CN218730428U - Capacitor-attached tungsten-copper carrier substrate - Google Patents
Capacitor-attached tungsten-copper carrier substrate Download PDFInfo
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- CN218730428U CN218730428U CN202222886985.5U CN202222886985U CN218730428U CN 218730428 U CN218730428 U CN 218730428U CN 202222886985 U CN202222886985 U CN 202222886985U CN 218730428 U CN218730428 U CN 218730428U
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Abstract
The utility model provides a tungsten copper carrier substrate is pasted to electric capacity belongs to chip and pastes dress technical field, including loading board and locating plate, the up end of loading board is equipped with a plurality of and holds the groove for placing tungsten copper alloy, holds the tank bottom surface of groove and is equipped with the absorption hole, and the loading board is used for installing on the vacuum base, and is located the top of vacuum tank; the positioning plate is fixedly arranged below the bearing plate and is used for being arranged in the vacuum groove; a plurality of through holes are formed in the end face, far away from the bearing plate, of the positioning plate, and the through holes correspond to the adsorption holes one to one. The utility model provides a tungsten copper carrier substrate is pasted to electric capacity for paste the dress degree of difficulty and reduce, improved production efficiency.
Description
Technical Field
The utility model belongs to the technical field of the chip pastes the dress, concretely relates to electric capacity pastes tungsten copper carrier substrate.
Background
With the progress of the times, the application range of the capacitor chip is very large in the current electronic technology field, and thus the demand of the capacitor chip is increasing. However, when the capacitor chip is mounted, the tungsten-copper alloy and the chip are mounted by one manual operation, and the mounting position is also accurate, but the current production technology is complex in operation, so that the mounting efficiency is low, and the market demand is difficult to guarantee.
SUMMERY OF THE UTILITY MODEL
An embodiment of the utility model provides a tungsten copper carrier substrate is pasted to electric capacity to solve the electric capacity that exists among the prior art and paste chip complex operation, and the technical problem that production efficiency is low.
In order to achieve the above object, the utility model adopts the following technical scheme: providing a capacitor mounted tungsten copper carrier substrate, comprising:
the upper end face of the bearing plate is provided with a plurality of containing grooves for containing tungsten-copper alloy; the bottom surface of the containing groove is provided with an adsorption hole, and the bearing plate is arranged on the vacuum base and positioned above the vacuum groove;
the positioning plate is fixedly arranged below the bearing plate and is used for being arranged in the vacuum groove; a plurality of through holes are formed in the end face, far away from the bearing plate, of the positioning plate, and the through holes are in one-to-one correspondence with the adsorption holes.
In one possible implementation manner, the plurality of receiving grooves are arranged in a rectangular array, and the plurality of through holes are arranged in a rectangular array.
In a possible implementation manner, two adjacent through holes in the same column are communicated with each other.
In one possible implementation, the two sides of the carrier plate are provided with outwardly extending gripping portions.
In a possible implementation manner, the upper end surface of the holding portion and the upper end surface of the bearing plate are located on the same plane, and the thickness of the holding portion is smaller than that of the bearing plate.
In one possible implementation, the bearing plate and the positioning plate are integrally formed.
In one possible implementation manner, the capacitor mounted tungsten copper carrier substrate further includes: and the sealing structure is arranged on the lower end surface of the bearing plate and is surrounded on the outer side of the positioning plate.
In one possible implementation, the sealing structure includes a sealing groove and a sealing strip disposed in the sealing groove.
The utility model provides a pair of tungsten copper carrier substrate is pasted to electric capacity beneficial effect lies in: compared with the prior art, the tungsten copper carrier substrate is attached to the capacitor, when in use, tungsten copper alloy is firstly respectively placed in the plurality of containing grooves on the bearing plate, then the carrier substrate is placed on the vacuum base, the positioning plate is installed in the vacuum groove of the vacuum base, and the bearing plate can be prevented from being deviated and can be accurately and quickly positioned by utilizing the matching installation of the vacuum groove and the positioning plate; the vacuum adsorption device is started, negative pressure is formed in the adsorption holes under the action of the vacuum base so as to adsorb the bearing plate and the tungsten-copper alloy, the operations of dispensing, die bonding, chip mounting and the like can be stably and firmly carried out, and after the chip mounting work is finished, the vacuum adsorption device is closed, the bearing plate and the tungsten-copper alloy are not adsorbed by the negative pressure any more, so that the carrier substrate can be conveniently and quickly taken down; through the mode, the bearing plate can be used for mounting a plurality of chips at one time, the mounting, positioning and dismounting operations of the whole capacitor chip tungsten-copper carrier substrate are quick and accurate, the mounting difficulty of the capacitor chip is reduced, and the production efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a capacitor mounted tungsten copper carrier substrate according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a carrier plate according to an embodiment of the present invention;
FIG. 3 is a side view of a carrier plate according to an embodiment of the present invention;
fig. 4 is a schematic structural view of a positioning plate according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a receiving slot on a capacitor mounted tungsten copper carrier substrate according to an embodiment of the present invention.
Wherein, in the figures, the various reference numbers:
1. a carrier plate; 11. an accommodating groove; 12. an adsorption hole; 13. a grip portion; 2. positioning a plate; 21. a through hole; 22. the groove is sealed.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1 to 5, a tungsten-copper carrier substrate for capacitor attachment provided by the present invention will now be described. A capacitor-attached tungsten copper carrier substrate comprises a bearing plate 1 and a positioning plate 2, wherein the upper end face of the bearing plate 1 is provided with a plurality of containing grooves 11 for containing tungsten copper alloy, the bottom faces of the containing grooves 11 are provided with adsorption holes 12, and the bearing plate 1 is arranged on a vacuum base and is positioned above a vacuum groove; the locating plate 2 is fixedly arranged below the bearing plate 1 and used for being installed in the vacuum groove, a plurality of through holes 21 are formed in the end face, away from the bearing plate 1, of the locating plate 2, and the through holes 21 correspond to the adsorption holes 12 one to one.
Compared with the prior art, the capacitor-mounted tungsten copper carrier substrate provided by the embodiment has the advantages that when the capacitor-mounted tungsten copper carrier substrate is used, firstly, tungsten copper alloy is respectively placed in the containing grooves 11 on the bearing plate 1, then, the carrier substrate is placed on the vacuum base, the positioning plate 2 is installed in the vacuum groove of the vacuum base, and the bearing plate 1 can be prevented from being deviated and can be accurately and quickly positioned by utilizing the matching installation of the vacuum groove and the positioning plate 2; starting the vacuum adsorption device, forming negative pressure in the adsorption holes 12 under the action of the vacuum base so as to adsorb the bearing plate 1 and the tungsten-copper alloy, stably and firmly performing the operations of dispensing, die bonding, chip mounting and the like, and closing the vacuum adsorption device after the chip mounting work is completed, so that the bearing plate 1 and the tungsten-copper alloy are not adsorbed by the negative pressure any more, and the carrier substrate can be conveniently and quickly taken down; through the mode, the bearing plate 1 can be used for mounting a plurality of chips at one time, and the whole capacitor mounting, positioning and dismounting operation of the tungsten-copper carrier substrate is quick and accurate, so that the mounting difficulty of the capacitor mounting chip is reduced, and the production efficiency is improved.
Referring to fig. 1, fig. 2 and fig. 5, as a specific embodiment of the tungsten copper carrier substrate for capacitor attachment provided by the present invention, a plurality of receiving slots 11 are located on the upper end surface of the carrier plate 1 and are arranged in a rectangular array, the receiving slots 11 are arranged in a 10 × 10 rectangular array, and the upper end surface of the receiving slots 11 has a chamfer, so that the tungsten copper alloy can be easily placed in the receiving slots 11. And the structure of the containing groove 11 is formed by a rectangle and a semicircle, so that the shape of the chip is more consistent, the chip can be more conveniently attached when being placed, the working efficiency is ensured, and the operation difficulty is reduced.
A plurality of through holes 21 are positioned on the positioning plate 2 and are arranged in a rectangular array, and the through holes 21 correspond to the accommodating grooves 11 one by one; the thickness of the adsorption holes 12 is reduced in the phase change manner, the carrier substrate and the tungsten-copper alloy are more easily adsorbed, and when the vacuum adsorption device is used, the carrier substrate and the tungsten-copper alloy can be firmly adsorbed by using the vacuum adsorption by only placing the positioning plate 2 into the vacuum groove of the vacuum base, so that the positioning is accurate, the next operation is convenient, the labor is greatly saved, and the working efficiency is improved.
Referring to fig. 4, as a specific embodiment of the tungsten-copper carrier substrate for capacitor attachment provided by the present invention, a plurality of through holes 21 are formed on the positioning plate 2, and the arrangement manner is that two adjacent through holes 21 are located in the same row and are communicated with each other; therefore, the method not only reduces the weight of the capacitor-mounted tungsten copper carrier substrate, but also effectively prevents the adsorption holes 12 from being blocked by dirt.
Referring to fig. 2 and 3, as an embodiment of the tungsten copper carrier substrate for capacitor attachment provided by the present invention, two sides of the carrier plate 1 are provided with outwardly extending holding portions 13; the operation such as carrying, installation and dismantlement can be carried, convenient, swift to loading board 1 to the handheld portion 13 of staff.
Referring to fig. 2 and fig. 3, as a specific embodiment of the capacitor-mounted tungsten-copper carrier substrate provided by the present invention, the upper end surface of the holding portion 13 and the upper end surface of the carrier plate 1 are located on the same plane, and the thickness of the holding portion 13 is smaller than the thickness of the carrier plate 1; by using the mode, the carrier substrate consisting of the bearing plate 1 and the positioning plate 2 can be more tightly attached to the vacuum base, and a gap is prevented from being left between the bearing plate and the positioning plate, so that the vacuum base leaks air and cannot fixedly adsorb the carrier substrate.
Referring to fig. 1, fig. 2 and fig. 4, as a specific embodiment of the capacitor-mounted tungsten-copper carrier substrate of the present invention, a carrier plate 1 and a positioning plate 2 are integrally formed, and both are plate-shaped structures; by adopting the method, the structure of the carrier substrate is lighter and more portable, and the operation is easier; the plate-shaped structure adopted by the bearing plate 1 ensures that the lower end face can be in contact with the upper end face of the vacuum base in the largest area, so that the bearing plate 1 is more tightly attached to the vacuum base, and the carrier substrate is more stable and firm; 4 angles of the bearing plate 1 are chamfer structures, 4 angles of the positioning plate 2 are radius structures, the chamfer and the radius structures are convenient to assemble and attach with the vacuum groove, the shape is more attractive, and the carrier substrate is more convenient to attach to the vacuum groove of the vacuum base.
Referring to fig. 1 and 4, as a specific embodiment of the capacitor-mounted tungsten copper carrier substrate provided by the present invention, the capacitor-mounted tungsten copper carrier substrate further includes a sealing structure, the sealing structure is mounted on the lower end surface of the loading plate 1 and surrounds the outer side of the positioning plate 2; the positioning plate 2 can be sealed in the vacuum groove of the vacuum base by the sealing structure, so that the carrier substrate is prevented from moving due to air leakage when the vacuum adsorption device is started.
Referring to fig. 1 and 4, as a specific embodiment of the capacitor mounted tungsten-copper carrier substrate provided by the present invention, the sealing structure includes a sealing groove 22 and a sealing strip disposed in the sealing groove 22; by adopting the mode, the carrier substrate is more firmly fixed in the vacuum groove of the vacuum base, and the sealing groove 22 and the sealing strip can ensure that the positioning plate 2 is better fixed in the vacuum groove, thereby preventing the phenomenon of a large amount of air leakage during working.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. A capacitor-mounted tungsten copper carrier substrate, comprising:
the upper end face of the bearing plate is provided with a plurality of containing grooves for containing tungsten-copper alloy; the bottom surface of the containing groove is provided with an adsorption hole, and the bearing plate is arranged on the vacuum base and positioned above the vacuum groove;
the positioning plate is fixedly arranged below the bearing plate and is used for being arranged in the vacuum groove; a plurality of through holes are formed in the end face, far away from the bearing plate, of the positioning plate, and the through holes are in one-to-one correspondence with the adsorption holes.
2. The capacitor mounted tungsten copper carrier substrate of claim 1, wherein a plurality of said receiving cavities are arranged in a rectangular array and a plurality of said through holes are arranged in a rectangular array.
3. The capacitor mounted tungsten copper carrier substrate of claim 2, wherein two adjacent through holes in the same row are in communication.
4. The capacitor attached tungsten-copper carrier substrate according to claim 1, wherein the carrier plate is provided with outwardly extending grips on both sides.
5. The capacitor attached tungsten-copper carrier substrate according to claim 4, wherein the upper end surface of the holding portion and the upper end surface of the carrier plate are located on the same plane, and the thickness of the holding portion is smaller than that of the carrier plate.
6. The capacitor mounted tungsten copper carrier substrate of claim 1, wherein the carrier plate and the positioning plate are integrally formed.
7. The capacitor mounted tungsten copper carrier substrate of claim 1, wherein the capacitor mounted tungsten copper carrier substrate further comprises:
and the sealing structure is arranged on the lower end surface of the bearing plate and is surrounded on the outer side of the positioning plate.
8. The capacitor attached tungsten-copper carrier substrate according to claim 7, wherein the sealing structure comprises a sealing groove and a sealing strip disposed in the sealing groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222886985.5U CN218730428U (en) | 2022-10-31 | 2022-10-31 | Capacitor-attached tungsten-copper carrier substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222886985.5U CN218730428U (en) | 2022-10-31 | 2022-10-31 | Capacitor-attached tungsten-copper carrier substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218730428U true CN218730428U (en) | 2023-03-24 |
Family
ID=85596739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222886985.5U Active CN218730428U (en) | 2022-10-31 | 2022-10-31 | Capacitor-attached tungsten-copper carrier substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218730428U (en) |
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2022
- 2022-10-31 CN CN202222886985.5U patent/CN218730428U/en active Active
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