CN216793659U - Routing clamp and routing equipment - Google Patents
Routing clamp and routing equipment Download PDFInfo
- Publication number
- CN216793659U CN216793659U CN202220354283.XU CN202220354283U CN216793659U CN 216793659 U CN216793659 U CN 216793659U CN 202220354283 U CN202220354283 U CN 202220354283U CN 216793659 U CN216793659 U CN 216793659U
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- China
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- heat sink
- cover plate
- groove
- supporting plate
- sink chip
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Abstract
The utility model provides a routing clamp and routing equipment, and relates to the technical field of routing clamps, wherein the routing clamp comprises a supporting plate and a cover plate, the front surface of the supporting plate is provided with a groove, and the groove is used for accommodating a heat sink chip integrated structure; the cover plate is provided with a window penetrating through the front surface and the back surface, and the window is aligned with the groove so as to expose the position to be wire bonded on the heat sink chip integrated structure; the supporting plate is connected with the cover plate, and the cover plate can press the heat sink chip integrated structure in the groove so as to prevent the heat sink chip integrated structure from moving up and down. The heat sink chip integral structure is placed in the groove, and then the supporting plate is covered by the cover plate, so that the heat sink chip integral structure and the supporting plate are connected together. The back of apron can the crimping on heat sink chip body structure, prevents heat sink chip body structure along the up-and-down motion in the recess, can carry out the routing operation to heat sink chip body structure in the recess through the window on the apron, and the routing in-process, heat sink chip body structure is inseparable with anchor clamps connection, can not produce and rock relatively.
Description
Technical Field
The utility model relates to the technical field of routing clamps, in particular to a routing clamp and routing equipment.
Background
The chip and the heat sink are fixed to form a heat sink chip integrated structure, and the electrodes of the chip and the electrodes on the heat sink are electrically connected through wires by using a wire bonding mechanism.
The conventional routing clamp is only provided with a supporting plate with a groove, the bottom of the groove is provided with a hole, and a vacuumizing system of a routing machine is utilized to carry out vacuum adsorption on a hot-sinking chip integrated structure placed in the groove. The disadvantage is that when the vacuum suction of the wire bonding machine is insufficient, the heat sinking chip integrated structure is easy to shake in the wire bonding process, and wire bonding is affected.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a routing clamp and routing equipment to solve the technical problem that the prior routing clamp cannot firmly fix an integrated structure of a heat sink chip.
In a first aspect, an embodiment of the present invention provides a wire bonding fixture, including: the heat sink chip integrated structure comprises a supporting plate and a cover plate, wherein a groove is formed in the front face of the supporting plate and used for accommodating a heat sink chip integrated structure;
the cover plate is provided with a window penetrating through the front surface and the back surface, and the window is aligned with the groove so as to expose a position to be wire bonded on the heat sink chip integrated structure;
the supporting plate is connected with the cover plate, and the cover plate can press the heat sink chip integrated structure in the groove so as to prevent the heat sink chip integrated structure from moving up and down.
Furthermore, the number of the grooves and the windows is multiple and the grooves and the windows are in one-to-one correspondence.
Furthermore, the back of the cover plate is provided with a first protrusion and a second protrusion which protrude downwards, the first protrusion and the second protrusion are respectively located on two opposite sides of the window, and the first protrusion and the second protrusion are used for being abutted to the heat sink chip integrated structure.
Further, the supporting plate is connected with the cover plate through a magnet.
Furthermore, a placing groove for placing a magnet is arranged on the supporting plate, and the cover plate is made of a material capable of being attracted by the magnet;
or the cover plate is provided with a placing groove for placing a magnet, and the supporting plate is made of a material capable of being attracted by the magnet.
Furthermore, the supporting plate and the cover plate are correspondingly provided with positioning structures, so that the groove is aligned with the window.
Furthermore, the positioning structure comprises a positioning pin arranged on the front surface of the supporting plate and a positioning pin hole arranged on the back surface of the cover plate;
or the positioning structure comprises a positioning pin arranged on the back surface of the cover plate and a positioning pin hole arranged on the front surface of the supporting plate.
Further, the cross-sectional area of the window becomes smaller from the front surface to the back surface of the cover plate.
Furthermore, the bottom surface of the groove is provided with a vacuum suction hole which penetrates through the bottom surface of the supporting plate and the bottom surface of the groove.
In a second aspect, the embodiment of the utility model provides a wire bonding apparatus, which includes the wire bonding fixture.
The routing clamp provided by the embodiment of the utility model comprises: the heat sink chip integrated structure comprises a supporting plate and a cover plate, wherein a groove is formed in the front face of the supporting plate and used for accommodating a heat sink chip integrated structure; the cover plate is provided with a window penetrating through the front surface and the back surface, and the window is aligned with the groove so as to expose a position to be wire bonded on the heat sink chip integrated structure; the supporting plate is connected with the cover plate, and the cover plate can press the heat sink chip integrated structure in the groove so as to prevent the heat sink chip integrated structure from moving up and down. And placing the heat sink chip integrated structure in the groove, and then covering the supporting plate by using the cover plate to connect the supporting plate and the supporting plate. The back of apron can the crimping on heat sink chip body structure, prevents heat sink chip body structure along the up-and-down direction motion in the recess, can carry out the routing operation to heat sink chip body structure in the recess through the window on the apron, and the routing in-process, heat sink chip body structure is connected closely with anchor clamps, can not produce and rock relatively.
The routing equipment provided by the embodiment of the utility model comprises the routing clamp. Because the routing equipment provided by the embodiment of the utility model uses the routing clamp, the routing equipment provided by the embodiment of the utility model also has the advantages of the routing clamp.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic view of a wire bonding fixture according to an embodiment of the present invention;
fig. 2 is an exploded view of a wire bonding fixture according to an embodiment of the present invention;
fig. 3 is a schematic view of a supporting plate of the wire bonding fixture according to the embodiment of the utility model;
fig. 4 is a schematic view of a cover plate of the wire bonding clamp according to the embodiment of the utility model;
fig. 5 is a partial schematic view of a back side of a cover plate of a wire bonding clamp according to an embodiment of the utility model.
Icon: 100-heat sink chip integrated structure;
200-a pallet; 210-a groove; 211-vacuum suction holes; 220-placing a groove; 230-a magnet; 240-locating pins;
300-a cover plate; 310-a window; 320-a first protrusion; 330-a second protrusion; 340-dowel hole.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-5, a wire bonding fixture according to an embodiment of the present invention includes: the heat sink chip integrated structure comprises a supporting plate 200 and a cover plate 300, wherein the front surface of the supporting plate 200 is provided with a groove 210, and the groove 210 is used for accommodating the heat sink chip integrated structure 100; the cover plate 300 is provided with a window 310 penetrating through the front surface and the back surface, and the window 310 is aligned with the groove 210, so that a position to be wire-bonded on the heat sink chip integrated structure 100 is exposed; the support plate 200 is detachably connected to the cover plate 300, and the cover plate 300 can press the heat sink chip integrated structure 100 into the groove 210 to prevent the heat sink chip integrated structure 100 from moving up and down. The heat sink chip unitary structure 100 is placed in the recess 210 and the pallet 200 is then covered with the cover plate 300 to connect the two together. The back of apron 300 can the crimping on heat sink chip integrated into one piece structure 100, prevents heat sink chip integrated into one piece structure 100 along the up-and-down direction motion in recess 210, can carry out the routing operation to heat sink chip integrated into one piece structure 100 in the recess 210 through window 310 on the apron 300, and the routing in-process, heat sink chip integrated into one piece structure 100 is closely connected with routing anchor clamps, can not produce relative rocking.
The number of the grooves 210 and the number of the windows 310 can be multiple, the grooves 210 are in one-to-one correspondence, the grooves 210 are arranged in a matrix, the cover plate 300 can be used for fixing the heat sink chip integrated structures 100 in the supporting plate 200, and the wire bonding operation is performed by using the wire bonding heads to fix the heat sink chip integrated structures 100 one by one, so that the clamping and placing processes of the clamp are reduced, and the processing efficiency is improved.
In order to improve the contact stability of the cover plate 300 and the heat sink chip integrated structure 100, the back of the cover plate 300 is provided with a first protrusion 320 and a second protrusion 330 protruding downwards, the first protrusion 320 and the second protrusion 330 may be both in the shape of a bar corresponding to two sides of the heat sink not covered with the chip, the first protrusion 320 and the second protrusion 330 are respectively located on two opposite sides of the window 310, the first protrusion 320 and the second protrusion 330 are used for abutting against the heat sink chip integrated structure 100, and the contact with the heat sink chip integrated structure 100 is better.
The supporting plate 200 and the cover plate 300 may be coupled by a magnet 230. Specifically, the tray 200 may be provided with a placement groove 220 for placing the magnet 230, the magnet 230 may be fixedly coupled to the inside of the tray 200, the cover 300 may be made of a material that can be attracted to the magnet 230, and the cover 300 may be coupled to the tray 200 by the magnet 230. Conversely, the placement grooves 220 may be provided on the cover plate 300, and the material of the support plate 200 may be a material capable of being attracted by the magnets 230. The number of the magnets 230 and the placement grooves 220 can be multiple, and the connecting force between the supporting plate 200 and the cover plate 300 can be changed by adjusting the number of the magnets 230, so that the cover plate 300 and the supporting plate 200 are stably connected in the routing process.
In order to facilitate the alignment of the window 310 on the cover plate 300 with the groove 210, the supporting plate 200 and the cover plate 300 are correspondingly provided with positioning structures, specifically, the positioning structures include positioning pins 240 arranged on the front surface of the supporting plate 200 and positioning pin holes 340 arranged on the back surface of the cover plate 300. Conversely, the alignment pins 240 may be provided on the cover plate 300, and the alignment pin holes 340 may be provided on the pallet 200. The number of the positioning pins 240 and the positioning pin holes 340 may be multiple, the cover plate 300 is covered on the supporting plate 200, and the positioning pins 240 are inserted into the positioning pin holes 340 to align the windows 310 with the grooves 210.
By the direction of the front to the back of apron 300, the cross-sectional area of window 310 is littleer and littleer to form the slope on the inside wall of window 310, thereby certain dodging has been carried out the routing head of equipment of making a line, to making a line head production during the prevention routing and interfering.
The shape of the window 310 has a circular arc structure, so as to better avoid the front cavity surface of the heat sink chip integrated structure 100, and specifically, the window 310 may be a kidney-shaped hole.
The bottom surface of the groove 210 is provided with a vacuum suction hole 211 penetrating the bottom surface of the pallet 200 and the bottom surface of the groove 210. Before or after routing, the heat sink chip integrated structure 100 can be adsorbed in the groove 210 by using the vacuum suction hole 211, so that the supporting plate 200 can be transferred.
The routing equipment provided by the embodiment of the utility model comprises the routing clamp. Because the routing equipment provided by the embodiment of the utility model uses the routing clamp, the routing equipment provided by the embodiment of the utility model also has the advantages of the routing clamp.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the utility model has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A wire bonding jig, comprising: the heat sink chip integrated structure comprises a supporting plate (200) and a cover plate (300), wherein a groove (210) is formed in the front face of the supporting plate (200), and the groove (210) is used for accommodating the heat sink chip integrated structure (100);
the cover plate (300) is provided with a window (310) penetrating through the front surface and the back surface, and the window (310) is aligned with the groove (210) so as to expose a position to be wire-bonded on the heat sink chip integrated structure (100);
the supporting plate (200) is connected with the cover plate (300), and the cover plate (300) can press the heat sink chip integrated structure (100) in the groove (210) to prevent the heat sink chip integrated structure (100) from moving up and down.
2. The bonding jig of claim 1, wherein the number of the grooves (210) and the windows (310) is plural and corresponds to one another.
3. The bonding jig of claim 1, wherein the cover plate (300) is provided at the back thereof with a first protrusion (320) and a second protrusion (330) protruding downward, the first protrusion (320) and the second protrusion (330) are respectively located at two opposite sides of the window (310), and the first protrusion (320) and the second protrusion (330) are used for abutting against the heat sink chip integrated structure (100).
4. The bonding jig of claim 1, wherein the support plate (200) and the cover plate (300) are connected by a magnet (230).
5. The wire bonding fixture according to claim 4, wherein a placing groove (220) for placing a magnet (230) is formed on the supporting plate (200), and the cover plate (300) is made of a material capable of being attracted by the magnet (230);
or, a placing groove (220) for placing a magnet (230) is arranged on the cover plate (300), and the material of the supporting plate (200) is a material capable of being attracted by the magnet (230).
6. The bonding jig of claim 1, wherein the supporting plate (200) and the cover plate (300) are correspondingly provided with positioning structures to align the groove (210) with the window (310).
7. The bonding jig of claim 6, wherein the positioning structure comprises positioning pins (240) disposed on the front surface of the supporting plate (200), and positioning pin holes (340) disposed on the back surface of the cover plate (300);
or the positioning structure comprises a positioning pin (240) arranged on the back surface of the cover plate (300) and a positioning pin hole (340) arranged on the front surface of the supporting plate (200).
8. The wire bonding jig of claim 1, wherein the window (310) has a smaller cross-sectional area from the front side to the back side of the cover plate (300).
9. The bonding jig according to claim 1, wherein the bottom surface of the groove (210) is provided with a vacuum suction hole (211) penetrating through the bottom surface of the support plate (200) and the bottom surface of the groove (210).
10. A wire bonding apparatus comprising the wire bonding jig of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220354283.XU CN216793659U (en) | 2022-02-21 | 2022-02-21 | Routing clamp and routing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220354283.XU CN216793659U (en) | 2022-02-21 | 2022-02-21 | Routing clamp and routing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216793659U true CN216793659U (en) | 2022-06-21 |
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ID=82018982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220354283.XU Active CN216793659U (en) | 2022-02-21 | 2022-02-21 | Routing clamp and routing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216793659U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117038623A (en) * | 2023-08-18 | 2023-11-10 | 上海纳矽微电子有限公司 | Carrier assembly for routing chips to a frame and chip routing method |
-
2022
- 2022-02-21 CN CN202220354283.XU patent/CN216793659U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117038623A (en) * | 2023-08-18 | 2023-11-10 | 上海纳矽微电子有限公司 | Carrier assembly for routing chips to a frame and chip routing method |
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