving tray 202 is located below the hot air chamber 105 of the heat exchange system, as shown in fig. 2. Preferably, the water receiving tray 202 is inclined downward toward the inlet of the hot air chamber 105. In the air conditioner adopting the preferred technical scheme in the embodiment, the water receiving tray 202 is located below the hot air cavity 105 of the heat exchange system, so that accumulated water in the water receiving tray 202 can be dried by heat in the hot air cavity 105, and filth blockage caused by long-time accumulated water in the water receiving tray 202 is prevented; furthermore, the water receiving tray 202 is inclined downwards towards the inlet of the hot air cavity 105, so that water in the water receiving tray 202 can flow towards one end close to the inlet of the hot air cavity 105, and the drying effect of the hot air cavity 105 on accumulated water in the water receiving tray 202 can be enhanced.
According to a preferred embodiment, a humidity sensor is arranged in the water receiving tray 202 and is positioned at one end of the water receiving tray 202 close to the inlet of the hot air cavity 105, and the humidity sensor is used for detecting the humidity in the water receiving tray 202. The air conditioner of the preferred technical scheme of this embodiment is provided with humidity transducer in water collector 202, through the humidity transducer detectable water collector 202 in humidity, the air conditioner can be based on humidity transducer's testing result and confirm whether need carry out drying process to water collector 202.
Example 3
This embodiment will explain the control method of the air conditioner of the present invention in detail.
Fig. 5 is a flowchart illustrating a control method of an air conditioner. As shown in fig. 5, the method for controlling an air conditioner according to any one of embodiments 2 includes the steps of:
and acquiring the running mode of the air conditioner.
The duty ratio of the power obtained by the semiconductor refrigeration sheet 101, the frequency of the compressor and/or the rotating speed of the fan of the indoor unit are adjusted based on the operation mode of the air conditioner, and the ambient temperature is kept at the target temperature set by a user.
The control method of the air conditioner comprises the steps of obtaining the operation mode of the air conditioner; and adjusting the power-on duty ratio of the semiconductor refrigeration sheet, the frequency of the compressor and/or the rotating speed of a fan of the indoor unit based on the operation mode of the air conditioner, and keeping the ambient temperature at the target temperature set by a user, so that quick refrigeration or quick heating can be realized, an air conditioning system can reach the set temperature at the highest speed and maintain the temperature for a long time, and reasonable application of energy is realized. Therefore, the control method of the air conditioner in the embodiment can enable the first gust of wind sensed by the air conditioner indoor unit after the air conditioner indoor unit is started to be cold wind or hot wind, improve the user feeling, and solve the technical problem that the air conditioner indoor unit cannot blow out the cold wind or the hot wind within a period of time after the air conditioner is started in the prior art; on the other hand, the time for the compressor to maintain the strong load operation in the first heat exchange mechanism can be reduced, the energy consumption is reduced, the service life of the compressor can be prolonged, the service cycle of the air conditioner is prolonged, and the problem that the service life of the compressor is influenced because the compressor needs to be maintained to operate in a strong load state when the air conditioner in the prior art hopes to realize quick refrigeration or heating in a short time is solved.
According to a preferred embodiment, the operation mode of the air conditioner includes an instantaneous rapid heat exchange mode. The instant fast heat exchange mode is suitable for the instant starting of the air conditioner. As shown in fig. 6, when the air conditioner is in the instantaneous rapid heat exchange mode, the compressor is turned on, the semiconductor cooling fins 101, the first fan 106 and the second fan are all turned on, and after about 2 seconds, the blower of the indoor unit is turned on. Preferably, when the air conditioner is in the instant rapid heat exchange mode, the method comprises the following steps: obtaining ambient temperature T 1 Temperature T at the air outlet 201 2 And a target temperature T set by a user 3 . In particular, the ambient temperature T 1 And the temperature T at the outlet 201 2 The target temperature T set by the user can be obtained by a temperature sensor 3 The setting for the user is obtained through the input module. Calculating a target temperature T set by a user 3 And ambient temperature T 1 Difference value Δ T of 1 Calculating the temperature T at the tuyere 201 2 And ambient temperature T 1 Difference value Δ T of 2 . Specifically, Δ T 1 ＝T 3 －T 1 ，ΔT 2 ＝T 2 －T 1 . Target temperature T set by user 3 And ambient temperature T 1 Difference value Δ T of 1 And/or the temperature T at the outlet 201 2 And ambient temperature T 1 Difference value Δ T of 2 The duty ratio of the power obtained by the semiconductor refrigeration sheet 101, the frequency of the compressor and the rotating speed of the fan of the indoor unit are adjusted, and the environment temperature is kept at the target temperature set by the user.
According to a preferred embodiment, the instant rapid heat exchange mode includes an instant rapid cooling mode and an instant rapid heating mode. When the air conditioner is in the instant fast cooling mode, and when the delta T is 1 At a temperature of not more than-5 deg.C orΔT 2 When the temperature is more than or equal to 5 ℃, the duty ratio of the power on of the semiconductor refrigerating sheet 101 is adjusted to 100%, the compressor is adjusted to operate at the maximum frequency, and the fan of the indoor unit is adjusted to operate at the highest wind gear; when the temperature is more than 5 ℃ and less than delta T 1 < 0 ℃ or < 0 ℃ DeltaT 2 When the temperature is lower than 5 ℃, the duty ratio of the power on the semiconductor refrigerating sheet 101 is adjusted towards the reduction direction, the compressor is adjusted to operate under 80% of the maximum frequency, and the fan of the indoor unit is adjusted to operate at the highest wind gear; when Δ T 1 Not less than 0 ℃ or Delta T 2 When the temperature is less than or equal to 0 ℃, the duty ratio of the power on of the semiconductor refrigeration sheet 101 is reduced to 0, the first fan 106 and the second fan 107 are powered off, the compressor is adjusted to run under the condition of 60% of the maximum frequency, and the indoor unit fan is adjusted to run at a medium wind gear. It is known that the control method of the instantaneous fast heating mode can be obtained based on the control method similar to the instantaneous fast cooling mode.
The control method of the air conditioner in the preferred technical scheme of the embodiment is based on the target temperature T set by the user 3 And ambient temperature T 1 Difference value Δ T of 1 And/or the temperature T at the outlet 201 2 And ambient temperature T 1 Difference value Δ T of 2 The duty ratio of the power obtained by the semiconductor refrigeration sheet 101, the frequency of the compressor and the rotating speed of the fan of the indoor unit are adjusted, the ambient temperature is kept at the target temperature set by a user, the air conditioner can realize quick refrigeration or quick heating, the air conditioning system can reach the set temperature at the highest speed and maintain for a long time, and reasonable application of energy is realized. Specifically, when Δ T 1 Not less than-5 ℃ or delta T 2 Not less than 5 deg.C, i.e. the target temperature T set by the user 3 Specific ambient temperature T 1 A temperature T of 5 ℃ or more or at the air outlet 201 2 Specific ambient temperature T 1 When the temperature is 5 ℃ or higher, the duty ratio of the power on the semiconductor refrigerating sheet 101 is adjusted to 100%, the compressor is adjusted to operate at the maximum frequency, and the fan of the indoor unit is adjusted to operate at the highest wind level, so that the first heat exchange mechanism and the second heat exchange mechanism of the air conditioner operate under the condition of full load, and the air conditioner can realize quick refrigeration. When the temperature is more than 5 ℃ and less than delta T 1 < 0 ℃ or < 0 ℃ DeltaT 2 The duty ratio of the power on the semiconductor refrigerating sheet 101 is less than 5 DEG CThe direction of the reduction is adjusted, the compressor is adjusted to operate under 80% of the maximum frequency, the fan of the indoor unit is adjusted to operate at the highest wind level, the air conditioner refrigerates through the first heat exchange mechanism, the second heat exchange mechanism assists in refrigerating, the time for the compressor to maintain strong load operation in the first heat exchange mechanism can be reduced, the energy consumption is reduced, the service life of the compressor can be prolonged, and the service cycle of the air conditioner is prolonged. When Δ T is measured 1 Not less than 0 ℃ or Delta T 2 When the temperature is less than or equal to 0 ℃, the duty ratio of the power on of the semiconductor refrigeration sheet 101 is reduced to 0, the first fan 106 and the second fan 107 are powered off, the compressor is adjusted to run under 60% of the maximum frequency, the indoor unit fan is adjusted to run at a medium wind gear, and the ambient temperature T is measured 1 Has fallen below the target temperature T set by the user 3 And the second heat exchange mechanism is not needed for auxiliary refrigeration, the compressor is adjusted to run under the condition of 60% of the maximum frequency, and the indoor unit fan is adjusted to run at a medium gear, so that the ambient temperature can be kept at the target temperature set by a user.
According to a preferred embodiment, the duty ratio of the power supply of the semiconductor chilling plate 101 is equal to the target temperature T set by the user 3 And ambient temperature T 1 Difference value Δ T of 1 Is linearly related. For example, Δ T 1 When the temperature is = 4 ℃, the duty ratio of the power on the semiconductor refrigerating chip 101 is 80%; delta T 1 When the temperature is = 3 ℃, the duty ratio of the power on the semiconductor refrigeration chip 101 is 60%. Without being limited thereto, the duty ratio of the power supplied to the semiconductor chilling plate 101 is equal to the target temperature T set by the user 3 And ambient temperature T 1 Difference value Δ T of 1 The remaining linear relationship is also possible. In the preferable technical scheme of the embodiment, the duty ratio of the power on of the semiconductor chilling plate 101 is equal to the target temperature T set by the user 3 And ambient temperature T 1 Difference value Δ T of 1 The magnitude of the voltage difference is linearly related, the linear relationship between the voltage difference and the current of the semiconductor chilling plate 101 is stored in advance, and the semiconductor chilling plate 101 can be quickly adjusted to the corresponding power-on duty ratio by searching the linear relationship between the voltage difference and the current of the semiconductor chilling plate.
According to a preferred embodiment, the operation mode of the air conditioner further includes a normal heat exchange mode. The normal heat exchange mode is an operation mode after the instant quick heat exchange mode of the air conditioner starting. Preferably, when the air conditioner is in the normal heat exchange mode, the method comprises the following steps: the frequency of the compressor is acquired, the operating state of the semiconductor chilling plates 101 is adjusted based on the frequency of the compressor, and the compressor is maintained to operate at 80% of the maximum frequency. More preferably, when the frequency of the compressor is less than 80% of the maximum frequency, the semiconductor refrigeration sheet 101 is controlled to be in a non-working state; when the frequency of the compressor is more than or equal to 80% of the maximum frequency, the semiconductor refrigeration piece 101 is controlled to be in a working state, and the compressor is kept to operate under 80% of the maximum frequency by adjusting the duty ratio of the power on the semiconductor refrigeration piece 101. The higher the compressor frequency, the higher the duty cycle of the semiconductor chilling plates 101.
The control method of the air conditioner in the preferred technical scheme of the embodiment adjusts the working state of the semiconductor refrigeration sheet 101 based on the frequency of the compressor, enables the compressor to be kept to operate under 80% of the maximum frequency, and enables the compressor to be kept to operate under 80% of the maximum frequency by sharing the pressure of the compressor through the semiconductor refrigeration sheet 101, so that the time for the compressor to maintain strong-load operation can be reduced, the energy consumption can be reduced, the service life of the compressor can be prolonged, and the service cycle of the air conditioner can be prolonged. Specifically, when the frequency of the compressor is less than 80% of the maximum frequency, the semiconductor chilling plate 101 is in a non-working state, and the semiconductor chilling plate 101 is not required to share the pressure of the compressor; when the frequency of the compressor is more than or equal to 80% of the maximum frequency, the semiconductor refrigeration piece 101 is controlled to be in a working state, the compressor is kept to operate at 80% of the maximum frequency by adjusting the duty ratio of the power of the semiconductor refrigeration piece 101, and therefore the pressure of the compressor can be shared by the semiconductor refrigeration piece 101, and the time for the compressor to maintain strong-load operation is shortened.
According to a preferred embodiment, the operation mode of the air conditioner further includes a drying operation mode. The drying mode can be triggered by a user or automatically by an air conditioner. Preferably, when the air conditioner is in the drying operation mode, the method includes the following steps: acquiring the humidity in the water pan 202; the working states of the semiconductor refrigeration sheet 101 and the second fan 107 are adjusted based on the humidity in the water receiving tray 202, and the humidity in the water receiving tray 202 is less than 50%. More preferably, when the humidity in the water pan 202 is greater than or equal to 50%, the duty ratio of the power on of the semiconductor refrigeration sheet 101 is adjusted to 100%, and the second fan 107 is in an on state; when the humidity in the water pan 202 is less than 50%, the duty ratio of the power on of the semiconductor refrigeration sheet 101 is reduced to 0, the second fan 107 is in a closed state, and the unit enters a standby state.
According to the control method of the air conditioner adopting the preferred technical scheme, the working states of the semiconductor refrigeration sheet 101 and the second fan 107 are adjusted based on the humidity in the water receiving tray 202, specifically, when the humidity in the water receiving tray 202 is larger than or equal to 50%, the duty ratio of the power on of the semiconductor refrigeration sheet 101 is adjusted to 100%, and the second fan 107 is in an open state, so that the accumulated water in the water receiving tray 202 can be dried by the heat generated by the semiconductor refrigeration sheet 101 until the humidity in the water receiving tray 202 is smaller than 50%, and the phenomenon that the accumulated water in the water receiving tray 202 is accumulated for a long time to cause filth blockage is prevented; when the humidity in the water pan 202 is less than 50%, the duty ratio of the power obtained by the semiconductor refrigeration sheet 101 is reduced to 0, the second fan 107 is in a closed state, the unit enters a standby state, and at the moment, the accumulated water in the water pan 202 does not need to be dried.
In the description of the present invention, it is to be noted that, unless otherwise specified, "a plurality" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood as the case may be, by those of ordinary skill in the art.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (14)
1. The heat exchange system is characterized by comprising a first heat exchange mechanism and a second heat exchange mechanism, wherein the first heat exchange mechanism is a refrigerant heat exchange mechanism and is used for carrying out primary heat exchange on air, the second heat exchange mechanism is a semiconductor heat exchange mechanism and is used for carrying out secondary heat exchange on at least part of air subjected to primary heat exchange.
2. A heat exchange system according to claim 1, wherein the second heat exchange means comprises a semiconductor chilling plate (101) and a power supply (102), the semiconductor chilling plate (101) being electrically connected to the power supply (102), and the power supply (102) being used to supply power to the semiconductor chilling plate (101).
3. The heat exchange system according to claim 2, wherein the second heat exchange mechanism further comprises an air duct (103), the semiconductor chilling plates (101) are fixed in the air duct (103), and the semiconductor chilling plates (101) divide the air duct (103) into a cold air duct and a hot air duct.
4. The heat exchange system according to claim 3, wherein the second heat exchange mechanism further comprises a cold air chamber (104) and a hot air chamber (105), and the cold air chamber (104) is communicated with the cold air duct and the hot air chamber (105) is communicated with the hot air duct.
5. The heat exchange system according to claim 4, wherein the second heat exchange mechanism further comprises a first fan (106) and a second fan (107), wherein the first fan (106) is disposed at a junction of the cold air chamber (104) and the cold air duct, and the second fan (107) is disposed at a junction of the hot air chamber (105) and the hot air duct.
6. The heat exchange system according to claim 4, wherein the air duct (103) is an arc-shaped structure, the cold air cavity (104) and the hot air cavity (105) are arranged at two ends of the air duct (103), and the semiconductor chilling plate (101) is arranged in the middle of the air duct (103).
7. The heat exchange system according to claim 3, wherein a first air hole (1031) is arranged on the air duct (103), and the first air hole (1031) is used for air circulation.
8. The heat exchange system according to claim 4, wherein a second air hole (1041) is arranged on one of the cold air cavity (104) and the hot air cavity (105), and the second air hole (1041) is used for air circulation; the other one of the cold air cavity (104) and the hot air cavity (105) is of a closed structure.
9. The heat exchange system according to claim 4, characterized in that the hot air chamber (105) is located above a water pan (202) of an air conditioner.
10. The heat exchange system according to claim 2, wherein the hot end face of the semiconductor chilling plate (101) is provided with a heat dissipation assembly for dissipating heat generated by the hot end face of the semiconductor chilling plate (101).
11. The heat exchange system of claim 10, wherein the heat dissipation assembly comprises a heat dissipation paste layer and/or a heat dissipation aluminum block, wherein the heat dissipation paste layer is coated on the hot end surface of the semiconductor refrigeration sheet (101), and the thickness of the heat dissipation paste layer is 0.1-0.5 mm; the heat dissipation aluminum block is fixed on the hot end face of the semiconductor refrigeration piece (101).
12. An air conditioner is characterized by comprising a machine shell (20) and a heat exchange system, wherein the heat exchange system is the heat exchange system in any one of claims 1 to 11, the heat exchange system is arranged in the machine shell (20), an air outlet (201) is further formed in the machine shell (20), and air subjected to primary heat exchange and secondary heat exchange with the heat exchange system is blown out of the air outlet (201).
13. The air conditioner according to claim 12, wherein a water pan (202) is further disposed in the casing (20), the water pan (202) is located below the hot air chamber (105) of the heat exchange system, and the water pan (202) is inclined downward toward the inlet of the hot air chamber (105).
14. The air conditioner according to claim 13, characterized in that a humidity sensor is arranged in the water pan (202), the humidity sensor is arranged at one end of the water pan (202) close to the inlet of the hot air chamber (105), and the humidity sensor is used for detecting the humidity in the water pan (202).
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| CN202221589087.7U CN217763721U (en) | 2022-06-23 | 2022-06-23 | Heat exchange system and air conditioner |
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| CN202221589087.7U CN217763721U (en) | 2022-06-23 | 2022-06-23 | Heat exchange system and air conditioner |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115076813A (en) * | 2022-06-23 | 2022-09-20 | 珠海格力电器股份有限公司 | Heat exchange system, air conditioner and control method |
| CN115076813B (en) * | 2022-06-23 | 2024-09-27 | 珠海格力电器股份有限公司 | Heat exchange system, air conditioner and control method |
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2022
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115076813A (en) * | 2022-06-23 | 2022-09-20 | 珠海格力电器股份有限公司 | Heat exchange system, air conditioner and control method |
| CN115076813B (en) * | 2022-06-23 | 2024-09-27 | 珠海格力电器股份有限公司 | Heat exchange system, air conditioner and control method |
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