CN218868601U - Tungsten copper carrier paster anchor clamps - Google Patents
Tungsten copper carrier paster anchor clamps Download PDFInfo
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- CN218868601U CN218868601U CN202222886878.2U CN202222886878U CN218868601U CN 218868601 U CN218868601 U CN 218868601U CN 202222886878 U CN202222886878 U CN 202222886878U CN 218868601 U CN218868601 U CN 218868601U
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- base
- tungsten
- substrate
- copper carrier
- vacuum pump
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model provides a tungsten copper carrier paster clamp, belonging to the technical field of chip pasting, comprising a base, a substrate and a vacuum pump; the base is used for being installed on the workbench, a generating cavity is formed in the upper end face of the base, and a communicating hole communicated with the generating cavity is formed in the side face of the base; the base plate is arranged on the base and positioned above the generation cavity, the base plate is hermetically connected with the base, the base plate is provided with an accommodating groove for accommodating tungsten-copper alloy and an adsorption hole arranged in the accommodating groove, and the adsorption hole penetrates through the base plate and is communicated with the generation cavity; the vacuum pump is connected with the communication hole, and negative pressure is formed in the generating cavity by the vacuum pump and used for fixing the substrate and the tungsten-copper alloy. The utility model provides a tungsten copper carrier paster anchor clamps utilizes vacuum adsorption's mode, makes electric capacity paster chip dismantle simple, labour saving and time saving.
Description
Technical Field
The utility model belongs to the technical field of the chip pastes the dress, concretely relates to tungsten copper carrier paster anchor clamps.
Background
With the progress of the times, the application range of the capacitor chip is very large in the current electronic technology field, and thus the demand of the capacitor chip is increasing. At present, when a capacitor chip is pasted, the substrate and the tungsten-copper alloy need to be fixed by using the methods of bolts, bonding, spot welding and the like, so that the operation of pasting the chip is relatively accurate. However, this fixing method is difficult to disassemble and time-consuming and labor-consuming.
SUMMERY OF THE UTILITY MODEL
An embodiment of the utility model provides a tungsten copper carrier paster anchor clamps to the base plate and the tungsten copper alloy that exist among the solution prior art dismantle, install comparatively difficultly, and waste time and energy.
In order to achieve the purpose, the utility model adopts the technical proposal that: provided is a tungsten copper carrier patch clamp, including:
the base is used for being arranged on the workbench; a generating cavity is formed in the upper end face of the base, and a communicating hole communicated with the generating cavity is formed in the side face of the base;
the base plate is arranged on the base and is positioned above the generating cavity; the substrate is hermetically connected with the base; the substrate is provided with an accommodating groove for accommodating tungsten-copper alloy and an adsorption hole arranged in the accommodating groove, and the adsorption hole penetrates through the substrate and is communicated with the generation cavity;
a vacuum pump connected to the communication hole; and the vacuum pump forms negative pressure in the generating cavity and is used for fixing the substrate and the tungsten-copper alloy.
In a possible implementation manner, the base is further provided with an annular groove surrounding the generation cavity, the lower end of the base plate is provided with a limiting plate matched with the annular groove, and the adsorption hole penetrates through the limiting plate.
In a possible implementation manner, a holding portion is arranged on the substrate, an avoiding groove corresponding to the holding portion is arranged on the base, and the holding portion is located above the avoiding groove.
In a possible implementation manner, a counter bore is formed in the base, internal threads are formed in the wall of the counter bore, the counter bore is communicated with the communication hole, and a connecting pipe on the vacuum pump is connected with the counter bore.
In a possible implementation, the number of communication holes is at least two.
In a possible implementation manner, a sealing structure is arranged between the base and the substrate, and the sealing structure is arranged around the generation cavity.
In one possible implementation, the sealing structure includes a sealing groove and a sealing strip disposed in the sealing groove.
In a possible implementation mode, the lower end of the base is further provided with a connecting block used for being connected with the workbench, and an open groove used for being connected with a positioning block on the workbench is formed in the connecting block.
In a possible implementation manner, a sliding groove is arranged on the outer side surface of the connecting block.
In a possible implementation manner, the tungsten-copper carrier patch fixture further comprises a vacuum cylinder, the vacuum cylinder is connected with the vacuum pump, and a cylinder rod of the vacuum cylinder is connected with the base and used for fixing the base on the workbench.
The utility model provides a pair of tungsten copper carrier paster anchor clamps's beneficial effect lies in: compared with the prior art, when the tungsten copper carrier patch clamp is used, the base is firstly installed on the workbench, then the tungsten copper alloy is placed in the accommodating groove of the base plate, then the base plate is placed on the base and is positioned above the generating cavity, and the base plate is in sealing connection with the base; the method comprises the steps of connecting a communicating hole in a base with a vacuum pump, forming negative pressure in a generating cavity by using the vacuum pump, firmly adsorbing a substrate on the base, firmly adsorbing the tungsten-copper alloy by using an adsorption hole communicated with the generating cavity, moving the base to a mounting position by using a workbench, starting mounting equipment, mounting a chip, and subsequently dispensing and die bonding, and after the operation of the mounting equipment is completed, closing the vacuum pump, and directly taking down the substrate and the capacitor-mounted chip. By the mode, the substrate and the tungsten-copper alloy can be firmly fixed by utilizing vacuum adsorption, and the capacitor chip can be conveniently taken down after the mounting is finished, so that the capacitor chip is extremely simple to disassemble, and time and labor are saved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a first schematic structural diagram of a tungsten copper carrier patch fixture according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a tungsten copper carrier patch clamp according to an embodiment of the present invention;
fig. 3 is a front view of a base according to an embodiment of the present invention;
fig. 4 is a bottom view of a base according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a substrate according to an embodiment of the present invention;
fig. 6 is a schematic structural view of the accommodating groove according to an embodiment of the present invention.
Wherein, in the figures, the respective reference numerals:
1. a base; 11. a generation chamber; 12. a communicating hole; 13. an avoidance groove; 14. a countersunk hole; 15. sealing the groove; 2. a substrate; 21. accommodating a tank; 22. an adsorption hole; 23. a limiting plate; 24. a grip portion.
Detailed Description
In order to make the technical problem, technical solution and beneficial effects to be solved by the present invention more clearly understood, the following description is made in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1 to 6, a tungsten copper carrier patch clamp according to the present invention will now be described. A tungsten copper carrier patch clamp comprises a base 1, a substrate 2 and a vacuum pump; the base 1 is used for being installed on a workbench, a generating cavity 11 is formed in the upper end face of the base 1, and a communicating hole 12 communicated with the generating cavity 11 is formed in the side face of the base 1; the substrate 2 is arranged on the base 1 and positioned above the generation cavity 11, the substrate 2 is hermetically connected with the base 1, the substrate 2 is provided with an accommodating groove 21 for accommodating tungsten-copper alloy and an adsorption hole 22 arranged in the accommodating groove 21, and the adsorption hole 22 penetrates through the substrate 2 and is communicated with the generation cavity 11; the vacuum pump is connected to the communicating hole 12, and the vacuum pump forms a negative pressure in the generation chamber 11 for fixing the substrate 2 and the tungsten-copper alloy.
Compared with the prior art, the tungsten copper carrier patch clamp provided by the embodiment of the invention has the advantages that when the tungsten copper carrier patch clamp is used, the base 1 is firstly installed on the workbench, then the tungsten copper alloy is placed in the accommodating groove 21 of the substrate 2, then the substrate 2 is placed on the base 1 and is positioned above the generation cavity 11, and the substrate 2 is hermetically connected with the base 1; connecting the communication hole 12 on the base 1 with a vacuum pump, forming negative pressure in the generating cavity 11 by using the vacuum pump, firmly adsorbing the substrate 2 on the base 1, and firmly adsorbing the tungsten-copper alloy by using the adsorption hole 22 communicated with the generating cavity 11; the base 1 is moved to a mounting position by using the workbench, then mounting equipment is started to mount a chip, and subsequent glue dispensing and die bonding are carried out, after the mounting equipment is operated, the vacuum pump is closed, and the substrate 2 and the capacitor chip can be directly taken down. By the mode, the substrate 2 and the tungsten-copper alloy can be firmly fixed by utilizing vacuum adsorption, and the capacitor chip can be taken down very conveniently after the mounting is finished, so that the dismounting is very simple, and time and labor are saved.
Referring to fig. 1, 3 and 5, as a specific embodiment of the tungsten copper carrier patch clamp of the present invention, an annular groove is disposed around the generation cavity 11 on the upper end surface of the base 1, and the annular groove is adapted to the limiting plate 23 on the lower end of the substrate 2, so as to form a limiting structure, so as to fix the substrate 2 in the annular groove and limit the horizontal movement of the substrate 2; the substrate 2 is also provided with an adsorption hole 22 which passes through the limiting plate 23, and the substrate 2 and the tungsten-copper alloy are adsorbed by using a vacuum adsorption mode to limit the movement of the substrate 2 and the tungsten-copper alloy in the vertical direction.
Please refer to fig. 1, fig. 3 and fig. 5, as a specific embodiment of the tungsten copper carrier patch fixture provided by the present invention, a holding portion 24 is further disposed on the substrate 2, the holding portion 24 is disposed on two side surfaces of the substrate 2, and the base 1 is provided with a relative avoiding groove 13, because the substrate 2 is disposed on the upper end surface of the base 1, the holding portion 24 is disposed above the avoiding groove 13, the substrate 2 can be more conveniently placed or taken by a worker by using the method, the avoiding grooves 13 reduce the weight of the base 1, and the material is saved.
Referring to fig. 1 and 3, as a specific embodiment of the tungsten copper carrier patch fixture provided by the present invention, a counter bore 14 is further formed on the base 1, an internal thread is formed on a bore wall of the counter bore 14, the counter bore 14 is communicated with a communication hole 12 on a side surface of the generation chamber 11, and a connection pipe on the vacuum pump is connected with the counter bore 14; because the inner thread is arranged on the hole wall of the counter bore 14, the counter bore and the connecting pipe form detachable threaded connection, the threaded connection has good tightness, the unstable connection between the counter bore 14 and the connecting pipe and the air leakage can not occur, so that the substrate 2 and the tungsten-copper alloy are not firmly adsorbed, and the threaded connection is very convenient for mounting and dismounting the connecting pipe.
Referring to fig. 1 and 3, as a specific embodiment of the tungsten copper carrier mounting fixture provided by the present invention, the number of the communication holes 12 is at least two; the larger the number of the communication holes 12, the more firmly the substrate 2 and the tungsten-copper alloy are adsorbed, and the substrate 2 and the tungsten-copper alloy are not moved due to insufficient suction force.
Referring to fig. 1, 3 and 5, as a specific embodiment of the tungsten copper carrier patch fixture provided by the present invention, a sealing structure is disposed between the base 1 and the substrate 2, and the sealing structure is located on the upper end surface of the base 1 and surrounds the outer side of the generation cavity 11; the substrate 2 can be sealed on the base 1 by the sealing structure, and the substrate 2 is prevented from moving due to air leakage when the vacuum pump is started.
Referring to fig. 1, 3 and 5, as a specific embodiment of the tungsten copper carrier patch fixture provided by the present invention, the sealing structure includes a sealing groove 15 and a sealing strip disposed in the sealing groove 15; in this way, the sealing groove 15 can fix the limiting plate 23 at the lower end of the substrate 2 on the base 1, and the sealing strip can better fix and seal the substrate 2 on the base 1, so as to prevent the occurrence of a large amount of air leakage during operation.
Referring to fig. 1, 2 and 3, as a specific embodiment of the fixture for mounting a tungsten-copper carrier of the present invention, a connecting block connected to a worktable is disposed at a lower end of a base 1, and an opening slot connected to a positioning block on the worktable is disposed on the connecting block; for the firm degree of installation that improves base 1, set up the locating piece on the workstation, and at base 1's lower extreme installation connecting block, set up the open slot of locating piece cooperation installation on the connecting block, during installation base 1, the locating piece card is in the open slot to it is spacing to base 1, prevents that base 1 from removing wantonly on the workstation.
Please refer to fig. 1, fig. 2 and fig. 4, as a specific embodiment of the tungsten copper carrier patch clamp provided by the present invention, a sliding groove is provided on the lateral surface of the connecting block, a U-shaped block disposed by a semi-surrounding positioning block is further provided on the worktable, a guide rail is provided on the inner wall of the U-shaped block, and the sliding groove on the lateral surface of the connecting block is in sliding fit with the guide rail, therefore, when the mounting base 1 is on the worktable, the connecting block enters into the open slot, and the sliding groove is also in sliding fit with the guide rail, thereby further enhancing the limitation to the connecting block.
Please refer to fig. 1, fig. 2 and fig. 4, as a specific embodiment of the tungsten copper carrier patch clamp provided by the present invention, the tungsten copper carrier patch clamp further includes a vacuum cylinder, the vacuum cylinder is connected to a vacuum pump, a cylinder rod of the vacuum cylinder is connected to the base 1, the cylinder rod of the vacuum cylinder is pressed against the base 1 when the vacuum pump is started, so as to limit the backward movement, and the base 1 is completely fixed on the worktable.
The tungsten copper carrier patch clamp is used in the following process: firstly, the base 1 is installed on a workbench, wherein an open slot on a connecting block is installed in a matching manner with a positioning block of the workbench, tungsten-copper alloy is placed in an accommodating groove 21 of the base plate 2, then the base plate 2 is placed on the base 1 by using a holding part 24, the base plate 2 is sealed on the base 1 by using a sealing groove 15 and a sealing strip, a cylinder rod of a vacuum cylinder connected with a vacuum pump is propped against the base 1, the base 1 is accurately installed on the workbench without adjusting the position due to the fact that the positioning block is arranged on the workbench, a connecting pipe of the vacuum pump is connected with a countersunk hole 14, the vacuum pump is started again, the base plate 2 and the tungsten-copper alloy in the accommodating groove 21 are adsorbed and fixed together by means of a generating cavity 11 and an adsorbing hole 22, then the workbench is started to move the base 1 to a mounting position, chip mounting, chip dispensing and chip fixing are carried out, finally the vacuum pump is closed, the base plate 2 is taken down, and the capacitor chip is taken away. By the mode, the substrate 2 and the tungsten-copper alloy can be firmly fixed by utilizing vacuum adsorption, and the capacitor chip can be taken down very conveniently after the mounting is finished, so that the dismounting is very simple, and time and labor are saved.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (10)
1. The utility model provides a tungsten copper carrier paster anchor clamps which characterized in that includes:
the base is used for being arranged on the workbench; a generating cavity is formed in the upper end face of the base, and a communicating hole communicated with the generating cavity is formed in the side face of the base;
the base plate is arranged on the base and is positioned above the generating cavity; the substrate is hermetically connected with the base; the substrate is provided with an accommodating groove for accommodating tungsten-copper alloy and an adsorption hole arranged in the accommodating groove, and the adsorption hole penetrates through the substrate and is communicated with the generation cavity;
a vacuum pump connected to the communication hole; and the vacuum pump forms negative pressure in the generating cavity and is used for fixing the substrate and the tungsten-copper alloy.
2. The tungsten-copper carrier chip clamp according to claim 1, wherein the base further has an annular groove disposed around the generation cavity, the lower end of the base plate has a limiting plate adapted to the annular groove, and the suction hole passes through the limiting plate.
3. The fixture for a tungsten-copper carrier chip as claimed in claim 1, wherein a holding portion is disposed on the substrate, an avoiding groove corresponding to the holding portion is disposed on the base, and the holding portion is disposed above the avoiding groove.
4. The tungsten-copper carrier patch fixture as claimed in claim 1, wherein the base is provided with a counter bore, the wall of the counter bore is provided with internal threads, the counter bore is communicated with the communication hole, and a connecting pipe on the vacuum pump is connected with the counter bore.
5. The tungsten-copper carrier chip holder as claimed in claim 1, wherein the number of the communication holes is at least two.
6. A tungsten copper carrier patch fixture as claimed in claim 1 wherein a sealing structure is provided between said base and said substrate, said sealing structure being disposed around said generation chamber.
7. The tungsten copper carrier patch fixture of claim 6 wherein said sealing structure comprises a sealing channel and a sealing strip disposed within said sealing channel.
8. The fixture for mounting a tungsten-copper carrier according to any one of claims 1 to 7, wherein the lower end of the base is further provided with a connecting block for connecting with a worktable, and the connecting block is provided with an open slot for connecting with a positioning block on the worktable.
9. The tungsten-copper carrier patch fixture as claimed in claim 8, wherein the connecting block is provided with a sliding groove on an outer side thereof.
10. The tungsten copper carrier die holder as claimed in claim 8, further comprising a vacuum cylinder, wherein the vacuum cylinder is connected to the vacuum pump, and a rod of the vacuum cylinder is connected to the base for fixing the base to the worktable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222886878.2U CN218868601U (en) | 2022-10-31 | 2022-10-31 | Tungsten copper carrier paster anchor clamps |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222886878.2U CN218868601U (en) | 2022-10-31 | 2022-10-31 | Tungsten copper carrier paster anchor clamps |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218868601U true CN218868601U (en) | 2023-04-14 |
Family
ID=87365128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222886878.2U Active CN218868601U (en) | 2022-10-31 | 2022-10-31 | Tungsten copper carrier paster anchor clamps |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218868601U (en) |
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2022
- 2022-10-31 CN CN202222886878.2U patent/CN218868601U/en active Active
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