CN1288522C - Method and apapratus for temperature circulation control - Google Patents
Method and apapratus for temperature circulation control Download PDFInfo
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- CN1288522C CN1288522C CN 03111670 CN03111670A CN1288522C CN 1288522 C CN1288522 C CN 1288522C CN 03111670 CN03111670 CN 03111670 CN 03111670 A CN03111670 A CN 03111670A CN 1288522 C CN1288522 C CN 1288522C
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- temperature
- heat
- fuel tank
- cooling device
- control plate
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- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000001816 cooling Methods 0.000 claims abstract description 63
- 238000009825 accumulation Methods 0.000 claims abstract description 43
- 239000004065 semiconductor Substances 0.000 claims abstract description 40
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000011347 resin Substances 0.000 claims abstract description 7
- 229920005989 resin Polymers 0.000 claims abstract description 7
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 7
- 239000010703 silicon Substances 0.000 claims abstract description 7
- 239000002828 fuel tank Substances 0.000 claims description 60
- 238000005057 refrigeration Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- 239000004033 plastic Substances 0.000 claims description 6
- 230000001172 regenerating effect Effects 0.000 claims description 4
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 239000003921 oil Substances 0.000 abstract 3
- 238000001514 detection method Methods 0.000 abstract 1
- 238000004134 energy conservation Methods 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000012774 insulation material Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000010721 machine oil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
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Abstract
The present invention relates to a method and a device for temperature circulation control, which belongs to the field of temperature control. In the method, an electric heater or a circulation water cooling device is used for the temperature control of a heat accumulation oil box, a thermocouple temperature sensor is used for the detection of the temperature of the heat accumulation oil box, and simultaneously the temperature circulation of a temperature control board is also needed to be controlled. The heating or cooling of the temperature control board is realized by changing the direction of current passing through a semiconductor thermoelectric cooling device. The device is composed of the electric heater, the heat accumulation oil box, the circulation water cooling device and a thermocouple, and is also provided with the temperature control board capable of heat conduction, the semiconductor thermoelectric cooling device, a platinum resistance temperature sensor, heat conduction silicon resin rubber and a heat insulation material. The present invention has the advantages of lowering the power consumption, which is favorable for energy conservation, realizing accurate and rapid control of temperature rise and drop and increasing the response speed and efficiency.
Description
Technical field
The method and the device of temperature cycles control of the present invention belong to domain of control temperature, relate to using the semiconductor heat electric cooling device to carry out temperature controlled method and apparatus.
Background technology
In the manufacturing process of plastic microfluidic chip, the bonding of the hot forming of microchannel and substrate and cover plate also needs temperature is carried out cycle control except that needs are controlled pressure on the plastic chip.Adopt at present usually electric heater control, the recirculated water cooling control of lowering the temperature that heats up, time delay is long, and low-response can't be controlled accurately by desired temperature lift-down curve, influences the quality and the stability thereof of made chip.
The semiconductor heat electric cooling device is based on the device of paltie effect, by P type and N-type semiconductor element and up and down ceramic copper-clad base plate form, cooler moves by means of the orientation of the charge carrier in the DC current, respectively the heat of refrigerator is moved to another side from one side, realized simultaneously absorb heat refrigeration (or heating) effect of one side heat release of refrigerator.If change the polarity of direct supply, suction, the exothermic effect of its generation are just the opposite.The semiconductor heat electric cooling device has the advantage that response is fast, efficient is high, promptly can add heat control, can freeze again.Number of patent application is that 97115423.6 " Temperature-controlled appliance " adopts semiconductor heat electric cooling device (Peltier device) to carry out temperature control.This invention relates to a kind of Temperature-controlled appliance that uses in room or other resemble construction thing, it has combination function, allly if can carry out freezing, refrigeration (refrigeration), thaw and warm up Tibetan etc. food and other analog.Because the refrigeration work consumption of semiconductor heat electric cooling device depends on the temperature difference of its both sides, this invention is only adopted fan to dispel the heat and is cooled off, and can't carry out accurately and control fast heating and cooling process.Mainly there are low-response in existing temperature cycles control method and device, easily produce overshoot, can't carry out accurately and quick control heating and cooling process, and wasted power is bigger in the process of heating and cooling simultaneously, and efficient is low.
Summary of the invention
The method that the purpose of this invention is to provide a kind of temperature cycles control, provide the temperature cycles control device of this method of realization, can be used in the hot forming and the bonding of plastic microfluidic chip, it is simple in structure, can overcome above-mentioned defective, realization is carried out accurately and control fast heating and cooling, improves response speed and efficient, reduces energy resource consumption.
The technical solution used in the present invention is: a kind of temperature cycles control device that utilizes carries out the method that temperature cycles is controlled, and can be used for the hot forming and the bonding of plastic microfluidic chip; The regenerative apparatus of described temperature cycles control device is by electric heater, the accumulation of heat fuel tank, circulating water cooling device, thermopair is formed, and electric heater 8 and thermopair 7 are installed in the accumulation of heat fuel tank 9, circulating water cooling device 10 is installed in the both sides of accumulation of heat fuel tank 9 outsides, but the temperature control plate 1 that also has heat conduction in the device, semiconductor heat electric cooling device 2, platinum resistance temperature sensor 3, thermal conductive silicon resin rubber 4, heat-barrier material 5; The temperature control plate 1 of temperature cycles control links by semiconductor heat electric cooling device 2 and accumulation of heat fuel tank 8, but be lined with thermal conductive silicon resin rubber 4 between the surface in contact of two end faces with the accumulation of heat fuel tank 8 of temperature control plate 1 and heat conduction of semiconductor heat electric cooling device 2, be placed with heat-barrier material 5 between temperature control plate 1 and the accumulation of heat fuel tank 8, platinum resistance temperature sensor 3 is installed in the temperature control plate, picks out external by lead-in wire 6; Transmitter 11 in the temperature cycles control device is connected with platinum resistance temperature sensor 3, and analog-digital commutator 12 is connected on the control computer 13; The driving power 15 of semiconductor heat electric cooling device is connected with control computer 13 by digiverter 14, and fuel tank temperature controller 16 also links with control computer 13;
The method of temperature cycles control is characterized in that,
1), this method need be carried out temperature cycles control to temperature control plate 1, change by semiconductor heat electric cooling device 2 senses of current, can make the hot face of semiconductor heat electric cooling device change into chill surface, chill surface is changed into hot face, realizes heating or refrigeration to the temperature control plate; In the process that temperature control plate 1 is heated, heat partly comes from the heat that shifts from accumulation of heat fuel tank 9 by semiconductor heat electric cooling device 2, and part comes from the electric power that semiconductor heat electric cooling device 2 is consumed; In the process that temperature control plate 1 is freezed, accumulation of heat fuel tank 9 absorbs from temperature control plate 1 and shifts the part electric power that the heat that comes and semiconductor cooler 2 are consumed;
2), utilize platinum resistance temperature sensor 3 to detect the temperature of temperature control plates, the temperature of temperature control plate 1 collects in the control computer 13 by transmitter 11, analog-digital commutator 12.Control computer is according to the temperature control curve of input, with the temperature information of the temperature control plate that collects etc. by digiverter 14 and driving power 15, according to the size and Orientation of needed temperature lift-down curve control, realize temperature cycles control to temperature control plate 1 by semiconductor heat electric cooling device 2 electric currents; The big I of regulating this electric current changes intensification or cooling rate; Described fuel tank temperature controller 16 is controlled by electric heater 8 or 10 pairs of fuel tank temperature of circulating cooling device by the temperature information of described thermocouple temperature sensor 7 collection accumulation of heat fuel tanks 9; Control computer 13 is controlled fuel tank temperature controller 16 by COM port;
3), requiring the thermal capacity of accumulation of heat fuel tank 9 is about 10 times of temperature control plate 1 thermal capacity, in the process of the temperature control plate being carried out temperature cycles control, the part heat transmits between temperature control plate and regenerative apparatus, by electric heater 8 replenishment system thermal losss, or, realize regenerative apparatus is carried out temperature control by the unnecessary heat of circulating water cooling device 10 removal systems.
Adopting effect of the present invention is to carry out accurately and control fast heating and cooling process, and control system is simple and be easy to realize.Because adopt the present invention that the temperature control plate is being carried out in the temperature cycles control procedure, the part heat transmits between temperature control plate and accumulation of heat fuel tank, so the present invention can reduce power consumption, help energy savings.
The synoptic diagram of description of drawings Fig. 1 temperature cycles control device.Wherein: 1-temperature control plate; 2-semiconductor heat electric cooling device; The 3-platinum resistance temperature sensor; 4-thermal conductive silicon resin rubber; The 5-heat-barrier material; The 6-lead; The 7-thermocouple temperature sensor; The 8-electric heater; 9-accumulation of heat fuel tank; The 10-cooling back installation.Fig. 2 is temperature control plate and accumulation of heat fuel tank temperature variation synoptic diagram.Among the figure: the temperature variation curve of A-temperature control plate; The temperature variation curve of B-accumulation of heat fuel tank.Fig. 3 is the control system block diagram of temperature cycles control device.Wherein: 2-semiconductor heat electric cooling device; 3-is a platinum resistance temperature sensor; The 7-thermocouple temperature sensor; The 8-electric heater; The 10-cooling back installation; The 11-transmitter; The 12-analog to digital converter; The 13-control computer; The 14-digital to analog converter; The driving power of 15-semiconductor heat electric cooling device; 16-fuel tank temperature controller.
Embodiment describes the embodiment of an embodiment in detail below in conjunction with accompanying drawing.
A kind of bonding process of plastic microfluidic chip need carry out heating and cooling control between 40 ℃～105 ℃, warming and cooling rate is 30 ℃ of per minutes.In installation drawing shown in Figure 1, the temperature control plate 1 that directly contacts with chip is a copper coin, and semiconductor heat electric cooling device 2 is selected 4 for use, and every maximum refrigeration work consumption is 80W.The accumulation of heat fuel tank of being made by Heat Conduction Material is an aluminium casing, and inside is full of machine oil, and its thermal capacity is about 10 times of temperature control plate thermal capacity.Between fuel tank bottom and the semiconductor heat electric cooling device, and be lined with thermal conductive silicon resin rubber 4 between temperature control plate top and the semiconductor heat electric cooling device, to guarantee reliable and uniform contact.Accumulation of heat fuel tank 9 and temperature control plate 1 link by heat-barrier material 5.Thermocouple temperature sensor 7 is housed in fuel tank, platinum resistance temperature sensor 3 is installed in the temperature control plate 1.The liquid cooling back installation 10 that is used for personal computer CPU heat radiation can be installed in the fuel tank both sides, fuel tank internal can be installed electric heater 8, because in each temperature cycles control procedure, system needs additional heat, still unnecessary heat need scatter and disappear, have only a kind of situation to exist, therefore can need determine cooling device still to need to install electric heater by the experiment of in concrete working environment, being carried out.
Because the thermal capacity of accumulation of heat fuel tank 9 is more than 10 times of temperature control plate 1 thermal capacity, therefore in the heating and cooling cycle control, the range of temperature of temperature control plate 1 is much larger than accumulation of heat fuel tank 9 ranges of temperature.
The accumulation of heat fuel tank is not being carried out under the temperature controlled condition, the temperature control plate is being carried out temperature cycles control, determining that by the temperature variation that detects fuel tank system need heat or need heat radiation.Temperature control plate and accumulation of heat fuel tank temperature variation synoptic diagram, as shown in Figure 2, curve A is illustrated in the temperature cycles control procedure, and the temperature variation of temperature control plate, curve B are represented the temperature variation of accumulation of heat fuel tank.Controlling the temperature control plate from temperature T
1Be heated to T
2Process in, the direction of current by semiconductor cooler make with the contacted one side of accumulation of heat fuel tank be refrigeration face, and another side is a hot face.The heat that the part electric power of semiconductor cooler consumption is produced and shift the heat come from the accumulation of heat fuel tank and make the temperature of temperature control plate rise.Because the thermal capacity of accumulation of heat fuel tank is greater than the thermal capacity of temperature control plate, thereby the accumulation of heat fuel tank only has temperature by a small margin to descend, promptly from T
3Drop to T
4In the temperature of control temperature control plate from T
2Drop to T
1Process in, change direction of current by the semiconductor heat electric cooling device, make with the contacted one side of temperature control plate be refrigeration face, and with the contacted one side of accumulation of heat fuel tank be hot face.Because the heat that the part electric power of semiconductor heat electric cooling device consumption is produced is absorbed by the accumulation of heat fuel tank, thereby the amplitude that slightly rises of accumulation of heat fuel tank may be greater than decline scope before this, so system shown in the figure needs heat radiation, and cooling device promptly is installed.Fuel tank is operated between 50 ℃～55 ℃ in the present embodiment, and system needs heat radiation.
Below in conjunction with Fig. 3 the control procedure of apparatus of the present invention is described.The temperature of temperature control plate collects in the control computer 13 by platinum resistance temperature sensor 3, transmitter 11, analog-digital commutator 12.Control computer according to the temperature control curve of input, the temperature information of the temperature control plate that collects etc. by digiverter 14 and driving power 15 controls by semiconductor cooler 2 senses of current and size.Fuel tank temperature controller 16 passes through the temperature information that thermopair 7 is gathered fuel tanks, and controls by electric heater 8 or 10 pairs of fuel tank temperature of circulating cooling device.Control computer 13 is controlled fuel tank temperature controller 16 by COM port, as revising controlled variable, reading fuel tank temperature value etc.
Claims (1)
1. one kind is utilized the temperature cycles control device to carry out the method that temperature cycles is controlled, and can be used for the hot forming and the bonding of plastic microfluidic chip; The regenerative apparatus of described temperature cycles control device is by electric heater, the accumulation of heat fuel tank, circulating water cooling device, thermocouple temperature sensor is formed, electric heater [8] and thermocouple temperature sensor [7] are installed in the accumulation of heat fuel tank [9], circulating water cooling device [10] is installed in the outside both sides of accumulation of heat fuel tank [9], but also has temperature control plate [1] heat conduction, that directly contact in the temperature cycles control device with chip, semiconductor heat electric cooling device [2], platinum resistance temperature sensor [3], thermal conductive silicon resin rubber [4], heat-barrier material [5]; The temperature control plate [1] of temperature cycles control links by semiconductor heat electric cooling device [2] and accumulation of heat fuel tank [9], two end faces of semiconductor heat electric cooling device [2] with temperature control plate [1] but and be lined with thermal conductive silicon resin rubber [4] between the surface in contact of the accumulation of heat fuel tank [9] of heat conduction, be placed with heat-barrier material [5] between temperature control plate [1] and the accumulation of heat fuel tank [9], platinum resistance temperature sensor [3] is installed in the temperature control plate, picks out external by lead-in wire [6]; Transmitter in the temperature cycles control device [11] is connected with platinum resistance temperature sensor [3], and analog-digital commutator [12] is connected on the control computer [13]; The driving power of semiconductor heat electric cooling device [15] is connected with control computer [13] by digiverter [14], and fuel tank temperature controller [16] also links with control computer [13];
The method of temperature cycles control is characterized in that,
1), this method need be carried out temperature cycles control to the temperature control plate [1] that directly contacts with chip, change by semiconductor heat electric cooling device [2] sense of current, can make the hot face of semiconductor heat electric cooling device change into chill surface, chill surface is changed into hot face, realizes heating or refrigeration to the temperature control plate; In the process that temperature control plate [1] is heated, heat partly comes from the heat that shifts from accumulation of heat fuel tank [9] by semiconductor heat electric cooling device [2], and part comes from the electric power that semiconductor heat electric cooling device [2] is consumed; In the process that temperature control plate [1] is freezed, accumulation of heat fuel tank [9] absorbs from temperature control plate [1] and shifts the part electric power that the heat that comes and semiconductor heat electric cooling device [2] are consumed;
2), utilize platinum resistance temperature sensor [3] to detect the temperature of temperature control plate [1], the temperature of temperature control plate is by transmitter [11], analog-digital commutator [12] collects in the control computer [13], control computer is according to the temperature lift-down curve of input, with the temperature information of the temperature control plate that collects driving power [15] by digiverter [14] and semiconductor heat electric cooling device, according to the size and Orientation of needed temperature lift-down curve control by semiconductor heat electric cooling device [2] electric current, realization is to the temperature cycles control of temperature control plate [1], and the size of regulating this electric current can change intensification or cooling rate; Described fuel tank temperature controller [16] is gathered the temperature information of accumulation of heat fuel tank [9] by described thermocouple temperature sensor [7], and by electric heater [8] or circulating cooling device [10] the fuel tank temperature is controlled; Control computer [13] can be controlled fuel tank temperature controller [16] by COM port;
3), requiring the thermal capacity of accumulation of heat fuel tank [9] is about 10 times of temperature control plate [1] thermal capacity, in the process of the temperature control plate being carried out temperature cycles control, the part heat transmits between temperature control plate and accumulation of heat fuel tank, by electric heater [8] replenishment system thermal loss, or, realize the accumulation of heat fuel tank is carried out temperature control by the unnecessary heat of circulating water cooling device [10] removal system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03111670 CN1288522C (en) | 2003-05-13 | 2003-05-13 | Method and apapratus for temperature circulation control |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03111670 CN1288522C (en) | 2003-05-13 | 2003-05-13 | Method and apapratus for temperature circulation control |
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| Publication Number | Publication Date |
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| CN1549074A CN1549074A (en) | 2004-11-24 |
| CN1288522C true CN1288522C (en) | 2006-12-06 |
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| CN 03111670 Expired - Fee Related CN1288522C (en) | 2003-05-13 | 2003-05-13 | Method and apapratus for temperature circulation control |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105043716A (en) * | 2015-08-29 | 2015-11-11 | 中国科学院上海光学精密机械研究所 | Miniature test clamp used for disk laser device for controlling shell temperature |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7925389B2 (en) * | 2006-06-15 | 2011-04-12 | International Business Machines Corporation | Method of detecting recirculation of heated air within a rack enclosure |
| CN101071137B (en) * | 2007-06-12 | 2010-09-29 | 大连理工大学 | Heating device quick-change device for planar pressing structure |
| CN102251430B (en) * | 2011-07-28 | 2013-06-05 | 广东理文造纸有限公司 | Heating device of calender for papermaking |
| CN103349339B (en) * | 2013-04-03 | 2014-10-08 | 华南理工大学 | Pulse electric field treatment chamber |
| CN104006009A (en) * | 2013-12-13 | 2014-08-27 | 昆山洛博格机械技术咨询有限公司 | Multifunctional hydraulic station oil tank |
| CN105487576A (en) * | 2016-01-04 | 2016-04-13 | 中国电子信息产业集团有限公司第六研究所 | Constant temperature oil tank device with temperature control system |
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2003
- 2003-05-13 CN CN 03111670 patent/CN1288522C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105043716A (en) * | 2015-08-29 | 2015-11-11 | 中国科学院上海光学精密机械研究所 | Miniature test clamp used for disk laser device for controlling shell temperature |
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| CN1549074A (en) | 2004-11-24 |
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