CN214669455U

CN214669455U - Chip vacuum test fixture

Info

Publication number: CN214669455U
Application number: CN202120747004.1U
Authority: CN
Inventors: 张锋
Original assignee: Kunshan Zhuolida Precision Metal Parts Co ltd
Current assignee: Kunshan Zhuolida Precision Metal Parts Co ltd
Priority date: 2021-04-13
Filing date: 2021-04-13
Publication date: 2021-11-09
Anticipated expiration: 2031-04-13

Abstract

The utility model discloses a chip vacuum test fixture, including the test panel, the test panel top intermediate position is seted up with the chip groove, the chip inslot has seted up the vacuum hole, vacuum hole rectangle array distributes in the chip inslot, the chip groove is provided with spacing subassembly all around, the test panel bottom fixed mounting has the adsorption plate, the utility model discloses a set up the chip groove, seted up the vacuum hole in the chip groove to set up the vacuum absorption subassembly and carry out the evacuation to the vacuum hole, will place on the chip groove through the vacuum suction that produces in the vacuum hole and await measuring the test panel absorption on the chip test panel, just so can guarantee that the chip keeps leveling all the time in the testing process, reduced the defective rate; be provided with spacing subassembly all around the chip groove to the arc wall has all been seted up at the both sides lateral wall in chip groove, has all seted up the hole of stepping down in the four corners in chip groove, and the chip snatchs in test fixture, places easily, and places the position accurate, improves the detection efficiency of chip.

Description

Chip vacuum test fixture

Technical Field

The utility model relates to a chip test fixture technical field specifically is a chip vacuum test fixture.

Background

Chip, abbreviated as IC; or microcircuits, microchips, chips/chips, are a way in electronics to miniaturize circuits (including primarily semiconductor devices, including passive components, etc.) and are often fabricated on the surface of semiconductor wafers.

The jig is a tool for carpenters, ironmen, pincers, machines, electrical controls and other handicrafts, and is mainly used as a tool for assisting in controlling position or action (or both). The jig can be divided into a process assembly type jig, a project test type jig and a circuit board test type jig.

The test fixture that current chip was used is mostly location pressfitting test fixture, and in chip testing, will await measuring the chip and put in special test fixture's test frame usually to carry out the fixed of chip position, chip rigidity back, test fixture's upper cover is pressed down, compresses tightly the chip and makes the pin of chip and the test contact of bottom test panel fully contact, thereby realizes electric connection, in order to carry out electrical test to the chip. But uneven phenomenon can appear in the chip when testing, because the too big general upper cover of chip only pressfitting chip all around, the centre that leads to the chip easily has protruding phenomenon, leads to the pressfitting uneven then, can appear testing unstable phenomenon. Therefore, it is desirable to provide a vacuum test fixture for chips to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a chip vacuum test fixture, through setting up the chip groove, set up the vacuum hole in the chip groove, and set up the vacuum adsorption subassembly and carry out the evacuation to the vacuum hole, will place the chip to be tested in the chip groove and adsorb on the test board through the vacuum suction that produces in the vacuum hole, in this way can guarantee that the chip keeps level and smooth all the time in the test process, reduced the defective rate; to solve the problems set forth in the background art described above.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a chip vacuum test fixture, includes surveys the test panel, survey test panel top position placed in the middle and seted up the chip groove, the chip inslot is seted up vacuum hole, vacuum hole rectangular array distributes in the chip inslot, the chip groove is provided with spacing subassembly all around, survey test panel bottom fixed mounting has the adsorption plate, the adsorption plate bottom is provided with the vacuum adsorption subassembly, the vacuum adsorption subassembly sets up in the below in chip groove.

Preferably, the arc wall has all been seted up to the both sides lateral wall in chip groove, the diameter value of arc wall is greater than five times of vacuum hole diameter, just the hole of stepping down has all been seted up in the four corners in chip groove.

Preferably, the limiting assembly comprises a folded plate, a connecting plate and screws, the connecting plate is mounted on one side of the chip groove through the screws, the folded plate is fixedly connected to one side of the connecting plate, and an included angle between the folded plate and the connecting plate is set to be an obtuse angle.

Preferably, the limiting assembly further comprises a limiting block, the limiting block is fixedly connected to the other side of the connecting plate, the connecting plate and the limiting block are vertically arranged, the limiting block is arranged in the chip groove, and one side of the limiting block is attached to the inner wall of the chip groove.

Preferably, the vacuum adsorption component comprises a vacuum storage tank, a vacuum pump and a first air suction pipe, the two sides of the bottom of the adsorption plate are fixedly connected with a support, a bottom plate is fixedly mounted at the bottom of the support, a through groove is formed in the side wall of the support, the vacuum storage tank is fixedly mounted at the top of the bottom plate, the first air suction pipe is fixedly communicated with an air inlet of the vacuum storage tank, the vacuum pump is fixedly connected onto the first air suction pipe, an air outlet pipe is fixedly communicated with an air outlet of the vacuum storage tank, and a valve is mounted at one end of the air outlet pipe.

Preferably, the vacuum adsorption component further comprises a pipe joint, a second air suction pipe and a suction disc, the adsorption plate is provided with a vacuum adsorption cavity, the suction disc is fixedly connected to the bottom of the vacuum adsorption cavity, one end of the suction disc is fixedly communicated with the second air suction pipe, and one end of the second air suction pipe is fixedly communicated with the first air suction pipe through the pipe joint.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a set up the chip groove, open the vacuum hole in the chip groove, and set up the vacuum adsorption subassembly and carry out the evacuation to the vacuum hole, will place the chip to be tested in the chip groove and adsorb on the test board through the vacuum suction that produces in the vacuum hole, just so can guarantee that the chip keeps level all the time in the test process, reduced the defective rate;

2. through being provided with spacing subassembly all around at the chip groove to the arc wall has all been seted up at the both sides lateral wall in chip groove, has all seted up the hole of stepping down in the four corners in chip groove, and the chip snatchs in test fixture, places easily, and places the position accurately, can not appear crushing, bend, break the pin of chip, reduces the production of useless, improves the detection efficiency of chip, and this detection tool simple structure, the production of being convenient for.

Drawings

Fig. 1 is a schematic three-dimensional structure of the present invention;

FIG. 2 is a schematic sectional view of the present invention;

fig. 3 is a schematic structural view of the present invention from above.

In the figure: 1. a test board; 2. a chip slot; 3. an arc-shaped slot; 4. a hole of abdication; 5. a vacuum hole; 6. a limiting component; 7. folding the plate; 8. a connecting plate; 9. a screw; 10. a limiting block; 11. an adsorption plate; 1101. a vacuum adsorption chamber; 12. a support; 1201. a through groove; 13. a base plate; 14. a vacuum adsorption assembly; 15. a vacuum storage tank; 16. a vacuum pump; 17. a first inhalation tube; 18. a pipe joint; 19. a second suction duct; 20. a suction cup; 21. an air outlet pipe; 22. and (4) a valve.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a chip vacuum test fixture comprises a test board 1, wherein a chip groove 2 is formed in the middle position of the top of the test board 1, arc-shaped grooves 3 are formed in the side walls of two sides of the chip groove 2, the diameter value of each arc-shaped groove 3 is larger than five times of the diameter of a vacuum hole 5, the arc-shaped grooves 3 are arranged to facilitate chip grabbing and placing, meanwhile, accurate positioning can be achieved during grabbing, abdicating holes 4 are formed in four corners of the chip groove 2, and the abdicating holes 4 prevent chips from being damaged when being placed into and taken out of the chip groove 2;

vacuum holes 5 are formed in the chip grooves 2, the vacuum holes 5 are distributed in the chip grooves 2 in a rectangular array mode, limiting assemblies 6 are arranged on the periphery of the chip grooves 2, each limiting assembly 6 comprises a folded plate 7, a connecting plate 8 and a screw 9, the connecting plate 8 is installed on one side of each chip groove 2 through the screw 9, the folded plate 7 is fixedly connected to one side of the connecting plate 8, an included angle between the folded plate 7 and the connecting plate 8 is set to be an obtuse angle, and the folded plate 7 is arranged to facilitate taking of the connecting plate 8; the limiting assembly 6 further comprises a limiting block 10, the limiting block 10 is fixedly connected to the other side of the connecting plate 8, the connecting plate 8 and the limiting block 10 are vertically arranged, the limiting block 10 is arranged in the chip groove 2, one side of the limiting block 10 is attached to the inner wall of the chip groove 2, and the limiting block 10 of the limiting assembly 6 positions the chip placement position so as to quickly realize the alignment of the pins of the chip to be tested and the test contacts of the test board 1;

an adsorption plate 11 is fixedly installed at the bottom of a test plate 1, a vacuum adsorption component 14 is arranged at the bottom of the adsorption plate 11, the vacuum adsorption component 14 is arranged below a chip groove 2, the vacuum adsorption component 14 comprises a vacuum storage tank 15, a vacuum pump 16 and a first air suction pipe 17, two sides of the bottom of the adsorption plate 11 are fixedly connected with a support 12, a bottom plate 13 is fixedly installed at the bottom of the support 12, a through groove 1201 is formed in the side wall of the support 12, the vacuum storage tank 15 is fixedly installed at the top of the bottom plate 13, the first air suction pipe 17 is fixedly communicated with an air inlet of the vacuum storage tank 15, the vacuum pump 16 is fixedly connected onto the first air suction pipe 17, an air outlet pipe 21 is fixedly communicated with an air outlet of the vacuum storage tank 15, a valve 22 is installed at one end of the air outlet pipe 21, and the air outlet pipe 21 and the valve 22 are arranged to facilitate vacuum discharge in the vacuum storage tank 15;

vacuum adsorption subassembly 14 still includes coupling 18, second breathing pipe 19 and sucking disc 20, vacuum adsorption chamber 1101 has been seted up on adsorption plate 11, sucking disc 20 fixed connection is in the bottom in vacuum adsorption chamber 1101, the fixed intercommunication of sucking disc 20 one end has second breathing pipe 19, second breathing pipe 19 one end is through coupling 18 and the fixed intercommunication of first breathing pipe 17, start vacuum pump 16 of vacuum adsorption subassembly 14, carry out the evacuation to vacuum hole 5, vacuum pump 16 starts, follow sucking disc 20 suction second breathing pipe 19 and first breathing pipe 17 with the air in the vacuum hole 5, store in getting into vacuum storage tank 15 at last, the vacuum suction in the vacuum hole 5 can be with the chip that awaits measuring firmly adsorb in chip groove 2, just so can guarantee that the chip remains level and smooth all the time in the testing process, the defective rate has been reduced.

When the device is used, a chip to be tested is placed in the chip groove 2, then the position of the chip is positioned by the limiting block 10 of the limiting component 6, so that alignment of pins of the chip to be tested and test contacts of the test board 1 is quickly realized, the vacuum pump 16 of the vacuum adsorption component 14 is started, the vacuum hole 5 is vacuumized, the vacuum pump 16 is started, air in the vacuum hole 5 is pumped into the second air suction pipe 19 and the first air suction pipe 17 from the suction disc 20, and finally the air enters the vacuum storage tank 15 for storage, the chip to be tested can be firmly adsorbed in the chip groove 2 by the vacuum suction force in the vacuum hole 5, and therefore the chip can be guaranteed to be always kept flat in the test process, and the reject ratio is reduced; when the chip to be tested is adsorbed, after the testing contact is fully contacted with the pin of the chip to be tested, the electric connection between the pin of the chip and the testing contact can be realized, the electric test is carried out, the chip is easy to grab and place in the testing jig, the placing position is accurate, the pin of the chip can not be crushed, bent and broken, the generation of waste pieces is reduced, the detection efficiency of the chip is improved, and the detection jig is simple in structure and convenient to produce.

In the description of the present application, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a chip vacuum test fixture, includes test panel (1), its characterized in that: survey test panel (1) top position placed in the middle and offer chip groove (2), vacuum hole (5) have been seted up in chip groove (2), vacuum hole (5) rectangular array distributes in chip groove (2), chip groove (2) are provided with spacing subassembly (6) all around, survey test panel (1) bottom fixed mounting has adsorption plate (11), adsorption plate (11) bottom is provided with vacuum adsorption subassembly (14), vacuum adsorption subassembly (14) set up in the below in chip groove (2).

2. The vacuum test fixture for chips of claim 1, wherein: arc wall (3) have all been seted up to the both sides lateral wall in chip groove (2), the diameter value of arc wall (3) is greater than five times of vacuum hole (5) diameter, just hole (4) of stepping down has all been seted up in the four corners in chip groove (2).

3. The vacuum test fixture for chips of claim 1, wherein: spacing subassembly (6) include folded plate (7), connecting plate (8) and screw (9), install in chip groove (2) one side through screw (9) connecting plate (8), folded plate (7) fixed connection is in connecting plate (8) one side, the contained angle between folded plate (7) and connecting plate (8) sets up to the obtuse angle.

4. The vacuum test fixture for chips as claimed in claim 3, wherein: spacing subassembly (6) still include stopper (10), stopper (10) fixed connection is in connecting plate (8) opposite side, be perpendicular setting between connecting plate (8) and stopper (10), stopper (10) set up in chip groove (2), just stopper (10) one side sets up with the laminating of chip groove (2) inner wall.

5. The vacuum test fixture for chips of claim 1, wherein: vacuum adsorption subassembly (14) include vacuum storage tank (15), vacuum pump (16) and first trachea (17), adsorption plate (11) bottom both sides equal fixedly connected with support (12), support (12) bottom fixed mounting has bottom plate (13), logical groove (1201) have been seted up to support (12) lateral wall, vacuum storage tank (15) fixed mounting is in bottom plate (13) top, first trachea (17) fixed intercommunication in the air inlet of vacuum storage tank (15), vacuum pump (16) fixed connection is on first trachea (17), the fixed intercommunication in vacuum storage tank (15) gas outlet has outlet duct (21), valve (22) are installed to outlet duct (21) one end.

6. The vacuum test fixture for chips as claimed in claim 5, wherein: the vacuum adsorption component (14) further comprises a pipe joint (18), a second air suction pipe (19) and a suction disc (20), a vacuum adsorption cavity (1101) is formed in the adsorption plate (11), the suction disc (20) is fixedly connected to the bottom of the vacuum adsorption cavity (1101), one end of the suction disc (20) is fixedly communicated with the second air suction pipe (19), and one end of the second air suction pipe (19) is fixedly communicated with the first air suction pipe (17) through the pipe joint (18).